JPS6371548U - - Google Patents
Info
- Publication number
- JPS6371548U JPS6371548U JP1987151522U JP15152287U JPS6371548U JP S6371548 U JPS6371548 U JP S6371548U JP 1987151522 U JP1987151522 U JP 1987151522U JP 15152287 U JP15152287 U JP 15152287U JP S6371548 U JPS6371548 U JP S6371548U
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- insulator
- thick
- main surface
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
- H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
- H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
- H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987151522U JPH0328510Y2 (https=) | 1987-10-02 | 1987-10-02 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987151522U JPH0328510Y2 (https=) | 1987-10-02 | 1987-10-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6371548U true JPS6371548U (https=) | 1988-05-13 |
| JPH0328510Y2 JPH0328510Y2 (https=) | 1991-06-19 |
Family
ID=31068673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987151522U Expired JPH0328510Y2 (https=) | 1987-10-02 | 1987-10-02 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0328510Y2 (https=) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51131174U (https=) * | 1975-04-15 | 1976-10-22 | ||
| JPS57147260A (en) * | 1981-03-05 | 1982-09-11 | Matsushita Electronics Corp | Manufacture of resin-sealed semiconductor device and lead frame used therefor |
| JPS57175448U (https=) * | 1981-04-30 | 1982-11-05 |
-
1987
- 1987-10-02 JP JP1987151522U patent/JPH0328510Y2/ja not_active Expired
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51131174U (https=) * | 1975-04-15 | 1976-10-22 | ||
| JPS57147260A (en) * | 1981-03-05 | 1982-09-11 | Matsushita Electronics Corp | Manufacture of resin-sealed semiconductor device and lead frame used therefor |
| JPS57175448U (https=) * | 1981-04-30 | 1982-11-05 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0328510Y2 (https=) | 1991-06-19 |
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