JPWO2019244485A1 - 半導体装置の製造方法および半導体装置 - Google Patents
半導体装置の製造方法および半導体装置 Download PDFInfo
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Abstract
Description
特許文献1 特開2017−168829号公報
特許文献2 特開2016−33993号公報
特許文献3 特開2013−187440号公報
Claims (12)
- 半導体基板の上面から前記半導体基板の内部まで設けられ前記半導体基板の上面において予め定められた延伸方向に延伸する複数のトレンチ部と、隣り合う2つの前記トレンチ部の間において前記半導体基板の深さ方向に第2導電型のドーパントを第1の深さおよび第1の注入量で注入して形成される第2導電型のコンタクト領域と、隣り合う2つの前記トレンチ部の間において前記延伸方向に前記コンタクト領域と並んで配置され前記半導体基板の上面に露出する第1導電型のエミッタ領域と、によって、前記延伸方向における長さが隣り合う2つの前記トレンチ部の間の幅以下であって、且つ、前記延伸方向における前記エミッタ領域の長さが前記コンタクト領域の長さよりも大きいセルを形成し、
前記セルの上方に、前記延伸方向におけるコンタクト領域の長さよりも前記トレンチ部の間の開口幅が小さいコンタクトホールを形成し、
前記半導体基板の深さ方向に第2導電型のドーパントを前記第1の深さよりも浅い第2の深さおよび前記第1の注入量以上の第2の注入量で注入して第2導電型のプラグ領域を形成する
半導体装置の製造方法。 - 前記延伸方向における前記セルの長さが3.2μm以下となるように前記セルを形成する
請求項1に記載の半導体装置の製造方法。 - 前記トレンチ部の間の前記コンタクトホールの開口幅が1.0μm以下となるように前記コンタクトホールを形成する
請求項1または2に記載の半導体装置の製造方法。 - 前記トレンチ部の間の前記コンタクトホールの開口幅が、前記トレンチ部の幅よりも小さくなるように、前記コンタクトホールおよび前記トレンチ部を形成する
請求項1から3のいずれか1項に記載の半導体装置の製造方法。 - 前記トレンチ部の間の前記コンタクトホールの開口幅が、前記第2の深さよりも大きくなるように、前記コンタクトホールを形成する
請求項1から4のいずれか一項に記載の半導体装置の製造方法。 - 前記トレンチ部の間の前記コンタクトホールの開口幅が、前記トレンチ部の間の前記プラグ領域の幅よりも小さくなるように、前記コンタクトホールおよび前記プラグ領域を形成する
請求項1から5のいずれか1項に記載の半導体装置の製造方法。 - 前記半導体基板の深さ方向における前記プラグ領域のドーピング濃度のピーク位置が、前記半導体基板の上面から前記コンタクト領域のドーピング濃度のピーク位置までの深さの1/2よりも浅くなるように、前記プラグ領域および前記コンタクト領域を形成する
請求項1から6のいずれか1項に記載の半導体装置の製造方法。 - 前記延伸方向において前記コンタクト領域の端部とマスクとを重畳させて前記ドーパントを注入することで、前記プラグ領域を形成し、
前記コンタクト領域の端部と前記マスクとが重畳する長さが、前記トレンチ部の間の前記コンタクトホールの開口幅よりも小さくなるように、前記コンタクトホールを形成する
請求項1から7のいずれか1項に記載の半導体装置の製造方法。 - 前記コンタクト領域を、第1の温度で第1の時間アニールし、
前記プラグ領域を、前記第1の温度よりも低い第2の温度で第1の時間より短い第2の時間アニールする
請求項1から8のいずれか1項に記載の半導体装置の製造方法。 - 前記半導体基板に、前記第1の深さおよび前記第1の注入量で前記第2導電型のドーパントを注入せず、且つ、前記第2の深さおよび前記第2の注入量で前記第2導電型のドーパントを注入して形成された前記プラグ領域を含むダイオード部を更に形成する
請求項1から9のいずれか一項に記載の半導体装置の製造方法。 - 前記半導体基板に、前記セルを含むメイン半導体素子部を形成すると共に、前記セルと同じ工程で電流検出セルを形成しセンス半導体素子部を形成する
請求項1から10のいずれか一項に記載の半導体装置の製造方法。 - 半導体基板と、
前記半導体基板の上面から前記半導体基板の内部まで設けられ、前記半導体基板の上面において予め定められた延伸方向に延伸して設けられたトレンチ部と、
前記半導体基板の内部において、前記トレンチ部よりも浅く設けられた第2導電型のベース領域と、
前記半導体基板の内部において、前記ベース領域の上方に設けられた第2導電型のコンタクト領域と、
前記半導体基板の内部において、前記コンタクト領域と並んで前記ベース領域の上方に設けられたエミッタ領域と、
前記半導体基板の内部に前記コンタクト領域の深さよりも浅く設けられ、前記コンタクト領域よりもドーピング濃度が高い第2導電型のプラグ領域と、
前記コンタクト領域および前記エミッタ領域の上方に設けられ、前記トレンチ部の間の開口幅が前記延伸方向における前記コンタクト領域の長さよりも小さいコンタクトホールと、
を備え、
前記コンタクト領域と前記エミッタ領域とで形成される延伸方向におけるセルの長さが、隣り合う2つの前記トレンチ部の間の幅以下であって、且つ、前記延伸方向における前記エミッタ領域の長さが前記コンタクト領域の長さよりも大きく、
前記プラグ領域のドーピング濃度を前記半導体基板の深さ方向に積分した第1積分濃度が、前記コンタクト領域のドーピング濃度を前記半導体基板の深さ方向に積分した第2積分濃度以上である
半導体装置。
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