JPWO2019167905A1 - 封止用樹脂組成物 - Google Patents
封止用樹脂組成物 Download PDFInfo
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- JPWO2019167905A1 JPWO2019167905A1 JP2020503502A JP2020503502A JPWO2019167905A1 JP WO2019167905 A1 JPWO2019167905 A1 JP WO2019167905A1 JP 2020503502 A JP2020503502 A JP 2020503502A JP 2020503502 A JP2020503502 A JP 2020503502A JP WO2019167905 A1 JPWO2019167905 A1 JP WO2019167905A1
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- Japan
- Prior art keywords
- resin composition
- mass
- sealing resin
- hydrotalcite
- acrylate
- Prior art date
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- 239000011342 resin composition Substances 0.000 title claims abstract description 114
- 238000007789 sealing Methods 0.000 title claims abstract description 103
- 229960001545 hydrotalcite Drugs 0.000 claims abstract description 93
- 229910001701 hydrotalcite Inorganic materials 0.000 claims abstract description 93
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000000292 calcium oxide Substances 0.000 claims abstract description 15
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 claims abstract description 15
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 claims abstract 6
- 150000001875 compounds Chemical class 0.000 claims description 79
- 239000003822 epoxy resin Substances 0.000 claims description 56
- 229920000647 polyepoxide Polymers 0.000 claims description 56
- 239000006087 Silane Coupling Agent Substances 0.000 claims description 28
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 claims description 26
- 239000007870 radical polymerization initiator Substances 0.000 claims description 23
- 125000002723 alicyclic group Chemical group 0.000 claims description 20
- 239000003505 polymerization initiator Substances 0.000 claims description 17
- 239000000203 mixture Substances 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 15
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 239000004925 Acrylic resin Substances 0.000 claims description 11
- 229920000178 Acrylic resin Polymers 0.000 claims description 11
- 230000006866 deterioration Effects 0.000 abstract description 12
- 230000000903 blocking effect Effects 0.000 abstract description 6
- 238000001035 drying Methods 0.000 abstract description 5
- PWZFXELTLAQOKC-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide;tetrahydrate Chemical compound O.O.O.O.[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O PWZFXELTLAQOKC-UHFFFAOYSA-A 0.000 description 88
- -1 NO 3- Chemical class 0.000 description 64
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 57
- 150000002148 esters Chemical class 0.000 description 40
- 239000000126 substance Substances 0.000 description 23
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 22
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 18
- 239000010410 layer Substances 0.000 description 18
- 239000002245 particle Substances 0.000 description 18
- 239000003085 diluting agent Substances 0.000 description 16
- 125000003700 epoxy group Chemical group 0.000 description 15
- 125000004386 diacrylate group Chemical group 0.000 description 12
- 238000010521 absorption reaction Methods 0.000 description 11
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 10
- 230000001588 bifunctional effect Effects 0.000 description 10
- 238000010438 heat treatment Methods 0.000 description 10
- 239000004593 Epoxy Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 9
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 9
- 230000009467 reduction Effects 0.000 description 9
- 229920006395 saturated elastomer Polymers 0.000 description 9
- 229940042596 viscoat Drugs 0.000 description 9
- LWNGJAHMBMVCJR-UHFFFAOYSA-N (2,3,4,5,6-pentafluorophenoxy)boronic acid Chemical compound OB(O)OC1=C(F)C(F)=C(F)C(F)=C1F LWNGJAHMBMVCJR-UHFFFAOYSA-N 0.000 description 8
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 7
- 239000004844 aliphatic epoxy resin Substances 0.000 description 7
- 125000001931 aliphatic group Chemical group 0.000 description 7
- 239000011575 calcium Substances 0.000 description 7
- 125000004122 cyclic group Chemical group 0.000 description 7
- 238000009826 distribution Methods 0.000 description 7
- 230000000694 effects Effects 0.000 description 7
- 239000003112 inhibitor Substances 0.000 description 7
- 238000005259 measurement Methods 0.000 description 7
- 229940105570 ornex Drugs 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- FIHBHSQYSYVZQE-UHFFFAOYSA-N 6-prop-2-enoyloxyhexyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCOC(=O)C=C FIHBHSQYSYVZQE-UHFFFAOYSA-N 0.000 description 6
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- IAXXETNIOYFMLW-GYSYKLTISA-N [(1r,3r,4r)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@@]2(C)[C@H](OC(=O)C(=C)C)C[C@@H]1C2(C)C IAXXETNIOYFMLW-GYSYKLTISA-N 0.000 description 6
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 6
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 6
- 238000000634 powder X-ray diffraction Methods 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 239000012756 surface treatment agent Substances 0.000 description 6
- UCBQKJQXUPVHFJ-UHFFFAOYSA-N 1-cyclopenta-2,4-dien-1-yl-2-propan-2-ylbenzene Chemical compound CC(C)C1=CC=CC=C1C1C=CC=C1 UCBQKJQXUPVHFJ-UHFFFAOYSA-N 0.000 description 5
- XFCMNSHQOZQILR-UHFFFAOYSA-N 2-[2-(2-methylprop-2-enoyloxy)ethoxy]ethyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCOCCOC(=O)C(C)=C XFCMNSHQOZQILR-UHFFFAOYSA-N 0.000 description 5
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 5
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 5
- 239000002202 Polyethylene glycol Substances 0.000 description 5
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 5
- 230000007423 decrease Effects 0.000 description 5
- 235000014113 dietary fatty acids Nutrition 0.000 description 5
- 239000000194 fatty acid Substances 0.000 description 5
- 229930195729 fatty acid Natural products 0.000 description 5
- 150000004665 fatty acids Chemical class 0.000 description 5
- 229910052731 fluorine Inorganic materials 0.000 description 5
- 239000011737 fluorine Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- ZQMHJBXHRFJKOT-UHFFFAOYSA-N methyl 2-[(1-methoxy-2-methyl-1-oxopropan-2-yl)diazenyl]-2-methylpropanoate Chemical compound COC(=O)C(C)(C)N=NC(C)(C)C(=O)OC ZQMHJBXHRFJKOT-UHFFFAOYSA-N 0.000 description 5
- 229920001223 polyethylene glycol Polymers 0.000 description 5
- AOBIOSPNXBMOAT-UHFFFAOYSA-N 2-[2-(oxiran-2-ylmethoxy)ethoxymethyl]oxirane Chemical compound C1OC1COCCOCC1CO1 AOBIOSPNXBMOAT-UHFFFAOYSA-N 0.000 description 4
- CERQOIWHTDAKMF-UHFFFAOYSA-M Methacrylate Chemical compound CC(=C)C([O-])=O CERQOIWHTDAKMF-UHFFFAOYSA-M 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 4
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 4
- 125000000217 alkyl group Chemical group 0.000 description 4
- 150000001343 alkyl silanes Chemical class 0.000 description 4
- 125000003118 aryl group Chemical group 0.000 description 4
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 4
- 239000011229 interlayer Substances 0.000 description 4
- 229940119545 isobornyl methacrylate Drugs 0.000 description 4
- SFLRURCEBYIKSS-UHFFFAOYSA-N n-butyl-2-[[1-(butylamino)-2-methyl-1-oxopropan-2-yl]diazenyl]-2-methylpropanamide Chemical compound CCCCNC(=O)C(C)(C)N=NC(C)(C)C(=O)NCCCC SFLRURCEBYIKSS-UHFFFAOYSA-N 0.000 description 4
- 229920003986 novolac Polymers 0.000 description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- FBBATURSCRIBHN-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyldisulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSCCC[Si](OCC)(OCC)OCC FBBATURSCRIBHN-UHFFFAOYSA-N 0.000 description 4
- OZAIFHULBGXAKX-UHFFFAOYSA-N 2-(2-cyanopropan-2-yldiazenyl)-2-methylpropanenitrile Chemical compound N#CC(C)(C)N=NC(C)(C)C#N OZAIFHULBGXAKX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- BGNXCDMCOKJUMV-UHFFFAOYSA-N Tert-Butylhydroquinone Chemical compound CC(C)(C)C1=CC(O)=CC=C1O BGNXCDMCOKJUMV-UHFFFAOYSA-N 0.000 description 3
- ULQMPOIOSDXIGC-UHFFFAOYSA-N [2,2-dimethyl-3-(2-methylprop-2-enoyloxy)propyl] 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCC(C)(C)COC(=O)C(C)=C ULQMPOIOSDXIGC-UHFFFAOYSA-N 0.000 description 3
- PFHLXMMCWCWAMA-UHFFFAOYSA-N [4-(4-diphenylsulfoniophenyl)sulfanylphenyl]-diphenylsulfanium Chemical compound C=1C=C([S+](C=2C=CC=CC=2)C=2C=CC=CC=2)C=CC=1SC(C=C1)=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 PFHLXMMCWCWAMA-UHFFFAOYSA-N 0.000 description 3
- FHLPGTXWCFQMIU-UHFFFAOYSA-N [4-[2-(4-prop-2-enoyloxyphenyl)propan-2-yl]phenyl] prop-2-enoate Chemical class C=1C=C(OC(=O)C=C)C=CC=1C(C)(C)C1=CC=C(OC(=O)C=C)C=C1 FHLPGTXWCFQMIU-UHFFFAOYSA-N 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 239000012298 atmosphere Substances 0.000 description 3
- 239000004305 biphenyl Substances 0.000 description 3
- 235000010290 biphenyl Nutrition 0.000 description 3
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical class C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000013329 compounding Methods 0.000 description 3
- FWLDHHJLVGRRHD-UHFFFAOYSA-N decyl prop-2-enoate Chemical compound CCCCCCCCCCOC(=O)C=C FWLDHHJLVGRRHD-UHFFFAOYSA-N 0.000 description 3
- VFHVQBAGLAREND-UHFFFAOYSA-N diphenylphosphoryl-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C1=CC=CC=C1 VFHVQBAGLAREND-UHFFFAOYSA-N 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 229910021645 metal ion Inorganic materials 0.000 description 3
- LUCXVPAZUDVVBT-UHFFFAOYSA-N methyl-[3-(2-methylphenoxy)-3-phenylpropyl]azanium;chloride Chemical compound Cl.C=1C=CC=CC=1C(CCNC)OC1=CC=CC=C1C LUCXVPAZUDVVBT-UHFFFAOYSA-N 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 150000004767 nitrides Chemical class 0.000 description 3
- 229920001451 polypropylene glycol Polymers 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- CIHOLLKRGTVIJN-UHFFFAOYSA-N tert‐butyl hydroperoxide Chemical compound CC(C)(C)OO CIHOLLKRGTVIJN-UHFFFAOYSA-N 0.000 description 3
- 238000002411 thermogravimetry Methods 0.000 description 3
- MXFQRSUWYYSPOC-UHFFFAOYSA-N (2,2-dimethyl-3-prop-2-enoyloxypropyl) prop-2-enoate Chemical class C=CC(=O)OCC(C)(C)COC(=O)C=C MXFQRSUWYYSPOC-UHFFFAOYSA-N 0.000 description 2
- VWDXBRMLFUFNSX-UHFFFAOYSA-N (2-hydroxy-5-methyl-4-oxohex-5-enyl) prop-2-enoate Chemical compound CC(=C)C(=O)CC(O)COC(=O)C=C VWDXBRMLFUFNSX-UHFFFAOYSA-N 0.000 description 2
- QEQBMZQFDDDTPN-UHFFFAOYSA-N (2-methylpropan-2-yl)oxy benzenecarboperoxoate Chemical compound CC(C)(C)OOOC(=O)C1=CC=CC=C1 QEQBMZQFDDDTPN-UHFFFAOYSA-N 0.000 description 2
- ZMTBGVBNTHTBEC-UHFFFAOYSA-N (3,3,5-trimethylcyclohexyl) prop-2-enoate Chemical compound CC1CC(OC(=O)C=C)CC(C)(C)C1 ZMTBGVBNTHTBEC-UHFFFAOYSA-N 0.000 description 2
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- LTQBNYCMVZQRSD-UHFFFAOYSA-N (4-ethenylphenyl)-trimethoxysilane Chemical compound CO[Si](OC)(OC)C1=CC=C(C=C)C=C1 LTQBNYCMVZQRSD-UHFFFAOYSA-N 0.000 description 2
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 2
- VDYWHVQKENANGY-UHFFFAOYSA-N 1,3-Butyleneglycol dimethacrylate Chemical compound CC(=C)C(=O)OC(C)CCOC(=O)C(C)=C VDYWHVQKENANGY-UHFFFAOYSA-N 0.000 description 2
- AZQWKYJCGOJGHM-UHFFFAOYSA-N 1,4-benzoquinone Chemical compound O=C1C=CC(=O)C=C1 AZQWKYJCGOJGHM-UHFFFAOYSA-N 0.000 description 2
- CDDDRVNOHLVEED-UHFFFAOYSA-N 1-cyclohexyl-3-[1-[[1-(cyclohexylcarbamoylamino)cyclohexyl]diazenyl]cyclohexyl]urea Chemical compound C1CCCCC1(N=NC1(CCCCC1)NC(=O)NC1CCCCC1)NC(=O)NC1CCCCC1 CDDDRVNOHLVEED-UHFFFAOYSA-N 0.000 description 2
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 2
- ZDDUSDYMEXVQNJ-UHFFFAOYSA-N 1H-imidazole silane Chemical compound [SiH4].N1C=NC=C1 ZDDUSDYMEXVQNJ-UHFFFAOYSA-N 0.000 description 2
- PUGOMSLRUSTQGV-UHFFFAOYSA-N 2,3-di(prop-2-enoyloxy)propyl prop-2-enoate Chemical class C=CC(=O)OCC(OC(=O)C=C)COC(=O)C=C PUGOMSLRUSTQGV-UHFFFAOYSA-N 0.000 description 2
- AVTLBBWTUPQRAY-UHFFFAOYSA-N 2-(2-cyanobutan-2-yldiazenyl)-2-methylbutanenitrile Chemical compound CCC(C)(C#N)N=NC(C)(CC)C#N AVTLBBWTUPQRAY-UHFFFAOYSA-N 0.000 description 2
- URQQDYIVGXOEDA-UHFFFAOYSA-N 2-(2-ethenoxyethoxy)ethyl prop-2-enoate Chemical compound C=COCCOCCOC(=O)C=C URQQDYIVGXOEDA-UHFFFAOYSA-N 0.000 description 2
- FTALTLPZDVFJSS-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl prop-2-enoate Chemical compound CCOCCOCCOC(=O)C=C FTALTLPZDVFJSS-UHFFFAOYSA-N 0.000 description 2
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 2
- DABQKEQFLJIRHU-UHFFFAOYSA-N 2-Propenoic acid, 2-methyl-, 3,3,5-trimethylcyclohexyl ester Chemical compound CC1CC(OC(=O)C(C)=C)CC(C)(C)C1 DABQKEQFLJIRHU-UHFFFAOYSA-N 0.000 description 2
- OWDBMKZHFCSOOL-UHFFFAOYSA-N 2-[2-[2-(2-methylprop-2-enoyloxy)propoxy]propoxy]propyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)COC(C)COC(C)COC(=O)C(C)=C OWDBMKZHFCSOOL-UHFFFAOYSA-N 0.000 description 2
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 2
- GWZMWHWAWHPNHN-UHFFFAOYSA-N 2-hydroxypropyl prop-2-enoate Chemical compound CC(O)COC(=O)C=C GWZMWHWAWHPNHN-UHFFFAOYSA-N 0.000 description 2
- RZVINYQDSSQUKO-UHFFFAOYSA-N 2-phenoxyethyl prop-2-enoate Chemical compound C=CC(=O)OCCOC1=CC=CC=C1 RZVINYQDSSQUKO-UHFFFAOYSA-N 0.000 description 2
- FRIBMENBGGCKPD-UHFFFAOYSA-N 3-(2,3-dimethoxyphenyl)prop-2-enal Chemical compound COC1=CC=CC(C=CC=O)=C1OC FRIBMENBGGCKPD-UHFFFAOYSA-N 0.000 description 2
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 2
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 2
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 2
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 2
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 2
- JHWGFJBTMHEZME-UHFFFAOYSA-N 4-prop-2-enoyloxybutyl prop-2-enoate Chemical compound C=CC(=O)OCCCCOC(=O)C=C JHWGFJBTMHEZME-UHFFFAOYSA-N 0.000 description 2
- SAPGBCWOQLHKKZ-UHFFFAOYSA-N 6-(2-methylprop-2-enoyloxy)hexyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OCCCCCCOC(=O)C(C)=C SAPGBCWOQLHKKZ-UHFFFAOYSA-N 0.000 description 2
- COCLLEMEIJQBAG-UHFFFAOYSA-N 8-methylnonyl 2-methylprop-2-enoate Chemical compound CC(C)CCCCCCCOC(=O)C(C)=C COCLLEMEIJQBAG-UHFFFAOYSA-N 0.000 description 2
- PGDIJTMOHORACQ-UHFFFAOYSA-N 9-prop-2-enoyloxynonyl prop-2-enoate Chemical compound C=CC(=O)OCCCCCCCCCOC(=O)C=C PGDIJTMOHORACQ-UHFFFAOYSA-N 0.000 description 2
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- FVCOIAYSJZGECG-UHFFFAOYSA-N diethylhydroxylamine Chemical compound CCN(O)CC FVCOIAYSJZGECG-UHFFFAOYSA-N 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- DEJRLAVWNDPXGZ-UHFFFAOYSA-N dimethyl(3-trimethoxysilylpropyl)azanium;chloride Chemical compound Cl.CO[Si](OC)(OC)CCCN(C)C DEJRLAVWNDPXGZ-UHFFFAOYSA-N 0.000 description 1
- OWZDULOODZHVCQ-UHFFFAOYSA-N diphenyl-(4-phenylsulfanylphenyl)sulfanium Chemical compound C=1C=C([S+](C=2C=CC=CC=2)C=2C=CC=CC=2)C=CC=1SC1=CC=CC=C1 OWZDULOODZHVCQ-UHFFFAOYSA-N 0.000 description 1
- OZLBDYMWFAHSOQ-UHFFFAOYSA-N diphenyliodanium Chemical compound C=1C=CC=CC=1[I+]C1=CC=CC=C1 OZLBDYMWFAHSOQ-UHFFFAOYSA-N 0.000 description 1
- GMSCBRSQMRDRCD-UHFFFAOYSA-N dodecyl 2-methylprop-2-enoate Chemical compound CCCCCCCCCCCCOC(=O)C(C)=C GMSCBRSQMRDRCD-UHFFFAOYSA-N 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 235000011187 glycerol Nutrition 0.000 description 1
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- 235000019382 gum benzoic Nutrition 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 description 1
- QUPCNWFFTANZPX-UHFFFAOYSA-N hydrogen peroxide;1-methyl-4-propan-2-ylcyclohexane Chemical compound OO.CC(C)C1CCC(C)CC1 QUPCNWFFTANZPX-UHFFFAOYSA-N 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 239000003230 hygroscopic agent Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000004898 kneading Methods 0.000 description 1
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- 239000002184 metal Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000004702 methyl esters Chemical class 0.000 description 1
- 125000002816 methylsulfanyl group Chemical group [H]C([H])([H])S[*] 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- JAYXSROKFZAHRQ-UHFFFAOYSA-N n,n-bis(oxiran-2-ylmethyl)aniline Chemical compound C1OC1CN(C=1C=CC=CC=1)CC1CO1 JAYXSROKFZAHRQ-UHFFFAOYSA-N 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- 125000004108 n-butyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- UMRZSTCPUPJPOJ-KNVOCYPGSA-N norbornane Chemical group C1C[C@H]2CC[C@@H]1C2 UMRZSTCPUPJPOJ-KNVOCYPGSA-N 0.000 description 1
- SLYCYWCVSGPDFR-UHFFFAOYSA-N octadecyltrimethoxysilane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OC)(OC)OC SLYCYWCVSGPDFR-UHFFFAOYSA-N 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- 229940065472 octyl acrylate Drugs 0.000 description 1
- ANISOHQJBAQUQP-UHFFFAOYSA-N octyl prop-2-enoate Chemical compound CCCCCCCCOC(=O)C=C ANISOHQJBAQUQP-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- AHHWIHXENZJRFG-UHFFFAOYSA-N oxetane Chemical group C1COC1 AHHWIHXENZJRFG-UHFFFAOYSA-N 0.000 description 1
- AFEQENGXSMURHA-UHFFFAOYSA-N oxiran-2-ylmethanamine Chemical compound NCC1CO1 AFEQENGXSMURHA-UHFFFAOYSA-N 0.000 description 1
- ULDDEWDFUNBUCM-UHFFFAOYSA-N pentyl prop-2-enoate Chemical compound CCCCCOC(=O)C=C ULDDEWDFUNBUCM-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- WRAQQYDMVSCOTE-UHFFFAOYSA-N phenyl prop-2-enoate Chemical class C=CC(=O)OC1=CC=CC=C1 WRAQQYDMVSCOTE-UHFFFAOYSA-N 0.000 description 1
- IGALFTFNPPBUDN-UHFFFAOYSA-N phenyl-[2,3,4,5-tetrakis(oxiran-2-ylmethyl)phenyl]methanediamine Chemical compound C=1C(CC2OC2)=C(CC2OC2)C(CC2OC2)=C(CC2OC2)C=1C(N)(N)C1=CC=CC=C1 IGALFTFNPPBUDN-UHFFFAOYSA-N 0.000 description 1
- KTNLYTNKBOKXRW-UHFFFAOYSA-N phenyliodanium Chemical compound [IH+]C1=CC=CC=C1 KTNLYTNKBOKXRW-UHFFFAOYSA-N 0.000 description 1
- 125000003356 phenylsulfanyl group Chemical group [*]SC1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920005906 polyester polyol Polymers 0.000 description 1
- 229920000223 polyglycerol Polymers 0.000 description 1
- 229920005650 polypropylene glycol diacrylate Polymers 0.000 description 1
- 229920005651 polypropylene glycol dimethacrylate Polymers 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- BWJUFXUULUEGMA-UHFFFAOYSA-N propan-2-yl propan-2-yloxycarbonyloxy carbonate Chemical compound CC(C)OC(=O)OOC(=O)OC(C)C BWJUFXUULUEGMA-UHFFFAOYSA-N 0.000 description 1
- 239000001294 propane Substances 0.000 description 1
- YXTWPSHEGIZWEU-UHFFFAOYSA-N propoxy propyl carbonate Chemical compound CCCOOC(=O)OCCC YXTWPSHEGIZWEU-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 125000001424 substituent group Chemical group 0.000 description 1
- 239000004250 tert-Butylhydroquinone Substances 0.000 description 1
- OPQYOFWUFGEMRZ-UHFFFAOYSA-N tert-butyl 2,2-dimethylpropaneperoxoate Chemical compound CC(C)(C)OOC(=O)C(C)(C)C OPQYOFWUFGEMRZ-UHFFFAOYSA-N 0.000 description 1
- SJMYWORNLPSJQO-UHFFFAOYSA-N tert-butyl 2-methylprop-2-enoate Chemical compound CC(=C)C(=O)OC(C)(C)C SJMYWORNLPSJQO-UHFFFAOYSA-N 0.000 description 1
- NMOALOSNPWTWRH-UHFFFAOYSA-N tert-butyl 7,7-dimethyloctaneperoxoate Chemical compound CC(C)(C)CCCCCC(=O)OOC(C)(C)C NMOALOSNPWTWRH-UHFFFAOYSA-N 0.000 description 1
- SWAXTRYEYUTSAP-UHFFFAOYSA-N tert-butyl ethaneperoxoate Chemical compound CC(=O)OOC(C)(C)C SWAXTRYEYUTSAP-UHFFFAOYSA-N 0.000 description 1
- 125000000999 tert-butyl group Chemical group [H]C([H])([H])C(*)(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 235000019281 tert-butylhydroquinone Nutrition 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- TUNFSRHWOTWDNC-HKGQFRNVSA-N tetradecanoic acid Chemical compound CCCCCCCCCCCCC[14C](O)=O TUNFSRHWOTWDNC-HKGQFRNVSA-N 0.000 description 1
- YRHRIQCWCFGUEQ-UHFFFAOYSA-N thioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC=CC=C3SC2=C1 YRHRIQCWCFGUEQ-UHFFFAOYSA-N 0.000 description 1
- 150000004992 toluidines Chemical class 0.000 description 1
- WLOQLWBIJZDHET-UHFFFAOYSA-N triphenylsulfonium Chemical compound C1=CC=CC=C1[S+](C=1C=CC=CC=1)C1=CC=CC=C1 WLOQLWBIJZDHET-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F2/00—Processes of polymerisation
- C08F2/44—Polymerisation in the presence of compounding ingredients, e.g. plasticisers, dyestuffs, fillers
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- C—CHEMISTRY; METALLURGY
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
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- C08K5/00—Use of organic ingredients
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- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
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- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
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- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
- C08L63/06—Triglycidylisocyanurates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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Abstract
Description
[2] ハイドロタルサイトに対する酸化カルシウムの割合が質量比で0.1〜1である前記[1]に記載の封止用樹脂組成物。
[3] ハイドロタルサイトの含有量が、樹脂組成物の不揮発分100質量%に対し、10質量%〜70質量%である前記[1]または[2]に記載の封止用樹脂組成物。
[4] さらに、アクリル樹脂およびエポキシ樹脂から選ばれる少なくとも1種の樹脂を含有する前記[1]〜[3]のいずれか一つに記載の封止用樹脂組成物。
[5] さらに、少なくとも1種のアクリル樹脂を含有する前記[1]〜[3]のいずれか一つに記載の封止用樹脂組成物。
[6] アクリル樹脂が、1分子中に3個以上のエチレン性不飽和基を有する化合物を含む前記[4]または[5]に記載の封止用樹脂組成物。
[7] アクリル樹脂が、1分子中に2個以上のエチレン性不飽和基および脂環式構造を有する化合物を含む前記[4]〜[6]のいずれか一つに記載の封止用樹脂組成物。
[8] エチレン性不飽和基が(メタ)アクリロイル基である前記[6]または[7]に記載の封止用樹脂組成物。
[9] 1分子中に2個以上のエチレン性不飽和基および脂環式構造を有する化合物の量が、樹脂組成物全体あたり、5〜75質量%である前記[7]または[8]に記載の封止用樹脂組成物。
[10] ハイドロタルサイトが、半焼成ハイドロタルサイトである前記[1]〜[9]のいずれか一つに記載の封止用樹脂組成物。
[11] さらに、ラジカル重合開始剤を含有する、前記[1]〜[10]のいずれか一つに記載の封止用樹脂組成物。
[12] ラジカル重合開始剤が、光ラジカル重合開始剤および/または熱ラジカル重合開始剤である前記[11]に記載の封止用樹脂組成物。
[13] ラジカル重合開始剤の量が、エチレン性不飽和基を有する化合物100質量部に対して、0.5〜10質量部である前記[11]または[12]に記載の封止用樹脂組成物。
[14] さらに、シランカップリング剤を含む前記[1]〜[13]のいずれか一つに記載の封止用樹脂組成物。
[15] 液状である前記[1]〜[14]のいずれか一つに記載の封止用樹脂組成物。
[16] 有機EL素子の封止用である前記[1]〜[15]のいずれか一つに記載の封止用樹脂組成物。
[17] 前記[1]〜[16]のいずれか一つに記載の封止用樹脂組成物の硬化物で有機EL素子が封止された有機ELデバイス。
本発明の封止用樹脂組成物は、ハイドロタルサイトおよび酸化カルシウムを含有する。本発明の封止用樹脂組成物は、樹脂、ハイドロタルサイト、酸化カルシウムおよび必要に応じて他の成分を混練ローラーや回転ミキサーなどを用いて混合することによって製造することができる。
本発明の封止用樹脂組成物は、ハイドロタルサイトを含有する。ハイドロタルサイトは、未焼成ハイドロタルサイト、半焼成ハイドロタルサイトおよび焼成ハイドロタルサイトに分類することができ、それらのいずれであってもよく、また、1種のみでもよく、2種以上でもよい。
(式中、M2+はMg2+、Zn2+などの2価の金属イオンを表し、M3+はAl3+、Fe3+などの3価の金属イオンを表し、An−はCO3 2−、Cl−、NO3 −などのn価のアニオンを表し、0<x<1であり、0≦m<1であり、nは正の数である。)
式(I)中、M2+は、好ましくはMg2+であり、M3+は、好ましくはAl3+であり、An−は、好ましくはCO3 2−である。
(式中、M2+はMg2+、Zn2+などの2価の金属イオンを表し、An−はCO3 2−、Cl−、NO3−などのn価のアニオンを表し、xは2以上の正の数であり、zは2以下の正の数であり、mは正の数であり、nは正の数である。)
式(II)中、M2+は、好ましくはMg2+であり、An−は、好ましくはCO3 2−である。
飽和吸水率(質量%)
=100×(吸湿後の質量−初期質量)/初期質量 (i)
で求めることができる。
熱重量減少率(質量%)
=100×(加熱前の質量−所定温度に達した時の質量)/加熱前の質量 (ii)で求めることができる。
本発明の封止用樹脂組成物は、酸化カルシウムを含有する。本発明の封止用樹脂組成物中のハイドロタルサイトに対する酸化カルシウムの割合は、本発明の効果が発揮されれば、特に限定されるものではないが、好ましくは、質量比で0.1〜1であり、より好ましくは、質量比で0.1〜0.75であり、さらに好ましくは、質量比で0.15〜0.55である。質量比が0.1よりも低いと、本発明の効果が発揮されにくい傾向となり、質量比が1よりも高いと、樹脂組成物の含水率が増加する、水分遮断性が低下する等の問題が生じる傾向となる。
本発明の封止用樹脂組成物を構成する樹脂は、当該分野において封止用樹脂組成物に用いられるものであれば、特に限定されるものではなく、1種または2種以上を使用することができるが、好ましくは、アクリル樹脂およびエポキシ樹脂から選ばれる少なくとも1種の樹脂であり、より好ましくは、少なくとも1種のアクリル樹脂である。
1分子中に2個以上のエチレン性不飽和基を有する化合物(以下「多官能エチレン性不飽和化合物」と略称することがある)は、1種のみを単独で用いてもよく、2種以上を併用してもよい。多官能エチレン性不飽和化合物は本発明の効果が発揮される範囲で、エポキシ基等の他の官能基を含んでいてもよい。なお、エポキシ基を含む多官能エチレン性不飽和化合物は、本発明では、エポキシ樹脂ではなく、多官能エチレン性不飽和化合物に分類される。
1分子中に3個以上のエチレン性不飽和基を有する化合物を使用する場合、その含有量は、高い水分遮断性を発揮する観点から、樹脂組成物全体あたり、好ましくは2質量%以上、より好ましくは3質量%以上、さらに好ましくは4質量%以上であり、好ましくは70質量%以下、より好ましくは65質量%以下、さらに好ましくは60質量%以下である。
1分子中に1個のエチレン性不飽和基を有する化合物(以下「単官能エチレン性不飽和化合物」と略称する場合がある)を含有していてもよい。「単官能エチレン性不飽和化合物」は、後述するように、希釈剤として本発明の封止用樹脂組成物に含まれる場合がある。単官能エチレン性不飽和化合物は、本発明の効果が発揮される範囲で、エポキシ基等の他の官能基を含んでいてもよい。このような化合物としては、例えば、1分子中に1個以上のエポキシ基および1個のエチレン性不飽和基を有する化合物が挙げられる。なお、エポキシ基を含む単官能エチレン性不飽和化合物は、本発明では、エポキシ樹脂ではなく、単官能エチレン性不飽和化合物に分類される。
上述の「多官能エチレン性不飽和化合物」および「単官能エチレン性不飽和化合物」をまとめて「エチレン性不飽和基を有する化合物」と記載する。このエチレン性不飽和基を有する化合物の含有量は、樹脂組成物全体あたり、好ましくは30〜80質量%、より好ましくは35〜80質量%、さらに好ましくは40〜80質量%である。
ラジカル重合開始剤は、1種のみでもよく、2種以上でもよい。ラジカル重合開始剤は、光ラジカル重合開始剤でもよく、熱ラジカル重合開始剤でもよい。即ち、ラジカル重合開始剤は、光ラジカル重合開始剤および/または熱ラジカル重合開始剤である。ラジカル重合開始剤は、好ましくは光ラジカル重合開始剤または熱ラジカル重合開始剤である。光ラジカル重合開始剤および熱ラジカル重合開始剤は、いずれも、1種のみでもよく、2種以上でもよい。
アゾ化合物としては、例えば、2,2’−アゾビス(イソブチロニトリル)、2,2’−アゾビス(2,4−ジメチルバレロニトリル)、2,2’−アゾビス(2−メチルブチロニトリル)、4,4’−アゾビス(4−シアノ吉草酸)、2,2’−アゾビス(2−メチル)二塩酸塩、1,1’−アゾビス(1−アセトキシ−1−フェニルエタン、1,1’−アゾビス(シクロヘキサン−1−カルボニトリル)、ジメチル2,2’−アゾビス(イソブチレート)、2,2’−アゾビス(4−メトキシ−2,4−ジメチルバレロニトリル)、2,2’−アゾビス(2−メチルプロピオニトリル)、2,2’−アゾビス(2−メチルブチロニトリル)、1−[(1−シアノ−1−メチルエチル)アゾ]ホルムアミド、2−フェニルアゾ−4−メトキシ−2,4−ジメチルバレロニトリル、ジメチル 2,2’−アゾビス(2−メチルプロピオネート)、2,2’−アゾビス(N−ブチル−2−メチルプロピオンアミド等が挙げられる。
エポキシ樹脂は、1種のみでもよく、2種以上でもよい。1分子中に1個のエポキシ基を有するエポキシ樹脂を「単官能エポキシ樹脂」と、1分子中に2個のエポキシ基を有するエポキシ樹脂を「2官能エポキシ樹脂」と略称することがある。1分子中に3個以上のエポキシ基を有するエポキシ樹脂も同様に略称することがある。
本発明の封止用樹脂組成物は、その効果を損なわない範囲で、上述の成分とは異なる他の成分を含有してもよい。
本発明の封止用樹脂組成物は、液状封止用樹脂組成物として適当な粘度を達成する上で希釈剤を含有していてもよい。E型粘度計で25℃の温度条件下で測定した希釈剤の粘度は、好ましくは0.1〜5000mPa・s、より好ましくは0.1〜2500mPa・s、さらに好ましくは0.1〜1000mPa・sである。
本発明の封止用樹脂組成物は、光カチオン重合開始剤を含有していてもよい。光カチオン重合開始剤は、1種のみでもよく、2種以上でもよい。
本発明の封止用樹脂組成物は、シランカップリング剤を含有していてもよい。シランカップリング剤は、1種のみでもよく、2種以上でもよい。
本発明の封止用樹脂組成物は、重合禁止剤を含有していてもよい。重合禁止剤は、1種のみでもよく、2種以上でもよい。
本発明の封止用樹脂組成物の硬化物で有機EL素子が封止された有機ELデバイスは、例えば、基板上の有機EL素子の上から本発明の封止用樹脂組成物を塗布した後、該樹脂組成物を硬化させることによって製造することができる。
なお、以下に記載の量における「部」は、特段の記載が無い限り、「質量部」を意味する。
2官能脂環式アクリレート(ダイセル・オルネクス社製「IRR214−K」)90部と、6官能アクリレート(日本化薬社製「DPCA−60」)30部と、2官能脂肪族アクリレート(協栄社化学社製「1.9ND−A」)30部と、重合禁止剤(和光純薬社製「Q−1301」)0.05部と、市販のハイドロタルサイトA(半焼成ハイドロタルサイト、BET比表面積:13m2/g、平均粒子径:400nm))90部と、市販の酸化カルシウム30部(喜多村社製)とを配合し、高速回転ミキサーで均一に分散した。その後、重合開始剤(BASF社製「Irgacure 1173」)11部を添加し、再度分散して、樹脂組成物を得た。
半焼成ハイドロタルサイトAと市販のハイドロタルサイトD(未焼成ハイドロタルサイト、平均粒子径:400nm)を併用し、表1に記載した各成分を所定の配合比で撹拌混合して、樹脂組成物を得た。
半焼成ハイドロタルサイトAと市販のハイドロタルサイトC(焼成ハイドロタルサイト、平均粒子径:400nm)を併用し、表1に記載した各成分を所定の配合比で撹拌混合して、樹脂組成物を得た。
実施例1と同様にして、表1に記載した各成分を所定の配合比で撹拌混合して、実施例4〜6、比較例1〜4の樹脂組成物を得た。
各ハイドロタルサイトを天秤にて1.5g量りとり、初期質量を測定した。大気圧下、60℃、90%RH(相対湿度)に設定した小型環境試験器(エスペック社製SH−222)に200時間静置して、吸湿後の質量を測定し、上記式(i)を用いて飽和吸水率を求めた。結果を表1に示す。
日立ハイテクサイエンス社製TG/DTA EXSTAR6300を用いて、各ハイドロタルサイトの熱重量分析を行った。AL製のサンプルパンにハイドロタルサイトを10mg秤量し、蓋をせずオープンの状態で、窒素流量200mL/分の雰囲気下で、30℃から550℃まで10℃/分で昇温した。上記式(ii)を用いて、280℃および380℃における熱重量減少率を求めた。結果を表1に表す。
粉末X線回折の測定は、粉末X線回折装置(PANalytical社製、Empyrean)により、対陰極CuKα(1.5405Å)、電圧:45V、電流:40mA、サンプリング幅:0.0260°、走査速度:0.0657°/s、測定回折角範囲(2θ):5.0131〜79.9711°の条件で行った。ピークサーチは、回折装置付属のソフトウエアのピークサーチ機能を利用し、「最小有意度:0.50、最小ピークチップ:0.01°、最大ピークチップ:1.00°、ピークベース幅:2.00°、方法:2次微分の最小値」の条件で行った。2θが8〜18°の範囲内で現れたスプリットした二つのピーク、または二つのピークの合成によりショルダーを有するピークを検出し、低角側に現れたピークまたはショルダーの回折強度(=低角側回折強度)と、高角側に現れるピークまたはショルダーの回折強度(=高角側回折強度)を測定し、相対強度比(=低角側回折強度/高角側回折強度)を算出した。結果を表1に表す。
実施例及び比較例で調製した樹脂組成物を80℃のオーブンで一週間保管した後、カールフィッシャー水分測定装置(三菱ケミカルアナリテック社製、CA−200)を用いて、樹脂組成物中に含まれる水分を測定した。130℃の炉内で加熱時に検出される含水率を以下の基準で評価した。その結果を表2に示す。
良好(○):1000ppm未満
可 (△):1000ppm以上1500ppm未満
不良(×):1500ppm以上
ガラス基板上にCa 200nmを成膜した後、調製した樹脂組成物をCa上に塗布し硬化処理を施した。100℃で30分加熱した後のCa膜面の劣化有無を確認し、以下の基準で評価した。その結果を表2に示す。
良好(○):Ca膜面の劣化無し
不良(×):Ca膜面の顕著な劣化あり
まず、酸化インジウムスズ(ITO)付ガラス基板(ジオマテック社製)に発光面積が4mm2となるように有機EL素子(有機膜の厚さ:110nm、陰極の厚さ:10nm)を形成させる。次に有機EL素子上に化学気相成長法(CVD法)を用いて窒化膜(厚さ:500nm)を形成する。次いで、実施例1で作製した組成物を、窒化膜付の有機EL素子の周囲を囲うように塗布した後、その上から無アルカリガラス板を重ねて積層体(無アルカリガラス板/組成物層/窒化膜付の有機EL素子/ITO付ガラス基板)を調製する。該積層体を100℃で30分間加熱して組成物を硬化させることで、有機EL素子を封止した積層体を製造する(硬化物の厚さ:10μm)。
Claims (17)
- ハイドロタルサイトおよび酸化カルシウムを含有する封止用樹脂組成物。
- ハイドロタルサイトに対する酸化カルシウムの割合が質量比で0.1〜1である請求項1に記載の封止用樹脂組成物。
- ハイドロタルサイトの含有量が、樹脂組成物の不揮発分100質量%に対し、10質量%〜70質量%である請求項1または2に記載の封止用樹脂組成物。
- さらに、アクリル樹脂およびエポキシ樹脂から選ばれる少なくとも1種の樹脂を含有する請求項1〜3のいずれか1項に記載の封止用樹脂組成物。
- さらに、少なくとも1種のアクリル樹脂を含有する請求項1〜3のいずれか1項に記載の封止用樹脂組成物。
- アクリル樹脂が、1分子中に3個以上のエチレン性不飽和基を有する化合物を含む請求項4または5に記載の封止用樹脂組成物。
- アクリル樹脂が、1分子中に2個以上のエチレン性不飽和基および脂環式構造を有する化合物を含む請求項4〜6のいずれか1項に記載の封止用樹脂組成物。
- エチレン性不飽和基が(メタ)アクリロイル基である請求項6または7に記載の封止用樹脂組成物。
- 1分子中に2個以上のエチレン性不飽和基および脂環式構造を有する化合物の量が、樹脂組成物全体あたり、5〜75質量%である請求項7または8に記載の封止用樹脂組成物。
- ハイドロタルサイトが、半焼成ハイドロタルサイトである請求項1〜9のいずれか1項に記載の封止用樹脂組成物。
- さらに、ラジカル重合開始剤を含有する、請求項1〜10のいずれか1項に記載の封止用樹脂組成物。
- ラジカル重合開始剤が、光ラジカル重合開始剤および/または熱ラジカル重合開始剤である請求項11に記載の封止用樹脂組成物。
- ラジカル重合開始剤の量が、エチレン性不飽和基を有する化合物100質量部に対して、0.5〜10質量部である請求項11または12に記載の封止用樹脂組成物。
- さらに、シランカップリング剤を含む請求項1〜13のいずれか1項に記載の封止用樹脂組成物。
- 液状である請求項1〜14のいずれか1項に記載の封止用樹脂組成物。
- 有機EL素子の封止用である請求項1〜15のいずれか1項に記載の封止用樹脂組成物。
- 請求項1〜16のいずれか1項に記載の封止用樹脂組成物の硬化物で有機EL素子が封止された有機ELデバイス。
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