WO2015068805A1 - 封止用樹脂組成物 - Google Patents
封止用樹脂組成物 Download PDFInfo
- Publication number
- WO2015068805A1 WO2015068805A1 PCT/JP2014/079588 JP2014079588W WO2015068805A1 WO 2015068805 A1 WO2015068805 A1 WO 2015068805A1 JP 2014079588 W JP2014079588 W JP 2014079588W WO 2015068805 A1 WO2015068805 A1 WO 2015068805A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- resin composition
- resin
- sealing
- mass
- sheet
- Prior art date
Links
- 239000011342 resin composition Substances 0.000 title claims abstract description 143
- 238000007789 sealing Methods 0.000 title claims abstract description 52
- 229920005989 resin Polymers 0.000 claims abstract description 80
- 239000011347 resin Substances 0.000 claims abstract description 78
- 229920002367 Polyisobutene Polymers 0.000 claims abstract description 24
- 229920005672 polyolefin resin Polymers 0.000 claims abstract description 21
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 claims description 22
- 229920001577 copolymer Polymers 0.000 claims description 21
- 229910044991 metal oxide Inorganic materials 0.000 claims description 21
- 150000004706 metal oxides Chemical class 0.000 claims description 21
- 230000035699 permeability Effects 0.000 claims description 21
- 150000003505 terpenes Chemical class 0.000 claims description 20
- 235000007586 terpenes Nutrition 0.000 claims description 20
- VXNZUUAINFGPBY-UHFFFAOYSA-N 1-Butene Chemical compound CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 claims description 18
- 125000000524 functional group Chemical group 0.000 claims description 16
- 239000011256 inorganic filler Substances 0.000 claims description 12
- 229910003475 inorganic filler Inorganic materials 0.000 claims description 12
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 9
- 239000005977 Ethylene Substances 0.000 claims description 9
- 150000001336 alkenes Chemical class 0.000 claims description 8
- 239000000178 monomer Substances 0.000 claims description 8
- 125000004018 acid anhydride group Chemical group 0.000 claims description 6
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 6
- 238000002834 transmittance Methods 0.000 claims description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 30
- -1 hydrogenated cyclic olefin Chemical class 0.000 description 23
- 239000007788 liquid Substances 0.000 description 20
- 239000002245 particle Substances 0.000 description 19
- 239000010408 film Substances 0.000 description 18
- 239000000047 product Substances 0.000 description 18
- 239000002966 varnish Substances 0.000 description 17
- 239000000203 mixture Substances 0.000 description 15
- 238000001723 curing Methods 0.000 description 14
- 238000000034 method Methods 0.000 description 14
- 239000003208 petroleum Substances 0.000 description 14
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 13
- 239000006087 Silane Coupling Agent Substances 0.000 description 12
- 239000010410 layer Substances 0.000 description 12
- 239000000243 solution Substances 0.000 description 12
- VQTUBCCKSQIDNK-UHFFFAOYSA-N Isobutene Chemical group CC(C)=C VQTUBCCKSQIDNK-UHFFFAOYSA-N 0.000 description 11
- 229920000642 polymer Polymers 0.000 description 11
- 239000000126 substance Substances 0.000 description 10
- 239000000853 adhesive Substances 0.000 description 9
- 230000001070 adhesive effect Effects 0.000 description 9
- 125000003118 aryl group Chemical group 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 9
- 230000000694 effects Effects 0.000 description 9
- 239000002985 plastic film Substances 0.000 description 9
- 229920006255 plastic film Polymers 0.000 description 9
- 229920001195 polyisoprene Polymers 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 8
- 239000005062 Polybutadiene Substances 0.000 description 7
- 229920002857 polybutadiene Polymers 0.000 description 7
- 239000012756 surface treatment agent Substances 0.000 description 7
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical compound C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 6
- RRHGJUQNOFWUDK-UHFFFAOYSA-N Isoprene Chemical compound CC(=C)C=C RRHGJUQNOFWUDK-UHFFFAOYSA-N 0.000 description 6
- 125000002723 alicyclic group Chemical group 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 238000009826 distribution Methods 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 239000012948 isocyanate Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 6
- 239000002184 metal Substances 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- BRPQOXSCLDDYGP-UHFFFAOYSA-N calcium oxide Chemical compound [O-2].[Ca+2] BRPQOXSCLDDYGP-UHFFFAOYSA-N 0.000 description 5
- 239000000292 calcium oxide Substances 0.000 description 5
- ODINCKMPIJJUCX-UHFFFAOYSA-N calcium oxide Inorganic materials [Ca]=O ODINCKMPIJJUCX-UHFFFAOYSA-N 0.000 description 5
- 235000014113 dietary fatty acids Nutrition 0.000 description 5
- 239000000194 fatty acid Substances 0.000 description 5
- 229930195729 fatty acid Natural products 0.000 description 5
- 150000004665 fatty acids Chemical class 0.000 description 5
- 230000002349 favourable effect Effects 0.000 description 5
- 239000000395 magnesium oxide Substances 0.000 description 5
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 5
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 4
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 4
- 239000002253 acid Substances 0.000 description 4
- 150000001343 alkyl silanes Chemical class 0.000 description 4
- IAQRGUVFOMOMEM-UHFFFAOYSA-N but-2-ene Chemical compound CC=CC IAQRGUVFOMOMEM-UHFFFAOYSA-N 0.000 description 4
- 239000011362 coarse particle Substances 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 4
- ZSWFCLXCOIISFI-UHFFFAOYSA-N cyclopentadiene Chemical compound C1C=CC=C1 ZSWFCLXCOIISFI-UHFFFAOYSA-N 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- 238000013007 heat curing Methods 0.000 description 4
- 229920001519 homopolymer Polymers 0.000 description 4
- 238000005259 measurement Methods 0.000 description 4
- 238000002156 mixing Methods 0.000 description 4
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 4
- 239000003566 sealing material Substances 0.000 description 4
- 229910000077 silane Inorganic materials 0.000 description 4
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 3
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 description 3
- UMHKOAYRTRADAT-UHFFFAOYSA-N [hydroxy(octoxy)phosphoryl] octyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OP(O)(=O)OCCCCCCCC UMHKOAYRTRADAT-UHFFFAOYSA-N 0.000 description 3
- 239000002390 adhesive tape Substances 0.000 description 3
- 230000015556 catabolic process Effects 0.000 description 3
- 229920006026 co-polymeric resin Polymers 0.000 description 3
- 239000007822 coupling agent Substances 0.000 description 3
- 238000006731 degradation reaction Methods 0.000 description 3
- 230000006866 deterioration Effects 0.000 description 3
- GDVKFRBCXAPAQJ-UHFFFAOYSA-A dialuminum;hexamagnesium;carbonate;hexadecahydroxide Chemical compound [OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[OH-].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Mg+2].[Al+3].[Al+3].[O-]C([O-])=O GDVKFRBCXAPAQJ-UHFFFAOYSA-A 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 239000011888 foil Substances 0.000 description 3
- 238000005227 gel permeation chromatography Methods 0.000 description 3
- 229960001545 hydrotalcite Drugs 0.000 description 3
- 229910001701 hydrotalcite Inorganic materials 0.000 description 3
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 3
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 239000003960 organic solvent Substances 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- MSFGZHUJTJBYFA-UHFFFAOYSA-M sodium dichloroisocyanurate Chemical compound [Na+].ClN1C(=O)[N-]C(=O)N(Cl)C1=O MSFGZHUJTJBYFA-UHFFFAOYSA-M 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000006104 solid solution Substances 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- 238000004381 surface treatment Methods 0.000 description 3
- 239000000454 talc Substances 0.000 description 3
- 229910052623 talc Inorganic materials 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- PMJHHCWVYXUKFD-SNAWJCMRSA-N (E)-1,3-pentadiene Chemical compound C\C=C\C=C PMJHHCWVYXUKFD-SNAWJCMRSA-N 0.000 description 2
- IANQTJSKSUMEQM-UHFFFAOYSA-N 1-benzofuran Chemical compound C1=CC=C2OC=CC2=C1 IANQTJSKSUMEQM-UHFFFAOYSA-N 0.000 description 2
- YBYIRNPNPLQARY-UHFFFAOYSA-N 1H-indene Chemical compound C1=CC=C2CC=CC2=C1 YBYIRNPNPLQARY-UHFFFAOYSA-N 0.000 description 2
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 2
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 2
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 2
- NLXLAEXVIDQMFP-UHFFFAOYSA-N Ammonia chloride Chemical compound [NH4+].[Cl-] NLXLAEXVIDQMFP-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920002284 Cellulose triacetate Polymers 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 2
- 239000004372 Polyvinyl alcohol Substances 0.000 description 2
- 235000021355 Stearic acid Nutrition 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 2
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- QVQLCTNNEUAWMS-UHFFFAOYSA-N barium oxide Chemical compound [Ba]=O QVQLCTNNEUAWMS-UHFFFAOYSA-N 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 229920001400 block copolymer Polymers 0.000 description 2
- INLLPKCGLOXCIV-UHFFFAOYSA-N bromoethene Chemical compound BrC=C INLLPKCGLOXCIV-UHFFFAOYSA-N 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- XNMQEEKYCVKGBD-UHFFFAOYSA-N dimethylacetylene Natural products CC#CC XNMQEEKYCVKGBD-UHFFFAOYSA-N 0.000 description 2
- 239000010459 dolomite Substances 0.000 description 2
- 229910000514 dolomite Inorganic materials 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229920000578 graft copolymer Polymers 0.000 description 2
- IPCSVZSSVZVIGE-UHFFFAOYSA-N hexadecanoic acid Chemical compound CCCCCCCCCCCCCCCC(O)=O IPCSVZSSVZVIGE-UHFFFAOYSA-N 0.000 description 2
- FFUAGWLWBBFQJT-UHFFFAOYSA-N hexamethyldisilazane Chemical compound C[Si](C)(C)N[Si](C)(C)C FFUAGWLWBBFQJT-UHFFFAOYSA-N 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000007561 laser diffraction method Methods 0.000 description 2
- 238000000691 measurement method Methods 0.000 description 2
- UAEPNZWRGJTJPN-UHFFFAOYSA-N methylcyclohexane Chemical compound CC1CCCCC1 UAEPNZWRGJTJPN-UHFFFAOYSA-N 0.000 description 2
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 2
- 239000010445 mica Substances 0.000 description 2
- 229910052618 mica group Inorganic materials 0.000 description 2
- UTOPWMOLSKOLTQ-UHFFFAOYSA-N octacosanoic acid Chemical compound CCCCCCCCCCCCCCCCCCCCCCCCCCCC(O)=O UTOPWMOLSKOLTQ-UHFFFAOYSA-N 0.000 description 2
- QIQXTHQIDYTFRH-UHFFFAOYSA-N octadecanoic acid Chemical compound CCCCCCCCCCCCCCCCCC(O)=O QIQXTHQIDYTFRH-UHFFFAOYSA-N 0.000 description 2
- OQCDKBAXFALNLD-UHFFFAOYSA-N octadecanoic acid Natural products CCCCCCCC(C)CCCCCCCCC(O)=O OQCDKBAXFALNLD-UHFFFAOYSA-N 0.000 description 2
- SLYCYWCVSGPDFR-UHFFFAOYSA-N octadecyltrimethoxysilane Chemical compound CCCCCCCCCCCCCCCCCC[Si](OC)(OC)OC SLYCYWCVSGPDFR-UHFFFAOYSA-N 0.000 description 2
- 239000012788 optical film Substances 0.000 description 2
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- 229920002223 polystyrene Polymers 0.000 description 2
- 229920002451 polyvinyl alcohol Polymers 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000000790 scattering method Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 229910052814 silicon oxide Inorganic materials 0.000 description 2
- 239000008117 stearic acid Substances 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- IATRAKWUXMZMIY-UHFFFAOYSA-N strontium oxide Chemical compound [O-2].[Sr+2] IATRAKWUXMZMIY-UHFFFAOYSA-N 0.000 description 2
- 150000003440 styrenes Chemical class 0.000 description 2
- TXDNPSYEJHXKMK-UHFFFAOYSA-N sulfanylsilane Chemical compound S[SiH3] TXDNPSYEJHXKMK-UHFFFAOYSA-N 0.000 description 2
- 239000010936 titanium Substances 0.000 description 2
- 229910052719 titanium Inorganic materials 0.000 description 2
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 2
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- UGXMKSYKRKUMGY-UHFFFAOYSA-N 1,3,5,2,4,6-triazatrisilinane Chemical compound N1[SiH2]N[SiH2]N[SiH2]1 UGXMKSYKRKUMGY-UHFFFAOYSA-N 0.000 description 1
- KWKAKUADMBZCLK-UHFFFAOYSA-N 1-octene Chemical group CCCCCCC=C KWKAKUADMBZCLK-UHFFFAOYSA-N 0.000 description 1
- VHJRQDUWYYJDBE-UHFFFAOYSA-N 11-trimethoxysilylundecane-1-thiol Chemical compound CO[Si](OC)(OC)CCCCCCCCCCCS VHJRQDUWYYJDBE-UHFFFAOYSA-N 0.000 description 1
- HIQAWCBKWSQMRQ-UHFFFAOYSA-N 16-methylheptadecanoic acid;2-methylprop-2-enoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(=C)C(O)=O.CC(=C)C(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O HIQAWCBKWSQMRQ-UHFFFAOYSA-N 0.000 description 1
- IEKHISJGRIEHRE-UHFFFAOYSA-N 16-methylheptadecanoic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O.CC(C)CCCCCCCCCCCCCCC(O)=O IEKHISJGRIEHRE-UHFFFAOYSA-N 0.000 description 1
- DJOYTAUERRJRAT-UHFFFAOYSA-N 2-(n-methyl-4-nitroanilino)acetonitrile Chemical compound N#CCN(C)C1=CC=C([N+]([O-])=O)C=C1 DJOYTAUERRJRAT-UHFFFAOYSA-N 0.000 description 1
- TWJNQYPJQDRXPH-UHFFFAOYSA-N 2-cyanobenzohydrazide Chemical compound NNC(=O)C1=CC=CC=C1C#N TWJNQYPJQDRXPH-UHFFFAOYSA-N 0.000 description 1
- KKOHCQAVIJDYAF-UHFFFAOYSA-N 2-dodecylbenzenesulfonic acid;propan-2-ol;titanium Chemical compound [Ti].CC(C)O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O.CCCCCCCCCCCCC1=CC=CC=C1S(O)(=O)=O KKOHCQAVIJDYAF-UHFFFAOYSA-N 0.000 description 1
- KTXWGMUMDPYXNN-UHFFFAOYSA-N 2-ethylhexan-1-olate;titanium(4+) Chemical compound [Ti+4].CCCCC(CC)C[O-].CCCCC(CC)C[O-].CCCCC(CC)C[O-].CCCCC(CC)C[O-] KTXWGMUMDPYXNN-UHFFFAOYSA-N 0.000 description 1
- DTQHSUHILQWIOM-UHFFFAOYSA-J 2-hydroxypropanoate titanium(4+) dihydroxide Chemical compound O[Ti++]O.CC(O)C([O-])=O.CC(O)C([O-])=O DTQHSUHILQWIOM-UHFFFAOYSA-J 0.000 description 1
- 125000003504 2-oxazolinyl group Chemical group O1C(=NCC1)* 0.000 description 1
- ZDZYGYFHTPFREM-UHFFFAOYSA-N 3-[3-aminopropyl(dimethoxy)silyl]oxypropan-1-amine Chemical compound NCCC[Si](OC)(OC)OCCCN ZDZYGYFHTPFREM-UHFFFAOYSA-N 0.000 description 1
- ZYAASQNKCWTPKI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propan-1-amine Chemical compound CO[Si](C)(OC)CCCN ZYAASQNKCWTPKI-UHFFFAOYSA-N 0.000 description 1
- IKYAJDOSWUATPI-UHFFFAOYSA-N 3-[dimethoxy(methyl)silyl]propane-1-thiol Chemical compound CO[Si](C)(OC)CCCS IKYAJDOSWUATPI-UHFFFAOYSA-N 0.000 description 1
- BYIMSFXYUSZVLI-UHFFFAOYSA-N 3-methoxysilylpropan-1-amine Chemical compound CO[SiH2]CCCN BYIMSFXYUSZVLI-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- KBQVDAIIQCXKPI-UHFFFAOYSA-N 3-trimethoxysilylpropyl prop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C=C KBQVDAIIQCXKPI-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 239000004251 Ammonium lactate Substances 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- 229920002799 BoPET Polymers 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- SRORDPCXIPXEAX-UHFFFAOYSA-N CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC.CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC Chemical compound CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC.CCCCCCCCCCCCCP(CCCCCCCCCCCCC)(O)(OCCCCCCCC)OCCCCCCCC SRORDPCXIPXEAX-UHFFFAOYSA-N 0.000 description 1
- KLQSRTKDOLFPQJ-UHFFFAOYSA-M CCCCO[Ti+](OCCCC)OCCCC.CCCCCCCCCCCCCCCCCC([O-])=O Chemical compound CCCCO[Ti+](OCCCC)OCCCC.CCCCCCCCCCCCCCCCCC([O-])=O KLQSRTKDOLFPQJ-UHFFFAOYSA-M 0.000 description 1
- 235000008733 Citrus aurantifolia Nutrition 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229920000089 Cyclic olefin copolymer Polymers 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- AEMRFAOFKBGASW-UHFFFAOYSA-M Glycolate Chemical compound OCC([O-])=O AEMRFAOFKBGASW-UHFFFAOYSA-M 0.000 description 1
- 229920013646 Hycar Polymers 0.000 description 1
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 description 1
- 235000021360 Myristic acid Nutrition 0.000 description 1
- TUNFSRHWOTWDNC-UHFFFAOYSA-N Myristic acid Natural products CCCCCCCCCCCCCC(O)=O TUNFSRHWOTWDNC-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- DRNPGEPMHMPIQU-UHFFFAOYSA-N O.[Ti].[Ti].CCCCO.CCCCO.CCCCO.CCCCO.CCCCO.CCCCO Chemical compound O.[Ti].[Ti].CCCCO.CCCCO.CCCCO.CCCCO.CCCCO.CCCCO DRNPGEPMHMPIQU-UHFFFAOYSA-N 0.000 description 1
- 229920005987 OPPANOL® Polymers 0.000 description 1
- 235000021314 Palmitic acid Nutrition 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 235000005128 Sapium sebiferum Nutrition 0.000 description 1
- 244000057114 Sapium sebiferum Species 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- UCKMPCXJQFINFW-UHFFFAOYSA-N Sulphide Chemical compound [S-2] UCKMPCXJQFINFW-UHFFFAOYSA-N 0.000 description 1
- 235000011941 Tilia x europaea Nutrition 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- DUYKOAQJUCADEC-UHFFFAOYSA-N [SiH4].N1=NN=CC=C1 Chemical compound [SiH4].N1=NN=CC=C1 DUYKOAQJUCADEC-UHFFFAOYSA-N 0.000 description 1
- NOKSMMGULAYSTD-UHFFFAOYSA-N [SiH4].N=C=O Chemical compound [SiH4].N=C=O NOKSMMGULAYSTD-UHFFFAOYSA-N 0.000 description 1
- TWSOFXCPBRATKD-UHFFFAOYSA-N [diphenyl-(triphenylsilylamino)silyl]benzene Chemical compound C=1C=CC=CC=1[Si](C=1C=CC=CC=1)(C=1C=CC=CC=1)N[Si](C=1C=CC=CC=1)(C=1C=CC=CC=1)C1=CC=CC=C1 TWSOFXCPBRATKD-UHFFFAOYSA-N 0.000 description 1
- 239000002318 adhesion promoter Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 150000004703 alkoxides Chemical class 0.000 description 1
- 229920000180 alkyd Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- OJMOMXZKOWKUTA-UHFFFAOYSA-N aluminum;borate Chemical compound [Al+3].[O-]B([O-])[O-] OJMOMXZKOWKUTA-UHFFFAOYSA-N 0.000 description 1
- 125000003368 amide group Chemical group 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 235000019270 ammonium chloride Nutrition 0.000 description 1
- 229940059265 ammonium lactate Drugs 0.000 description 1
- 235000019286 ammonium lactate Nutrition 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 239000002518 antifoaming agent Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- RZOBLYBZQXQGFY-HSHFZTNMSA-N azanium;(2r)-2-hydroxypropanoate Chemical compound [NH4+].C[C@@H](O)C([O-])=O RZOBLYBZQXQGFY-HSHFZTNMSA-N 0.000 description 1
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 description 1
- 229910002113 barium titanate Inorganic materials 0.000 description 1
- 229910021523 barium zirconate Inorganic materials 0.000 description 1
- DQBAOWPVHRWLJC-UHFFFAOYSA-N barium(2+);dioxido(oxo)zirconium Chemical compound [Ba+2].[O-][Zr]([O-])=O DQBAOWPVHRWLJC-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 229910002115 bismuth titanate Inorganic materials 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 238000011088 calibration curve Methods 0.000 description 1
- 125000004432 carbon atom Chemical group C* 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000013522 chelant Substances 0.000 description 1
- 239000007809 chemical reaction catalyst Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 239000013065 commercial product Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate group Chemical group [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 description 1
- KQAHMVLQCSALSX-UHFFFAOYSA-N decyl(trimethoxy)silane Chemical compound CCCCCCCCCC[Si](OC)(OC)OC KQAHMVLQCSALSX-UHFFFAOYSA-N 0.000 description 1
- 230000003111 delayed effect Effects 0.000 description 1
- 238000007607 die coating method Methods 0.000 description 1
- OTARVPUIYXHRRB-UHFFFAOYSA-N diethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](C)(OCC)CCCOCC1CO1 OTARVPUIYXHRRB-UHFFFAOYSA-N 0.000 description 1
- JJQZDUKDJDQPMQ-UHFFFAOYSA-N dimethoxy(dimethyl)silane Chemical compound CO[Si](C)(C)OC JJQZDUKDJDQPMQ-UHFFFAOYSA-N 0.000 description 1
- WHGNXNCOTZPEEK-UHFFFAOYSA-N dimethoxy-methyl-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](C)(OC)CCCOCC1CO1 WHGNXNCOTZPEEK-UHFFFAOYSA-N 0.000 description 1
- HTDKEJXHILZNPP-UHFFFAOYSA-N dioctyl hydrogen phosphate Chemical compound CCCCCCCCOP(O)(=O)OCCCCCCCC HTDKEJXHILZNPP-UHFFFAOYSA-N 0.000 description 1
- XMQYIPNJVLNWOE-UHFFFAOYSA-N dioctyl hydrogen phosphite Chemical compound CCCCCCCCOP(O)OCCCCCCCC XMQYIPNJVLNWOE-UHFFFAOYSA-N 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- VTIXMGZYGRZMAW-UHFFFAOYSA-N ditridecyl hydrogen phosphite Chemical compound CCCCCCCCCCCCCOP(O)OCCCCCCCCCCCCC VTIXMGZYGRZMAW-UHFFFAOYSA-N 0.000 description 1
- 238000007606 doctor blade method Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 1
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 1
- MBGQQKKTDDNCSG-UHFFFAOYSA-N ethenyl-diethoxy-methylsilane Chemical compound CCO[Si](C)(C=C)OCC MBGQQKKTDDNCSG-UHFFFAOYSA-N 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- CZWLNMOIEMTDJY-UHFFFAOYSA-N hexyl(trimethoxy)silane Chemical compound CCCCCC[Si](OC)(OC)OC CZWLNMOIEMTDJY-UHFFFAOYSA-N 0.000 description 1
- 238000007757 hot melt coating Methods 0.000 description 1
- 150000002429 hydrazines Chemical class 0.000 description 1
- 150000004678 hydrides Chemical class 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 150000002513 isocyanates Chemical class 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000004571 lime Substances 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000011777 magnesium Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- GYNNXHKOJHMOHS-UHFFFAOYSA-N methyl-cycloheptane Natural products CC1CCCCCC1 GYNNXHKOJHMOHS-UHFFFAOYSA-N 0.000 description 1
- PHQOGHDTIVQXHL-UHFFFAOYSA-N n'-(3-trimethoxysilylpropyl)ethane-1,2-diamine Chemical compound CO[Si](OC)(OC)CCCNCCN PHQOGHDTIVQXHL-UHFFFAOYSA-N 0.000 description 1
- XFFPIAQRIDTSIZ-UHFFFAOYSA-N n'-[3-(dimethoxymethylsilyl)propyl]ethane-1,2-diamine Chemical compound COC(OC)[SiH2]CCCNCCN XFFPIAQRIDTSIZ-UHFFFAOYSA-N 0.000 description 1
- KBJFYLLAMSZSOG-UHFFFAOYSA-N n-(3-trimethoxysilylpropyl)aniline Chemical compound CO[Si](OC)(OC)CCCNC1=CC=CC=C1 KBJFYLLAMSZSOG-UHFFFAOYSA-N 0.000 description 1
- WQEPLUUGTLDZJY-UHFFFAOYSA-N n-Pentadecanoic acid Natural products CCCCCCCCCCCCCCC(O)=O WQEPLUUGTLDZJY-UHFFFAOYSA-N 0.000 description 1
- DVYVMJLSUSGYMH-UHFFFAOYSA-N n-methyl-3-trimethoxysilylpropan-1-amine Chemical compound CNCCC[Si](OC)(OC)OC DVYVMJLSUSGYMH-UHFFFAOYSA-N 0.000 description 1
- 238000006386 neutralization reaction Methods 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- TVMXDCGIABBOFY-UHFFFAOYSA-N octane Chemical compound CCCCCCCC TVMXDCGIABBOFY-UHFFFAOYSA-N 0.000 description 1
- MSRJTTSHWYDFIU-UHFFFAOYSA-N octyltriethoxysilane Chemical compound CCCCCCCC[Si](OCC)(OCC)OCC MSRJTTSHWYDFIU-UHFFFAOYSA-N 0.000 description 1
- 229960003493 octyltriethoxysilane Drugs 0.000 description 1
- 239000012766 organic filler Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 125000003566 oxetanyl group Chemical group 0.000 description 1
- 239000003209 petroleum derivative Substances 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 description 1
- JTQPTNQXCUMDRK-UHFFFAOYSA-N propan-2-olate;titanium(2+) Chemical compound CC(C)O[Ti]OC(C)C JTQPTNQXCUMDRK-UHFFFAOYSA-N 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229920005604 random copolymer Polymers 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 230000001846 repelling effect Effects 0.000 description 1
- 239000013557 residual solvent Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007127 saponification reaction Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- FZHAPNGMFPVSLP-UHFFFAOYSA-N silanamine Chemical compound [SiH3]N FZHAPNGMFPVSLP-UHFFFAOYSA-N 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000011863 silicon-based powder Substances 0.000 description 1
- IYMSIPPWHNIMGE-UHFFFAOYSA-N silylurea Chemical compound NC(=O)N[SiH3] IYMSIPPWHNIMGE-UHFFFAOYSA-N 0.000 description 1
- 230000003595 spectral effect Effects 0.000 description 1
- 238000001228 spectrum Methods 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 150000003557 thiazoles Chemical class 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000012974 tin catalyst Substances 0.000 description 1
- 150000003606 tin compounds Chemical class 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 150000003918 triazines Chemical class 0.000 description 1
- FBBATURSCRIBHN-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyldisulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSCCC[Si](OCC)(OCC)OCC FBBATURSCRIBHN-UHFFFAOYSA-N 0.000 description 1
- VTHOKNTVYKTUPI-UHFFFAOYSA-N triethoxy-[3-(3-triethoxysilylpropyltetrasulfanyl)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCSSSSCCC[Si](OCC)(OCC)OCC VTHOKNTVYKTUPI-UHFFFAOYSA-N 0.000 description 1
- NMEPHPOFYLLFTK-UHFFFAOYSA-N trimethoxy(octyl)silane Chemical compound CCCCCCCC[Si](OC)(OC)OC NMEPHPOFYLLFTK-UHFFFAOYSA-N 0.000 description 1
- QLNOVKKVHFRGMA-UHFFFAOYSA-N trimethoxy(propyl)silane Chemical group [CH2]CC[Si](OC)(OC)OC QLNOVKKVHFRGMA-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- VMYXFDVIMUEKNP-UHFFFAOYSA-N trimethoxy-[5-(oxiran-2-yl)pentyl]silane Chemical compound CO[Si](OC)(OC)CCCCCC1CO1 VMYXFDVIMUEKNP-UHFFFAOYSA-N 0.000 description 1
- UKRDPEFKFJNXQM-UHFFFAOYSA-N vinylsilane Chemical compound [SiH3]C=C UKRDPEFKFJNXQM-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/18—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms
- C08L23/20—Homopolymers or copolymers of hydrocarbons having four or more carbon atoms having four to nine carbon atoms
- C08L23/22—Copolymers of isobutene; Butyl rubber ; Homo- or copolymers of other iso-olefins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/08—Copolymers of ethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/26—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
Definitions
- the present invention relates to a resin composition that can be suitably used for sealing an organic EL element.
- An organic EL (Electroluminescence) element is a light-emitting element using an organic substance as a light-emitting material, and can obtain high-intensity light emission at a low voltage.
- organic EL elements are extremely sensitive to moisture, and the organic material itself is altered by moisture, resulting in a decrease in brightness, no light emission, the interface between the electrode and the organic EL layer being peeled off due to moisture, metal There is a problem that the metal oxide is oxidized to increase the resistance.
- thermosetting resin composition When the thermosetting resin composition is used as a whole surface sealing material for an organic EL element, the lamination work is easy because the material viscosity before curing is low, and the moisture permeability of the cured product after thermosetting is low. As an advantage. However, on the other hand, there is a problem that the organic EL element deteriorates due to the heating temperature during thermosetting.
- Patent Document 1 discloses an encapsulating film containing a polyisobutylene resin and a hydrogenated cyclic olefin-based polymer.
- the film is usually laminated with a protective film and the tackiness of the film is large, it is difficult to peel off the protective film, and the film is greatly deformed when the protective film is peeled off. It is known that handling is extremely difficult.
- Patent Document 2 discloses a composition for a sealing material containing an isobutylene polymer, an epoxy group-containing compound, and a curing agent for epoxy resin, and this composition is used for hot melt coating. Therefore, a sheet cannot be produced as easily as varnish coating. In addition, there is no mention of adhesion and handling properties, and no sufficient study has been made. Further, as a method for avoiding thermal degradation of the organic EL element, Patent Document 3 discloses polyisobutylene resin, polyisoprene resin having a functional group capable of reacting with an epoxy group and / or polyisobutylene resin, tackifying resin, and epoxy. A resin composition containing a resin is disclosed.
- Patent Document 4 discloses a sealing resin composition containing a styrene-isobutylene-modified resin and (B) a tackifying resin.
- a process of heating and curing at a high temperature such as 130 ° C. for a long time after coating and drying is required, and there is a problem in flatness and productivity such as curling of the film.
- the hardness is insufficient, there is a problem that the adhesive breaks down after storage at high temperature and peels off when used with another optical film that contracts due to heat, such as a polarizing plate. .
- varnish coating is possible, it can be easily made into a sheet, does not require a heat curing step, can greatly reduce the thermal deterioration of the organic EL device, and can also be productive It is an object to provide a resin composition and a resin composition sheet obtained from the resin composition that can realize a sheet having good transparency, moisture permeability resistance, adhesive strength, and heat resistance.
- the present inventor has used the sealing resin composition containing the polyisobutylene resin (A), the modified polyolefin resin (B), and the tackifier resin (C) to achieve the above problem. Has been found to be solved, and the present invention has been achieved.
- the present invention provides “(1) a sealing resin composition comprising a polyisobutylene resin (A), a modified polyolefin resin (B), and a tackifying resin (C), (2) The encapsulating resin composition according to (1), wherein the polyisobutylene resin (A) is contained in an amount of 35 to 95% by mass with respect to 100% by mass of the nonvolatile content in the resin composition.
- G hygroscopic metal oxide
- varnish coating can be performed, and a sheet can be easily formed without requiring a heat curing step. Not only can the thermal degradation of organic EL elements be greatly reduced, it can also greatly improve productivity, and can realize a sheet that combines good transparency, moisture permeability resistance, adhesive strength, and heat resistance.
- the resin composition sheet for sealing and the resin composition sheet for sealing obtained from this composition can be provided.
- the resin composition of the present invention is mainly characterized by containing a polyisobutylene resin (A), a modified polyolefin resin (B), and a tackifier resin (C).
- the polyisobutylene resin (A) (hereinafter also abbreviated as “component (A)”) used in the present invention has an effect of stably maintaining other physical properties while improving the moisture permeability of the resin composition.
- component (A) is preferably in a solid state at room temperature (25 ° C.).
- the component (A) is a polymer mainly composed of a polyisobutylene skeleton
- an isobutylene homopolymer (homopolymer) or an appropriate amount of an olefinic compound such as 1-butene or 2-butene is added to isobutylene.
- a copolymer (block copolymer or graft copolymer) in which the skeleton is copolymerized may be used.
- Examples of monomer components other than isobutylene in the copolymer include isoprene, styrene, butadiene, ethylene, propylene, acrylonitrile, vinyl chloride, vinyl bromide, hydrogenated styrene, pentadiene, cyclopentadiene, and dicyclopentadiene. These can use 1 type (s) or 2 or more types. Of these, styrene is preferable from the viewpoints of improvement of heat resistance and moisture permeability.
- the proportion of the polyisobutylene skeleton is preferably 50% by mass or more, more preferably 60% by mass or more of the whole polymer.
- the preferred copolymer composition that is, the ratio of each of the segment skeletons composed of monomer components other than polyisobutylene skeleton and isobutylene (polyisobutylene skeleton / segment skeleton composed of monomer components other than isobutylene) is 60 to 90% by mass / It is 10 to 40% by mass, and more preferably 65 to 80% by mass / 20 to 35% by mass.
- the copolymer may be used in combination with an isobutylene polymer.
- component (A) examples include commercially available products such as Opanol B10, B12, B15, B50, B50SF, B80, B100, B120, B150, B220 (manufactured by BASF), JSR butyl 065, 268, 365 (JSR). Manufactured), Vistanex LM-MS, MH, H, MML-80, 100, 120, 140 (manufactured by Exxon Chemical), HYCAR (manufactured by Goodrich), SIBSTARSTT102 (manufactured by Kaneka), and the like. These may be used alone or in combination of two or more.
- the average molecular weight of the component (A) is not particularly limited, but from the viewpoint of providing good coatability and compatibility, the viscosity average molecular weight is preferably 4,000,000 or less, and 2,600,000 or less. More preferred is 1,000,000 or less. On the other hand, the viscosity average molecular weight is preferably 100,000 or more from the viewpoint of preventing repellency during coating of the resin composition, expressing moisture resistance of the resin composition sheet, and improving mechanical strength. 000 or more is more preferable, and 300,000 or more is more preferable.
- the component (A) is preferably solid at room temperature (25 ° C.).
- the viscosity average molecular weight in this invention is calculated
- a component can use 1 type (s) or 2 or more types.
- limiting in particular in content of (A) component in a resin composition From a viewpoint that it can provide favorable coating property and compatibility, and can ensure favorable thermal resistance and handleability (tack suppression), 95 mass% or less is preferable with respect to 100 mass% of non volatile matters in a resin composition, and 80 mass% or less is more preferable.
- 35% by mass or more is preferable and 50% by mass or more is more preferable with respect to 100% by mass of the nonvolatile content in the resin composition.
- the modified polyolefin resin (B) used in the present invention (hereinafter also abbreviated as “component (B)”) has a cohesive strength while maintaining good adhesion to the substrate of the resin composition sheet obtained. (Holding power) is improved, heat resistance is improved, and handleability in the sheet processing step is also improved.
- the improvement of holding power here means reducing the amount of shear deviation after 1 hour at 80 ° C. and 1 kg load, preferably to 0.5 mm or less.
- the component (B) used in the present invention can further improve the cohesive force (holding force) and improve heat resistance by causing a crosslinking reaction after the sheet is formed.
- the component (B) is a polymer mainly composed of an olefin skeleton, and is a homopolymer (homopolymer) or a copolymer containing an olefin skeleton, and has a functional group, and is particularly limited. Not.
- the form of the copolymer is not particularly limited, and examples thereof include a random copolymer, a block copolymer, and a graft copolymer.
- Examples of the monomer component of the olefin include ethylene, propylene, 1-butene, 2-butene and the like, and these can be used alone or in combination of two or more. Of these, ethylene and 1-butene are preferable from the viewpoint of compatibility with the component (A).
- Examples of monomer components other than olefins include styrene, butadiene, acrylonitrile, vinyl chloride, vinyl bromide, hydrogenated styrene, pentadiene, cyclopentadiene, dicyclopentadiene, and the like, one or two of these. The above can be used. Of these, styrene is preferable from the viewpoints of improvement of heat resistance and moisture permeability.
- component (B) a copolymer containing ethylene and / or 1-butene and styrene and having a functional group can be mentioned.
- the proportion of each component of ethylene, 1-butene and styrene is not particularly limited, but the total proportion of ethylene and / or 1-butene component is 20% by mass or more of the entire copolymer. More preferably, it is 40% by mass or more, and the proportion of the styrene component is preferably 10% by mass or more, more preferably 20% by mass or more of the entire copolymer.
- the functional group may have any structure as long as it does not adversely affect the desired moisture resistance and adhesiveness.
- an acid anhydride group [—C (O) —O—C (O) —] Carboxyl group, epoxy group, amino group, hydroxyl group, oxazoline group, oxetane group, cyanate group, phenol group [-Ph-OH], hydrazide group, amide group, etc., among which an acid anhydride group is preferred.
- the functional group may be any one of these or two or more.
- component (B) examples include a copolymer containing an acid anhydride group as the functional group and containing ethylene and / or 1-butene and styrene.
- the acid value is preferably 1 to 50 mgKOH / g, and more preferably 5 to 30 mgKOH / g. preferable.
- the acid value referred to here is based on JIS K 2501-2003 petroleum product and lubricating oil-neutralization number test method.
- the number average molecular weight of the component (B) is preferably 300,000 or less, and more preferably 150,000 or less, from the viewpoint of improving the compatibility of the resin composition. Moreover, from a viewpoint of expressing the moisture permeability resistance of a resin composition, 5,000 or more are preferable and 10,000 or more are more preferable.
- the component (B) is preferably a solid at room temperature (25 ° C.).
- the number average molecular weight in this invention is measured by the gel permeation chromatography (GPC) method (polystyrene conversion).
- GPC gel permeation chromatography
- the number average molecular weight by the GPC method is LC-9A / RID-6A manufactured by Shimadzu Corporation as a measuring device, and Shodex K-800P / K-804L / K-804L manufactured by Showa Denko KK as a column. Measured at a column temperature of 40 ° C. using tetrahydrofuran or the like as the mobile phase, and can be calculated using a standard polystyrene calibration curve.
- component (B) Commercially available products that can be used as component (B) include Surflene P-1000 (a special polyolefin resin acid-modified (number average molecular weight 70000) 20% solution (acid value 13-16 mg KOH / g), Mitsubishi Chemical Corporation. Manufactured).
- Surflene P-1000 a special polyolefin resin acid-modified (number average molecular weight 70000) 20% solution (acid value 13-16 mg KOH / g), Mitsubishi Chemical Corporation. Manufactured).
- (B) 1 type or 2 types or more can be used for a component.
- limiting in particular in content of (B) component in a resin composition 40 mass with respect to 100 mass% of non volatile matters in a resin composition from a viewpoint that the favorable moisture permeability resistance of a resin composition can be ensured. % Or less is preferable, and 30% by mass or less is more preferable.
- 1 mass% or more is preferable with respect to 100 mass% of non volatile matters in a resin composition, and 5 mass% or more is more preferable.
- the tackifier resin (C) used in the present invention can stably maintain other physical properties while improving the adhesiveness of the resin composition.
- the component (C) is not particularly limited, and is a terpene resin, modified terpene resin (hydrogenated terpene resin, terpene phenol copolymer resin, aromatic modified terpene resin, etc.), coumarone resin, indene resin, petroleum resin.
- terpene resin modified terpene resin
- modified terpene resin hydrochloric resin
- coumarone resin indene resin
- indene resin petroleum resin.
- terpene resin aromatic modified terpene resin, terpene phenol copolymer resin, hydrogenated alicyclic petroleum resin, aromatic petroleum resin, and aliphatic aromatic copolymer are preferred in terms of compatibility, adhesion, and moisture permeability.
- Polymerized petroleum resins and alicyclic petroleum resins are more preferable, and terpene resins and aromatic modified terpene resins are more preferable.
- the component (C) may be used alone or in combination of two or more.
- examples of terpene resins include YS resin PX and YS resin PXN (both manufactured by Yasuhara Chemical Co., Ltd.), and examples of aromatic modified terpene resins include YS resin TO, TR. Series (all manufactured by Yasuhara Chemical Co., Ltd.) and the like, and as hydrogenated terpene resins, Clearon P, Clearon M, Clearon K series (all manufactured by Yasuhara Chemical Co., Ltd.) and the like are listed, and terpene phenol copolymer resin is YS Polystar 2000.
- (C) component content in a resin composition From a viewpoint of maintaining favorable moisture permeability resistance, 40 mass% or less is with respect to 100 mass% of non volatile matters in a resin composition. Preferably, 30 mass% or less is more preferable. Moreover, from a viewpoint of having sufficient adhesiveness, 1 mass% or more is preferable with respect to 100 mass% of non volatile matters in a resin composition, and 5 mass% or more is more preferable.
- the softening point of the component (C) is preferably 50 to 200 ° C., more preferably 90 to 160 ° C., from the viewpoint that the sheet is softened in the step of laminating the resin composition sheet and has the desired heat resistance.
- the softening point is measured by the ring and ball method according to JIS K2207.
- Isoprene component (D)
- liquid polybutadiene is a liquid butadiene-based polymer
- liquid polyisoprene is a liquid isoprene-based polymer
- Liquid is a state at room temperature (25 ° C.).
- liquid polybutadiene and liquid polyisoprene having a functional group capable of reacting with an isocyanate group examples include NIISO-PB G series, GI series (manufactured by Nippon Soda Co., Ltd.), etc.
- liquid polyisoprene examples include Epol (made by Idemitsu Kosan Co., Ltd.). You may use these 1 type or in combination of 2 or more types.
- the content of the component (D) in the resin composition is not particularly limited, but is preferably 20% by mass or less with respect to 100% by mass of the nonvolatile content in the resin composition from the viewpoint of maintaining desired transparency. 15% by mass or less is more preferable. Moreover, 1 mass% or more is preferable with respect to 100 mass% of non volatile matters in a resin composition from a viewpoint of fully expressing the effect which mix
- the resin composition of the present invention can improve the curing performance of the resin composition by further containing a curing agent to the extent that the effects of the present invention are not impaired.
- the curing agent (E) in the present invention is a compound that reacts with the functional group of the component (B) or the component (D), and is not particularly limited, but is an epoxy compound, an isocyanate compound, a metal chelate compound, a metal alkoxide. , Metal salts, amine compounds, hydrazine compounds or aldehyde compounds. You may use these 1 type or in combination of 2 or more types. When using an isocyanate compound, a tin compound may be used in combination as a catalyst.
- the inorganic filler is not particularly limited, but silica, alumina, barium sulfate, talc, clay, mica powder, aluminum hydroxide, magnesium hydroxide, calcium carbonate, magnesium carbonate, boron nitride, aluminum borate, barium titanate Strontium titanate, calcium titanate, magnesium titanate, bismuth titanate, titanium oxide, barium zirconate, calcium zirconate and the like.
- talc and mica are preferable and talc is particularly preferable from the viewpoint of improving the moisture permeability of the cured resin. You may use these 1 type or in combination of 2 or more types.
- the inorganic filler is preferably one that has been surface treated with a surface treatment agent to improve its moisture resistance.
- a surface treatment agent aminosilane-based cups such as aminopropylmethoxysilane, aminopropyltriethoxysilane, ureidopropyltriethoxysilane, N-phenylaminopropyltrimethoxysilane, N-2 (aminoethyl) aminopropyl trimethoxysilane, etc.
- Epoxy silanes such as ring agents, glycidoxypropyltrimethoxysilane, glycidoxypropyltriethoxysilane, glycidoxypropylmethyldiethoxysilane, glycidylbutyltrimethoxysilane, (3,4-epoxycyclohexyl) ethyltrimethoxysilane Coupling agents, mercaptosilane coupling agents such as mercaptopropyltrimethoxysilane, mercaptopropyltriethoxysilane, methyltrimethoxysilane, octadecyltrimethoxy Silane coupling agents such as Sisilane, Phenyltrimethoxysilane, Methacryloxypropyltrimethoxysilane, Imidazolesilane, Triazinesilane, Hexamethyldisilazane, Hexaphenyldisilazane, Trisilazan
- the average particle size of the inorganic filler is not particularly limited, but is preferably 10 ⁇ m or less and more preferably 5 ⁇ m or less from the viewpoint of not damaging the organic EL element. On the other hand, from the viewpoint of exhibiting moisture permeability resistance, 0.05 ⁇ m or more is preferable, and 0.1 ⁇ m or more is more preferable.
- the average particle size of the inorganic filler can be measured by a laser diffraction / scattering method based on the Mie scattering theory. Specifically, the particle size distribution of the inorganic filler can be created on a volume basis by a laser diffraction particle size distribution measuring device, and the median diameter can be measured as the average particle diameter.
- a measurement sample an inorganic filler dispersed in water by ultrasonic waves can be preferably used.
- LA-500 manufactured by Horiba, Ltd. can be used as a laser diffraction particle size distribution measuring apparatus.
- the content of the inorganic filler is not particularly limited, but from the viewpoint of preventing the viscosity of the resin composition from rising and preventing the strength of the cured product from being reduced and becoming brittle. 50 mass% or less is preferable with respect to 100 mass% of non volatile matters in a thing, 40 mass% or less is more preferable, and 30 mass% or less is still more preferable. On the other hand, from the viewpoint of sufficiently obtaining the effect of blending the inorganic filler, it is preferably 1% by mass or more, more preferably 5% by mass or more, more preferably 10% by mass or more with respect to 100% by mass of the nonvolatile content in the resin composition. Is more preferable.
- the resin composition of the present invention may further contain a hygroscopic metal oxide (G) in order to further improve the moisture permeability resistance of the cured product.
- hygroscopic metal oxide means a metal oxide that has a capability of absorbing moisture and chemically reacts with moisture that has been absorbed to become a hydroxide.
- it is one kind selected from calcium oxide, magnesium oxide, strontium oxide, aluminum oxide, barium oxide, or the like, or a mixture or solid solution of two or more kinds.
- calcium oxide and magnesium oxide are preferable from the viewpoint of high hygroscopicity, cost, and stability of raw materials.
- the mixture or solid solution of two or more types include calcined dolomite (a mixture containing calcium oxide and magnesium oxide), calcined hydrotalcite (a solid solution of calcium oxide and aluminum oxide), and the like. It is done.
- a hygroscopic metal oxide is known as a hygroscopic material in various technical fields, and a commercially available product can be used. Specifically, calcium oxide (“Moystop # 10” manufactured by Sankyo Flour Milling Co., Ltd.), magnesium oxide (“Kyowa Mag MF-150”, “Kyowa Mag MF-30” manufactured by Kyowa Chemical Industry Co., Ltd., “Pure Mag” manufactured by Tateho Chemical Industry Co., Ltd.
- the average particle diameter of the hygroscopic metal oxide is not particularly limited, but is 10 ⁇ m or less from the viewpoint of preventing coarse particles from damaging the organic EL element in the sealing step and increasing the interfacial bond strength with the resin component. Preferably, it is 5 ⁇ m or less, more preferably 1 ⁇ m or less. On the other hand, 0.001 ⁇ m or more is preferable from the viewpoint of preventing the particles from being easily aggregated and preventing it from being difficult to impart sufficiently high moisture resistance to the cured product due to poor dispersion in the composition. 0.01 ⁇ m or more is more preferable, and 0.1 ⁇ m or more is more preferable.
- the average particle size of the hygroscopic metal oxide is 10 ⁇ m or less, it can be used as it is, but if the average particle size of the commercial product exceeds 10 ⁇ m, the average particle size is 10 ⁇ m or less by pulverization, classification, etc. It is preferable to use after preparing the granular material.
- the hygroscopic metal oxide those having an average particle diameter in the above-mentioned preferred range and not containing coarse particles having a particle diameter of 20 ⁇ m or more are preferable. More preferably, it does not contain coarse particles of 5 ⁇ m or more. By not including such coarse particles, it is advantageous in that the EL element is hardly damaged in the sealing process.
- the average particle diameter of the hygroscopic metal oxide can be measured by a laser diffraction / scattering method based on the Mie scattering theory. Specifically, the particle size distribution of the hygroscopic metal oxide can be created on a volume basis by a laser diffraction particle size distribution measuring device, and the median diameter can be measured as the average particle diameter.
- a hygroscopic metal oxide dispersed in water by ultrasonic waves can be preferably used.
- a LAW-500 manufactured by Horiba Ltd. can be used as a laser diffraction type particle size distribution measuring device.
- hygroscopic metal oxide a surface treated with a surface treatment agent can be used.
- a surface-treated hygroscopic metal oxide By using such a surface-treated hygroscopic metal oxide, the adhesion stability of the cured product can be further increased, and the moisture in the resin reacts with the hygroscopic metal oxide before curing. Can be prevented.
- the surface treatment agent used for the surface treatment for example, higher fatty acids, alkylsilanes, silane coupling agents and the like can be used, among which higher fatty acids or alkylsilanes are preferable. You may use these 1 type or in combination of 2 or more types.
- higher fatty acid for example, higher fatty acids having 18 or more carbon atoms such as stearic acid, montanic acid, myristic acid and palmitic acid are preferable. Of these, stearic acid is preferred. You may use these 1 type or in combination of 2 or more types.
- Alkylsilanes include methyltrimethoxysilane, ethyltrimethoxysilane, hexyltrimethoxysilane, octyltrimethoxysilane, decyltrimethoxysilane, octadecyltrimethoxysilane, dimethyldimethoxysilane, octyltriethoxysilane, n-octadecyldimethyl ( And 3- (trimethoxysilyl) propyl) ammonium chloride. You may use these 1 type or in combination of 2 or more types.
- silane coupling agent examples include 3-glycidyloxypropyltrimethoxysilane, 3-glycidyloxypropyltriethoxysilane, 3-glycidyloxypropyl (dimethoxy) methylsilane, and 2- (3,4-epoxycyclohexyl) ethyltrimethoxy.
- Epoxy silane coupling agents such as silane; mercapto silane coupling agents such as 3-mercaptopropyltrimethoxysilane, 3-mercaptopropyltriethoxysilane, 3-mercaptopropylmethyldimethoxysilane and 11-mercaptoundecyltrimethoxysilane ; 3-aminopropyltrimethoxysilane, 3-aminopropyltriethoxysilane, 3-aminopropyldimethoxymethylsilane, N-phenyl-3-aminopropyltri Amino-based silane cups such as toxisilane, N-methylaminopropyltrimethoxysilane, N- (2-aminoethyl) -3-aminopropyltrimethoxysilane and N- (2-aminoethyl) -3-aminopropyldimethoxymethylsilane Ringing agents; Ureido silane coupling agents such
- the surface treatment can be performed, for example, by adding and spraying a surface treatment agent and stirring for 5 to 60 minutes while stirring and dispersing untreated hygroscopic metal oxide at room temperature with a mixer.
- a mixer a well-known mixer can be used, for example, blenders, such as V blender, a ribbon blender, and a bubble cone blender, mixers, such as a Henschel mixer and a concrete mixer, a ball mill, a cutter mill, etc. are mentioned.
- a method of surface treatment by mixing the higher fatty acid, alkylsilanes or silane coupling agent is also possible.
- the treatment amount of the surface treatment agent varies depending on the type of the hygroscopic metal oxide or the type of the surface treatment agent, but is preferably 1 to 10% by weight with respect to the hygroscopic metal oxide.
- the content of the hygroscopic metal oxide is not particularly limited, but from the viewpoint of preventing the viscosity of the resin composition from increasing and preventing the strength of the cured product from being reduced and becoming brittle. 50 mass% or less is preferable with respect to 100 mass% of non volatile matters in a resin composition, 40 mass% or less is more preferable, and 30 mass% or less is still more preferable. On the other hand, from the viewpoint of sufficiently obtaining the effect of blending the inorganic filler, it is preferably 1% by mass or more, more preferably 5% by mass or more, more preferably 10% by mass or more with respect to 100% by mass of the nonvolatile content in the resin composition. Is more preferable.
- the resin composition of the present invention may optionally contain various resin additives other than the above-described components to the extent that the effects of the present invention are not impaired.
- resin additives include organic fillers such as rubber particles, silicon powder, nylon powder, and fluorine powder, thickeners such as olben and benton, silicone-based, fluorine-based, and polymer-based antifoaming agents.
- adhesion promoters such as leveling agents, triazole compounds, thiazole compounds, triazine compounds, porphyrin compounds, and the like can be given.
- the method for preparing the resin composition of the present invention is not particularly limited, and examples thereof include a method of adding a solvent or the like as necessary and mixing the blended components using a rotary mixer or the like.
- the transparency of the cured product of the resin composition of the present invention can be measured with a spectrophotometer.
- the transmittance at 380 to 780 nm calculated in accordance with JIS Z8722 is preferably 80% or more, more preferably 82% or more, still more preferably 84% or more, still more preferably 86% or more, and 88%
- the above is particularly preferable, and 90% or more is particularly preferable.
- the moisture permeation resistance of the cured product of the resin composition of the present invention can be measured by the differential pressure method of JIS K-7129A (measuring conditions: temperature 40 ° C., relative humidity 90%).
- the value when a resin composition layer having a thickness of 50 ⁇ m is measured under the conditions of 40 ° C. and 90% RH is 40 g / m 2 ⁇ day or less is preferred, 20 g / m 2 ⁇ day or less is more preferred, and 10 / m 2 ⁇ day or less is even more preferred.
- the lower the moisture permeability the better, but practically, it is preferably 0.1 g / m 2 ⁇ day or more.
- the use of the resin composition of the present invention is not particularly limited, it can be used as a sealing material for various devices such as semiconductors, solar cells, high-brightness LEDs, LCDs, and organic ELs, and is particularly suitable for organic EL devices. Can be used.
- the resin composition sheet of the present invention includes both a sheet of the resin composition itself of the present invention and a sheet in which a layer of the resin composition of the present invention is formed on a support.
- a resin composition sheet obtained by forming a layer of the resin composition of the present invention on a support is laminated on a necessary portion of an object to be applied, and the resin composition layer is applied. You may make it transfer to a target object.
- the organic EL device When the resin composition sheet obtained by forming the resin composition layer of the present invention on a support is applied to an organic EL device, the organic EL device is cured in advance before the organic EL device sealing step. Heat sealing after the sealing step is not required, and the thermal deterioration of the organic EL element can be greatly reduced. Industrially, a method using such a resin composition sheet is preferable.
- the resin composition sheet having a support can be carried out using methods known to those skilled in the art, such as die coating, spin coating, doctor blade coating, calendering, and extrusion molding.
- it can be produced by preparing a varnish in which a resin composition is dissolved in an organic solvent, applying the varnish on a support, and further drying the organic solvent by heating or blowing hot air.
- organic solvent examples include aliphatic hydrocarbons such as hexane, heptane, and octane, alicyclic hydrocarbons such as cyclohexane and methylcyclohexane, and aromatic hydrocarbons such as toluene and xylene. From the viewpoint of the shelf life (usable period) of the resin composition sheet, those having a low boiling point are preferred, and one or two or more kinds may be used in combination.
- the drying conditions of the resin composition sheet of the present invention are not particularly limited, but are preferably dried at 50 to 140 ° C. for 3 to 20 minutes.
- the temperature is lower than 50 ° C., the amount of the solvent remaining in the resin composition layer tends to increase.
- the temperature is higher than 140 ° C., the support tends to be deformed by heat when the layer of the resin composition of the present invention is formed on the support.
- the resin composition sheet of the present invention can be cured by heating in advance to react the component (B), the component (D), and the component (E) before the sealing step.
- Such curing can be used as a resin composition sheet having better cohesive strength, adhesiveness, and handleability.
- the curing conditions are not particularly limited, but the curing temperature is preferably 20 to 50 ° C, more preferably 30 to 40 ° C.
- the curing time is preferably 1 to 10 days, and more preferably 3 to 7 days.
- the thickness of the cured resin composition sheet is preferably 3 ⁇ m to 200 ⁇ m, more preferably 10 ⁇ m to 100 ⁇ m, and even more preferably 20 ⁇ m to 80 ⁇ m.
- the cured resin composition sheet preferably has a resin composition weight reduction (residual solvent amount) of 0.1% or less when the sheet is dried at 130 ° C. for 15 minutes. By being 0.1% or less, the effect of reducing damage to the element after the sealing step to the organic EL device is improved.
- a moisture-proof support that is, a sealing substrate.
- the sealing substrate include a moisture-proof plastic film or a metal foil such as a copper foil and an aluminum foil.
- the plastic film having moisture resistance include a plastic film in which an inorganic substance such as silicon oxide (silica), silicon nitride, SiON, SiCN, or amorphous silicon is deposited on the surface.
- plastic film examples include polyolefins such as polyethylene, polypropylene, and polyvinyl chloride, polyethylene terephthalate (hereinafter sometimes abbreviated as “PET”), polyesters such as polyethylene naphthalate, polycarbonate, polyimide, and cycloolefin polymers (hereinafter referred to as “polyethylene terephthalate”).
- PET polyethylene terephthalate
- polyesters such as polyethylene naphthalate, polycarbonate, polyimide, and cycloolefin polymers
- COP cycloolefin polymers
- the sealing substrate one having a multilayer structure of two or more layers may be used.
- a support of the type in which the plastic film and the metal foil are bonded to each other with an adhesive in order to improve handling properties is inexpensive and is industrially convenient.
- a plastic film or the like that does not have moisture resistance can also be used as a support, and the surface of the resin composition may be protected by means such as a release liner. In that case, after forming the resin composition sheet on the substrate on which the organic EL element is formed, it is preferable to peel the support, and then separately laminate a sealing substrate on the resin composition sheet.
- the resin composition of the present invention can be provided in various shapes.
- a sheet formed from the resin composition of the present invention can be used in combination with a component of the electronic device. .
- a sheet formed from the resin composition can be used in combination with an optical film such as a color filter, a polarizing plate, or a retardation plate.
- Polyisobutylene resin (A) Polyisobutylene (isobutylene-based weight body) (Opanol B80, viscosity average molecular weight 800000, manufactured by BASF) -Polyisobutylene (isobutylene-based weight body) (B50SF, viscosity average molecular weight 400000, manufactured by BASF)
- Modified polyolefin resin (B) ⁇ Surflen P-1000 (20% solution of special polyolefin-based resin acid-modified product (number average molecular weight 70000), acid value 13-16 mg KOH / g, manufactured by Mitsubishi Chemical Corporation)
- Tackifying resin (C) Aromatic modified terpene resin (YS resin TO125, softening point 125 ° C., manufactured by Yasuhara Chemical Co., Ltd.)
- Liquid polybutadiene and / or liquid polyisoprene (D) having functional groups capable of reacting with isocyanate groups ⁇ Liquid polybutadiene (NIISO-PB G series, GI series, manufactured by Nippon Soda Co., Ltd.) ⁇ Liquid polyisoprene (Epol, Idemitsu Kosan Co., Ltd.)
- Curing agent (E) An isocyanate compound having a functional group capable of reacting with a functional group of liquid polyisobutylene and / or liquid polyisoprene butylene.
- Isocyanate compounds Duranate TPA-100, manufactured by Asahi Kasei Chemicals
- the resin composition sheet having a thickness of 50 ⁇ m was measured by a differential pressure method using a water vapor permeability evaluation apparatus DELTAPARM DP-ST manufactured by Technolox.
- a pressure-sensitive adhesive is applied on a release film so that the film thickness after drying is 50 ⁇ m, dried, and bonded to the moisture-proof layer side of COP having moisture resistance, and a laminated sheet provided with the moisture-proof film and the pressure-sensitive adhesive Created.
- a release film of such a laminated sheet is peeled off and bonded to a glass plate, and a polyvinyl alcohol polarizing plate having a cellulose triacetate film as a protective layer (average polymerization degree 1700 of polyvinyl alcohol polarizing film, average saponification degree 99.5).
- a polarizing plate having a pressure-sensitive adhesive layer on the cellulose triacetate film side was pressed and bonded to the moisture-proof film surface of a laminated sheet provided with a moisture-proof film and an adhesive.
- the bonded product was subjected to a durability test (left at 80 ° C. for 500 hours) to observe a foamed state, a peeled state, and a deteriorated state. The results are shown in Table 1.
- Example 1 40 parts of polyisobutylene (12.5% toluene solution of Oppanol B80) and 40 parts of polyisobutylene (12.5% toluene solution of B50SF) 5 parts) and 2 parts of an aromatic modified terpene resin solution (50% toluene solution of YS resin TO-125) were mixed and dispersed uniformly with a mixer to obtain a varnish.
- the obtained varnish is uniformly applied on a release treatment surface of a PET film (thickness 38 ⁇ m) treated with an alkyd release agent with a comma coater so that the thickness of the resin composition layer after drying becomes 50 ⁇ m.
- the resin composition sheet was obtained by applying and drying at 110 ° C. for 10 minutes.
- Example 2 Liquid polyisoprene (epol 50% toluene solution) 1 part, isocyanate compound (duranate TPA-100 50% toluene solution) 0.3 part, tin catalyst (0.1% toluene solution of dibutyltin laurate) 0
- a varnish was obtained according to the formulation table in Table 1 below.
- a resin composition sheet was obtained in exactly the same manner as in Example 1. The obtained resin composition sheet was aged at 35 ° C. for 3 days.
- Example 3 In the same manner as in Example 2 except that liquid polybutadiene (50% toluene solution of NIISO-PB GI3000) was used instead of liquid polyisoprene (50% toluene solution of Epaul), varnish was prepared according to the composition table of Table 1 below. Got. Using the obtained varnish, a resin composition sheet was obtained in exactly the same manner as in Example 2. The obtained resin composition sheet was aged at 35 ° C. for 3 days.
- liquid polybutadiene 50% toluene solution of NIISO-PB GI3000
- liquid polyisoprene 50% toluene solution of Epaul
- Example 1 A varnish was obtained in the same manner as in Example 1 except that the modified polyolefin resin (Surflen P-1000) was not used according to the formulation table in Table 1 below. Using the obtained varnish, a resin composition sheet was obtained in exactly the same manner as in Example 1.
- Example 2 A varnish was obtained in the same manner as in Example 2 except that the modified polyolefin resin (Surflen P-1000) was not used according to the formulation table in Table 1 below. Using the obtained varnish, a resin composition sheet was obtained in exactly the same manner as in Example 1. The obtained resin composition sheet was aged at 35 ° C. for 3 days.
- the modified polyolefin resin Sudflen P-1000
- Example 3 A varnish was obtained in the same manner as in Example 3 except that the modified polyolefin resin (Surflen P-1000) was not used according to the formulation table in Table 1 below. Using the obtained varnish, a resin composition sheet was obtained in exactly the same manner as in Example 1. The obtained resin composition sheet was aged at 35 ° C. for 3 days.
- the modified polyolefin resin Sudflen P-1000
- the resin composition sheet obtained from the resin composition of the present invention does not require high-temperature heating such as 80 ° C. for curing, and does not require heat-curing during lamination. It can be bonded with a sufficiently high adhesive force by low temperature heating, can maintain a good appearance even after being laminated in a polarizing plate and then placed in a high temperature environment, and has good transparency and good permeation resistance. Wet. Therefore, according to the present invention, a sealing material capable of forming a highly reliable sealing structure without causing deterioration of the organic EL element with respect to the organic EL element that is likely to be deteriorated by moisture or heat. A resin composition and a resin composition sheet can be obtained, thereby providing a highly reliable organic EL device.
- the resin composition of the present invention can be varnished and can be easily formed into a sheet. It does not require a heat-curing process and can not only greatly reduce the thermal degradation of organic EL elements, it can also greatly improve productivity, and has good moisture resistance, adhesive strength, transparency, and heat resistance. It is possible to provide a resin composition capable of realizing a sheet and a resin composition sheet obtained therefrom.
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Electroluminescent Light Sources (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
Description
また、有機EL素子の熱劣化を回避する方法として、特許文献3には、ポリイソブチレン樹脂、エポキシ基と反応し得る官能基を持つポリイソプレン樹脂及び/又はポリイソブチレン樹脂、粘着付与樹脂、及びエポキシ樹脂を含有する樹脂組成物が開示されている。特許文献4には、スチレンーイソブチレン変性樹脂及び(B)粘着付与樹脂を含有することを特徴とする封止用樹脂組成物が開示されている。しかし、いずれも塗布乾燥後に130℃といった高温で長時間かけて加熱硬化させる工程が必要となり、フィルムのカール等の平面性や生産性に問題があった。
一方、硬度が不十分であると、偏光板などの熱により収縮する他の光学フィルムと貼り合せて使用する場合に、高温保存後に粘着剤の凝集破壊が生じ、剥れてしまうという問題がある。
(2)前記樹脂組成物中の不揮発分100質量%に対し、前記ポリイソブチレン樹脂(A)を35~95質量%含有することを特徴とする、(1)に記載の封止用樹脂組成物、
(3)前記変性ポリオレフィン樹脂(B)が、単量体成分としてオレフィン及びスチレンを含む共重合体であることを特徴とする、(1)又は(2)に記載の封止用樹脂組成物、
(4)前記オレフィンがエチレン及び/又は1-ブテンであり、前記共重合体が、官能基を有するものであることを特徴とする(3)に記載の封止用樹脂組成物、
(5)前記変性ポリオレフィン樹脂(B)が、官能基として酸無水物基を有することを特徴とする、(1)~(4)のいずれか1項に記載の封止用樹脂組成物、
(6)前記樹脂組成物中の不揮発分100質量%に対し、前記変性ポリオレフィン樹脂(B)を1~40質量%含有することを特徴とする、(1)~(5)のいずれか1項に記載の封止用樹脂組成物、
(7)前記粘着付与樹脂(C)が、テルペン樹脂であることを特徴とする、(1)~(6)のいずれか1項に記載の封止用樹脂組成物、
(8)前記粘着付与樹脂(C)が、芳香族変性テルペン樹脂であることを特徴とする、(1)~(7)のいずれか1項に記載の封止用樹脂組成物、
(9)前記樹脂組成物中の不揮発分100質量%に対し、前記粘着付与樹脂(C)を1~40質量%含有することを特徴とする、(1)~(8)のいずれか1項に記載の封止用樹脂組成物、
(10)(1)~(9)のいずれか1項に記載の封止用樹脂組成物の硬化物、
(11)380nmから780nmまでの可視光透過率が80~100%であることを特徴とする、(10)に記載の硬化物、
(12)透湿度が0.1~40g/m2・dayであることを特徴とする、(10)または(11)に記載の硬化物、
(13)(1)~(9)のいずれか1項に記載の封止用樹脂組成物を含むことを特徴とする、封止用樹脂組成物シート、
(14)有機EL素子の封止用である(13)記載の封止用樹脂組成物シート、
(15)(1)~(9)のいずれか1項に記載の封止用樹脂組成物を含むことを特徴とする、有機ELデバイス、
(16)無機充填材(F)をさらに含有することを特徴とする、(1)~(9)のいずれか1項に記載の封止用樹脂組成物、
(17)吸湿性金属酸化物(G)をさらに含有することを特徴とする、(1)~(9)のいずれか1項に記載の封止用樹脂組成物」
に関する。
実験に用いた材料は以下の通りである。
ポリイソブチレン樹脂(A)
・ポリイソブチレン(イソブチレン系重量体)(オパノールB80、粘度平均分子量800000、BASF社製)
・ポリイソブチレン(イソブチレン系重量体)(B50SF、粘度平均分子量400000、BASF社製)
・サーフレンP-1000(特殊ポリオレフィン系樹脂酸変性物(数平均分子量70000)の20%溶液、酸価13~16mgKOH/g、三菱化学社製)
・芳香族変性テルペン樹脂(YSレジンTO125、軟化点125℃、ヤスハラケミカル社製)
・液状ポリブタジエン(NIISO-PB Gシリーズ、GIシリーズ、日本曹達社製)
・液状ポリイソプレン(エポール、出光興産社製)
液状ポリイソブチレン及び/又は液状ポリイソプレンブチレンの官能基と反応しうる官能基をもつ、イソシアネート系化合物。
・イソシアネート系化合物(デュラネートTPA-100、旭化成ケミカルズ社製)
・イソシアネート反応触媒:ラウリン酸ジブチルすず
・溶剤:トルエン
各種測定方法・評価方法について説明する。
厚み50μmの樹脂組成物シートを用い、島津社製分光光度UV-3600によって、380nmから780nmまでの分光スペクトルを測定し、JIS Z8722に準拠し、可視光透過率を算出した。
<ヘイズの評価>
ヘイズメーター(東京電色社製 TC-HIIIDPK)を用いて、JIS K6714に準拠して、得られた粘着シートのヘイズ値を測定した。
<対ガラス保持力の評価>
被着体としてガラス板に、各粘着シートを25mm×25mmの接着面積でラミネートし、50℃、0.5Paで30分間圧着し、ついでガラス板を垂下して粘着テープの自由末端に1000gの均一荷重を負荷し、80℃で1時間経過後の粘着テープがずれた長さを測定した。
<対ガラス剥離接着力>
被着体としてのガラス板に25mm×200mmの大きさにカットした各粘着テープを25×80mmの接着面積でラミネートし、50℃、0.5Paで30分間圧着し、23℃で20分間経過後、その剥離に要する力を測定した(180度剥離、引張り速度300mm/分、23℃、65%RH雰囲気下)。
<耐透湿性の評価>
厚み50μmの樹脂組成物シートについて、Technolox社の水蒸気透過性評価装置 DELTAPARM DP-STを用いて差圧法により測定した。(JIS K-7129A準拠 測定条件:温度40℃、相対湿度90%)
<耐熱性の評価>
粘着剤を剥離フィルム上に乾燥後の膜厚が50μmになるように塗布し乾燥後、防湿性を有するCOPの防湿処理層側と貼り合せ、防湿性フィルムと粘着剤とを備えた積層シートを作成した。かかる積層シートの剥離フィルムを剥離し、ガラス板に貼り合せ、三酢酸セルロースフィルムを保護層とするポリビニルアルコール系偏光板(ポリビニルアルコール系偏光性フィルムの平均重合度1700、平均ケン化度99.5モル%、5倍延伸)の三酢酸セルロースフィルム側に粘着層を有する偏光板を、防湿性フィルムと粘着剤とを備えた積層シートの防湿性フィルム面に、ローラーで押圧し貼り合せた。かかる貼合品について耐久性試験(80℃ 500時間放置)を行い、発泡状態、剥離状態、劣化状態を観察した。結果を表1に示す。
ポリイソブチレン(Oppanol B80の12.5%トルエン溶液)40部とポリイソブチレン(B50SFの12.5%トルエン溶液)40部に、変性ポリオレフィン樹脂(サーフレンP-1000:特殊ポリオレフィン系樹脂酸変性物の20%溶液)5部、芳香族変性テルペン樹脂溶液(YSレジンTO-125の50%トルエン溶液)2部を混合し、ミキサーで均一に分散してワニスを得た。
得られたワニスをアルキッド系離型剤で処理されたPETフィルム(厚さ38μm)の離型処理面上に、乾燥後の樹脂組成物層の厚さが50μmになるようコンマコーターにて均一に塗布し、110℃で10分間乾燥させることにより、樹脂組成物シートを得た。
液状ポリイソプレン(エポールの50%トルエン溶液)1部と、イソシアネート系化合物(デュラネートTPA-100の50%トルエン溶液)0.3部と、すず触媒(ラウリン酸ジブチルすずの0.1%トルエン溶液)0.67部とを更に混合したこと以外は実施例1と同様にして、下記表1の配合表に従い、ワニスを得た。得られたワニスを使用し、実施例1と全く同様にして樹脂組成物シートを得た。得られた樹脂組成物シートを35℃で3日エージングした。
液状ポリイソプレン(エポールの50%トルエン溶液)の代わりに液状ポリブタジエン(NIISO-PB GI3000の50%トルエン溶液)を使用したこと以外は実施例2と同様にして、下記表1の配合表に従い、ワニスを得た。得られたワニスを使用し、実施例2と全く同様にして樹脂組成物シートを得た。得られた樹脂組成物シートを35℃で3日エージングした。
変性ポリオレフィン樹脂(サーフレンP-1000)を使用しないこと以外は実施例1と同様にして、下記表1の配合表に従い、ワニスを得た。得られたワニスを使用し、実施例1と全く同様にして樹脂組成物シートを得た。
変性ポリオレフィン樹脂(サーフレンP-1000)を使用しないこと以外は実施例2と同様にして、下記表1の配合表に従い、ワニスを得た。得られたワニスを使用し、実施例1と全く同様にして樹脂組成物シートを得た。得られた樹脂組成物シートを35℃で3日エージングした。
変性ポリオレフィン樹脂(サーフレンP-1000)を使用しないこと以外は実施例3と同様にして、下記表1の配合表に従い、ワニスを得た。得られたワニスを使用し、実施例1と全く同様にして樹脂組成物シートを得た。得られた樹脂組成物シートを35℃で3日エージングした。
一方、比較例1、2および3では(B)変性ポリオレフィン樹脂(サーフレンP-1000)を用いておらず、本発明の効果が発揮されていない。つまり、(B)成分を混合させることが重要であることがわかる。
Claims (17)
- ポリイソブチレン樹脂(A)、変性ポリオレフィン樹脂(B)、および粘着付与樹脂(C)を含有することを特徴とする封止用樹脂組成物。
- 前記樹脂組成物中の不揮発分100質量%に対し、前記ポリイソブチレン樹脂(A)を35~95質量%含有することを特徴とする、請求項1に記載の封止用樹脂組成物。
- 前記変性ポリオレフィン樹脂(B)が、単量体成分としてオレフィン及びスチレンを含む共重合体であることを特徴とする、請求項1又は2に記載の封止用樹脂組成物。
- 前記オレフィンがエチレン及び/又は1-ブテンであり、前記共重合体が、官能基を有するものであることを特徴とする請求項3に記載の封止用樹脂組成物。
- 前記変性ポリオレフィン樹脂(B)が、官能基として酸無水物基を有することを特徴とする、請求項1~4のいずれか1項に記載の封止用樹脂組成物。
- 前記樹脂組成物中の不揮発分100質量%に対し、前記変性ポリオレフィン樹脂(B)を1~40質量%含有することを特徴とする、請求項1~5のいずれか1項に記載の封止用樹脂組成物。
- 前記粘着付与樹脂(C)が、テルペン樹脂であることを特徴とする、請求項1~6のいずれか1項に記載の封止用樹脂組成物。
- 前記粘着付与樹脂(C)が、芳香族変性テルペン樹脂であることを特徴とする、請求項1~7のいずれか1項に記載の封止用樹脂組成物。
- 前記樹脂組成物中の不揮発分100質量%に対し、前記粘着付与樹脂(C)を1~40質量%含有することを特徴とする、請求項1~8のいずれか1項に記載の封止用樹脂組成物。
- 請求項1~9のいずれか1項に記載の封止用樹脂組成物の硬化物。
- 380nmから780nmまでの可視光透過率が80~100%であることを特徴とする、請求項10に記載の硬化物。
- 透湿度が0.1~40g/m2・dayであることを特徴とする、請求項10または11に記載の硬化物。
- 請求項1~9のいずれか1項に記載の封止用樹脂組成物を含むことを特徴とする、封止用樹脂組成物シート。
- 有機EL素子の封止用である請求項13記載の封止用樹脂組成物シート。
- 請求項1~9のいずれか1項に記載の封止用樹脂組成物を含むことを特徴とする、有機ELデバイス。
- 無機充填材(F)をさらに含有することを特徴とする、請求項1~9のいずれか1項に記載の封止用樹脂組成物。
- 吸湿性金属酸化物(G)をさらに含有することを特徴とする、請求項1~9のいずれか1項に記載の封止用樹脂組成物。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201480056892.5A CN105637029A (zh) | 2013-11-08 | 2014-11-07 | 密封用树脂组合物 |
KR1020167002194A KR20160086317A (ko) | 2013-11-08 | 2014-11-07 | 밀봉용 수지 조성물 |
JP2015546698A JPWO2015068805A1 (ja) | 2013-11-08 | 2014-11-07 | 封止用樹脂組成物 |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2013231756 | 2013-11-08 | ||
JP2013-231756 | 2013-11-08 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO2015068805A1 true WO2015068805A1 (ja) | 2015-05-14 |
Family
ID=53041580
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP2014/079588 WO2015068805A1 (ja) | 2013-11-08 | 2014-11-07 | 封止用樹脂組成物 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2015068805A1 (ja) |
KR (1) | KR20160086317A (ja) |
CN (1) | CN105637029A (ja) |
TW (1) | TW201522592A (ja) |
WO (1) | WO2015068805A1 (ja) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2018151002A1 (ja) * | 2017-02-14 | 2018-08-23 | 積水化学工業株式会社 | 光硬化性樹脂組成物、有機el表示素子用封止剤、有機el表示素子、量子ドットデバイス用封止剤、及び、量子ドットデバイス |
KR20190019960A (ko) * | 2016-06-16 | 2019-02-27 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 나노입자 충전된 배리어 접착제 조성물 |
WO2019082468A1 (ja) * | 2017-10-27 | 2019-05-02 | 株式会社Moresco | フレキシブル有機デバイス用の封止材、およびその利用 |
WO2019159830A1 (ja) * | 2018-02-16 | 2019-08-22 | 三井化学株式会社 | 画像表示装置封止材および画像表示装置封止シート |
WO2021065973A1 (ja) * | 2019-09-30 | 2021-04-08 | 味の素株式会社 | 封止用樹脂組成物 |
WO2023190191A1 (ja) * | 2022-03-30 | 2023-10-05 | 三井化学株式会社 | エポキシ樹脂組成物、封止材および画像表示装置 |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6725373B2 (ja) * | 2015-09-16 | 2020-07-15 | 日東電工株式会社 | 粘着剤組成物、粘着剤層、粘着剤層付光学フィルム、光学部材、及び画像表示装置 |
JP6852967B2 (ja) * | 2015-09-16 | 2021-03-31 | 日東電工株式会社 | 粘着剤層付偏光フィルム、光学部材、及び画像表示装置 |
JP7071279B2 (ja) * | 2016-11-18 | 2022-05-18 | リンテック株式会社 | 接着剤組成物、封止シート、及び封止体 |
TWI794234B (zh) * | 2017-05-31 | 2023-03-01 | 日商琳得科股份有限公司 | 黏著劑組合物、黏著薄片及密封體 |
WO2019167905A1 (ja) * | 2018-02-27 | 2019-09-06 | 味の素株式会社 | 封止用樹脂組成物 |
KR20220022876A (ko) * | 2020-08-19 | 2022-02-28 | 주식회사 엘지화학 | 열경화성 수지 조성물, 및 이를 이용한 봉지 필름 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006117758A (ja) * | 2004-10-20 | 2006-05-11 | Denki Kagaku Kogyo Kk | ポリイソブチレンを用いたシーリング材 |
JP2009524705A (ja) * | 2006-01-24 | 2009-07-02 | スリーエム イノベイティブ プロパティズ カンパニー | 接着性封入用組成物フィルム及び有機エレクトロルミネッセンスデバイス |
WO2011062167A1 (ja) * | 2009-11-18 | 2011-05-26 | 味の素株式会社 | 樹脂組成物 |
JP2011231309A (ja) * | 2010-04-09 | 2011-11-17 | Nitto Denko Corp | シーリング組成物、複層ガラスおよび太陽電池パネル |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008248055A (ja) | 2007-03-30 | 2008-10-16 | Kaneka Corp | シール材用組成物及びシール材 |
KR101969288B1 (ko) | 2012-01-16 | 2019-04-17 | 아지노모토 가부시키가이샤 | 밀봉용 수지 조성물 |
-
2014
- 2014-11-07 CN CN201480056892.5A patent/CN105637029A/zh active Pending
- 2014-11-07 TW TW103138825A patent/TW201522592A/zh unknown
- 2014-11-07 JP JP2015546698A patent/JPWO2015068805A1/ja active Pending
- 2014-11-07 WO PCT/JP2014/079588 patent/WO2015068805A1/ja active Application Filing
- 2014-11-07 KR KR1020167002194A patent/KR20160086317A/ko not_active Application Discontinuation
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006117758A (ja) * | 2004-10-20 | 2006-05-11 | Denki Kagaku Kogyo Kk | ポリイソブチレンを用いたシーリング材 |
JP2009524705A (ja) * | 2006-01-24 | 2009-07-02 | スリーエム イノベイティブ プロパティズ カンパニー | 接着性封入用組成物フィルム及び有機エレクトロルミネッセンスデバイス |
WO2011062167A1 (ja) * | 2009-11-18 | 2011-05-26 | 味の素株式会社 | 樹脂組成物 |
JP2011231309A (ja) * | 2010-04-09 | 2011-11-17 | Nitto Denko Corp | シーリング組成物、複層ガラスおよび太陽電池パネル |
Cited By (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20190019960A (ko) * | 2016-06-16 | 2019-02-27 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 나노입자 충전된 배리어 접착제 조성물 |
KR102407014B1 (ko) | 2016-06-16 | 2022-06-10 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 나노입자 충전된 배리어 접착제 조성물 |
WO2018151002A1 (ja) * | 2017-02-14 | 2018-08-23 | 積水化学工業株式会社 | 光硬化性樹脂組成物、有機el表示素子用封止剤、有機el表示素子、量子ドットデバイス用封止剤、及び、量子ドットデバイス |
CN109937214B (zh) * | 2017-02-14 | 2022-10-21 | 积水化学工业株式会社 | 光固化性树脂组合物、有机el显示元件用密封剂、有机el显示元件、量子点设备用密封剂和量子点设备 |
CN109937214A (zh) * | 2017-02-14 | 2019-06-25 | 积水化学工业株式会社 | 光固化性树脂组合物、有机el显示元件用密封剂、有机el显示元件、量子点设备用密封剂和量子点设备 |
EP3702430A4 (en) * | 2017-10-27 | 2021-08-04 | Moresco Corporation | SEALING MATERIAL FOR FLEXIBLE ORGANIC DEVICE AND ITS USE |
JPWO2019082468A1 (ja) * | 2017-10-27 | 2020-12-10 | 株式会社Moresco | フレキシブル有機デバイス用の封止材、およびその利用 |
WO2019082468A1 (ja) * | 2017-10-27 | 2019-05-02 | 株式会社Moresco | フレキシブル有機デバイス用の封止材、およびその利用 |
JPWO2019159830A1 (ja) * | 2018-02-16 | 2020-12-17 | 三井化学株式会社 | 画像表示装置封止材および画像表示装置封止シート |
JP7079839B2 (ja) | 2018-02-16 | 2022-06-02 | 三井化学株式会社 | 画像表示装置封止材および画像表示装置封止シート |
WO2019159830A1 (ja) * | 2018-02-16 | 2019-08-22 | 三井化学株式会社 | 画像表示装置封止材および画像表示装置封止シート |
WO2021065973A1 (ja) * | 2019-09-30 | 2021-04-08 | 味の素株式会社 | 封止用樹脂組成物 |
JP2021054981A (ja) * | 2019-09-30 | 2021-04-08 | 味の素株式会社 | 封止用樹脂組成物 |
JP7318462B2 (ja) | 2019-09-30 | 2023-08-01 | 味の素株式会社 | 封止用樹脂組成物 |
WO2023190191A1 (ja) * | 2022-03-30 | 2023-10-05 | 三井化学株式会社 | エポキシ樹脂組成物、封止材および画像表示装置 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2015068805A1 (ja) | 2017-03-09 |
TW201522592A (zh) | 2015-06-16 |
CN105637029A (zh) | 2016-06-01 |
KR20160086317A (ko) | 2016-07-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
WO2015068805A1 (ja) | 封止用樹脂組成物 | |
JP5768718B2 (ja) | 樹脂組成物 | |
KR102612145B1 (ko) | 밀봉용 수지 조성물 | |
JP6680295B2 (ja) | 封止用樹脂組成物 | |
JP5725671B2 (ja) | 電子的装置のカプセル化方法 | |
JP5634518B2 (ja) | 電子的装置のカプセル化方法 | |
JP2007197517A (ja) | 接着性封止組成物、封止フィルム及び有機el素子 | |
CA2688618A1 (en) | Method for encapsulating an electronic arrangement | |
JP6903992B2 (ja) | 封止用樹脂組成物および封止用シート | |
JP6410446B2 (ja) | 有機電子デバイス用素子封止用樹脂組成物、有機電子デバイス用素子封止用樹脂シート、有機エレクトロルミネッセンス素子、及び画像表示装置 | |
WO2015178474A1 (ja) | 樹脂組成物 | |
JP2017122136A (ja) | 樹脂組成物 | |
KR20220100902A (ko) | 밀봉용 시트 | |
JP2017122135A (ja) | 封止用樹脂組成物 | |
CN113646171A (zh) | 树脂组合物及树脂片材 | |
JP7099441B2 (ja) | 封止用シート | |
KR20230136066A (ko) | 밀봉용 조성물 및 밀봉용 시트 | |
TW202313837A (zh) | 密封用組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
121 | Ep: the epo has been informed by wipo that ep was designated in this application |
Ref document number: 14859593 Country of ref document: EP Kind code of ref document: A1 |
|
ENP | Entry into the national phase |
Ref document number: 2015546698 Country of ref document: JP Kind code of ref document: A |
|
ENP | Entry into the national phase |
Ref document number: 20167002194 Country of ref document: KR Kind code of ref document: A |
|
NENP | Non-entry into the national phase |
Ref country code: DE |
|
122 | Ep: pct application non-entry in european phase |
Ref document number: 14859593 Country of ref document: EP Kind code of ref document: A1 |