JPWO2018105299A1 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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Abstract
Description
実施の形態にかかる半導体装置の製造方法について、FWD領域にヘリウム(He)照射によりヘリウムの欠陥を導入した耐圧1200VクラスのRC−IGBTを例に説明する。耐圧とは、素子が誤動作や破壊を起こさない限界の電圧である。図1は、実施の形態にかかる半導体装置の製造途中の状態を示す断面図である。図2は、実施の形態にかかる半導体装置の製造途中の別の一例の状態を示す断面図である。図1,2には、それぞれ、半導体ウエハ10のおもて面10a側および裏面10b側からヘリウム照射を行っている状態を模式的に示す。
2 p型ベース領域
3 n+型エミッタ領域
4 p+型コンタクト領域
5 n型蓄積層
6 トレンチ
7 ゲート絶縁膜
8 ゲート電極
9 層間絶縁膜
10 半導体ウエハ
10a 半導体ウエハのおもて面
10b 半導体ウエハの裏面
10c 半導体ウエハの端部
10d 半導体ウエハの周縁部
11 おもて面電極
12 n型フィールドストップ層
13 p+型コレクタ領域
14 n+型カソード領域
15 欠陥
21 IGBT領域
22 FWD領域
31,33 フォトレジスト膜
31a フォトレジスト膜の端部の溶解される部分
31b フォトレジスト膜の端部の溶解中にフォトレジスト膜の新たに露出される端面
31c フォトレジスト膜のパターンの端面
31d フォトレジスト膜の開口部
32,34 ヘリウム照射
40 コーター
41 回転支持台
41a 回転支持台の回転軸
42 コーターカップ
43 薬液が吐出されるノズル
44 薬液
45 フォトレジスト膜の端部付近
46 加熱手段
46a 加熱手段の載置面
47 加熱手段の載置面の保持部
t1,t1’,t2 フォトレジスト膜の厚さ
w1 半導体ウエハの周縁部の幅、フォトレジスト膜の端部の溶解される部分の幅
w2 フォトレジスト膜の開口部の幅
Claims (14)
- 半導体ウエハの第1主面にフォトレジストを塗布してフォトレジスト膜を形成する第1工程と、
前記フォトレジスト膜の所定箇所を開口してレジストマスクを形成する第2工程と、
前記レジストマスクをマスクとして、前記半導体ウエハの第1主面から8μm以上の飛程となる加速エネルギーで不純物をイオン注入する第3工程と、
を含むことを特徴とする半導体装置の製造方法。 - 前記第1工程では、前記半導体ウエハの第1主面の全面に所定厚さの前記フォトレジスト膜を形成し、
前記第1工程の後、前記第2工程の前に、
熱処理により前記フォトレジスト膜を乾燥させる乾燥工程と、
前記乾燥工程の後、前記フォトレジスト膜の端部から所定幅の部分を、前記フォトレジスト膜の端部を全周にわたって薬液で溶解して除去する除去工程と、をさらに含むことを特徴とする請求項1に記載の半導体装置の製造方法。 - 前記第1工程では、前記半導体ウエハを当該半導体ウエハの第1主面と直交する中心軸周りに所定回転数で回転させることで前記フォトレジストを前記半導体ウエハの第1主面の全面に広げて前記所定厚さの前記フォトレジスト膜を形成し、
前記除去工程では、前記半導体ウエハを前記中心軸周りに前記所定回転数以下の回転数で回転させた状態で前記フォトレジスト膜の端部に前記薬液を滴下して、前記フォトレジスト膜の端部の全周にわたって前記薬液を塗布することを特徴とする請求項2に記載の半導体装置の製造方法。 - 前記フォトレジスト膜の厚さは、33μm以上であることを特徴とする請求項1に記載の半導体装置の製造方法。
- 前記イオン注入の加速エネルギーは、3.0MeV以上であることを特徴とする請求項1に記載の半導体装置の製造方法。
- 前記不純物はヘリウムであることを特徴とする請求項1に記載の半導体装置の製造方法。
- 前記イオン注入のドーズ量を1×1015/cm2以下とし、
前記イオン注入の加速エネルギーを5MeV以下とし、
前記第2工程の後、他の工程を挟まずに前記第3工程を行うことを特徴とする請求項6に記載の半導体装置の製造方法。 - 前記第2工程は、
前記フォトレジスト膜に所定のマスクパターンを転写する露光工程と、
前記マスクパターンに基づいて前記フォトレジスト膜を選択的に溶かして、前記フォトレジスト膜の前記所定箇所を開口する現像工程と、を含み、
前記現像工程の後、他の工程を挟まずに前記第3工程を行うことを特徴とする請求項7に記載の半導体装置の製造方法。 - 化学増幅型の前記フォトレジストを用いることを特徴とする請求項1に記載の半導体装置の製造方法。
- ポジ型の前記フォトレジストを用いることを特徴とする請求項1に記載の半導体装置の製造方法。
- ネガ型の前記フォトレジストを用いることを特徴とする請求項1に記載の半導体装置の製造方法。
- 前記第1工程の前に、前記半導体ウエハの第1領域に第1半導体素子を形成し、前記半導体ウエハの第2領域に第2半導体素子を形成する素子形成工程をさらに含み、
前記フォトレジスト膜の前記所定箇所は、前記第2領域の形成領域に対応する箇所であることを特徴とする請求項1〜11のいずれか一つに記載の半導体装置の製造方法。 - 前記第1半導体素子は絶縁ゲート型バイポーラトランジスタであり、
前記第2半導体素子はダイオードであり、
前記素子形成工程では、第1導電型の前記半導体ウエハの第1主面の表面層に、前記絶縁ゲート型バイポーラトランジスタのベース領域および前記ダイオードのアノード領域となる第2導電型半導体領域を形成し、
前記第3工程では、前記半導体ウエハの第1主面から、前記半導体ウエハの、前記第2導電型半導体領域との界面付近に前記不純物を注入することを特徴とする請求項12に記載の半導体装置の製造方法。 - 前記第1半導体素子は絶縁ゲート型バイポーラトランジスタであり、
前記第2半導体素子はダイオードであり、
前記素子形成工程では、第1導電型の前記半導体ウエハの第2主面の表面層に、前記絶縁ゲート型バイポーラトランジスタのベース領域および前記ダイオードのアノード領域となる第2導電型半導体領域を形成し、
前記第3工程では、前記半導体ウエハの第1主面から、前記半導体ウエハの、前記第2導電型半導体領域との界面付近に前記不純物を注入することを特徴とする請求項12に記載の半導体装置の製造方法。
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