JPWO2014080449A1 - 半導体装置 - Google Patents
半導体装置 Download PDFInfo
- Publication number
- JPWO2014080449A1 JPWO2014080449A1 JP2014548351A JP2014548351A JPWO2014080449A1 JP WO2014080449 A1 JPWO2014080449 A1 JP WO2014080449A1 JP 2014548351 A JP2014548351 A JP 2014548351A JP 2014548351 A JP2014548351 A JP 2014548351A JP WO2014080449 A1 JPWO2014080449 A1 JP WO2014080449A1
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- semiconductor device
- metal spacer
- transistor
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 88
- 239000000463 material Substances 0.000 claims abstract description 147
- 239000002184 metal Substances 0.000 claims abstract description 64
- 229910052751 metal Inorganic materials 0.000 claims abstract description 64
- 125000006850 spacer group Chemical group 0.000 claims abstract description 51
- 239000011347 resin Substances 0.000 claims abstract description 28
- 229920005989 resin Polymers 0.000 claims abstract description 28
- 229910000679 solder Inorganic materials 0.000 claims description 73
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 10
- 229910020888 Sn-Cu Inorganic materials 0.000 claims description 8
- 229910019204 Sn—Cu Inorganic materials 0.000 claims description 8
- 239000002105 nanoparticle Substances 0.000 claims description 8
- 229910020935 Sn-Sb Inorganic materials 0.000 claims description 6
- 229910008757 Sn—Sb Inorganic materials 0.000 claims description 6
- 229910007570 Zn-Al Inorganic materials 0.000 claims description 6
- 238000009792 diffusion process Methods 0.000 claims description 6
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- FOIXSVOLVBLSDH-UHFFFAOYSA-N Silver ion Chemical compound [Ag+] FOIXSVOLVBLSDH-UHFFFAOYSA-N 0.000 claims description 2
- 230000006866 deterioration Effects 0.000 abstract description 9
- 238000000034 method Methods 0.000 abstract description 3
- 238000005516 engineering process Methods 0.000 description 11
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 229910045601 alloy Inorganic materials 0.000 description 4
- 239000000956 alloy Substances 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000007791 liquid phase Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000004088 simulation Methods 0.000 description 2
- 229910000789 Aluminium-silicon alloy Inorganic materials 0.000 description 1
- 229910016347 CuSn Inorganic materials 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910005887 NiSn Inorganic materials 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 125000004122 cyclic group Chemical group 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- JBQYATWDVHIOAR-UHFFFAOYSA-N tellanylidenegermanium Chemical compound [Te]=[Ge] JBQYATWDVHIOAR-UHFFFAOYSA-N 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
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Abstract
Description
Claims (8)
- 半導体素子と、
リードフレームと、
半導体素子とリードフレームの間に配置された金属スペーサと、
半導体素子と金属スペーサを封止しているとともにリードフレームの一面が密着している樹脂モールド体と、を備えており、
金属スペーサと半導体素子が第1接合材によって接合されているとともに、金属スペーサとリードフレームが第2接合材によって接合されており、
第2の接合材の強度が第1の接合材の強度よりも低いことを特徴とする半導体装置。 - 前記強度は、予め定められた基準に基づく予測寿命で定められることを特徴とする請求項1に記載の半導体装置。
- 前記強度は、降伏応力あるいは0.2%耐力で定められることを特徴とする請求項1に記載の半導体装置。
- 樹脂モールド体の両側の夫々にリードフレームが固定されており、少なくとも一方のリードフレームと前記金属スペーサが第2接合材で接合されていることを特徴とする請求項1から3のいずれか1項に記載の半導体装置。
- 他方のリードフレームと別の金属スペーサが第2接合材で接合されており、別の金属スペーサと半導体素子が第1接合材で接合されていることを特徴とする請求項4に記載の半導体装置。
- 第2接合材がSn−Cuハンダ材であることを特徴とする請求項1から5のいずれか1項に記載の半導体装置。
- 第1接合材がSn−Sbハンダ材、Zn−Alハンダ材、ニッケルナノ粒子、銀ナノ粒子のいずれかであることを特徴とする請求項1から6のいずれか1項に記載の半導体装置。
- 半導体素子と金属スペーサは、インサート材を第1接合材として用いる拡散接合によって接合されていることを特徴とする請求項1から6のいずれか1項に記載の半導体装置。
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PCT/JP2012/080031 WO2014080449A1 (ja) | 2012-11-20 | 2012-11-20 | 半導体装置 |
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JP6354954B2 (ja) * | 2015-05-15 | 2018-07-11 | トヨタ自動車株式会社 | 半導体装置の製造方法及び半導体装置 |
US11094661B2 (en) * | 2015-11-16 | 2021-08-17 | Kabushiki Kaisha Toyota Chuo Kenkyusho | Bonded structure and method of manufacturing the same |
JP6480856B2 (ja) * | 2015-12-14 | 2019-03-13 | 株式会社東芝 | 半導体モジュール |
JP6477517B2 (ja) * | 2016-01-20 | 2019-03-06 | トヨタ自動車株式会社 | 半導体装置の製造方法 |
JP6750263B2 (ja) | 2016-03-18 | 2020-09-02 | 富士電機株式会社 | 電力用半導体モジュール |
WO2018025571A1 (ja) * | 2016-08-05 | 2018-02-08 | 三菱電機株式会社 | パワー半導体装置 |
JP6907546B2 (ja) * | 2017-01-17 | 2021-07-21 | 三菱マテリアル株式会社 | パワーモジュール |
JP6878930B2 (ja) * | 2017-02-08 | 2021-06-02 | 株式会社デンソー | 半導体装置 |
US10886251B2 (en) * | 2017-04-21 | 2021-01-05 | Toyota Motor Engineering & Manufacturing North America, Inc. | Multi-layered composite bonding materials and power electronics assemblies incorporating the same |
FR3092698B1 (fr) * | 2019-02-11 | 2021-05-07 | St Microelectronics Tours Sas | Assemblage comportant un composant vertical de puissance monté sur une plaque métallique de connexion |
EP3817044A1 (en) | 2019-11-04 | 2021-05-05 | Infineon Technologies Austria AG | Semiconductor package with a silicon carbide power semiconductor chip diffusion soldered to a copper leadframe part and a corresponding manufacturing method |
JP2023041490A (ja) * | 2021-09-13 | 2023-03-24 | 株式会社東芝 | 半導体装置 |
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US20150294920A1 (en) | 2015-10-15 |
DE112012007149B4 (de) | 2020-07-09 |
JP6028810B2 (ja) | 2016-11-24 |
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CN104756250A (zh) | 2015-07-01 |
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