JPWO2012111254A1 - 半導体装置及びその製造方法 - Google Patents
半導体装置及びその製造方法 Download PDFInfo
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- 239000010931 gold Substances 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
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Abstract
Description
以下、図6〜図10を参照しながら、本実施形態に係る半導体装置の製造方法の一例について説明する。
2 放熱板
2b 下面
2c 側面
3 リードフレーム
4 制御素子
5 リード
5a 切り欠き部
5b ダムバー
6 外装体
6a 上面
6b 下面
6c 樹脂充填部
6d 溝
6A 開口部
8 ろう材
9 第1ダイパッド部
9a 上面
9b 下面
10 絶縁シート
11 第2ダイパッド部
11a 上面
12 下金型
13 上金型
13A 金型挿入ピン
14 ダムバー切断用刃
21 金属部材
22 金ワイヤ
Claims (16)
- 切り欠き部が形成されたリードと、
ダイパッド部と、
前記ダイパッド部に保持された第1素子と、
前記第1素子を含むダイパッド部及び前記リードの内側の端部を封止する樹脂材から構成される外装体と、を備え、
前記切り欠き部は、前記リードにおける前記外装体との境界部分を含む領域に配置されると共に、
樹脂材が充填された半導体装置。 - 請求項1において、
前記切り欠き部に充填された樹脂材は、前記外装体を構成する樹脂材と組成が同一である半導体装置。 - 請求項1又は2において、
前記切り欠き部は、隣り合うリード同士の少なくとも一方に形成された半導体装置。 - 請求項1〜3のいずれか1項において、
前記切り欠き部は、1つのリードの両側面に形成された半導体装置。 - 請求項1〜4のいずれか1項において、
前記切り欠き部に充填された樹脂材と、前記外装体を構成する樹脂材とは一体に形成された半導体装置。 - 請求項1〜5のいずれか1項において、
前記第1素子は、パワー素子である半導体装置。 - 請求項6において、
前記パワー素子を制御する第2素子である制御素子をさらに備え、
前記切り欠き部が形成されたリードは、前記制御素子と接続された半導体装置。 - 請求項1〜7のいずれか1項において、
前記切り欠き部は、前記リードにおいて、前記リードに形成されたダムバーよりも内側に形成された半導体装置。 - 請求項1〜7のいずれか1項において、
前記切り欠き部間に充填された樹脂材に、前記リードの突出方向と平行な溝が形成されている半導体装置。 - 請求項9において、
前記溝の一部が、前記外装体の内部に配置された半導体装置。 - 請求項1〜10のいずれか1項において、
1つのリードにおいて、前記切り欠き部に充填された樹脂材による樹脂充填部同士の間隔が0.4mm以上である半導体装置。 - 請求項1〜11のいずれか1項において、
前記切り欠き部の一部が、前記外装体内に配置された半導体装置。 - 請求項12において、
前記外装体内に配置された前記切り欠き部の長さが、前記樹脂材に混錬されたフィラーの径よりも大きい半導体装置。 - 請求項1〜13のいずれか1項において、
前記切り欠き部の内側の形状が、傾斜状又は階段状である半導体装置。 - 第1素子を保持するダイパッド部と、切り欠き部を有するリードとを用意し、
前記リードの切り欠き部を金型のクランプ位置に配置して封止用の樹脂材を前記金型に注入することで、前記樹脂材により前記第1素子を含むダイパッド部及び前記リードの内側の端部を封止する半導体装置の製造方法。 - 請求項15において、
前記リードの切り欠き部を前記金型のクランプ位置に配置して前記樹脂材を前記金型内に注入することで、
前記リードに形成された切り欠き部に前記樹脂材を充填する半導体装置の製造方法。
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