JPWO2010119792A1 - 基板、薄膜付き基板、半導体装置、および半導体装置の製造方法 - Google Patents
基板、薄膜付き基板、半導体装置、および半導体装置の製造方法 Download PDFInfo
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- JPWO2010119792A1 JPWO2010119792A1 JP2011509265A JP2011509265A JPWO2010119792A1 JP WO2010119792 A1 JPWO2010119792 A1 JP WO2010119792A1 JP 2011509265 A JP2011509265 A JP 2011509265A JP 2011509265 A JP2011509265 A JP 2011509265A JP WO2010119792 A1 JPWO2010119792 A1 JP WO2010119792A1
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- silicon carbide
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Abstract
Description
Claims (21)
- 主表面(1a、1b)の直径が2インチ以上であり、前記主表面(1a、1b)におけるbowの値が−40μm以上−5μm以下、前記主表面におけるwarpの値が5μm以上40μm以下である、炭化珪素からなる基板。
- 前記基板(1、101、103)の、一方の主表面(1a)の表面粗さRaの値が1nm以下、前記一方の主表面に対向する他方の主表面(1b)の表面粗さRaの値が100nm以下である、請求の範囲第1項に記載の基板。
- 前記主表面(1a、1b)におけるTTVの値が5μm以下である、請求の範囲第1項に記載の基板。
- 前記主表面(1a、1b)がC面となす角度が50°以上65°以下である、請求の範囲第1項に記載の基板。
- 請求の範囲第1項に記載の基板(1、101、103)を用いた半導体装置。
- 主表面(1a、1b)の直径が2インチ以上の炭化珪素からなる基板(1)と、
一方の前記主表面(1a)上に形成された炭化珪素の薄膜(4)とを備える薄膜付き基板(2、3)であって、
前記主表面(1a、1b)におけるbowの値が−40μm以上0μm以下、前記主表面(1a、1b)におけるwarpの値が0μm以上40μm以下である薄膜付き基板。 - 前記基板(1)の、一方の主表面(1a)の表面粗さRaの値が1nm以下、前記一方の主表面に対向する他方の主表面(1b)の表面粗さRaの値が100nm以下である、請求の範囲第6項に記載の薄膜付き基板。
- 前記主表面(1a、1b)におけるTTVの値が5μm以下である、請求の範囲第6項に記載の薄膜付き基板。
- 前記主表面(1a、1b)がC面となす角度が50°以上65°以下である、請求の範囲第6項に記載の薄膜付き基板。
- 請求の範囲第6項に記載の薄膜付き基板(2、3)を用いた半導体装置。
- 主表面(1a、1b)の直径が2インチ以上の炭化珪素からなる基板(1)と、
一方の前記主表面上に形成された炭化珪素の薄膜(4)と、
前記炭化珪素の薄膜の前記基板と対向しない主表面上に形成された炭化珪素以外の薄膜(5)とを備える薄膜付き基板(3)であって、
前記主表面(1a、1b)におけるbowの値が0μm以上150μm以下、前記主表面(1a、1b)におけるwarpの値が0μm以上150μm以下である薄膜付き基板。 - 前記主表面(1a、1b)におけるbowの値が0μm以上100μm以下、warpの値が0μm以上100μm以下である、請求の範囲第11項に記載の薄膜付き基板。
- 前記基板(1)の、一方の主表面(1a)の表面粗さRaの値が1nm以下、前記一方の主表面に対向する他方の主表面(1b)の表面粗さRaの値が100nm以下である、請求の範囲第11項に記載の薄膜付き基板。
- 前記主表面(1a、1b)におけるTTVの値が5μm以下である、請求の範囲第11項に記載の薄膜付き基板。
- 前記主表面(1a、1b)がC面となす角度が50°以上65°以下である、請求の範囲第11項に記載の薄膜付き基板。
- 請求の範囲第11項に記載の薄膜付き基板(3)を用いた半導体装置。
- 主表面(1a、1b)の直径が2インチ以上の炭化珪素からなる基板(1)を準備する工程と、
前記基板(1)の一方の前記主表面上に、炭化珪素の薄膜(4)を形成する工程と、
前記薄膜(4)の前記基板(1)と対向しない主表面上に、炭化珪素以外の薄膜(5)を形成する工程とを備える、半導体装置の製造方法であって、
前記基板を準備する工程においては、前記主表面(1a、1b)におけるbowの値が−40μm以上0μm以下、前記主表面(1a、1b)におけるwarpの値が0μm以上40μm以下となるように前記基板を準備し、
前記炭化珪素の薄膜(4)を形成する工程においては、前記主表面におけるbowの値が−40μm以上0μm以下、前記主表面におけるwarpの値が0μm以上40μm以下となるように前記炭化珪素の薄膜(49)を形成し、
前記炭化珪素以外の薄膜(5)を形成する工程においては、前記主表面におけるbowの値が0μm以上150μm以下、前記主表面におけるwarpの値が0μm以上150μm以下となるように前記炭化珪素以外の薄膜(5)を形成する、半導体装置の製造方法。 - 前記基板(1)を準備する工程においては、前記主表面のうち一方の主表面(1a)の表面粗さRaの値が1nm以下、前記一方の主表面に対向する他方の主表面(1b)の表面粗さRaの値が100nm以下となるように前記基板を準備する、請求の範囲第17項に記載の半導体装置の製造方法。
- 前記炭化珪素以外の薄膜(5)を形成する工程においては、前記炭化珪素以外の薄膜(5)として金属の薄膜または絶縁膜を形成する、請求の範囲第17項に記載の半導体装置の製造方法。
- 前記金属はタングステンである、請求の範囲第19項に記載の半導体装置の製造方法。
- 前記絶縁膜はシリコン酸化膜である、請求の範囲第19項に記載の半導体装置の製造方法。
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EP2420599A4 (en) | 2014-02-26 |
WO2010119792A9 (ja) | 2011-05-05 |
EP2824223B1 (en) | 2020-07-08 |
CA2747776A1 (en) | 2010-10-21 |
EP2762615A2 (en) | 2014-08-06 |
TW201101481A (en) | 2011-01-01 |
CN102257190B (zh) | 2014-04-16 |
US20110233562A1 (en) | 2011-09-29 |
EP2824223A1 (en) | 2015-01-14 |
JP5993146B2 (ja) | 2016-09-14 |
US8436366B2 (en) | 2013-05-07 |
EP2420599A1 (en) | 2012-02-22 |
WO2010119792A1 (ja) | 2010-10-21 |
EP2762615A3 (en) | 2014-10-29 |
KR20120015428A (ko) | 2012-02-21 |
CN102257190A (zh) | 2011-11-23 |
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