JPWO2010114164A1 - ばね用線材、コンタクトプローブおよびプローブユニット - Google Patents
ばね用線材、コンタクトプローブおよびプローブユニット Download PDFInfo
- Publication number
- JPWO2010114164A1 JPWO2010114164A1 JP2011507321A JP2011507321A JPWO2010114164A1 JP WO2010114164 A1 JPWO2010114164 A1 JP WO2010114164A1 JP 2011507321 A JP2011507321 A JP 2011507321A JP 2011507321 A JP2011507321 A JP 2011507321A JP WO2010114164 A1 JPWO2010114164 A1 JP WO2010114164A1
- Authority
- JP
- Japan
- Prior art keywords
- spring
- probe
- spring wire
- coil spring
- cross
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F1/00—Springs
- F16F1/02—Springs made of steel or other material having low internal friction; Wound, torsion, leaf, cup, ring or the like springs, the material of the spring not being relevant
- F16F1/021—Springs made of steel or other material having low internal friction; Wound, torsion, leaf, cup, ring or the like springs, the material of the spring not being relevant characterised by their composition, e.g. comprising materials providing for particular spring properties
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F1/00—Springs
- F16F1/02—Springs made of steel or other material having low internal friction; Wound, torsion, leaf, cup, ring or the like springs, the material of the spring not being relevant
- F16F1/024—Covers or coatings therefor
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F1/00—Springs
- F16F1/02—Springs made of steel or other material having low internal friction; Wound, torsion, leaf, cup, ring or the like springs, the material of the spring not being relevant
- F16F1/04—Wound springs
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F1/00—Springs
- F16F1/02—Springs made of steel or other material having low internal friction; Wound, torsion, leaf, cup, ring or the like springs, the material of the spring not being relevant
- F16F1/04—Wound springs
- F16F1/042—Wound springs characterised by the cross-section of the wire
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16F—SPRINGS; SHOCK-ABSORBERS; MEANS FOR DAMPING VIBRATION
- F16F1/00—Springs
- F16F1/02—Springs made of steel or other material having low internal friction; Wound, torsion, leaf, cup, ring or the like springs, the material of the spring not being relevant
- F16F1/04—Wound springs
- F16F1/047—Wound springs characterised by varying pitch
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
- H01R13/035—Plated dielectric material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0607—Wires
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/045—Sockets or component fixtures for RF or HF testing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R2201/00—Connectors or connections adapted for particular applications
- H01R2201/20—Connectors or connections adapted for particular applications for testing or measuring purposes
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measuring Leads Or Probes (AREA)
- Springs (AREA)
Abstract
Description
2、11、14、17 芯材
3、12、15、18 被覆材
4 プローブユニット
5 コンタクトプローブ
6 プローブホルダ
6h 保持孔
7 ベース部材
9 メッキ被膜
19 接続端子
19a コイルばね部
19b、19c 電極ピン部
51 第1プランジャ
51a、52a 先端部
51b、52b フランジ部
51c、52c ボス部
51d、52d 基端部
52 第2プランジャ
53 圧縮コイルばね
61 第1基板
61a、62a 母材
61b、62b 絶縁被膜
62 第2基板
100 半導体パッケージ
200 配線基板
611、621 孔部
611a、621a 小径孔
611b、621b 大径孔
Claims (6)
- 電気抵抗率が5.00×10-8Ω・m以下の導電性材料からなる線状の芯材と、
縦弾性係数が1.00×104kgf/mm2以上のばね材料からなり、前記芯材の外周を被覆する被覆材と、
を備えたことを特徴とするばね用線材。 - 前記被覆材の被覆厚さは、前記芯材の横断面の重心から該横断面の外縁までの距離の最小値より小さいことを特徴とする請求項1に記載のばね用線材。
- 前記被覆材の外周を被覆するメッキ被膜をさらに備えたことを特徴とする請求項1または2に記載のばね用線材。
- 各々が軸対称な形状を有する導電性材料からなる第1および第2プランジャと、
長手方向の両端部が前記第1および第2プランジャの端部であって互いに対向する端部にそれぞれ圧入され、該長手方向に伸縮自在な圧縮コイルばねと、
を備え、
前記圧縮コイルばねは、
請求項1〜3のいずれか一項に記載のばね用線材を所定のピッチで巻回してなることを特徴とするコンタクトプローブ。 - 各々が軸対称な形状を有する導電性材料からなる第1および第2プランジャと、長手方向の両端部が前記第1および第2プランジャの端部であって互いに対向する端部にそれぞれ圧入され、該長手方向に伸縮自在な圧縮コイルばねとをそれぞれ有する複数のコンタクトプローブと、板状をなし、前記コンタクトプローブの両端部を相反する板面からそれぞれ露出した状態で伸縮可能に保持する保持孔を複数個有するプローブホルダと、を備えたプローブユニットであって、
前記圧縮コイルばねは、
請求項1〜3のいずれか一項に記載のばね用線材を所定のピッチで巻回してなることを特徴とするプローブユニット。 - 前記プローブホルダは、
導電性材料からなる母材と、前記母材の表面を被覆する絶縁被膜とを有することを特徴とする請求項5記載のプローブユニット。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2009091371 | 2009-04-03 | ||
JP2009091371 | 2009-04-03 | ||
PCT/JP2010/056182 WO2010114164A1 (ja) | 2009-04-03 | 2010-04-05 | ばね用線材、コンタクトプローブおよびプローブユニット |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2010114164A1 true JPWO2010114164A1 (ja) | 2012-10-11 |
Family
ID=42828444
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2011507321A Pending JPWO2010114164A1 (ja) | 2009-04-03 | 2010-04-05 | ばね用線材、コンタクトプローブおよびプローブユニット |
Country Status (7)
Country | Link |
---|---|
US (1) | US20120019277A1 (ja) |
EP (1) | EP2418495A4 (ja) |
JP (1) | JPWO2010114164A1 (ja) |
KR (1) | KR101335514B1 (ja) |
CN (1) | CN102369447A (ja) |
TW (1) | TWI482973B (ja) |
WO (1) | WO2010114164A1 (ja) |
Families Citing this family (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102668253B (zh) * | 2009-11-24 | 2015-10-14 | 日本发条株式会社 | 连接构件 |
EP2765427B1 (en) * | 2011-10-07 | 2016-12-07 | NHK Spring Co., Ltd. | Probe unit |
JP2013088389A (ja) * | 2011-10-21 | 2013-05-13 | Tokyo Electron Ltd | プローブカード用接触端子及びプローブカード |
KR102016427B1 (ko) | 2013-09-10 | 2019-09-02 | 삼성전자주식회사 | 포고 핀 및 이를 포함하는 프로브 카드 |
TW201533449A (zh) * | 2014-02-24 | 2015-09-01 | Mpi Corp | 具有彈簧套筒式探針之探針裝置 |
JP2018107011A (ja) * | 2016-12-27 | 2018-07-05 | 株式会社エンプラス | 電気接触子及び電気部品用ソケット |
WO2018230627A1 (ja) * | 2017-06-14 | 2018-12-20 | 日本発條株式会社 | 導電性接触子ユニット |
JP6837665B2 (ja) * | 2017-10-30 | 2021-03-03 | 株式会社サンケイエンジニアリング | コンタクトプローブ |
TWI671529B (zh) * | 2017-12-22 | 2019-09-11 | 馬來西亞商宇騰精密探針集團 | 具有壓縮性彈簧組件的接觸探針 |
TWI669510B (zh) * | 2018-02-06 | 2019-08-21 | 冠銓科技實業有限公司 | Probe for high frequency testing |
US20200119481A1 (en) * | 2018-10-12 | 2020-04-16 | David A. Struyk | Inductance canceling spring pin contact |
CN109188033A (zh) * | 2018-10-15 | 2019-01-11 | 东莞市盈之宝电子科技有限公司 | 一种新式探针 |
JP6756946B1 (ja) | 2018-11-27 | 2020-09-16 | 日本発條株式会社 | プローブユニット |
EP3680507A1 (en) * | 2019-01-11 | 2020-07-15 | NV Bekaert SA | Method for making a spring |
CN114325003A (zh) * | 2020-10-10 | 2022-04-12 | 深圳市容微精密电子有限公司 | 一种新型探针内部连接结构 |
TWI786625B (zh) * | 2021-05-07 | 2022-12-11 | 范劉文玲 | 傳輸探針 |
KR20230032060A (ko) * | 2021-08-30 | 2023-03-07 | (주)포인트엔지니어링 | 전기 전도성 접촉핀 및 이를 구비하는 수직형 프로브 카드 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001337110A (ja) * | 2000-05-29 | 2001-12-07 | Bureijingu:Kk | プローブピンおよびプローブカード |
JP2008078032A (ja) * | 2006-09-22 | 2008-04-03 | Alps Electric Co Ltd | 接続装置 |
WO2008072699A1 (ja) * | 2006-12-15 | 2008-06-19 | Nhk Spring Co., Ltd. | 導電性接触子ホルダ、導電性接触子ユニット、および導電性接触子ホルダの製造方法 |
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DE3820795A1 (de) * | 1988-06-20 | 1989-12-21 | Ingun Pruefmittelbau Gmbh | Gefederter kontaktstift zum pruefen von prueflingen |
US4939457A (en) * | 1989-05-03 | 1990-07-03 | Mts Systems Corporation | Flexible tube sonic waveguide for determining liquid level |
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US5189364A (en) * | 1990-07-30 | 1993-02-23 | Nhk Spring Co., Ltd. | Contact probe |
JP3326095B2 (ja) * | 1996-12-27 | 2002-09-17 | 日本発条株式会社 | 導電性接触子 |
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-
2010
- 2010-04-02 TW TW099110503A patent/TWI482973B/zh not_active IP Right Cessation
- 2010-04-05 JP JP2011507321A patent/JPWO2010114164A1/ja active Pending
- 2010-04-05 KR KR1020117022821A patent/KR101335514B1/ko not_active IP Right Cessation
- 2010-04-05 CN CN2010800143838A patent/CN102369447A/zh active Pending
- 2010-04-05 WO PCT/JP2010/056182 patent/WO2010114164A1/ja active Application Filing
- 2010-04-05 US US13/262,351 patent/US20120019277A1/en not_active Abandoned
- 2010-04-05 EP EP10758925.1A patent/EP2418495A4/en not_active Withdrawn
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001337110A (ja) * | 2000-05-29 | 2001-12-07 | Bureijingu:Kk | プローブピンおよびプローブカード |
JP2008078032A (ja) * | 2006-09-22 | 2008-04-03 | Alps Electric Co Ltd | 接続装置 |
WO2008072699A1 (ja) * | 2006-12-15 | 2008-06-19 | Nhk Spring Co., Ltd. | 導電性接触子ホルダ、導電性接触子ユニット、および導電性接触子ホルダの製造方法 |
Also Published As
Publication number | Publication date |
---|---|
CN102369447A (zh) | 2012-03-07 |
US20120019277A1 (en) | 2012-01-26 |
KR20110122759A (ko) | 2011-11-10 |
KR101335514B1 (ko) | 2013-12-02 |
TWI482973B (zh) | 2015-05-01 |
EP2418495A1 (en) | 2012-02-15 |
TW201043969A (en) | 2010-12-16 |
WO2010114164A1 (ja) | 2010-10-07 |
EP2418495A4 (en) | 2015-08-26 |
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