JPWO2008041334A1 - 電子部品試験装置 - Google Patents
電子部品試験装置 Download PDFInfo
- Publication number
- JPWO2008041334A1 JPWO2008041334A1 JP2007540849A JP2007540849A JPWO2008041334A1 JP WO2008041334 A1 JPWO2008041334 A1 JP WO2008041334A1 JP 2007540849 A JP2007540849 A JP 2007540849A JP 2007540849 A JP2007540849 A JP 2007540849A JP WO2008041334 A1 JPWO2008041334 A1 JP WO2008041334A1
- Authority
- JP
- Japan
- Prior art keywords
- under test
- electronic device
- device under
- test
- tray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2893—Handling, conveying or loading, e.g. belts, boats, vacuum fingers
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Power Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Packaging Frangible Articles (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/JP2006/319870 WO2008041334A1 (en) | 2006-10-04 | 2006-10-04 | Electronic component testing apparatus |
Publications (1)
Publication Number | Publication Date |
---|---|
JPWO2008041334A1 true JPWO2008041334A1 (ja) | 2010-02-04 |
Family
ID=39268202
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2007540849A Ceased JPWO2008041334A1 (ja) | 2006-10-04 | 2006-10-04 | 電子部品試験装置 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPWO2008041334A1 (zh) |
KR (2) | KR20100017827A (zh) |
CN (1) | CN101258415B (zh) |
TW (1) | TW200821599A (zh) |
WO (1) | WO2008041334A1 (zh) |
Families Citing this family (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101499573B1 (ko) * | 2010-06-16 | 2015-03-10 | (주)테크윙 | 테스트핸들러에서의 반도체소자 언로딩방법 |
JP2013044684A (ja) * | 2011-08-25 | 2013-03-04 | Seiko Epson Corp | ハンドラー、及び部品検査装置 |
JP2013137285A (ja) | 2011-12-28 | 2013-07-11 | Advantest Corp | ピッチ変更装置、電子部品ハンドリング装置、及び電子部品試験装置 |
JP2013137284A (ja) | 2011-12-28 | 2013-07-11 | Advantest Corp | 電子部品移載装置、電子部品ハンドリング装置、及び電子部品試験装置 |
JP2014224785A (ja) * | 2013-05-17 | 2014-12-04 | セイコーエプソン株式会社 | ハンドラーおよび検査装置 |
JP2014228297A (ja) * | 2013-05-20 | 2014-12-08 | セイコーエプソン株式会社 | ハンドラーおよび検査装置 |
KR102053081B1 (ko) * | 2013-10-08 | 2019-12-06 | (주)테크윙 | 테스트핸들러 |
CN104133173B (zh) * | 2014-08-14 | 2017-02-01 | 潍坊路加精工有限公司 | 一种全自动测试装置 |
KR20160109484A (ko) | 2015-03-11 | 2016-09-21 | 가부시키가이샤 어드밴티스트 | 반송 캐리어, 반송 장치, 및 베이스부 |
TW201715243A (zh) * | 2015-07-31 | 2017-05-01 | Seiko Epson Corp | 電子零件搬送裝置及電子零件檢查裝置 |
CN106813888B (zh) * | 2015-11-27 | 2019-01-04 | 环维电子(上海)有限公司 | 冲击试验模块及其测试板 |
KR20170078209A (ko) * | 2015-12-29 | 2017-07-07 | (주)테크윙 | 반도체소자 테스트용 핸들러 |
JP2020012748A (ja) * | 2018-07-19 | 2020-01-23 | セイコーエプソン株式会社 | 電子部品搬送装置および電子部品検査装置 |
KR102053091B1 (ko) * | 2019-06-20 | 2019-12-06 | (주)테크윙 | 테스트핸들러 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001004702A (ja) * | 1999-06-22 | 2001-01-12 | Advantest Corp | 半導体試験装置のicハンドラ装置 |
JP2001264387A (ja) * | 2000-03-16 | 2001-09-26 | Nippon Eng Kk | バーンインボード用ローダアンローダ装置における吸着ヘッドおよびその制御システム |
WO2004109305A1 (ja) * | 2003-06-06 | 2004-12-16 | Advantest Corporation | 搬送装置、電子部品ハンドリング装置および電子部品ハンドリング装置における搬送方法 |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06302670A (ja) * | 1993-04-15 | 1994-10-28 | Hitachi Electron Eng Co Ltd | 小形角型ワーク用非接触吸着ヘッド |
KR100349942B1 (ko) * | 1999-12-06 | 2002-08-24 | 삼성전자 주식회사 | 램버스 핸들러 |
TW466567B (en) * | 2000-12-29 | 2001-12-01 | Samsung Electronics Co Ltd | Rambus handler |
-
2006
- 2006-10-04 WO PCT/JP2006/319870 patent/WO2008041334A1/ja active Application Filing
- 2006-10-04 JP JP2007540849A patent/JPWO2008041334A1/ja not_active Ceased
- 2006-10-04 KR KR1020097026216A patent/KR20100017827A/ko not_active Application Discontinuation
- 2006-10-04 CN CN2006800139501A patent/CN101258415B/zh active Active
- 2006-10-04 KR KR1020077024582A patent/KR100942527B1/ko active IP Right Grant
-
2007
- 2007-09-04 TW TW096132855A patent/TW200821599A/zh unknown
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001004702A (ja) * | 1999-06-22 | 2001-01-12 | Advantest Corp | 半導体試験装置のicハンドラ装置 |
JP2001264387A (ja) * | 2000-03-16 | 2001-09-26 | Nippon Eng Kk | バーンインボード用ローダアンローダ装置における吸着ヘッドおよびその制御システム |
WO2004109305A1 (ja) * | 2003-06-06 | 2004-12-16 | Advantest Corporation | 搬送装置、電子部品ハンドリング装置および電子部品ハンドリング装置における搬送方法 |
Also Published As
Publication number | Publication date |
---|---|
TWI345063B (zh) | 2011-07-11 |
CN101258415B (zh) | 2011-01-19 |
TW200821599A (en) | 2008-05-16 |
KR20100017827A (ko) | 2010-02-16 |
WO2008041334A1 (en) | 2008-04-10 |
CN101258415A (zh) | 2008-09-03 |
KR100942527B1 (ko) | 2010-02-12 |
KR20080057206A (ko) | 2008-06-24 |
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