WO2002067000A1 - Insert destine a un dispositif de test de composants electroniques - Google Patents

Insert destine a un dispositif de test de composants electroniques Download PDF

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Publication number
WO2002067000A1
WO2002067000A1 PCT/JP2001/001237 JP0101237W WO02067000A1 WO 2002067000 A1 WO2002067000 A1 WO 2002067000A1 JP 0101237 W JP0101237 W JP 0101237W WO 02067000 A1 WO02067000 A1 WO 02067000A1
Authority
WO
WIPO (PCT)
Prior art keywords
guide
electronic component
insert
under test
test
Prior art date
Application number
PCT/JP2001/001237
Other languages
English (en)
Japanese (ja)
Inventor
Noboru Saito
Original Assignee
Advantest Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advantest Corporation filed Critical Advantest Corporation
Priority to PCT/JP2001/001237 priority Critical patent/WO2002067000A1/fr
Publication of WO2002067000A1 publication Critical patent/WO2002067000A1/fr

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/04—Housings; Supporting members; Arrangements of terminals
    • G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
    • G01R1/0433—Sockets for IC's or transistors
    • G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2851—Testing of integrated circuits [IC]
    • G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
    • G01R31/2887—Features relating to contacting the IC under test, e.g. probe heads; chucks involving moving the probe head or the IC under test; docking stations

Definitions

  • the present invention relates to an electronic component test apparatus for testing electronic components (hereinafter, also simply referred to as ICs) such as semiconductor integrated circuit elements, and a tray and an insert used for the same.
  • ICs electronic components
  • the present invention relates to an insert, tray, and electronic component testing apparatus which is excellent in positioning accuracy of an IC under test to a contact portion and excellent in versatility of components.
  • a handler In an electronic component tester called a handler, a large number of ICs stored in a tray are transported into the tester, and each IC is brought into electrical contact with a test head. Have the main unit (hereinafter also referred to as a tester) perform the test. When the test is completed, each IC is taken out of the test head and placed on a tray according to the test result, thereby sorting the products into non-defective and defective products.
  • Conventional electronic component testing equipment includes a tray for storing ICs before testing and ICs that have been tested (hereinafter, also referred to as a custom tray), and a tray that is circulated and transported inside the electronic component testing equipment. (Hereinafter, also referred to as a test tray).
  • ICs are replaced between the waste tray and the test tray before and after the test.
  • the IC is pressed against a test head while being mounted on a test tray.
  • the test tray of a conventional electronic component tester is equipped with, for example, 64 IC mounters called inserts.
  • the insert 16 is attached to the insert body as shown in Fig. 27. It has lever plates 162 that approach and depart.
  • the lever plate 16 2 is mechanically connected to a latch 16 3 for holding the IC (preventing it from popping out). In this state, the latch 163 is closed as shown in the upper diagram of FIG. To prevent IC from jumping out during transport.
  • the lever plate 162 is pressed down from the outside, the latch 163 opens as shown in the lower diagram of FIG.
  • the contact part of the test head is made up of a plurality of contact pins that can be protruded and retracted by springs.
  • the tip is A conical recess is formed in accordance with the ball-shaped input / output terminal.
  • the position of the IC under test and the contact bin were aligned using the outer shape of the package mold of the IC.
  • the chip size package (CSP: Chip Size Package)
  • the dimensional accuracy of the package mold is extremely rough, and the positional accuracy between the outer peripheral shape and the solder balls is not necessarily guaranteed. For this reason, if positioning is performed on the outer periphery of the IC package mold, the solder ball will be pressed in a state shifted from the contact pin, and the sharp tip of the contact pin may damage the solder ball. there were.
  • the present inventors have developed a device in which the position is determined not by the package mold but by the solder ball itself. This not only prevents the solder balls from being damaged, but also allows the insert to be shared even if the external shape is different, as long as the arrangement matrix of the solder balls is the same.
  • the vertical clearance z between the latch 163 and the IC needs to be as small as possible. To achieve this, the tip of the latch 163 shown in FIG.
  • the opening / closing amount X when the latch 163 is opened is reduced as shown in the lower diagram of the figure, and the outer shape is large as shown in FIG. IC and small IC cannot be held on the same Absent.
  • the opening / closing amount X of the latch 163 is also increased, but the pushing amount of the lever plate 162 is determined by the test of the handler. It is difficult to increase due to process constraints.
  • the opening / closing amount X of the latch 163 increases even if the rotation center of the latch 163 is moved downward in the figure, but if the rotation center of the latch 163 is shifted downward, the insert itself is lowered. It may interfere with other mechanisms during transportation to the test process etc.
  • the contact portion of the test head 104 appears and disappears due to a spring (not shown). It consists of a plurality of contact pins 51 provided as possible, and the tip of the contact pin 51 is a ball-shaped input / output terminal (hereinafter, also referred to as a solder ball HB) of the IC under test as shown in part B of FIG. A conical concave portion 5 la corresponding to the above is formed.
  • the position of the IC to be tested and the contact pins 51 are aligned using the outer peripheral shape of the IC package mold PM.
  • the outer shape of the package mold PM is precisely dimensioned, if the outer shape is used for positioning, even if the solder ball HB has the same matrix, the outer shape will be smaller. If they are different, it will be necessary to replace even the test tray insert, which will increase the test cost.
  • a first object of the present invention is to provide an insert, a tray, and an electronic component test apparatus that are excellent in holding an electronic device under test.
  • a second object of the present invention is to provide an insert for an electronic component testing apparatus which is excellent in positioning accuracy of an IC under test to a contact portion and excellent in versatility of components.
  • a tray on which an electronic component under test is mounted and which is routed inside an electronic component test apparatus is provided so as to be finely movable. It is an insert that can be
  • a latch unit that moves between a position where the electronic device under test accommodated in the insert is held over the upper surface of the electronic device under test and a position where the electronic device is retracted from the upper surface of the electronic device under test;
  • a tip end of the latch portion and a rotation center of the latch arm portion are disposed on substantially the same vertical line in a side view of the insert,
  • an elastic body that urges the latch arm in a direction in which the latch portion moves to the holding position.
  • the point of force of the latch arm portion is provided on the opposite side of the latch portion with respect to the rotation center of the latch arm portion, via a lever plate provided on the insert body.
  • the external force acts on the force point (see FIGS. 6 and 11), or alternatively, the force point of the latch arm is provided on the opposite side of the rotation center of the latch arm to the latch.
  • a configuration may be adopted in which an external force acts directly on the force point (see FIG. 12).
  • a tray on which an electronic component under test is mounted and which is routed in an electronic component test apparatus is provided so as to be finely movable. Insert that can be
  • a guide core movably provided with respect to the insert body, on which the electronic component under test is mounted;
  • the drive mechanism moves the latch portion to the retreat position. Further, it is preferable that the linkage mechanism moves the latch portion to a holding position, and then causes the guide core to approach the insert body.
  • the guide core on which the electronic component is mounted is also moved toward and away from the insert body.
  • the latch part when mounting electronic components, the latch part is moved to the retracted position, the electronic components are mounted with the guide core moved to the separated position, and then the latch is moved to the holding position. Move the guide core closer to the insert body. That is, at least when the latch is closed, the guide core is at the separated position, so that even if the thickness of the electronic component is different, the latch does not interfere with the electronic component.
  • the latch part When removing electronic components, the latch part is in the holding position and the guide core is in the approaching position. In the state above, first move the guide core away from the insert body, and then move the latch part to the retracted position. That is, since the guide core is at the separated position at least when the latch portion is opened, the latch portion does not interfere with the electronic component even if the thickness of the electronic component is different.
  • the electronic component under test applied in the present invention is not particularly limited, and includes all types of electronic components.
  • the terminal of the electronic component under test is a ball-shaped terminal. The effect is particularly remarkable when applied to ball grid array type ICs.
  • the insert of the present invention preferably has a guide for contacting and positioning the terminal of the electronic component under test.
  • the insert can be shared even if the package mold shape is different, and it takes time for setup work such as production and replacement of special parts. Cost can be reduced.
  • this type of guide has a function of contacting and positioning the terminal of the electronic component under test, its shape, set position, number, material, etc. are not particularly limited. Is included.
  • the guide may be a hole into which a ball-shaped terminal of a ball grid array type IC is fitted.
  • all the ball terminals may be provided with holes to be fitted respectively, or some of the ball terminals may be provided with holes to be fitted respectively.
  • one end of one ball-shaped terminal and one end of another ball-shaped terminal are fitted into one hole. It can also be done.
  • the “hole” mentioned here is intended to include not only a through-hole penetrating the guide core but also a concave portion not penetrating the guide core.
  • a tray for carrying the electronic device under test into the contact portion of the test head of the slave component test apparatus and carrying the electronic component under test the tray having the insert.
  • a test is performed by pressing a terminal of an electronic component under test against a contact portion of a test head.
  • An electronic component test apparatus is provided, which has the above tray.
  • a tray on which an electronic component under test is mounted and which is routed inside the electronic component test apparatus is provided so as to be finely movable. It's an enormous
  • An insert which has a first guide for contacting and positioning a terminal of the electronic component under test, and having a guide core movably provided with respect to the insert body.
  • the terminal itself pressed against the contact portion is directly positioned by the first guide, not the package mold of the electronic device under test.
  • the positioning accuracy of the terminals is remarkably improved, and damage to the terminals can be prevented.
  • the first guide for positioning the terminal of the electronic device under test is formed on the guide core provided so as to be finely movable with respect to the insert main body. If there is a mounting error between the two, it can be absorbed by the fine movement of the guide core.
  • the insert can be shared even if the package mold shape is different, and the cost required for setup work time such as production and replacement of dedicated parts is reduced. Can be reduced.
  • the guide core may include a second guide for positioning the electronic component test apparatus with a carrier for picking up the electronic component under test. More preferred.
  • the tray body and insert body can be used when placing the electronic device under test on the tray and removing the electronic device under test from the tray. Regardless of the positional relationship (position error) between the pickup carrier and the pickup carrier, the positional accuracy between the peak carrier and the guide core can be ensured. Therefore, if the electronic device under test is accurately held by the pickup transporter, the electronic device under test can be mounted at the correct position on the guide core.c Also, the electronic device under test can be mounted accurately on the guide core. If this is done, it can be accurately held by the pick-up transfer device, and the electronic device under test can be transferred to the mounting destination with high accuracy.
  • the guide core has a third guide for positioning the test head of the electronic component test apparatus with a contact portion.
  • the third guide By using the third guide to position the test head against the contact part, when pressing the terminals of the electronic component under test against the contact part, the positional relationship between the tray body or insert body and the contact part ( Regardless of the position error), the positional accuracy between the contact portion and the guide core can be ensured. As a result, the terminal of the electronic component under test is correctly pressed against the contact portion, thereby preventing damage to the terminal and the like.
  • the second guide and the third guide are constituted by a common hole or pin.
  • the electronic component under test applied in the present invention is not particularly limited, and includes all types of electronic components.
  • a first guide in the present invention as long as it has a function of positioning them in contact with the terminals of the device under test, the shape, the set position
  • the number, material, etc. are not particularly limited, and include all.
  • the ball-shaped terminals of a ball grid array IC can be mentioned.
  • all the ball-shaped terminals may be provided with holes for fitting each, or some of the pole-shaped terminals may be provided with holes for fitting.
  • one hole may be fitted with one end of one ball-shaped terminal and one end of another ball-shaped terminal. it can.
  • the “hole” mentioned here is intended to include not only a through hole penetrating the guide core but also a concave portion not penetrating the guide core.
  • an electronic component under test is loaded into a contact portion of a test head of an electronic component test apparatus.
  • a tray for carrying the same is provided, the tray having the insert.
  • an electronic component for performing a test by pressing a terminal of an electronic component under test against a contact portion of a test head is provided.
  • the electronic device before mounting the electronic component under test on the tray, the electronic device further includes a precisor that corrects a position of the electronic component under test, wherein the precisor contacts a terminal of the electronic component under test and contacts the terminal.
  • a fourth guide for positioning and, when positioning the electronic component under test by the fourth guide, guiding a portion other than the terminal of the electronic component under test to connect the terminal of the electronic component under test to the terminal. More preferably, a fifth guide that matches the fourth guide is provided.
  • the precisor has a sixth guide for positioning with the transfer device for picking up the device under test.
  • the customer tray on which the electronic components under test are mounted often differs in the number and mounting pitch depending on the user, but the electronic components under test mounted on the customer tray are transported inside the electronic component test equipment. It is necessary to change the pitch when changing to a new tray.
  • the precisor of the present invention is preferable for use in this kind of pitch change and other attitude corrections of the electronic device under test.
  • the electronic component under test when the electronic component under test is placed on the presizer, first, a portion other than the terminal is guided by the fifth guide, and the terminal of the electronic component is connected to the fourth guide. Match.
  • the position of the electronic component transferred to the precisor is accurately determined, and if the electronic component with the position accuracy thus secured is held by the peak transfer machine using the sixth guide, the holding of the electronic component is maintained. Position accuracy will increase.
  • FIG. 1 is a perspective view showing an embodiment of an electronic component test apparatus of the present invention
  • FIG. 2 is a flow chart of a tray showing a method of handling the electronic component under test in the electronic component test apparatus of FIG.
  • FIG. 3 is a perspective view showing the structure of the IC stocking force of the electronic component test apparatus of FIG. 1
  • FIG. 4 is a perspective view showing a scrap tray used in the electronic component test apparatus of FIG. 1
  • FIG. 5 is the electronic component of FIG. Partially exploded perspective view showing a test tray used in a test apparatus
  • FIG. 6 is an exploded perspective view showing an embodiment of the insert of the present invention.
  • FIG. 7 is a plan view of the insert shown in FIG. 6,
  • Fig. 8 is a sectional view along the line VIII-VIII in Fig. 7 (latch closed),
  • Fig. 9 is a cross-sectional view (latch open) along the line VII I-VI II in Fig. 7.
  • FIG. 10 is a sectional view showing the structure of the pusher, insert, socket guide and contact pin in the test board of FIG. 1,
  • FIG. 11 is an exploded perspective view showing another embodiment of the insert of the present invention.
  • FIG. 12 is an exploded perspective view showing still another embodiment of the insert of the present invention
  • FIG. 13 is an exploded perspective view showing still another embodiment of the insert of the present invention
  • FIG. 14A to FIG. FIG. 13 is a cross-sectional view taken along the line XIV-XIV of FIG.
  • FIG. 15 is an exploded perspective view showing still another embodiment of the insert of the present invention
  • FIG. 16 is an exploded perspective view showing still another embodiment of the insert of the present invention
  • FIG. Sectional view along the line XVII-XVII
  • FIG. 18 is a cross-sectional view in which the XVI II portion of FIG. 17 is enlarged.
  • FIG. 19 is a perspective view of an essential part for explaining a method of replacing electronic components in the electronic component test apparatus of FIG. 1,
  • FIG. 20 is a sectional view showing the structure of the pusher, insert, socket guide and contact pin in the test head of FIG. 1
  • FIG. 21 is an exploded perspective view showing still another embodiment of the insert of the present invention
  • FIG. 22 is a cross-sectional view taken along the line XXII-XXII of FIG. 21,
  • FIG. 23 is an exploded perspective view showing still another embodiment of the insert of the present invention
  • FIG. 24 is a sectional view taken along line XXIV-XXIV of FIG. 23,
  • FIG. 25A is a perspective view showing another embodiment of the guide core according to the present invention.
  • FIG. 25B is a cross-sectional view taken along the line XXVB-XXVB of FIG. 25A,
  • FIG. 26A is a perspective view showing still another embodiment of the guide core according to the present invention
  • FIG. 26B is a sectional view taken along the line XXVIB-XXVIB of FIG. 26A,
  • FIG. 27 is a cross-sectional view showing a conventional insert.
  • FIG. 28 is a side view showing a general ball grid array type IC.
  • FIG. 29 is a perspective view showing a general contact pin (socket).
  • FIG. 30 is a cross-sectional view of a principal part showing a contact state between an IC ball terminal and a contact focus.
  • FIG. 2 is a diagram for understanding a method of handling electronic devices under test (hereinafter, also simply referred to as ICs or ICs) in the electronic device testing apparatus of the present embodiment. There is also a part in which the members arranged in are shown in plan. Therefore, its mechanical (three-dimensional) structure will be explained with reference to Fig. 13 ⁇ 4.
  • the electronic component test apparatus 1 of the present embodiment tests (inspects) whether or not an IC under test is properly operated in a state where a high or low temperature stress is applied to the IC under test or in a state where no temperature stress is applied.
  • This is a device that classifies ICs according to the test results.
  • An operation test with or without temperature stress is performed on a tray on which a large number of ICs to be tested are mounted (hereinafter referred to as “cassettes”).
  • the test IC is mounted on the test tray TST (see Fig. 5) which is transported inside the electronic component test equipment 1 from Fig. 4).
  • the electronic component test apparatus 1 of the present embodiment stores ICs to be tested from now on, and classifies and stores tested ICs.
  • an unloader unit 400 that classifies and extracts tested ICs that have been tested in the chamber unit 100.
  • the IC storage unit 200 stores the pre-test IC stocker 201 for storing the IC under test before the test, and the tested IC storage capacity 202 for storing the ICs under test classified according to the test results. Are provided.
  • the pre-test IC stock force 201 and the tested IC stocker 202 intrude from the frame-shaped tray support frame 203 and the lower portion of the tray support frame 203.
  • an elevator 204 capable of ascending and descending upward.
  • a plurality of waste trays KST are stacked and supported, and only the stacked waste trays KST are moved up and down by the elevator 204.
  • the pre-test IC stocker 201 holds the stack of trays KST containing the ICs to be tested, while the tested IC stocker 202 holds the test tray.
  • the customer tray KST, in which the IC under test has been appropriately classified, is stored in a stacked state.
  • the number of the pre-test IC stocker 201 and the number of the tested IC stocker 202 are different. The number can be appropriately set as needed.
  • two stoker STK-Bs are provided in the pre-test stoker 201, and two empty stokers STK-E to be sent to the unloader unit 400 are provided next to the stoker 201.
  • Tested IC stoker 202 is provided with eight stoker STK-1, STK-2,..., STK-8 so that they can be sorted into up to eight categories according to test results and stored. In other words, besides the good and bad products, the products are classified into high-quality products, medium-speed products, low-speed products, and defective products that require retesting.
  • the above-described waste tray KST is mounted on the window 300 of the loader unit 300 by a tray transfer arm 205 provided between the IC storage unit 200 and the device substrate 105. It is carried from below 0 5. Then, in the loader section 300, the IC under test loaded in the waste tray KST is once transferred to a preciser 305 by the XY transfer device 304, where the IC under test is loaded. After correcting the mutual positions, the IC under test transferred to the precisor 305 is again transferred to the test tray TS stopped at the loader section 300 by using the XY transfer device 304. Transship.
  • the IC transport device 304 that transfers the IC under test from the waste tray KST to the test tray TST includes two rails 301 mounted on the upper part of the device board 105, as shown in Fig. 1.
  • the movable arm 302 which can reciprocate between the test tray TST and the waste tray KST by using the two rails 301 (this direction is defined as the Y direction), and the movable arm 302, And a movable head 303 that can be moved in the X direction along the movable arm 302.
  • a suction head (detailed illustration is omitted) is mounted on the movable head 303 of the XY transfer device 304 in a downward direction, and the suction head removes air. By moving while aspirating, the IC under test is sucked from the waste tray KST, and the IC under test is transferred to the test tray TST.
  • about eight such suction heads are mounted on the movable head 303, and eight ICs to be tested can be transferred to the test tray TST at a time.
  • test tray T S the I C under test is loaded in the loader unit 300 and then sent to the chamber unit 100, and each I C under test is tested while being mounted on the test tray T ST.
  • the chamber section 100 is provided with a constant temperature chamber 101 for applying a desired high or low temperature thermal stress to the IC under test loaded on the test tray TST, and a state in which the thermal stress is applied to the constant temperature chamber 101.
  • the IC under test in contact with the test head 104 is brought into contact with the test chamber 102 and the heat removal tank 100 that removes the applied thermal stress from the IC under test tested in the test chamber 102 It consists of three.
  • the heat removal tank 103 when the high temperature is applied in the constant temperature bath 101, the IC under test is cooled by blowing air to return it to room temperature. If is applied, heat the IC under test with warm air or heat and cool it to a temperature that does not cause condensation. Then, the heat-removed IC under test is carried out to the unloader section 400.
  • the constant temperature bath 101 and the heat removal bath 103 of the chamber section 100 are arranged so as to protrude above the test chamber 102.
  • thermostat 1 As shown in FIG. 1, the constant temperature bath 101 and the heat removal bath 103 of the chamber section 100 are arranged so as to protrude above the test chamber 102.
  • thermostat 1 As shown in FIG. 1, the constant temperature bath 101 and the heat removal bath 103 of the chamber section 100 are arranged so as to protrude above the test chamber 102.
  • thermostat 1 is arranged so as to protrude above the test chamber 102.
  • a vertical transfer device is provided at 01, and a plurality of test trays TST are supported by this vertical transfer device until the test chamber 102 becomes empty. While waiting. Mainly, during this standby period, high or low temperature thermal stress is applied to the IC under test.
  • a test head 104 is arranged at the center thereof, and a test tray TST is carried on the test head 104, and an input / output terminal HB of the IC under test is connected.
  • the test is performed by making electrical contact with the contact bin 51 of the test head 104.
  • the temperature of the IC is returned to room temperature, and then discharged to the unloader section 400.
  • an apparatus substrate 105 is inserted in front of the constant temperature bath 101 and the heat removal tank 103 as shown in FIG. 1, and a test tray transport device 108 is mounted on the apparatus substrate 105. It is installed.
  • the test tray TS discharged from the heat removal tank 103 by the test tray transport device 108 provided on the device substrate 105 receives an unloader unit 400 and a loader unit 300 through the test tray TS. Is returned to the thermostat 101.
  • FIG. 5 is an exploded perspective view showing the structure of the test tray TST used in the present embodiment.
  • Each of the inserts 16 has the same shape and the same dimensions.
  • Each of the inserts 16 has an IC storage section 19 in which an IC to be tested is stored. The details will be described later.
  • the IC under test connected to the test head 104 at a time is, for example, every four columns if the IC under test is arranged in 4 rows ⁇ 16 columns as shown in FIG.
  • four rows of ICs under test are tested simultaneously.
  • 16 ICs to be tested arranged every four rows from the first row are connected to the contact pins 51 of the test head 104, and the second test is performed.
  • the test tray TST is moved by one row, and the ICs under test arranged in every fourth row from the second row are tested in the same manner.
  • This test is repeated four times to test all the ICs under test (so-called 16 simultaneous measurements).
  • the results of this test for example, the identification number assigned to the test tray TST, c is Adoresu in the storage determined by the number of the IC allocated inside the test tray TST
  • a guide hole 191 (a guide according to the present invention) having an opening as shown in FIG. 7 is formed in the IC housing portion 19, and the guide hole 1991 is formed in the IC under test. Some are formed corresponding to the positions of the solder balls HB of the ball grid array type IC. C Even if the size of the outer peripheral surface of the package mold is slightly different, the array matrix of the solder balls HB of the IC under test A small gap S is formed on the bottom surface of the IC housing portion 19 so that the solder ball HB can smoothly fit into the guide hole 19 1 without any obstacle as long as .
  • the guide hole 19 1 shown in the figure is configured as one opening so that only the outermost solder ball HB of the solder balls HB of the BGA type IC is fitted.
  • the guide can take various forms other than the above. For example, many guide holes are provided in the IC so that all the solder balls HB of the BGA type IC fit.
  • a through hole may be provided on the bottom of the housing portion 19 so that the contact pin 51 can contact all the solder balls HB from below.
  • a guide hole 191 in which, for example, only two rows of solder balls HB from the outside of the BGA type IC solder balls HB are fitted, is provided on the bottom surface of the IC housing portion 19, and other solder balls HB are provided.
  • An opening may be formed at the center of the bottom surface of the IC housing portion 19 so that the contact pin 51 can also be brought into contact.
  • the insert 16 of the present embodiment has a launch mechanism including the latch 163, the coil panel 1664, and the pin 165 shown in FIG.
  • the latch 163 of this latch mechanism has a latch 1613a formed at one end, a latch arm 1663d is connected to the latch 1613a, and a power point 1663c is provided on the latch arm 1663d. Have been.
  • a through hole serving as a rotation center 163b is formed in the launch arm 1613d between the launch 163a and the point of force 163c, and a pin 1665 is provided here.
  • the latch portion 1663a of the latch 163 covers a top surface of the IC mounted in the IC housing portion 19 to prevent the IC from jumping out (hereinafter referred to as a holding position or closing position). ) And a position where the IC can be retracted from the top of the IC as shown in Fig. 9 and the IC can be inserted and removed (hereinafter also referred to as a retracted position or an open position). ing.
  • the power point 16 3 c of the arm portion 16 3 d comes into contact with a lever plate 16 2, which will be described later, and an external force is applied from the power point 16 3 c as the lever plate 16 2 moves up and down. Is input, which causes the latch 163 to open.
  • the tip of the latch 162a and the rotation center 1663b of the latch arm 1663d are substantially aligned. They are arranged on the same vertical line.
  • the opening / closing movement amount D of the tip of the latch portion 1663a shown in FIG. 8 increases.
  • the latch arm 1613 d in a plan view of the insert 16 shown in FIG. 7, the latch arm 1613 d is located at a position offset from the latch 163 a, that is, the IC housing 19. It is provided in. As a result, the IC can be moved in and out of the IC housing 19 without any interference. Wear.
  • the coil panel 164 interposed between the other end of the latch arm 16 d and the insert body 16 1 is used when the external force from the lever plate 16 2 is not acting.
  • 3 is an elastic body for maintaining the holding position shown in FIG. 8, and when the test tray TST is being conveyed or the like, the IC is held by the latch portion 163a to prevent the IC from jumping out. .
  • the lever plate 16 2 provided on the insert 16 is urged to the raised position shown in FIG. 8 by the coil panel 16 6 provided between the insert body 16 1 and the lever plate 16 2.
  • the upper limit of the ascending position is regulated.
  • Fig. 10 shows the structure of the socket 50 having the pusher 30, the insert 16 (test tray TST side), the socket guide 40, and the contact pin 51 in the test head 104 of the same electronic component test apparatus.
  • the pusher 30 is provided on the upper side of the test head 104, and moves up and down in the Z-axis direction by a Z-axis driving device (for example, a fluid pressure cylinder) not shown.
  • the pushers 30 are attached to the Z-axis drive device according to the interval of the ICs to be tested at one time (in the above-described test tray, 16 rows of 4 rows and 4 rows in total). .
  • a presser 31 for pressing the IC under test is formed, and on both sides thereof, guides 20 to be inserted into a guide hole 20 of an insert 16 and a guide bush 41 of a socket guide 40 described later.
  • Dobin 32 is provided.
  • a stopper guide 33 is provided between the presser 31 and the guide pin 32 to regulate the lower limit when the pusher 30 is lowered by the Z-axis driving means. By contacting the stopper guide 33 with the stopper surface 42 (only one side is shown) of the socket guide 40, the lower limit position of the pusher to be pressed with an appropriate pressure that does not destroy the IC under test is determined.
  • the insert 16 is attached to the test tray TST using the fastener 17 as described with reference to FIG. 5, and the guide bin 32 and the pusher 30 described above are provided on both sides thereof.
  • a guide hole 20 into which the guide bush 41 of the socket guide 40 is inserted from above and below is formed.
  • the upper half of the guide hole 20 on the left side of the figure is a small-diameter hole in which the guide bin 32 of the pusher 30 is inserted and positioning is performed, and the lower half is the guide bush 40 of the socket guide 40. It is a large-diameter hole into which 1 is inserted for positioning.
  • the guide hole 20 on the right side in the figure, the guide pin 32 of the pusher 30 and the guide bush 41 of the socket guide 40 are loosely fitted.
  • a guide bush 41 for positioning is provided, and the left side of the guide push 41 also performs positioning with the insert 16.
  • a socket 50 having a plurality of contact bins 51 is fixed to a lower side of the socket guide 40, and the contact pins 51 are urged upward by a spring (not shown). Therefore, even if the IC under test is pressed, the contact pins 51 are retracted to the upper surface of the socket 50, and even if the IC under test is pressed with a slight inclination, the contact bins 51 are attached to all the ball terminals HB. You can make contact.
  • the unloader section 400 is also provided with X—Y transfer apparatuses 400 and 404 having the same structure as the X—Y transfer apparatus 304 provided in the loader section 300.
  • the tested ICs are transferred from the test tray TST carried out to the unloader section 400 to the waste tray KST by the devices 404 and 404.
  • the device board 105 of the unloader unit 400 is arranged such that the waste tray KST carried to the unloader unit 400 faces the upper surface of the device board: I05. Two pairs of windows 406 and 406 are provided.
  • a lifting table for raising and lowering the tray KST is provided under each window 406, and the tested IC under test is provided here. After loading the refilled waste tray KST, it descends and transfers this full tray to the tray transfer arm 205.
  • the categories that can be sorted in real time are limited to four categories.
  • non-defective products are classified into three categories: high-speed response element, medium-speed response element, and low-speed response element. Some categories, such as things, do not belong to these categories.
  • a buffer section 405 is provided between the test tray TST of the unloader section 400 and the window section 406, and this buffer section 405 is rarely provided.
  • the buffer section 405 has a capacity capable of storing about 20 to 30 ICs under test, and the category of the IC stored in each IC storage position of the buffer section 405 is stored.
  • a memory is provided, and the category and position of the IC under test temporarily stored in the buffer and buffer section 405 are stored for each IC under test. Then, during the sorting operation or when the buffer section 405 is full, the customer tray KST of the category to which the IC under test belongs in the buffer section 405 is called from the IC storage section 200, Put it in the waste tray KST.
  • the IC under test temporarily deposited in the buffer section 405 may cover a plurality of categories, but in such a case, when calling the customer tray KST, a plurality of customer trays KS are unregistered at one time. It can be called to the window section 400 of the mouth section section 400.
  • FIGS. 8 and 9. a case where an IC mounted on a test tray TST is taken out using an XY transfer device 304 will be described as an example.
  • FIG. 8 shows a state in which the IC under test is mounted on the test tray TST. In this state, when the suction head of the XY transfer device 304 approaches each insert 16, one of the suction heads is obtained.
  • the lever plate 16 2 is pushed down by the part. Along with this, the power point 163c of the arm 163d is also pushed down, and the arm 163d rotates clockwise about the rotation center 163b in the figure. In this example, it is about 20 °.
  • FIG. 9 shows an IC with a large device size and an IC with a small device size.
  • Fig. 8 shows an IC with a large device size and an IC with a small device size.
  • the arrangement matrix of the solder balls HB is the same, the size of the package is the same. However, even if they are different, they can be completely held by the latch part 163a of this example.
  • FIGS. 11 and 12 show a modification of the first embodiment.
  • the elastic body interposed between the radial section 16 3 d and the insert body 16 1 is a wound spring 16 4, which is used as the rotation center 16 3 It is attached to b.
  • the insert shown in FIG. 12 has a configuration in which the lever plate 162 is omitted and the force point 1663c of the arm portion 1663d is directly pressed down.
  • the other configuration is the same as that of FIG. 6 described above, and thus the same reference numerals are given and the detailed description is omitted.
  • both the IC having a large device size and the IC having a small device size can be mounted on the same insert 16.
  • the clearance between the tip of the latch portion 163a and the upper surface of the IC can be reduced as much as possible, even if the positioning is performed by the solder ball HB, it does not deviate from the guide hole 191.
  • ICs mainly having different thicknesses can be mounted on the same insert.
  • a guide core 1667 is mounted on the insert body 161 at the center of the insert 16 via pins 1-0.
  • This pin 170 is attached at both ends to the insert body 16 1, and contacts the flange 1 67 1 of the guide core 16 7 as shown in the cross-sectional views of FIG.
  • the guide core 167 is prevented from coming off, and the guide core 167 is three-dimensionally finely movable with respect to the insert body 161 and is provided in a so-called floating state.
  • a guide hole 1 71 (a guide according to the present invention) formed of an opening is formed in the guide core 1 67, and the guide hole 1 ⁇ 1 is used for soldering a ball grid lay type IC which is an IC under test. It is formed corresponding to the position of the ball HB. Even if the outer surface of the package mold is slightly different, as long as the arrangement matrix of the solder balls HB of the IC under test is the same, the solder balls HB can be smoothly inserted into these guide holes 17 1 without any obstacle.
  • the bottom surface of the guide core 167 is formed relatively wide so that it can be fitted into the boss.
  • the guide hole 17 1 shown in the figure is formed as one opening so that only the outermost solder ball HB of the solder ball HB of the BGA type IC fits.
  • the guide according to the present invention may take various other forms.
  • the guide core 1667 is provided with two guide holes 1672 into which the suction head guide bins of the XY transfer device 304 described above are fitted.
  • the suction head and the guide core 1 6 7 are directly connected regardless of the position error of the insert body 16 1 or the test tray TST itself. Will be aligned.
  • the guide hole 1667 of the guide core 1667 has a socket from below. Guide pins (not shown) can also be fitted.
  • the latch mechanism 16 3 has the same configuration as that of the first embodiment described above, the same reference numerals are given and the detailed description is omitted.
  • the lever plate 16 2 Two pins 169 are mounted, and the flange 167 1 of the guide core 167 is mounted on the pins 169 as shown in FIGS. 14A to 14D.
  • a coil spring 1668 that pushes the guide core 1667 downward in FIGS. 14 to 14D is interposed.
  • the relationship between the vertical movement of the lever plate 16 2, the vertical movement of the guide core 16 7, and the opening and closing movement of the latch mechanism 16 3 is determined by Become.
  • the lever plate 16 2 rises with respect to the insert body 16 1, as shown in FIG. 14A. 3 is the closed position, and the guide core 16 7 is set to the raised position by the pin 16 9.
  • the clearance H1 between the launch portion 1663a and the bottom surface of the guide core 1667 becomes the smallest.
  • the thickness of the thinnest IC to H1
  • the latch section 163a can be reliably maintained in the closed state, and the displacement of the IC can be prevented.
  • FIGS. 148 to 14D show a state in which the lever plate 162 gradually descends from the state of FIG. 14A.
  • the lever plate 162 since the clearance of H2 is set between the lever plate 162 and the power point 163c of the radial section 163d, the lever plate 162 has only H2. Until it descends, the latch mechanism 163 does not operate.
  • the guide core 1667 is supported by the pin 1669, when the lever plate 162 moves down by H2, the guide core 1667 also moves down by H2.
  • FIG. 14B shows a state in which the lever rate 16 2 has dropped by H 2. In this state, the clearance between the latch 163a and the bottom surface of the guide core 1667 is H1 + H2 from the initial H1.
  • the operation when the IC is mounted is reversed.
  • the guide core 167 descends and a clearance is formed between the IC and the latch portion 163a.
  • the latch part 1663a starts to open, and conversely, when mounting the IC, the guide core 1667 starts to rise after the latch part 1663a closes and moves to the position where it covers the top surface of the IC.
  • the latch portion 16a does not interfere from the side of the IC, and the same insert 16 can be used even for ICs having different thicknesses.
  • a guide core 161 is attached to the insert body via a pin 1613.
  • This pin 16 13 only contacts the flange 16 1 4 of the guide core 16 1 as shown in the cross-sectional view of Fig. 17 to prevent the guide core 16 1 from coming off.
  • the core 16 1 is three-dimensionally movable with respect to the insert body. It is provided in a so-called floating state.
  • the guide core 16 1 is formed with a guide hole 16 1 2 (first guide according to the present invention) having an opening as shown in FIG. It is formed corresponding to the position of the solder ball HB of the ball grid array type IC which is the IC under test. Even if the outer peripheral surface of the package mold PM has a slightly different size, the solder balls HB will not fit into the guide holes 1612 as long as the arrangement matrix of the solder balls HB of the IC under test is the same. To fit smoothly without any obstacles In addition, a slight gap S is formed on the bottom surface of the guide core 16 1.
  • the guide hole 1612 shown in the figure is formed as one opening so that only the outermost solder ball HB of the 60 type 1C solder balls HB is fitted.
  • the first guide of the present invention may take various forms other than the above.
  • a guide hole 1612 into which all the solder balls HB of the BGA type IC are fitted is provided on the bottom surface of the guide core 161, This is an example in which a through hole is provided so that the contact pin 51 can contact the solder pole HB from below.
  • the guide hole 20 on the right side in the figure, the guide pin 32 of the pusher 30 and the guide bush 41 of the socket guide 40 are loosely fitted.
  • two guide bins 32 of the pusher 30 are inserted on both sides of the socket guide: fixed to the test head 104, between the two guide bins 32.
  • a guide bush 41 is provided for positioning by using the guide bush 41.
  • the guide bush 41 on the left side also performs positioning with the insert 16.
  • a socket 50 having a plurality of connection bins 51 is fixed to the lower side of the socket guide 40, and the contact pins 51 are urged upward by a spring (not shown).
  • the waste tray KS which is full of ICs before the test, is transported from the IC stocker 201 to the window 300 of the mouth portion 300, where the XY transport device 304 is used. It can be reloaded into Precisor 3 05 by 8 pieces.
  • the position of the IC is extremely rough, and the suction 307 of the XY transfer device 304 sucks this and drops it into the precisor 305.
  • the rough position of the IC is determined relatively accurately by the concave portion 310 corresponding to the outer shape of the package of the IC, and the bottom surface of the concave portion 305 is formed.
  • the opening 305 formed in the hole guides the ball terminal HB of the IC, so that the position of the IC terminal with respect to the processor 305 is accurately determined.
  • the IC positioned by using the same XY transfer device 304 is sucked.
  • the suction head 3 0 7 1 of the suction head 3 0 7 and the guide hole 3 ′ 0 5 3 of the presizer 3 0 5 are fitted, the suction head 3 0 7 and the presizer 3 0 5 Since the positional relationship between and is accurately determined, the IC is accurately attracted to the attracting head 307.
  • the movable arm 3002 and the movable head 303 of the XY transfer device 304 are operated to transfer the IC to one of the test trays TST16. Then, by lowering the suction head 307 and fitting the guide bin 307 into the guide hole 161 of the guide core 161 of the insert 166, the suction head 307 is formed. Align the 7 with the guide core 16 1 and release the IC in this state. Thereby, in IC, the ball terminal HB is engaged with the guide hole 1612 of the guide core 161.
  • test tray T ST When IC is transported to all the inserts 16, the test tray T ST is transported to the test process in the chamber 100. In this test process, the IC under test is mounted on the test tray TST shown in Fig. 5, and more specifically, each IC under test is dropped into the guide core 161 of the insert 16 in the same figure. It is conveyed to the upper part of the test head 104 in the inserted state.
  • the Z-axis drive device starts to operate, and one pusher 30 shown in FIG. 20 descends so as to correspond to one insert. Then, the two guide pins 32 and 32 of the pusher 30 pass through the guide holes 20 and 20 of the insert 16 respectively, and are further connected to the guide bushes 41 and 41 of the socket guide 40. Fit. Then, the guide bin 52 provided in the socket 50 is fitted into the guide hole 1611 of the guide core 16 1 c.
  • test head 104 that is, the electronic component tester 1
  • the socket 16 and the socket guide 40 fixed to the insert 16 and the socket 30 have some positional error, but the guide bin 32 on the left side of the pusher 30 has the insert 1
  • the position of the pusher 30 and the insert 16 is adjusted, and as a result, the presser 31 of the pusher 30 moves the IC under test at an appropriate position. Can be imposed.
  • the large-diameter hole of the guide hole 20 on the left side of the insert 16 is the socket guide 40 By fitting into the guide bush 41 on the left side of the above, the position of the insert 16 and the socket guide 40 are adjusted, thereby increasing the positional accuracy between the IC under test and the contact pin 51.
  • the solder ball HB of the IC under test is positioned by the guide hole 16 1 2 of the guide core 16 1 of the insert 16, and
  • the guide core 16 1 and the socket are positioned by the guide pin 52 and the guide hole 16 11, the positioning between the solder ball HB and the contact pin 51 can be realized with high accuracy. .
  • the pusher guide 33 is pushed without any other alignment until the stopper guide 33 contacts the stopper surface 42. 30 is further lowered, and the IC under test is brought into contact with the contact pin 51 by the presser 31. While still in this state, perform the specified test.

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)

Abstract

L'invention concerne un insert destiné à un dispositif de test de pièces électroniques, qui comprend un verrou passant d'une position recouvrant et maintenant la surface supérieure d'un composant électronique testé stocké dans l'insert à une position s'éloignant de la surface supérieure du composant électronique testé, et un bras de verrouillage supportant de manière rotative le verrou sur un corps principal d'insert, la pointe du verrou et le centre de rotation du bras de verrouillage étant généralement disposés sur la même ligne verticale, vus du côté de l'insert, et le verrou et le centre de rotation du bras de verrouillage étant décalés, vus du plan horizontal de l'insert.
PCT/JP2001/001237 2001-02-21 2001-02-21 Insert destine a un dispositif de test de composants electroniques WO2002067000A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
PCT/JP2001/001237 WO2002067000A1 (fr) 2001-02-21 2001-02-21 Insert destine a un dispositif de test de composants electroniques

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2001/001237 WO2002067000A1 (fr) 2001-02-21 2001-02-21 Insert destine a un dispositif de test de composants electroniques

Publications (1)

Publication Number Publication Date
WO2002067000A1 true WO2002067000A1 (fr) 2002-08-29

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ID=11737039

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2001/001237 WO2002067000A1 (fr) 2001-02-21 2001-02-21 Insert destine a un dispositif de test de composants electroniques

Country Status (1)

Country Link
WO (1) WO2002067000A1 (fr)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010004844A1 (fr) * 2008-07-08 2010-01-14 株式会社アドバンテスト Méthode d'essai d'un composant électronique, insert, plateau et appareil d'essai d'un composant électronique
TWI637182B (zh) * 2013-11-28 2018-10-01 日商東京威力科創股份有限公司 Inspection device for electronic components, inspection method for electronic components, and inspection program for electronic components
CN111273121A (zh) * 2020-03-07 2020-06-12 东莞市和康轩电子科技有限公司 一种触摸功能产品检测装置及检测方法
JP2020144039A (ja) * 2019-03-07 2020-09-10 株式会社東芝 Ｉｃトレイおよびテスト治具

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11287842A (ja) * 1998-04-02 1999-10-19 Advantest Corp Ｉｃ試験装置
JP2001033518A (ja) * 1999-07-16 2001-02-09 Advantest Corp 電子部品試験装置用インサート

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11287842A (ja) * 1998-04-02 1999-10-19 Advantest Corp Ｉｃ試験装置
JP2001033518A (ja) * 1999-07-16 2001-02-09 Advantest Corp 電子部品試験装置用インサート

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010004844A1 (fr) * 2008-07-08 2010-01-14 株式会社アドバンテスト Méthode d'essai d'un composant électronique, insert, plateau et appareil d'essai d'un composant électronique
TWI394960B (zh) * 2008-07-08 2013-05-01 Advantest Corp Electronic component test methods, inserts, trays and electronic component test devices
JP5282093B2 (ja) * 2008-07-08 2013-09-04 株式会社アドバンテスト 電子部品の試験方法及び電子部品試験システム
TWI637182B (zh) * 2013-11-28 2018-10-01 日商東京威力科創股份有限公司 Inspection device for electronic components, inspection method for electronic components, and inspection program for electronic components
JP2020144039A (ja) * 2019-03-07 2020-09-10 株式会社東芝 Ｉｃトレイおよびテスト治具
CN111273121A (zh) * 2020-03-07 2020-06-12 东莞市和康轩电子科技有限公司 一种触摸功能产品检测装置及检测方法
CN111273121B (zh) * 2020-03-07 2022-11-04 东莞市和康轩电子科技有限公司 一种触摸功能产品检测装置及检测方法

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