JPS6346981B2 - - Google Patents

Info

Publication number
JPS6346981B2
JPS6346981B2 JP55119817A JP11981780A JPS6346981B2 JP S6346981 B2 JPS6346981 B2 JP S6346981B2 JP 55119817 A JP55119817 A JP 55119817A JP 11981780 A JP11981780 A JP 11981780A JP S6346981 B2 JPS6346981 B2 JP S6346981B2
Authority
JP
Japan
Prior art keywords
film
substrate
guard ring
semiconductor device
corner
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP55119817A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5745259A (en
Inventor
Juji Hara
Tatsu Ito
Tatsuro Totani
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Microcomputer System Ltd
Hitachi Ltd
Original Assignee
Hitachi Microcomputer System Ltd
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to JP55119817A priority Critical patent/JPS5745259A/ja
Application filed by Hitachi Microcomputer System Ltd, Hitachi Ltd filed Critical Hitachi Microcomputer System Ltd
Priority to GB8125494A priority patent/GB2083283B/en
Priority to IT23674/81A priority patent/IT1138522B/it
Priority to DE3134343A priority patent/DE3134343C2/de
Publication of JPS5745259A publication Critical patent/JPS5745259A/ja
Priority to US06/744,151 priority patent/US4625227A/en
Priority to HK542/86A priority patent/HK54286A/xx
Priority to MY546/86A priority patent/MY8600546A/xx
Publication of JPS6346981B2 publication Critical patent/JPS6346981B2/ja
Priority to US07/419,007 priority patent/US5023699A/en
Priority to US07/703,765 priority patent/US5229642A/en
Priority to US08/072,405 priority patent/US5371411A/en
Priority to US08/293,559 priority patent/US5468998A/en
Priority to US08/456,942 priority patent/US5539257A/en
Priority to US08/456,384 priority patent/US5552639A/en
Priority to US08/535,956 priority patent/US5583381A/en
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/58—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries
    • H01L23/585—Structural electrical arrangements for semiconductor devices not otherwise provided for, e.g. in combination with batteries comprising conductive layers or plates or strips or rods or rings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
    • H01L23/291—Oxides or nitrides or carbides, e.g. ceramics, glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3157—Partial encapsulation or coating
    • H01L23/3171—Partial encapsulation or coating the coating being directly applied to the semiconductor body, e.g. passivation layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/0212—Auxiliary members for bonding areas, e.g. spacers
    • H01L2224/02122—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body
    • H01L2224/02163—Auxiliary members for bonding areas, e.g. spacers being formed on the semiconductor or solid-state body on the bonding area
    • H01L2224/02165—Reinforcing structures
    • H01L2224/02166—Collar structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/04042—Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01014—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01068—Erbium [Er]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01077—Iridium [Ir]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/1015—Shape
    • H01L2924/1016—Shape being a cuboid
    • H01L2924/10161—Shape being a cuboid with a rectangular active surface
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/13—Discrete devices, e.g. 3 terminal devices
    • H01L2924/1304—Transistor
    • H01L2924/1306—Field-effect transistor [FET]
    • H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Formation Of Insulating Films (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Local Oxidation Of Silicon (AREA)
  • Semiconductor Integrated Circuits (AREA)
JP55119817A 1980-09-01 1980-09-01 Resin sealing type semiconductor device Granted JPS5745259A (en)

Priority Applications (14)

Application Number Priority Date Filing Date Title
JP55119817A JPS5745259A (en) 1980-09-01 1980-09-01 Resin sealing type semiconductor device
GB8125494A GB2083283B (en) 1980-09-01 1981-08-20 Resin molded type semiconductor device
IT23674/81A IT1138522B (it) 1980-09-01 1981-08-28 Dispositivo semiconduttore del tipo stampato in resina
DE3134343A DE3134343C2 (de) 1980-09-01 1981-08-31 Halbleiteranordnung
US06/744,151 US4625227A (en) 1980-09-01 1985-06-13 Resin molded type semiconductor device having a conductor film
HK542/86A HK54286A (en) 1980-09-01 1986-07-24 Resin molded type semiconductor device
MY546/86A MY8600546A (en) 1980-09-01 1986-12-30 Resin molded type semiconductor device
US07/419,007 US5023699A (en) 1980-09-01 1989-10-10 Resin molded type semiconductor device having a conductor film
US07/703,765 US5229642A (en) 1980-09-01 1991-05-21 Resin molded type semiconductor device having a conductor film
US08/072,405 US5371411A (en) 1980-09-01 1993-06-07 Resin molded type semiconductor device having a conductor film
US08/293,559 US5468998A (en) 1980-09-01 1994-08-22 Resin molded type semiconductor device having a conductor film
US08/456,942 US5539257A (en) 1980-09-01 1995-06-01 Resin molded type semiconductor device having a conductor film
US08/456,384 US5552639A (en) 1980-09-01 1995-06-01 Resin molded type semiconductor device having a conductor film
US08/535,956 US5583381A (en) 1980-09-01 1995-09-28 Resin molded type-semiconductor device having a conductor film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP55119817A JPS5745259A (en) 1980-09-01 1980-09-01 Resin sealing type semiconductor device

Related Child Applications (4)

Application Number Title Priority Date Filing Date
JP1233587A Division JPS62202525A (ja) 1987-01-23 1987-01-23 樹脂封止型半導体装置
JP63017091A Division JPH0815150B2 (ja) 1988-01-29 1988-01-29 樹脂封止型半導体装置の製造方法
JP20118589A Division JPH0277132A (ja) 1989-08-04 1989-08-04 樹脂封止型半導体装置
JP1201184A Division JPH0652735B2 (ja) 1989-08-04 1989-08-04 樹脂封止型半導体装置

Publications (2)

Publication Number Publication Date
JPS5745259A JPS5745259A (en) 1982-03-15
JPS6346981B2 true JPS6346981B2 (US20100223739A1-20100909-C00005.png) 1988-09-20

Family

ID=14770970

Family Applications (1)

Application Number Title Priority Date Filing Date
JP55119817A Granted JPS5745259A (en) 1980-09-01 1980-09-01 Resin sealing type semiconductor device

Country Status (7)

Country Link
US (2) US4625227A (US20100223739A1-20100909-C00005.png)
JP (1) JPS5745259A (US20100223739A1-20100909-C00005.png)
DE (1) DE3134343C2 (US20100223739A1-20100909-C00005.png)
GB (1) GB2083283B (US20100223739A1-20100909-C00005.png)
HK (1) HK54286A (US20100223739A1-20100909-C00005.png)
IT (1) IT1138522B (US20100223739A1-20100909-C00005.png)
MY (1) MY8600546A (US20100223739A1-20100909-C00005.png)

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JPS5925387B2 (ja) * 1980-06-10 1984-06-16 株式会社東芝 半導体装置
US5371411A (en) * 1980-09-01 1994-12-06 Hitachi, Ltd. Resin molded type semiconductor device having a conductor film
JPS5955037A (ja) * 1982-09-24 1984-03-29 Hitachi Ltd 半導体装置
US4835592A (en) * 1986-03-05 1989-05-30 Ixys Corporation Semiconductor wafer with dice having briding metal structure and method of manufacturing same
GB2209433B (en) * 1987-09-04 1990-06-13 Plessey Co Plc Semi-conductor devices
US4928162A (en) * 1988-02-22 1990-05-22 Motorola, Inc. Die corner design having topological configurations
JPH01135739U (US20100223739A1-20100909-C00005.png) * 1988-03-09 1989-09-18
EP0342681B1 (en) * 1988-05-19 1995-08-09 Semiconductor Energy Laboratory Co., Ltd. Method of manufacturing an electrical device
US5223735A (en) * 1988-09-30 1993-06-29 Mitsubishi Denki Kabushiki Kaisha Semiconductor integrated circuit device in which circuit functions can be remedied or changed and the method for producing the same
US5164816A (en) * 1988-12-29 1992-11-17 Hitachi Chemical Co., Ltd. Integrated circuit device produced with a resin layer produced from a heat-resistant resin paste
US5187558A (en) * 1989-05-08 1993-02-16 Mitsubishi Denki Kabushiki Kaisha Stress reduction structure for a resin sealed semiconductor device
JPH0322535A (ja) * 1989-06-20 1991-01-30 Oki Electric Ind Co Ltd 樹脂封止型半導体装置
JPH07111971B2 (ja) * 1989-10-11 1995-11-29 三菱電機株式会社 集積回路装置の製造方法
JP2936542B2 (ja) * 1990-01-30 1999-08-23 株式会社日立製作所 電源幹線のレイアウト方法
US5179435A (en) * 1990-03-05 1993-01-12 Nec Corporation Resin sealed semiconductor integrated circuit device
US5289036A (en) * 1991-01-22 1994-02-22 Nec Corporation Resin sealed semiconductor integrated circuit
JPH04256371A (ja) * 1991-02-08 1992-09-11 Toyota Autom Loom Works Ltd 半導体装置及びその製造方法
JP3004083B2 (ja) * 1991-06-21 2000-01-31 沖電気工業株式会社 半導体装置及びその製造装置
JPH05175191A (ja) * 1991-10-22 1993-07-13 Mitsubishi Electric Corp 積層導電配線
JP2559977B2 (ja) * 1992-07-29 1996-12-04 インターナショナル・ビジネス・マシーンズ・コーポレイション バイアに係るクラックを除去する方法及び構造、並びに、半導体セラミックパッケージ基板。
US5464794A (en) * 1994-05-11 1995-11-07 United Microelectronics Corporation Method of forming contact openings having concavo-concave shape
US5686356A (en) 1994-09-30 1997-11-11 Texas Instruments Incorporated Conductor reticulation for improved device planarity
US5572067A (en) * 1994-10-06 1996-11-05 Altera Corporation Sacrificial corner structures
US5543657A (en) * 1994-10-07 1996-08-06 International Business Machines Corporation Single layer leadframe design with groundplane capability
JP3384901B2 (ja) * 1995-02-02 2003-03-10 三菱電機株式会社 リードフレーム
KR0170316B1 (ko) * 1995-07-13 1999-02-01 김광호 반도체 장치의 패드 설계 방법
DE19630910A1 (de) * 1995-08-02 1997-02-06 Nat Semiconductor Corp Verfahren zum Herstellen eines Halbleiterbausteins
US5650666A (en) * 1995-11-22 1997-07-22 Cypress Semiconductor Corp. Method and apparatus for preventing cracks in semiconductor die
US5773895A (en) * 1996-04-03 1998-06-30 Intel Corporation Anchor provisions to prevent mold delamination in an overmolded plastic array package
KR100190927B1 (ko) * 1996-07-18 1999-06-01 윤종용 슬릿이 형성된 금속막을 구비한 반도체 칩 장치
US5750419A (en) * 1997-02-24 1998-05-12 Motorola, Inc. Process for forming a semiconductor device having a ferroelectric capacitor
US5977639A (en) * 1997-09-30 1999-11-02 Intel Corporation Metal staples to prevent interlayer delamination
US6246124B1 (en) 1998-09-16 2001-06-12 International Business Machines Corporation Encapsulated chip module and method of making same
KR100670693B1 (ko) * 2000-08-31 2007-01-17 주식회사 하이닉스반도체 반도체 소자 및 그의 제조 방법
US6709977B2 (en) * 2002-02-12 2004-03-23 Broadcom Corporation Integrated circuit having oversized components and method of manafacture thereof
KR100653715B1 (ko) * 2005-06-17 2006-12-05 삼성전자주식회사 적어도 하나의 개구부를 갖는 최상부 금속층을 구비하는반도체 소자들 및 그 제조방법들
JP5014969B2 (ja) * 2007-12-10 2012-08-29 ルネサスエレクトロニクス株式会社 半導体装置
JP5893287B2 (ja) 2011-08-10 2016-03-23 ルネサスエレクトロニクス株式会社 半導体装置および基板
US8703535B2 (en) * 2012-06-07 2014-04-22 Stats Chippac Ltd. Integrated circuit packaging system with warpage preventing mechanism and method of manufacture thereof
JP2015088576A (ja) * 2013-10-30 2015-05-07 ルネサスエレクトロニクス株式会社 半導体装置および半導体装置の製造方法

Citations (3)

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Publication number Priority date Publication date Assignee Title
JPS5389688A (en) * 1977-01-19 1978-08-07 Hitachi Ltd Semiconductor device
JPS53135585A (en) * 1977-05-02 1978-11-27 Hitachi Ltd Wiring for electronic components
JPS54133090A (en) * 1978-04-07 1979-10-16 Cho Lsi Gijutsu Kenkyu Kumiai Semiconductor device

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Also Published As

Publication number Publication date
US5023699A (en) 1991-06-11
IT1138522B (it) 1986-09-17
DE3134343A1 (de) 1982-06-03
MY8600546A (en) 1986-12-31
DE3134343C2 (de) 1996-08-22
GB2083283A (en) 1982-03-17
US4625227A (en) 1986-11-25
HK54286A (en) 1986-08-01
IT8123674A0 (it) 1981-08-28
GB2083283B (en) 1984-06-20
JPS5745259A (en) 1982-03-15

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