JPS6231836B2 - - Google Patents

Info

Publication number
JPS6231836B2
JPS6231836B2 JP56074689A JP7468981A JPS6231836B2 JP S6231836 B2 JPS6231836 B2 JP S6231836B2 JP 56074689 A JP56074689 A JP 56074689A JP 7468981 A JP7468981 A JP 7468981A JP S6231836 B2 JPS6231836 B2 JP S6231836B2
Authority
JP
Japan
Prior art keywords
electronic circuit
wiring board
circuit component
insulating substrate
mother wiring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56074689A
Other languages
English (en)
Japanese (ja)
Other versions
JPS57193094A (en
Inventor
Hisashi Nakamura
Tatsuo Kikuchi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP56074689A priority Critical patent/JPS57193094A/ja
Priority to KR8202084A priority patent/KR860000188B1/ko
Priority to US06/377,997 priority patent/US4495546A/en
Priority to EP82302525A priority patent/EP0065425B1/en
Priority to DE8282302525T priority patent/DE3279897D1/de
Publication of JPS57193094A publication Critical patent/JPS57193094A/ja
Publication of JPS6231836B2 publication Critical patent/JPS6231836B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/04—Manufacture of substantially flat articles, e.g. boards, from particles or fibres from fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/007—Manufacture of substantially flat articles, e.g. boards, from particles or fibres and at least partly composed of recycled material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B27—WORKING OR PRESERVING WOOD OR SIMILAR MATERIAL; NAILING OR STAPLING MACHINES IN GENERAL
    • B27N—MANUFACTURE BY DRY PROCESSES OF ARTICLES, WITH OR WITHOUT ORGANIC BINDING AGENTS, MADE FROM PARTICLES OR FIBRES CONSISTING OF WOOD OR OTHER LIGNOCELLULOSIC OR LIKE ORGANIC MATERIAL
    • B27N3/00—Manufacture of substantially flat articles, e.g. boards, from particles or fibres
    • B27N3/08—Moulding or pressing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/147—Structural association of two or more printed circuits at least one of the printed circuits being bent or folded, e.g. by using a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H10W70/611—
    • H10W70/688—
    • H10W90/00—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0302—Properties and characteristics in general
    • H05K2201/0305—Solder used for other purposes than connections between PCB or components, e.g. for filling vias or for programmable patterns
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/04—Assemblies of printed circuits
    • H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/055—Folded back on itself
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0064—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a polymeric substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0067—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto an inorganic, non-metallic substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/366—Assembling printed circuits with other printed circuits substantially perpendicularly to each other
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y10T29/4914—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal
    • Y10T29/49142—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture with deforming of lead or terminal including metal fusion

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Forests & Forestry (AREA)
  • Combinations Of Printed Boards (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP56074689A 1981-05-18 1981-05-18 Electronic circuit part and method of mounting same Granted JPS57193094A (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP56074689A JPS57193094A (en) 1981-05-18 1981-05-18 Electronic circuit part and method of mounting same
KR8202084A KR860000188B1 (ko) 1981-05-18 1982-05-13 혼성집적회로 부품 및 그 부착 방법
US06/377,997 US4495546A (en) 1981-05-18 1982-05-13 Hybrid integrated circuit component and printed circuit board mounting said component
EP82302525A EP0065425B1 (en) 1981-05-18 1982-05-18 Hybrid integrated circuit component and printed circuit board mounting said component
DE8282302525T DE3279897D1 (en) 1981-05-18 1982-05-18 Hybrid integrated circuit component and printed circuit board mounting said component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP56074689A JPS57193094A (en) 1981-05-18 1981-05-18 Electronic circuit part and method of mounting same

Publications (2)

Publication Number Publication Date
JPS57193094A JPS57193094A (en) 1982-11-27
JPS6231836B2 true JPS6231836B2 (enExample) 1987-07-10

Family

ID=13554428

Family Applications (1)

Application Number Title Priority Date Filing Date
JP56074689A Granted JPS57193094A (en) 1981-05-18 1981-05-18 Electronic circuit part and method of mounting same

Country Status (5)

Country Link
US (1) US4495546A (enExample)
EP (1) EP0065425B1 (enExample)
JP (1) JPS57193094A (enExample)
KR (1) KR860000188B1 (enExample)
DE (1) DE3279897D1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104955272A (zh) * 2014-03-31 2015-09-30 奇点新源国际技术开发(北京)有限公司 一种印刷电路板

Families Citing this family (125)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3123372C2 (de) * 1981-06-12 1983-07-07 Ifm Electronic Gmbh, 4300 Essen Elektrisches, insbesondere elektronisches, berührungslos arbeitendes Schaltgerät
JPS5879799A (ja) * 1981-11-06 1983-05-13 松下電器産業株式会社 混成集積回路の製造方法
JPS5961998A (ja) * 1982-09-30 1984-04-09 富士通株式会社 集積回路基板収納筐体構造
US4658332A (en) * 1983-04-04 1987-04-14 Raytheon Company Compliant layer printed circuit board
FR2544556B1 (fr) * 1983-04-15 1985-07-05 Telemecanique Electrique Dispositif entree/sortie pour automate programmable, gamme de tels dispositifs et procede pour realiser leur bornier
JPS6052084A (ja) * 1983-08-31 1985-03-23 株式会社東芝 印刷配線基板
JPH0817268B2 (ja) * 1984-04-25 1996-02-21 ソニー株式会社 プリント配線端子装置
DE3438423A1 (de) * 1984-10-19 1986-04-24 Siemens AG, 1000 Berlin und 8000 München Elektrisches geraet
EP0184747A1 (de) * 1984-12-13 1986-06-18 Heimann GmbH Infrarotdetektor
US4743868A (en) * 1985-04-03 1988-05-10 Nippondenso Co., Ltd. High frequency filter for electric instruments
US4623768A (en) 1985-07-29 1986-11-18 W. H. Brady Co. Foldable membrane switch with fold remote from contact-carrying panels
US5220488A (en) * 1985-09-04 1993-06-15 Ufe Incorporated Injection molded printed circuits
EP0238712A1 (de) * 1986-01-27 1987-09-30 Siemens-Albis Aktiengesellschaft Gesteuerte Umschalter-Matrix
WO1987006766A1 (en) * 1986-05-01 1987-11-05 Honeywell Inc. Multiple integrated circuit interconnection arrangement
US4978844A (en) * 1986-07-31 1990-12-18 Pioneer Electronic Corporation Optical element carrying printed substrate and optical head device using the substrate
US4922378A (en) * 1986-08-01 1990-05-01 Texas Instruments Incorporated Baseboard for orthogonal chip mount
US5031072A (en) * 1986-08-01 1991-07-09 Texas Instruments Incorporated Baseboard for orthogonal chip mount
JPH041750Y2 (enExample) * 1986-08-07 1992-01-21
US5214571A (en) * 1986-12-10 1993-05-25 Miraco, Inc. Multilayer printed circuit and associated multilayer material
US4961806A (en) * 1986-12-10 1990-10-09 Sanders Associates, Inc. Method of making a printed circuit
US5097390A (en) * 1986-12-10 1992-03-17 Interflex Corporation Printed circuit and fabrication of same
US4990948A (en) * 1986-12-27 1991-02-05 Canon Kabushiki Kaisha Flexible printed circuit board
US4858071A (en) * 1987-02-24 1989-08-15 Nissan Motor Co., Ltd. Electronic circuit apparatus
DE3709306A1 (de) * 1987-03-21 1988-09-29 Mueller Rolf K Dr Druckschalter, insbesondere einer tastatur
IT1202670B (it) * 1987-03-23 1989-02-09 Crouzet Spa Dispositivo di interfaccia per connessioni elettriche in macchine lavatrici e asciugatrici ad elementi piani rigidi e circuiti stampati flessibili
JP2631287B2 (ja) * 1987-06-30 1997-07-16 日本メクトロン 株式会社 混成多層回路基板の製造法
US4771366A (en) * 1987-07-06 1988-09-13 International Business Machines Corporation Ceramic card assembly having enhanced power distribution and cooling
JPS6457789A (en) * 1987-08-28 1989-03-06 Mitsubishi Electric Corp Electronic component mounting structure
JPS6466990A (en) * 1987-09-08 1989-03-13 Furukawa Electric Co Ltd Molded circuit board
US4751612A (en) * 1987-10-08 1988-06-14 Rca Corporation Construction for attaching a component to a substrate
DE3813565A1 (de) * 1988-04-22 1989-11-02 Bosch Gmbh Robert Elektrischer anschluss von hybridbaugruppen
US4922199A (en) * 1988-05-27 1990-05-01 Enprotech Corp. Rotary position transducer having hinged circuit boards
DE3843787A1 (de) * 1988-12-24 1990-07-05 Standard Elektrik Lorenz Ag Verfahren und leiterplatte zum montieren eines halbleiter-bauelements
US4945229A (en) * 1988-12-29 1990-07-31 Thomas & Betts Corporation Fiber optic receiver and transceiver
AU628547B2 (en) * 1989-05-19 1992-09-17 Compaq Computer Corporation Modular computer memory circuit board
JPH0635499Y2 (ja) * 1989-08-09 1994-09-14 ファイン電子株式会社 両面プリント基板
JPH03147388A (ja) * 1989-10-23 1991-06-24 Allen Bradley Internatl Ltd 射出成形印刷回路
JPH03145186A (ja) * 1989-10-30 1991-06-20 Mitsubishi Electric Corp 半導体モジュール
JPH03156905A (ja) * 1989-11-14 1991-07-04 Mitsubishi Electric Corp 積層形コンデンサを用いた電子部品
DE4037603A1 (de) * 1989-11-28 1991-05-29 Telefunken Electronic Gmbh Gehaeuse fuer den einbau in kraftfahrzeuge
FI914475A7 (fi) * 1990-01-24 1991-09-24 Jury Dimitrievich Sasov Kolmiulotteinen elektroninen laite ja menetelmä sen valmistamiseksi
US5170326A (en) * 1990-02-05 1992-12-08 Motorola, Inc. Electronic module assembly
US5103375A (en) * 1990-02-05 1992-04-07 Motorola, Inc. Electronic module assembly and method of manufacture
JP3280394B2 (ja) * 1990-04-05 2002-05-13 ロックヒード マーティン コーポレーション 電子装置
US5345205A (en) * 1990-04-05 1994-09-06 General Electric Company Compact high density interconnected microwave system
US5049089A (en) * 1990-08-17 1991-09-17 Eastman Kodak Company Low cost arch connector
US5121297A (en) * 1990-12-31 1992-06-09 Compaq Computer Corporation Flexible printed circuits
US5239448A (en) * 1991-10-28 1993-08-24 International Business Machines Corporation Formulation of multichip modules
EP0615679B1 (en) * 1991-12-02 1997-10-22 Motorola, Inc. Electronic module assembly
US5198965A (en) * 1991-12-18 1993-03-30 International Business Machines Corporation Free form packaging of specific functions within a computer system
US5831836A (en) * 1992-01-30 1998-11-03 Lsi Logic Power plane for semiconductor device
US5386342A (en) * 1992-01-30 1995-01-31 Lsi Logic Corporation Rigid backplane formed from a moisture resistant insulative material used to protect a semiconductor device
US5224023A (en) * 1992-02-10 1993-06-29 Smith Gary W Foldable electronic assembly module
US5179501A (en) * 1992-02-24 1993-01-12 Motorola, Inc. Laminated electronic module assembly
US5229916A (en) * 1992-03-04 1993-07-20 International Business Machines Corporation Chip edge interconnect overlay element
US5278724A (en) * 1992-07-06 1994-01-11 International Business Machines Corporation Electronic package and method of making same
US5363275A (en) * 1993-02-10 1994-11-08 International Business Machines Corporation Modular component computer system
US5345364A (en) * 1993-08-18 1994-09-06 Minnesota Mining And Manufacturing Company Edge-connecting printed circuit board
US5386341A (en) * 1993-11-01 1995-01-31 Motorola, Inc. Flexible substrate folded in a U-shape with a rigidizer plate located in the notch of the U-shape
DE4337258A1 (de) * 1993-11-02 1995-05-04 Philips Patentverwaltung Elektronisches Schaltungsmodul
JP2606177B2 (ja) * 1995-04-26 1997-04-30 日本電気株式会社 印刷配線板
US5758575A (en) * 1995-06-07 1998-06-02 Bemis Company Inc. Apparatus for printing an electrical circuit component with print cells in liquid communication
JPH0969983A (ja) * 1995-08-30 1997-03-11 Matsushita Electric Ind Co Ltd 固体撮像装置
US5805048A (en) * 1995-09-01 1998-09-08 Sumitomo Wiring Systems, Ltd. Plate fuse and method of producing the same
WO1997014157A1 (en) * 1995-10-07 1997-04-17 Img Group Limited An electrical circuit component formed of a conductive liquid printed directly onto a substrate
US5790380A (en) * 1995-12-15 1998-08-04 International Business Machines Corporation Method for fabricating a multiple chip module using orthogonal reorientation of connection planes
FR2754416B1 (fr) * 1996-10-04 1998-12-18 Thomson Csf Module electronique et son procede de fabrication
US5959839A (en) * 1997-01-02 1999-09-28 At&T Corp Apparatus for heat removal using a flexible backplane
JP2004506309A (ja) 1997-12-31 2004-02-26 エルパック（ユーエスエー）、インコーポレイテッド モールドされた電子パッケージ、製作方法およびシールディング方法
US6160714A (en) 1997-12-31 2000-12-12 Elpac (Usa), Inc. Molded electronic package and method of preparation
DE19924994A1 (de) * 1999-05-31 2000-12-21 Tyco Electronics Logistics Ag Intelligentes Leistungsmodul
DE50002850D1 (de) 1999-05-31 2003-08-14 Tyco Electronics Logistics Ag Intelligentes leistungsmodul
AU6349000A (en) * 1999-07-16 2001-02-05 Silicon Film Technologies, Inc. High-density packaging of integrated circuits
JP3973340B2 (ja) * 1999-10-05 2007-09-12 Ｎｅｃエレクトロニクス株式会社 半導体装置、配線基板、及び、それらの製造方法
JP3694825B2 (ja) * 1999-11-18 2005-09-14 日本航空電子工業株式会社 導体パターンの形成方法及びコネクタ、フレキシブルプリント配線板、異方導電性部材
DE20018538U1 (de) 2000-10-27 2002-03-07 Mannesmann Vdo Ag Sensormodul
GB0029312D0 (en) 2000-12-01 2001-01-17 Philips Corp Intellectual Pty Flexible electronic device
WO2002080637A1 (en) 2001-04-02 2002-10-10 Nashua Corporation Circuit elements having an embedded conductive trace and methods of manufacture
CN100559707C (zh) * 2001-05-03 2009-11-11 汤姆森特许公司 减小电磁辐射的方法和装置
US6665191B2 (en) * 2001-09-10 2003-12-16 Cardiac Pacemakers, Inc. Multi-folded printed wiring construction for an implantable medical device
EP1383364A3 (en) * 2002-05-23 2006-01-04 Nashua Corporation Circuit elements having an ink receptive coating and a conductive trace and methods of manufacture
KR100487860B1 (ko) * 2002-08-09 2005-05-03 (주)호설암물산 도금 방법
US7662093B2 (en) * 2002-09-30 2010-02-16 Given Imaging, Ltd. Reduced size imaging device
US6831835B2 (en) * 2002-12-24 2004-12-14 Ault, Inc. Multi-layer laminated structures, method for fabricating such structures, and power supply including such structures
US6893271B2 (en) * 2003-10-08 2005-05-17 Ingersoll-Rand Company Circuit board assembly, main and connector boards, and connector pins for same
US7134194B2 (en) * 2003-11-13 2006-11-14 Delphi Technologies, Inc. Method of developing an electronic module
US6993835B2 (en) * 2003-12-04 2006-02-07 Irvine Sensors Corp. Method for electrical interconnection of angularly disposed conductive patterns
US7193307B2 (en) * 2004-03-25 2007-03-20 Ault Incorporated Multi-layer FET array and method of fabricating
JP4143926B2 (ja) * 2004-04-28 2008-09-03 船井電機株式会社 フレキシブルプリント基板のプリント基板への接続構造
FR2871334B1 (fr) * 2004-06-03 2008-03-28 Bree Beauce Realisations Et Et Circuit imprime semi-flexible
WO2006028643A2 (en) * 2004-09-03 2006-03-16 Staktek Group L.P. Circuit module system and method
US20060261449A1 (en) * 2005-05-18 2006-11-23 Staktek Group L.P. Memory module system and method
US7616452B2 (en) * 2004-09-03 2009-11-10 Entorian Technologies, Lp Flex circuit constructions for high capacity circuit module systems and methods
US7443023B2 (en) * 2004-09-03 2008-10-28 Entorian Technologies, Lp High capacity thin module system
US20060050492A1 (en) 2004-09-03 2006-03-09 Staktek Group, L.P. Thin module system and method
US7312401B2 (en) * 2004-09-21 2007-12-25 Ibiden Co., Ltd. Flexible printed wiring board
JP2006234635A (ja) * 2005-02-25 2006-09-07 Three M Innovative Properties Co フレキシブルプリント配線板の接合部の非破壊検査方法
US7551433B2 (en) * 2005-10-26 2009-06-23 Dell Products L.P. Method and apparatus for mounting a component in a chassis
JP4640819B2 (ja) * 2005-12-02 2011-03-02 日東電工株式会社 配線回路基板
WO2008121394A1 (en) * 2007-03-29 2008-10-09 Flextronics Ap, Llc Method of producing a multi-turn coil from folded flexible circuitry
US7983024B2 (en) * 2007-04-24 2011-07-19 Littelfuse, Inc. Fuse card system for automotive circuit protection
CN101809851B (zh) * 2008-09-09 2013-06-12 丰田自动车株式会社 电压变换装置及电负载驱动装置
TWI392409B (zh) * 2009-05-26 2013-04-01 Wistron Corp 電子裝置及其軟性電路板
CN101875078A (zh) * 2010-03-25 2010-11-03 昆山凯意工模具配套有限公司 电路板冲压模具
EP2393308B1 (en) * 2010-06-07 2019-10-16 Oticon A/s Hearing aid comprising a folded substrate
US9117991B1 (en) 2012-02-10 2015-08-25 Flextronics Ap, Llc Use of flexible circuits incorporating a heat spreading layer and the rigidizing specific areas within such a construction by creating stiffening structures within said circuits by either folding, bending, forming or combinations thereof
EP2675253A1 (en) * 2012-06-15 2013-12-18 BIOTRONIK SE & Co. KG Flexible-rigid circuit board composite and method for producing a flexible-rigid circuit board composite
WO2014088974A1 (en) * 2012-12-03 2014-06-12 Flextronics Ap, Llc Driving board folding machine
JP5582276B1 (ja) * 2013-01-08 2014-09-03 株式会社村田製作所 フレキシブル基板および電子機器
US9338915B1 (en) 2013-12-09 2016-05-10 Flextronics Ap, Llc Method of attaching electronic module on fabrics by stitching plated through holes
US9560746B1 (en) 2014-01-24 2017-01-31 Multek Technologies, Ltd. Stress relief for rigid components on flexible circuits
GB2523145A (en) * 2014-02-14 2015-08-19 Nokia Technologies Oy A circuit board and associated apparatus and methods
US9402312B2 (en) 2014-05-12 2016-07-26 Invensas Corporation Circuit assemblies with multiple interposer substrates, and methods of fabrication
US9723713B1 (en) 2014-05-16 2017-08-01 Multek Technologies, Ltd. Flexible printed circuit board hinge
US9549463B1 (en) 2014-05-16 2017-01-17 Multek Technologies, Ltd. Rigid to flexible PC transition
US9780471B2 (en) * 2014-05-22 2017-10-03 Philips Lighting Holding B.V. Printed circuit board arrangement and method for mounting a product to a main printed circuit board
US10154583B1 (en) 2015-03-27 2018-12-11 Flex Ltd Mechanical strain reduction on flexible and rigid-flexible circuits
US9741620B2 (en) 2015-06-24 2017-08-22 Invensas Corporation Structures and methods for reliable packages
US9984962B2 (en) 2015-08-31 2018-05-29 Arizona Board Of Regents On Behalf Of Arizona State University Systems and methods for hybrid flexible electronics with rigid integrated circuits
KR101901697B1 (ko) * 2016-03-21 2018-11-07 삼성전기 주식회사 코일 장치의 제작 방법 및 코일 장치
US10180708B2 (en) * 2016-05-24 2019-01-15 Microsoft Technology Licensing, Llc Curved circuit board
CN107567178A (zh) * 2017-07-24 2018-01-09 深圳市深印柔性电路有限公司 基于贴片式热敏电阻的补强型fpc板结构
US20220096169A1 (en) * 2020-09-29 2022-03-31 Carnegie Mellon University Tracking of instrument motions using an inertial measurement system
JP2023019076A (ja) * 2021-07-28 2023-02-09 新光電気工業株式会社 回路基板
CN114035704B (zh) * 2021-11-05 2023-07-18 业成科技（成都）有限公司 电路板结构、背光模组、显示模组及触控显示模组

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2693584A (en) * 1953-08-18 1954-11-02 Sylvania Electric Prod Electrical component assembly
US2910628A (en) * 1955-09-26 1959-10-27 Robert L Kecner Right angle printed circuit connector
BE632250A (enExample) * 1962-05-21
GB1048021A (en) * 1963-02-04 1966-11-09 Nigel Archibald Walter Electrical circuit arrangements
DE1591513A1 (de) * 1967-07-10 1970-02-12 Siemens Ag Anordnung zur Verbindung gedruckter Schaltungsplatten
US3582865A (en) * 1969-12-16 1971-06-01 Ibm Microcircuit module and connector
JPS4819148U (enExample) * 1971-07-13 1973-03-03
JPS4822154U (enExample) * 1971-07-21 1973-03-13
JPS5124520Y2 (enExample) * 1971-07-23 1976-06-23
US3786439A (en) * 1972-12-26 1974-01-15 Ibm Error detection systems
US3829741A (en) * 1973-01-15 1974-08-13 Hobart Mfg Co Mounting for printed circuit boards
JPS5228067U (enExample) * 1975-08-20 1977-02-26
JPS583397B2 (ja) * 1975-08-21 1983-01-21 松下電器産業株式会社 コンセイビシヨウブヒン
US3971127A (en) * 1975-09-10 1976-07-27 Bell Telephone Laboratories, Incorporated Method of fabricating a printed wiring board assembly
JPS5279565U (enExample) * 1975-12-12 1977-06-14
US4109298A (en) * 1976-07-26 1978-08-22 Texas Instruments Incorporated Connector with printed wiring board structure
JPS5426671U (enExample) * 1977-07-26 1979-02-21
US4149219A (en) * 1978-02-22 1979-04-10 The United States Of America As Represented By The Secretary Of The Navy Flexible printed circuit board assembly
JPS5565890U (enExample) * 1978-10-30 1980-05-07
FR2442570A1 (fr) * 1978-11-27 1980-06-20 Radiotechnique Compelec Procede d'insertion d'une plaque portant des plages de contact metallisees dans un substrat de circuits imprimes et dispositif obtenu
JPS5834770Y2 (ja) * 1978-12-25 1983-08-04 松下電器産業株式会社 プリント基板装置
US4250536A (en) * 1978-12-26 1981-02-10 General Electric Company Interconnection arrangement for circuit boards
DE2914336A1 (de) * 1979-04-09 1980-11-06 Telefonbau & Normalzeit Gmbh Verfahren zur herstellung starr- flexibler leiterplatten
JPS598370Y2 (ja) * 1979-05-08 1984-03-15 アルプス電気株式会社 電気回路ユニツト
JPS5935018Y2 (ja) * 1979-10-23 1984-09-27 日本電気ホームエレクトロニクス株式会社 電子部品取付装置
FR2504345A1 (fr) * 1981-04-21 1982-10-22 Elbeuf Electro Indle Assemblage d'un circuit imprime souple et d'un circuit imprime rigide et circuits imprimes pour un tel assemblage
JPH0672973B2 (ja) * 1983-06-30 1994-09-14 株式会社リコー オ−トフオ−カス方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN104955272A (zh) * 2014-03-31 2015-09-30 奇点新源国际技术开发(北京)有限公司 一种印刷电路板

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US4495546A (en) 1985-01-22
EP0065425A3 (en) 1985-01-09
KR860000188B1 (ko) 1986-02-28
KR840000080A (ko) 1984-01-30
EP0065425A2 (en) 1982-11-24
DE3279897D1 (en) 1989-09-21
EP0065425B1 (en) 1989-08-16
JPS57193094A (en) 1982-11-27

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