FR2871334B1 - Circuit imprime semi-flexible - Google Patents

Circuit imprime semi-flexible

Info

Publication number
FR2871334B1
FR2871334B1 FR0451099A FR0451099A FR2871334B1 FR 2871334 B1 FR2871334 B1 FR 2871334B1 FR 0451099 A FR0451099 A FR 0451099A FR 0451099 A FR0451099 A FR 0451099A FR 2871334 B1 FR2871334 B1 FR 2871334B1
Authority
FR
France
Prior art keywords
semi
printed circuit
flexible printed
flexible
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0451099A
Other languages
English (en)
Other versions
FR2871334A1 (fr
Inventor
Stephane Barrey
Olivier Belnoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
BREE BEAUCE REALISATIONS ET ET
Original Assignee
BREE BEAUCE REALISATIONS ET ET
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by BREE BEAUCE REALISATIONS ET ET filed Critical BREE BEAUCE REALISATIONS ET ET
Priority to FR0451099A priority Critical patent/FR2871334B1/fr
Publication of FR2871334A1 publication Critical patent/FR2871334A1/fr
Application granted granted Critical
Publication of FR2871334B1 publication Critical patent/FR2871334B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
    • H05K3/0052—Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/44—Manufacturing insulated metal core circuits or other insulated electrically conductive core circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09036—Recesses or grooves in insulating substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/0909—Preformed cutting or breaking line
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09663—Divided layout, i.e. conductors divided in two or more parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
    • H05K3/0061—Laminating printed circuit boards onto other substrates, e.g. metallic substrates onto a metallic substrate, e.g. a heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Insulated Metal Substrates For Printed Circuits (AREA)
FR0451099A 2004-06-03 2004-06-03 Circuit imprime semi-flexible Expired - Fee Related FR2871334B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0451099A FR2871334B1 (fr) 2004-06-03 2004-06-03 Circuit imprime semi-flexible

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0451099A FR2871334B1 (fr) 2004-06-03 2004-06-03 Circuit imprime semi-flexible

Publications (2)

Publication Number Publication Date
FR2871334A1 FR2871334A1 (fr) 2005-12-09
FR2871334B1 true FR2871334B1 (fr) 2008-03-28

Family

ID=34945063

Family Applications (1)

Application Number Title Priority Date Filing Date
FR0451099A Expired - Fee Related FR2871334B1 (fr) 2004-06-03 2004-06-03 Circuit imprime semi-flexible

Country Status (1)

Country Link
FR (1) FR2871334B1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102005012404B4 (de) * 2005-03-17 2007-05-03 Siemens Ag Leiterplatte
FR2919781A1 (fr) 2007-07-31 2009-02-06 Beauce Realisations Et Etudes Procede de fabrication d'un circuit imprime semi-flexible, plaque utilisee pour un tel procede, circuit imprime et dispositif electronique associes
DE102009032984B3 (de) 2009-07-14 2011-03-03 Osram Gesellschaft mit beschränkter Haftung Biegbare Leuchtmodule und Verfahren zum Herstellen von biegbaren Leuchtmodulen

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS548872A (en) * 1977-06-21 1979-01-23 Matsushita Electric Ind Co Ltd Print wiring board and method of making same
JPS57193094A (en) * 1981-05-18 1982-11-27 Matsushita Electric Ind Co Ltd Electronic circuit part and method of mounting same
DE3141093A1 (de) * 1981-10-16 1983-04-28 Licentia Patent-Verwaltungs-Gmbh, 6000 Frankfurt Leiterplatte mit einer flexiblen folie
JPS62162349A (ja) * 1986-01-13 1987-07-18 Sanyo Electric Co Ltd 混成集積回路の製造方法
JPS6461992A (en) * 1987-09-02 1989-03-08 Matsushita Electric Works Ltd Manufacture of wiring board
JPS6461981A (en) * 1987-09-02 1989-03-08 Matsushita Electric Works Ltd Manufacture of wiring board
JPH0748946B2 (ja) * 1990-06-29 1995-05-24 三洋電機株式会社 スイッチング電源装置
JPH09162507A (ja) * 1995-12-08 1997-06-20 Nippon Seiki Co Ltd 金属ベースプリント基板

Also Published As

Publication number Publication date
FR2871334A1 (fr) 2005-12-09

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20150227