DK2393308T3 - Høreapparat, der omfatter et foldet substrat - Google Patents

Høreapparat, der omfatter et foldet substrat Download PDF

Info

Publication number
DK2393308T3
DK2393308T3 DK10165072.9T DK10165072T DK2393308T3 DK 2393308 T3 DK2393308 T3 DK 2393308T3 DK 10165072 T DK10165072 T DK 10165072T DK 2393308 T3 DK2393308 T3 DK 2393308T3
Authority
DK
Denmark
Prior art keywords
hearing aid
folded substrate
folded
substrate
hearing
Prior art date
Application number
DK10165072.9T
Other languages
English (en)
Inventor
Kenneth Rueskov Møller
Jan T L Larsen
Original Assignee
Oticon As
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=43382453&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=DK2393308(T3) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Oticon As filed Critical Oticon As
Application granted granted Critical
Publication of DK2393308T3 publication Critical patent/DK2393308T3/da

Links

Classifications

    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/609Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of circuitry
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/65Housing parts, e.g. shells, tips or moulds, or their manufacture
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2225/00Details of deaf aids covered by H04R25/00, not provided for in any of its subgroups
    • H04R2225/023Completely in the canal [CIC] hearing aids
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R2225/00Details of deaf aids covered by H04R25/00, not provided for in any of its subgroups
    • H04R2225/025In the ear hearing aids [ITE] hearing aids
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/60Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles
    • H04R25/602Mounting or interconnection of hearing aid parts, e.g. inside tips, housings or to ossicles of batteries
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04RLOUDSPEAKERS, MICROPHONES, GRAMOPHONE PICK-UPS OR LIKE ACOUSTIC ELECTROMECHANICAL TRANSDUCERS; DEAF-AID SETS; PUBLIC ADDRESS SYSTEMS
    • H04R25/00Deaf-aid sets, i.e. electro-acoustic or electro-mechanical hearing aids; Electric tinnitus maskers providing an auditory perception
    • H04R25/65Housing parts, e.g. shells, tips or moulds, or their manufacture
    • H04R25/658Manufacture of housing parts
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/189Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Neurosurgery (AREA)
  • Otolaryngology (AREA)
  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Signal Processing (AREA)
  • Manufacturing & Machinery (AREA)
  • Telephone Set Structure (AREA)
  • Structure Of Printed Boards (AREA)
  • Battery Mounting, Suspending (AREA)
DK10165072.9T 2010-06-07 2010-06-07 Høreapparat, der omfatter et foldet substrat DK2393308T3 (da)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP10165072.9A EP2393308B1 (en) 2010-06-07 2010-06-07 Hearing aid comprising a folded substrate

Publications (1)

Publication Number Publication Date
DK2393308T3 true DK2393308T3 (da) 2020-01-20

Family

ID=43382453

Family Applications (1)

Application Number Title Priority Date Filing Date
DK10165072.9T DK2393308T3 (da) 2010-06-07 2010-06-07 Høreapparat, der omfatter et foldet substrat

Country Status (5)

Country Link
US (6) US9338569B2 (da)
EP (1) EP2393308B1 (da)
CN (2) CN105872926B (da)
AU (1) AU2011202692A1 (da)
DK (1) DK2393308T3 (da)

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US8401219B2 (en) 2007-01-05 2013-03-19 Apple Inc. Headset connector
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WO2009055415A2 (en) 2007-10-24 2009-04-30 Hmicro, Inc. A flexible wireless patch for physiological monitoring and methods of manufacturing the same
WO2009055397A2 (en) 2007-10-24 2009-04-30 Hmicro, Inc. Multi-electrode sensing patch for long-term physiological monitoring with swappable electronics, radio, and battery, and methods of use
US9571948B2 (en) * 2012-12-11 2017-02-14 Starkey Laboratories, Inc. Low profile offset spout for hearing assistance device
US20150172806A1 (en) * 2013-12-17 2015-06-18 United Sciences, Llc Custom ear monitor
WO2015164287A1 (en) * 2014-04-21 2015-10-29 Uqmartyne Management Llc Wireless earphone
WO2016019181A1 (en) 2014-07-30 2016-02-04 Hmicro, Inc. Ecg patch and methods of use
CN104319561B (zh) * 2014-10-10 2017-11-10 中航光电科技股份有限公司 可实现小型化的电连接器
JP6631530B2 (ja) * 2014-10-30 2020-01-15 ソニー株式会社 音響出力装置
KR20160105226A (ko) * 2015-02-27 2016-09-06 삼성전자주식회사 웨어러블 전자 장치
US9881113B2 (en) * 2015-06-17 2018-01-30 Mentor Graphics Corporation Layout synthesis of a three-dimensional mechanical system design
US10582284B2 (en) 2015-09-30 2020-03-03 Apple Inc. In-ear headphone
EP3432792A4 (en) 2016-03-22 2019-11-27 LifeSignals, Inc. SYSTEMS AND METHOD FOR DETECTING PHYSIOLOGICAL SIGNALS
US11206499B2 (en) * 2016-08-18 2021-12-21 Qualcomm Incorporated Hearable device comprising integrated device and wireless functionality
WO2018185815A1 (ja) * 2017-04-03 2018-10-11 オリンパス株式会社 熱処置具
USD877886S1 (en) 2018-04-24 2020-03-10 Ataia Inc. Communication device for hard plastic masks
US20200359137A1 (en) 2017-04-24 2020-11-12 Ataia Inc. Systems and methods for communicating through a hard plastic mask
US11284201B2 (en) 2017-04-24 2022-03-22 Ataia Inc. Systems and methods for communicating through a hard plastic mask
WO2018200535A1 (en) * 2017-04-24 2018-11-01 Ataia Inc. Systems and methods for communicating through a hard plastic mask
EP3471201B1 (en) * 2017-10-16 2021-02-17 Widex A/S Antenna for a hearing assistance device
US10757515B2 (en) * 2018-02-21 2020-08-25 Oticon A/S Hearing aid device having an antenna
USD954269S1 (en) 2018-04-24 2022-06-07 Ataia, Inc. Communication device for hard plastic masks
EP3588980B1 (en) * 2018-06-25 2021-06-02 Sonova AG Ite hearing device
US11601746B2 (en) * 2018-08-06 2023-03-07 Dopple Ip B.V. Integrated sub-assembly for wearable audio device
EP3629600B1 (en) * 2018-09-28 2024-10-23 GN Hearing A/S Hearing device with antenna extending from the hearing device
US10659862B1 (en) 2018-10-31 2020-05-19 X Development Llc Modular in-ear device
CN109547906B (zh) * 2019-01-05 2023-12-08 深圳市韶音科技有限公司 骨传导扬声装置
CN112954564A (zh) 2019-12-11 2021-06-11 大北欧听力公司 用于放置在用户耳道中的助听器
EP3890354A1 (en) * 2020-03-30 2021-10-06 GN Hearing A/S Hearing device with printed circuit board assembly and output transducer
US20230118070A1 (en) * 2021-10-19 2023-04-20 The Hong Kong University Of Science And Technology Kirigami enabled method for fabrication of large-format electronic device arrays

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Also Published As

Publication number Publication date
US9866977B2 (en) 2018-01-09
CN105872926A (zh) 2016-08-17
CN102271305A (zh) 2011-12-07
EP2393308B1 (en) 2019-10-16
US20230247375A1 (en) 2023-08-03
CN102271305B (zh) 2016-05-11
US9338569B2 (en) 2016-05-10
US11647345B2 (en) 2023-05-09
US11240612B2 (en) 2022-02-01
US20160295336A1 (en) 2016-10-06
US10382871B2 (en) 2019-08-13
EP2393308A1 (en) 2011-12-07
US20180084353A1 (en) 2018-03-22
CN105872926B (zh) 2019-12-10
AU2011202692A1 (en) 2011-12-22
US20220116719A1 (en) 2022-04-14
US20190342678A1 (en) 2019-11-07
US20110299713A1 (en) 2011-12-08

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