JPS61236197A - 厚膜基板の両面間の連結として用いる孔をめつきスル−し同時にシルク−スクリ−ン印刷操作を行なう方法 - Google Patents

厚膜基板の両面間の連結として用いる孔をめつきスル−し同時にシルク−スクリ−ン印刷操作を行なう方法

Info

Publication number
JPS61236197A
JPS61236197A JP61077574A JP7757486A JPS61236197A JP S61236197 A JPS61236197 A JP S61236197A JP 61077574 A JP61077574 A JP 61077574A JP 7757486 A JP7757486 A JP 7757486A JP S61236197 A JPS61236197 A JP S61236197A
Authority
JP
Japan
Prior art keywords
substrate
screen printing
holes
paste
plating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP61077574A
Other languages
English (en)
Japanese (ja)
Inventor
ジャン　ポール　ブルジョア−モアン
ジャン−マルセル　ボネ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9318023&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=JPS61236197(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of JPS61236197A publication Critical patent/JPS61236197A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/095—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers of vias therein
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Screen Printers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
JP61077574A 1985-04-05 1986-04-05 厚膜基板の両面間の連結として用いる孔をめつきスル−し同時にシルク−スクリ−ン印刷操作を行なう方法 Pending JPS61236197A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8505262A FR2580135B1 (enExample) 1985-04-05 1985-04-05
FR8505262 1985-04-05

Publications (1)

Publication Number Publication Date
JPS61236197A true JPS61236197A (ja) 1986-10-21

Family

ID=9318023

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61077574A Pending JPS61236197A (ja) 1985-04-05 1986-04-05 厚膜基板の両面間の連結として用いる孔をめつきスル−し同時にシルク−スクリ−ン印刷操作を行なう方法

Country Status (6)

Country Link
EP (1) EP0197595B1 (enExample)
JP (1) JPS61236197A (enExample)
AU (1) AU5565186A (enExample)
DE (1) DE3674823D1 (enExample)
FR (1) FR2580135B1 (enExample)
NO (1) NO861301L (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61285794A (ja) * 1985-06-12 1986-12-16 株式会社村田製作所 印刷配線基板の製造方法
JPS63182892A (ja) * 1987-01-24 1988-07-28 株式会社ケンウッド 厚膜ハイブリツドｉｃのスル−ホ−ル形成方法
JPS63182893A (ja) * 1987-01-24 1988-07-28 株式会社ケンウッド 厚膜ハイブリツド印刷装置のワ−ク・ステ−ジ構造
JPH0171474U (enExample) * 1987-11-02 1989-05-12
JPH02101570U (enExample) * 1989-01-27 1990-08-13
JPH09162547A (ja) * 1995-12-12 1997-06-20 Niyuurongu Seimitsu Kogyo Kk スルーホール印刷用吸引台

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0327298A3 (en) * 1988-02-03 1990-06-27 THE GENERAL ELECTRIC COMPANY, p.l.c. Apparatus for selectively coating part of a member
GB8802393D0 (en) * 1988-02-03 1988-03-02 Gen Electric Co Plc Apparatus for selectively coating part of member
DE19724366A1 (de) * 1997-06-10 1998-12-17 Thomson Brandt Gmbh Verfahren zur Durchkontaktierung von Leiterplatten
FR2871336B1 (fr) * 2004-06-02 2007-01-19 Bree Ind Soc Par Actions Simpl Circuit imprime flex-rigide par collage
CN102794979A (zh) * 2011-05-27 2012-11-28 高正科技有限公司 真空涂布装置
CN113380630A (zh) * 2020-03-09 2021-09-10 重庆川仪微电路有限责任公司 厚膜电路孔金属化方法及厚膜电路印刷方法
CN113643985A (zh) * 2021-08-06 2021-11-12 西安微电子技术研究所 一种实现厚膜基板正反面图案的互连方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS556832A (en) * 1978-06-29 1980-01-18 Nippon Mektron Kk Method of manufacturing flexible circuit substrate
DE3245458A1 (de) * 1982-12-08 1984-06-14 Siemens AG, 1000 Berlin und 8000 München Verfahren zur herstellung von durchkontaktierungen in dickschichttechnik
BE896966A (nl) * 1983-06-06 1983-12-06 Bell Telephone Mfg Zeefdrukproces en -toestel en daarmee verdregen elektische gedrukte ketens

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61285794A (ja) * 1985-06-12 1986-12-16 株式会社村田製作所 印刷配線基板の製造方法
JPS63182892A (ja) * 1987-01-24 1988-07-28 株式会社ケンウッド 厚膜ハイブリツドｉｃのスル−ホ−ル形成方法
JPS63182893A (ja) * 1987-01-24 1988-07-28 株式会社ケンウッド 厚膜ハイブリツド印刷装置のワ−ク・ステ−ジ構造
JPH0171474U (enExample) * 1987-11-02 1989-05-12
JPH02101570U (enExample) * 1989-01-27 1990-08-13
JPH09162547A (ja) * 1995-12-12 1997-06-20 Niyuurongu Seimitsu Kogyo Kk スルーホール印刷用吸引台

Also Published As

Publication number Publication date
FR2580135A1 (enExample) 1986-10-10
EP0197595A1 (fr) 1986-10-15
DE3674823D1 (de) 1990-11-15
FR2580135B1 (enExample) 1988-08-12
EP0197595B1 (fr) 1990-10-10
NO861301L (no) 1986-10-06
AU5565186A (en) 1986-10-16

Similar Documents

Publication Publication Date Title
JPS61236197A (ja) 厚膜基板の両面間の連結として用いる孔をめつきスル−し同時にシルク−スクリ−ン印刷操作を行なう方法
US20090014909A1 (en) Printing device, production unit, and production method of electronic parts
JPH0367353B2 (enExample)
JPH02277284A (ja) 高密度バイアを埋める方法および装置
JP2743262B2 (ja) 多層プリント基板の穴の貫通部を導通状態にする方法
JPH0471293A (ja) プリント配線板におけるスルーホール等への導電性物質等の充填方法
JP4644266B2 (ja) 電子部品の製造方法
GB2143473A (en) Screen printing process and apparatus and electrical printed circuits obtained therewith
EP3070738B1 (en) Through electrode and method for producing multilayer substrate using through electrode
JPH0475398A (ja) プリント配線板のスルーホール等に対する充填材の充填装置
CN104135830A (zh) 一种将金属浆料填入生瓷通孔的填充方法及装置
JP2003257891A (ja) 導電性ペーストの充填方法及び貫通電極付き基板並びに非貫通電極付き基板
US5888584A (en) Provision of tracks on flat substrates by means of a stencil-printing method
JP3449529B2 (ja) 強制加圧印刷用スキージ及び強制加圧印刷装置
JPS62211992A (ja) 回路基板のスル−ホ−ル接続部形成方法
JPS63284893A (ja) 導体ペ−スト充填方法
JPH05237986A (ja) 高粘度ペーストの充填方法及び充填装置
JP3292923B2 (ja) 電子部品又はプリント配線板の樹脂封止方法
JPS60215589A (ja) セラミツク生シ−トの貫通孔内部を金属化する方法
JPH0929149A (ja) 枚葉型塗布装置
JP2002217509A (ja) 回路基板へのペースト充填方法およびその装置
JPH06297680A (ja) スクリーン印刷方法、スクリーン印刷装置、及び電子回路
JPS63164297A (ja) スル−ホ−ル印刷機
JPH03283490A (ja) ペースト充填装置
JP3412727B2 (ja) 導電樹脂ペーストの転写方法