AU5565186A - Screen printing using a partial vacuum chamber - Google Patents

Screen printing using a partial vacuum chamber

Info

Publication number
AU5565186A
AU5565186A AU55651/86A AU5565186A AU5565186A AU 5565186 A AU5565186 A AU 5565186A AU 55651/86 A AU55651/86 A AU 55651/86A AU 5565186 A AU5565186 A AU 5565186A AU 5565186 A AU5565186 A AU 5565186A
Authority
AU
Australia
Prior art keywords
vacuum chamber
screen printing
partial vacuum
partial
printing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU55651/86A
Inventor
Not Given Name
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=9318023&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=AU5565186(A) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of AU5565186A publication Critical patent/AU5565186A/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/486—Via connections through the substrate with or without pins
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09981—Metallised walls
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/082—Suction, e.g. for holding solder balls or components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
    • H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
    • H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Ceramic Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Screen Printers (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
AU55651/86A 1985-04-05 1986-04-04 Screen printing using a partial vacuum chamber Abandoned AU5565186A (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
FR8505262 1985-04-05
FR8505262A FR2580135B1 (en) 1985-04-05 1985-04-05

Publications (1)

Publication Number Publication Date
AU5565186A true AU5565186A (en) 1986-10-16

Family

ID=9318023

Family Applications (1)

Application Number Title Priority Date Filing Date
AU55651/86A Abandoned AU5565186A (en) 1985-04-05 1986-04-04 Screen printing using a partial vacuum chamber

Country Status (6)

Country Link
EP (1) EP0197595B1 (en)
JP (1) JPS61236197A (en)
AU (1) AU5565186A (en)
DE (1) DE3674823D1 (en)
FR (1) FR2580135B1 (en)
NO (1) NO861301L (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61285794A (en) * 1985-06-12 1986-12-16 株式会社村田製作所 Manufacture of printed wiring board
JPS63182892A (en) * 1987-01-24 1988-07-28 株式会社ケンウッド Method of forming through-hole of thick film hybrid ic
JPS63182893A (en) * 1987-01-24 1988-07-28 株式会社ケンウッド Construction of work stage of thick film hybrid printer
GB8802393D0 (en) * 1988-02-03 1988-03-02 Gen Electric Co Plc Apparatus for selectively coating part of member
EP0327298A3 (en) * 1988-02-03 1990-06-27 THE GENERAL ELECTRIC COMPANY, p.l.c. Apparatus for selectively coating part of a member
JPH02101570U (en) * 1989-01-27 1990-08-13
JPH09162547A (en) * 1995-12-12 1997-06-20 Niyuurongu Seimitsu Kogyo Kk Through hole printing sucking table
DE19724366A1 (en) * 1997-06-10 1998-12-17 Thomson Brandt Gmbh Process for the through-connection of printed circuit boards
FR2871336B1 (en) * 2004-06-02 2007-01-19 Bree Ind Soc Par Actions Simpl FLEX-RIGID PRINTED CIRCUIT BY COLLAGE
CN102794979A (en) * 2011-05-27 2012-11-28 高正科技有限公司 Vacuum coating device
CN113380630A (en) * 2020-03-09 2021-09-10 重庆川仪微电路有限责任公司 Method for metallizing thick film circuit hole and method for printing thick film circuit
CN113643985A (en) * 2021-08-06 2021-11-12 西安微电子技术研究所 Method for realizing interconnection of front and back patterns of thick film substrate

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS556832A (en) * 1978-06-29 1980-01-18 Nippon Mektron Kk Method of manufacturing flexible circuit substrate
DE3245458A1 (en) * 1982-12-08 1984-06-14 Siemens AG, 1000 Berlin und 8000 München Method for producing through-plated contacts in thick-film technology
BE896966A (en) * 1983-06-06 1983-12-06 Bell Telephone Mfg SCREEN PRINTING PROCESS AND DEVICE AND ELIMINATED ELECTRIC PRINTED CHAINS

Also Published As

Publication number Publication date
EP0197595A1 (en) 1986-10-15
JPS61236197A (en) 1986-10-21
NO861301L (en) 1986-10-06
DE3674823D1 (en) 1990-11-15
EP0197595B1 (en) 1990-10-10
FR2580135B1 (en) 1988-08-12
FR2580135A1 (en) 1986-10-10

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