NO861301L - PROCEDURE FOR CONTINUOUS PLATING OF HOLES FOR CONNECTING THE SIDES TO A PRINT MOVIE SUBSTANCE AND FOR SILK PRINTING. - Google Patents
PROCEDURE FOR CONTINUOUS PLATING OF HOLES FOR CONNECTING THE SIDES TO A PRINT MOVIE SUBSTANCE AND FOR SILK PRINTING.Info
- Publication number
- NO861301L NO861301L NO861301A NO861301A NO861301L NO 861301 L NO861301 L NO 861301L NO 861301 A NO861301 A NO 861301A NO 861301 A NO861301 A NO 861301A NO 861301 L NO861301 L NO 861301L
- Authority
- NO
- Norway
- Prior art keywords
- substrate
- holes
- screen printing
- cavities
- paste
- Prior art date
Links
- 238000000034 method Methods 0.000 title claims abstract description 22
- 238000007747 plating Methods 0.000 title claims abstract description 9
- 239000000126 substance Substances 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 35
- 238000007650 screen-printing Methods 0.000 claims abstract description 27
- 238000005259 measurement Methods 0.000 claims abstract description 5
- 238000012544 monitoring process Methods 0.000 claims abstract description 4
- 230000008021 deposition Effects 0.000 claims abstract description 3
- 238000011144 upstream manufacturing Methods 0.000 claims description 3
- 238000012546 transfer Methods 0.000 claims description 2
- 238000012986 modification Methods 0.000 claims 1
- 230000004048 modification Effects 0.000 claims 1
- 238000012806 monitoring device Methods 0.000 claims 1
- 230000015572 biosynthetic process Effects 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000003892 spreading Methods 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/486—Via connections through the substrate with or without pins
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09981—Metallised walls
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/08—Treatments involving gases
- H05K2203/082—Suction, e.g. for holding solder balls or components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4038—Through-connections; Vertical interconnect access [VIA] connections
- H05K3/4053—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques
- H05K3/4069—Through-connections; Vertical interconnect access [VIA] connections by thick-film techniques for via connections in organic insulating substrates
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Screen Printers (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Fremgangsmåte for å utføre et stort antall med grensesnitt-eller veggpletteringsoperasjoner i hull eller hulrom i et substrat (19) ved hjelp av tykkfilmsilketrykk, idet metoden består i å rette en effektsterk luftstrøm med et lavt partialvakuum inn i substratholdekammeret (8) samtidig med silketrykkoperasjonen. Anordningen anvendt for dette formål er en gassturbin med et variabelt hastighetsdrev (10). Målingen av de fysikalske parametrene til luftstrømmen (hastighet og/eller strømning) blir utført ved hjelp av en måleanordning som innbefatter en egnet sensor (14) og en indikator (15) for å overvåke avsetningen av pasta inne i substratet for derved å sikre selektiv plettering av. hullene eller hulrommene.Method for performing a large number of interface or wall plating operations in holes or cavities in a substrate (19) by means of thick film screen printing, the method consisting of directing a powerful air flow with a low partial vacuum into the substrate holding chamber (8) simultaneously with the screen printing operation. The device used for this purpose is a gas turbine with a variable speed drive (10). The measurement of the physical parameters of the air flow (velocity and / or flow) is performed by means of a measuring device which includes a suitable sensor (14) and an indicator (15) for monitoring the deposition of paste inside the substrate to thereby ensure selective plating. of. the holes or cavities.
Description
Oppfinnelsen angår en fremgangsmåte for å utføre et stort antall gjennomgående pletterings- eller veggpletteringsoperasjoner i huller eller hulrom i et substrat som en del av tykkfilmen, silketrykkteknikken, idet substratet fastholdes i posisjon ved dannelse av et partikal vakuum i et lufttett, substratholdekammer til silketrykkanordningen, idet viskositeten til ledende pasta er av egnet form og suge av pastaen inn i de på forhånd borede huller og/eller hulrommene blir bevirket ved hjelp av en anordning som kan innstilles i en effektfull luftstrøm med et lavt partialvakuum. The invention relates to a method for carrying out a large number of through plating or wall plating operations in holes or cavities in a substrate as part of the thick film, screen printing technique, the substrate being held in position by the formation of a partial vacuum in an airtight, substrate holding chamber of the screen printing device, the viscosity of the conductive paste is of a suitable form and suction of the paste into the pre-drilled holes and/or cavities is effected by means of a device which can be set in an effective air flow with a low partial vacuum.
Hele konseptet til de elektriske kretsene på ethvert substrat som anvender tykkfilmteknikken avhenger av kunnskapen om å danne pålitelige elektriske multisjikt og/eller grensesnittforbindelser. The entire concept of the electrical circuits on any substrate using the thick film technique depends on the knowledge of forming reliable electrical multilayer and/or interface connections.
Maskinering av huller ved hjelp av laser har gjort det mulig å øke antall huller pr. enhetsflate i en svært stor målestokk fra 1 til 3 huller pr. cm^ til 4 til 10 huller pr. cm^ eller også mer. Machining holes using a laser has made it possible to increase the number of holes per unit area on a very large scale from 1 to 3 holes per cm^ to 4 to 10 holes per cm^ or even more.
Avsetningen av grensesnittforbindelser innebærer en eller flere suksessive metalliseringer i hullene. Denne prosessen er som regel begrenset til en metallisering pr. side. The deposition of interface compounds involves one or more successive metallizations in the holes. This process is usually limited to one metallization per page.
Den enkleste metalliseringsprosessen består i å redusere viskositeten til silketrykkpåføringspastaen for således å øke dens strøm i hullene samtidig som den spredes over overflaten til kretsen ved bevegelse av gummi - valsen, men denne prosessen blir svært fort avsluttet som følge av overflatebelegningsvanskeligheter. The simplest metallization process consists in reducing the viscosity of the screen printing paste so as to increase its current in the holes while spreading it over the surface of the circuit by the movement of the rubber roller, but this process is very quickly terminated due to surface coating difficulties.
Ved den mest vanlig anvendte prosessen brukes et partialvakuum dannet ved hjelp av en vakuumpumpe i et lufttett kammer under substratet med hullene i løpet av silketrykkoperasjonen. Pastaen går således inn i hullene ved en langsom hastighet som følge av det effektive partial vakuumet som også blir anvendt for å holde substratet i stilling. Inntrengningen av pasta er avhengig av silketrykkparametrene og antall huller og fordelin-gen av hullene. Det er blitt funnet at bruk av dette partialtrykket er utilstrekkelig for å metallisere et stort antall huller pr. enhetsoverflate. En mer pålitelig prosess, slik som den nevnt i innledningen, består av suging av pastaen ved hjelp av en effektfull luftstrøm. Ved denne prosessen, som f.eks. er kjent fra tysk patent nr. 3.245.458, blir silketrykket av kretsen og sugingen inne i hullene utført i to separate operasjoner ved to forskjellige utstyrsanordninger. In the most commonly used process, a partial vacuum created by means of a vacuum pump is used in an airtight chamber under the substrate with the holes during the screen printing operation. The paste thus enters the holes at a slow speed as a result of the effective partial vacuum which is also used to hold the substrate in position. The penetration of paste depends on the screen printing parameters and the number of holes and the distribution of the holes. It has been found that using this partial pressure is insufficient to metallize a large number of holes per unit surface. A more reliable process, such as the one mentioned in the introduction, consists of sucking the paste using an effective air flow. By this process, which e.g. is known from German Patent No. 3,245,458, the screen printing of the circuit and the suction inside the holes are carried out in two separate operations by two different equipment devices.
For å unngå ulempene ved produksjonen ved to adskilte operasjoner, nemlig silketrykket og kretsen og dannelsen av grensesnittforbindelsen ved hjelp • av gjennomgående pletteringshuller, gir prosessen ifølge foreliggende oppfinnelse muligheten for å danne gjennomgående plet-teringer på de aktulle silketrykkmaskinene samtidig som pastaen valses på substratet. In order to avoid the disadvantages of the production by two separate operations, namely the screen printing and the circuit and the formation of the interface connection by means of • through plating holes, the process according to the present invention gives the possibility of forming through platings on the actual screen printing machines at the same time as the paste is rolled on the substrate.
Ovenfornevnte blir tilveiebrakt ved hjelp av en fremgangsmåte av den innledningsvis nevnte art hvis karakteristiske trekk fremgår av krav 1. The above is provided by means of a method of the type mentioned at the outset, the characteristic features of which appear in claim 1.
Ytterliger trekk ved oppfinnelsen fremgår av underkravene.Further features of the invention appear from the subclaims.
Nevnte anordning anvendt for å sirkulere luften med en effektfull strøm og med et lavt partialvakuum er en luftturbin med et variabelt hastighetsdrev, idet de fysikalske parametrene til luftstrømmen (hastighet og/eller mengde) blir tilveiebrakt ved hjelp av en permanent måling og styreutstyr som innbefatter blant annet en egnet sensor med dens indikator i luftsirkulasjonsbanen oppstrøms fra turbinen. Said device used to circulate the air with an effective flow and with a low partial vacuum is an air turbine with a variable speed drive, the physical parameters of the air flow (velocity and/or quantity) being provided by means of a permanent measurement and control equipment which includes among else a suitable sensor with its indicator in the air circulation path upstream from the turbine.
Målingen av de nevnte fysikalske parametrene gjør det mulig å kontrol-lere tilførselen av pasta inn i selve substratet og for å modifisere dens viskositet i samsvar med de andre parametrene til silketrykket, tett-heten og størrelsen på hullene og/eller hulrommene i substratet. The measurement of the aforementioned physical parameters makes it possible to control the supply of paste into the substrate itself and to modify its viscosity in accordance with the other parameters of the silk print, the density and the size of the holes and/or cavities in the substrate.
Den kjente fremgangsmåten består således i suge silketrykkpasta inn i hullene med luft ved en høy hastighet som gjør det mulig å plattere et stort antall huller (15 pr. cm^) med en god pålitelighet. The known method thus consists in sucking screen printing paste into the holes with air at a high speed which makes it possible to plate a large number of holes (15 per cm^) with good reliability.
Den samtidige tilføringen av pasta på substratet med silketrykket ifølge foreliggende oppfinnelse og sugingen av pasta inn i hullene ved hjelp av en gassturbin som gir en betydelig strøm med et lite partialvakuum sikrer overføringen av en stor mengde med energi tilgjengelig for å bevege pastaen inn i hullene og for å sikre optimal dekning av veggene. Mengden av farve overført fra skjermen til kretsen blir således øket ved den kombinerte virkningen av den bevegelige gassens virkning og den normale virkningen til gummivalsen. Følgelig er det mulig å velge skjermer som er finmasket (325 masker i stenden for 200) og følgelig å øke avgrensningen, dvs. oppløsningseffekten for spor- og kontaktputer. The simultaneous feeding of paste onto the substrate with the screen printing according to the present invention and the suction of paste into the holes by means of a gas turbine which provides a significant current with a small partial vacuum ensures the transfer of a large amount of energy available to move the paste into the holes and to ensure optimal coverage of the walls. The amount of color transferred from the screen to the circuit is thus increased by the combined action of the action of the moving gas and the normal action of the rubber roller. Consequently, it is possible to choose screens that are finely meshed (325 meshes instead of 200) and consequently to increase the delineation, i.e. the resolution effect for track and contact pads.
Dannelsen og innbefatningen av en anordning for overvåkning av de fysikalske parametrene til luftstrømmen - et element for lokal måling av hastigheter (anemometer) og/eller strømningen (strømningsmåler) egnet for sugeanordningen og kombinert med en standardindikator (manometrisk søyle- eller trykkmåler - muliggjør en fin justering av disse parametrene ved ethvert øyeblikk ved hjelp av et lekkasjesystem som kan justeres i samsvar med et antall huller og i forhold til silketrykkparametrene (parametrene til maskinen og parametrene til farven). The formation and inclusion of a device for monitoring the physical parameters of the air flow - an element for local measurement of speeds (anemometer) and/or flow (flow meter) suitable for the suction device and combined with a standard indicator (manometric column or pressure gauge - enables a fine adjustment of these parameters at any moment by means of a leakage system which can be adjusted according to a number of holes and in relation to the screen printing parameters (the parameters of the machine and the parameters of the color).
Den nøyaktige overvåkningen til hastighet og/eller strømmen med luft gjør det mulig å trekke opp et nomogram som definerer justeringer som en funksjon av antall huller som skal pletteres gjennomgående og deres diameter. The precise monitoring of the speed and/or flow of air makes it possible to draw up a nomogram that defines adjustments as a function of the number of holes to be plated through and their diameter.
Selve fremgangsmåten er ikke spesielt dyr og er lett å tilpasse enhver tykkfilm-silketrykkanordning, spesielt dersom den allerede er utstyrt med et substratfastholdelseskammer forbundet med et vakuumnett. The process itself is not particularly expensive and is easily adapted to any thick film screen printing device, especially if it is already equipped with a substrate retention chamber connected to a vacuum net.
Oppfinnelsen skal i det følgende beskrives nærmere ved hjelp av et eksempel med henvisning til tegningene, hvor: In the following, the invention will be described in more detail by means of an example with reference to the drawings, where:
Fig. 1 viser et vertikalsnitt gjennom silketrykkanordningen.Fig. 1 shows a vertical section through the screen printing device.
Fig. 2 viser et skjematisk riss av hele anordningen for å utføre Fig. 2 shows a schematic diagram of the entire device for carrying out
fremgangsmåten ifølge foreliggende oppfinnelse. the method according to the present invention.
Silketrykkanordningen vist på fig. 1 innbefatter skjermen 1 som bærer bildet til kretsen som skal bli silketrykt og anbrakt over kammeret 3 som holder substratet. Skjermen 1 bærer silketrykkpastaen 4 som skal bli spredd over substratet ved hjelp av en påstryker 5. Den øvre siden av substratholdekammeret 3 er formet ved hjelp av det perforerte substratet 2 som hviler på bakplaten 6 som er tilpasset den. Bakplaten 6 er forbundet ved dens kanter med et utløp 7, som kommuniserer med en vakuumpumpe, ikke vist. Ifølge foreliggende oppfinnelse har vakuum-kammeret 3 et utløp 8 forbundet med en gassturbin, ikke vist, for suging av luft ved en høy hastighet. I løpet av silketrykkoperasjonen blir skjermen, i form av f.eks. en nett 1 senket vertikalt inntil den kommer i kontakt med substratet 2, mens påstrykningsorganet 5 blir beveget horisontalt for således å spre pastaen over substratet 2 og for å bevirke at det trenger inn i hullene som tidligere er laget i substratet. The screen printing device shown in fig. 1 includes the screen 1 which carries the image to the circuit to be screen printed and placed above the chamber 3 which holds the substrate. The screen 1 carries the screen printing paste 4 which is to be spread over the substrate by means of an applicator 5. The upper side of the substrate holding chamber 3 is formed by means of the perforated substrate 2 which rests on the back plate 6 which is adapted to it. The back plate 6 is connected at its edges to an outlet 7, which communicates with a vacuum pump, not shown. According to the present invention, the vacuum chamber 3 has an outlet 8 connected to a gas turbine, not shown, for sucking air at a high speed. During the screen printing operation, the screen, in the form of e.g. a net 1 lowered vertically until it comes into contact with the substrate 2, while the spreading member 5 is moved horizontally so as to spread the paste over the substrate 2 and to cause it to penetrate into the holes previously made in the substrate.
Det totale skjematiske diagrammet av installeringen for å utføre fremgangsmåten ifølge foreliggende oppfinnelse innbefatter (fig. 2): en gassturbin 10 med variabel hastighet, som forskyver luften i røret med en diameter på 30 mm med en strømning på 4*10~<2>m^-s-<!>og ved et trykk på 2'IO<4>Pa; The overall schematic diagram of the installation for carrying out the method according to the present invention includes (Fig. 2): a variable speed gas turbine 10, which displaces the air in the pipe with a diameter of 30 mm with a flow of 4*10~<2>m^-s-<!>and at a pressure of 2'IO<4>Pa;
et permanent konstant-lekkasjesystem 11 for å beskytte motor til turbinen i løpet av perioden i hvilken strømmen er svak oppstrøms (dette systemet er valgfritt dersom turbinmotoren er utstyrt med en kjølekrets); a permanent constant leakage system 11 to protect the engine of the turbine during the period in which the flow is weak upstream (this system is optional if the turbine engine is equipped with a cooling circuit);
en treveis ventil 12 som tillater på/av-styring av luftsugingen via substratet. Driften av denne ventilen kan være manuell når den har blitt installert nær silketrykkanordningen. Den bilr så anvendt for å slå av sugingen ved nivået til substratholdekammeret. Dens drift kan også være elektrisk dersom systemet skal være anbrakt i et teknisk rom. I dette tilfellet blir den styrt fra silketrykkanordningen; a three-way valve 12 which allows on/off control of the air suction via the substrate. The operation of this valve can be manual when it has been installed close to the screen printing device. It is then used to switch off the suction at the level of the substrate holding chamber. Its operation can also be electrical if the system is to be located in a technical room. In this case it is controlled from the screen printing device;
et justerbart lekkasjesystem 13 som tillater tilpasning av hastigheten (eller strømmen) til luften som en funksjon av antall huller i substratet; an adjustable leakage system 13 which allows adaptation of the speed (or flow) of the air as a function of the number of holes in the substrate;
et element 14 for å måle trykkene eller hastighetene; an element 14 for measuring the pressures or velocities;
en trykk- eller hastighetsindikator 15: en manomatrisk søyle, en a pressure or speed indicator 15: a manometric column, a
trykkmåler eller en indikator egnet for måleelementet 14; pressure gauge or an indicator suitable for the measuring element 14;
en manuelt justerbar treveisventil 16 som danner en nulladapter for a manually adjustable three-way valve 16 which forms a zero adapter for
trykkmåleelementet; the pressure measuring element;
lufttett substratholdekammer 17 til hvilket sugerørledningen 18 er forbundet. Den er dekket på dens toppside av substratet 19 for å bli gjennomgående plettert, idet substratet har på forhånd borede huller og er anbrakt i et hus i kammeret 17 for understøttelse; airtight substrate holding chamber 17 to which the suction pipe line 18 is connected. It is covered on its top side by the substrate 19 to be plated throughout, the substrate having pre-drilled holes and housed in a housing in the chamber 17 for support;
gruppen 20 som består av nettet 1 og påstrykeren 5 til silketrykk-maskinen. the group 20 which consists of the net 1 and the ironer 5 of the screen printing machine.
De heltrukne pilene angir retningen til luftstrømmen.The solid arrows indicate the direction of the air flow.
De stiplede pillinjene angir retningen for påstrykerens bevegelse.The dashed arrow lines indicate the direction of the applicator's movement.
Støyen frembrakt ved bevegelsen av fluidumet gjør det nødvendig å installere deler av utstyret som innbefatter dette systemet i et spesielt kammer. Avhengig av om ventilen 13 er manuelt drevet eller arbeider elektrisk, er elementene til systemet installert i dette spesielle kammeret til venstre av den på fig. 2 viste stiplede linje 21 eller til venstre for den stiplede linje 22. The noise produced by the movement of the fluid makes it necessary to install parts of the equipment that include this system in a special chamber. Depending on whether the valve 13 is manually operated or electrically operated, the elements of the system are installed in this particular chamber to the left of the one in fig. 2 showed dashed line 21 or to the left of dashed line 22.
På grunn av øket risiko for forurensning av pastaen av omgivende støv er det vesentlig å arbeide i et rent rom (etter US-klassifikasjon bedre enn 10.000 U.S.). Due to the increased risk of contamination of the paste by ambient dust, it is essential to work in a clean room (according to US classification better than 10,000 U.S.).
Claims (3)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8505262A FR2580135B1 (en) | 1985-04-05 | 1985-04-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| NO861301L true NO861301L (en) | 1986-10-06 |
Family
ID=9318023
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| NO861301A NO861301L (en) | 1985-04-05 | 1986-04-02 | PROCEDURE FOR CONTINUOUS PLATING OF HOLES FOR CONNECTING THE SIDES TO A PRINT MOVIE SUBSTANCE AND FOR SILK PRINTING. |
Country Status (6)
| Country | Link |
|---|---|
| EP (1) | EP0197595B1 (en) |
| JP (1) | JPS61236197A (en) |
| AU (1) | AU5565186A (en) |
| DE (1) | DE3674823D1 (en) |
| FR (1) | FR2580135B1 (en) |
| NO (1) | NO861301L (en) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61285794A (en) * | 1985-06-12 | 1986-12-16 | 株式会社村田製作所 | Manufacture of printed wiring board |
| JPS63182893A (en) * | 1987-01-24 | 1988-07-28 | 株式会社ケンウッド | Construction of work stage of thick film hybrid printer |
| JPS63182892A (en) * | 1987-01-24 | 1988-07-28 | 株式会社ケンウッド | Method of forming through-hole of thick film hybrid ic |
| GB8802393D0 (en) * | 1988-02-03 | 1988-03-02 | Gen Electric Co Plc | Apparatus for selectively coating part of member |
| EP0327298A3 (en) * | 1988-02-03 | 1990-06-27 | THE GENERAL ELECTRIC COMPANY, p.l.c. | Apparatus for selectively coating part of a member |
| JPH02101570U (en) * | 1989-01-27 | 1990-08-13 | ||
| JPH09162547A (en) * | 1995-12-12 | 1997-06-20 | Niyuurongu Seimitsu Kogyo Kk | Through hole printing sucking table |
| DE19724366A1 (en) * | 1997-06-10 | 1998-12-17 | Thomson Brandt Gmbh | Process for the through-connection of printed circuit boards |
| FR2871336B1 (en) * | 2004-06-02 | 2007-01-19 | Bree Ind Soc Par Actions Simpl | FLEX-RIGID PRINTED CIRCUIT BY COLLAGE |
| CN102794979A (en) * | 2011-05-27 | 2012-11-28 | 高正科技有限公司 | Vacuum coating device |
| CN113380630A (en) * | 2020-03-09 | 2021-09-10 | 重庆川仪微电路有限责任公司 | Method for metallizing thick film circuit hole and method for printing thick film circuit |
| CN113643985A (en) * | 2021-08-06 | 2021-11-12 | 西安微电子技术研究所 | Method for realizing interconnection of front and back patterns of thick film substrate |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS556832A (en) * | 1978-06-29 | 1980-01-18 | Nippon Mektron Kk | Method of manufacturing flexible circuit substrate |
| DE3245458A1 (en) * | 1982-12-08 | 1984-06-14 | Siemens AG, 1000 Berlin und 8000 München | Method for producing through-plated contacts in thick-film technology |
| BE896966A (en) * | 1983-06-06 | 1983-12-06 | Bell Telephone Mfg | SCREEN PRINTING PROCESS AND DEVICE AND ELIMINATED ELECTRIC PRINTED CHAINS |
-
1985
- 1985-04-05 FR FR8505262A patent/FR2580135B1/fr not_active Expired
-
1986
- 1986-04-01 DE DE8686200532T patent/DE3674823D1/en not_active Expired - Lifetime
- 1986-04-01 EP EP19860200532 patent/EP0197595B1/en not_active Expired - Lifetime
- 1986-04-02 NO NO861301A patent/NO861301L/en unknown
- 1986-04-04 AU AU55651/86A patent/AU5565186A/en not_active Abandoned
- 1986-04-05 JP JP7757486A patent/JPS61236197A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| AU5565186A (en) | 1986-10-16 |
| DE3674823D1 (en) | 1990-11-15 |
| EP0197595B1 (en) | 1990-10-10 |
| EP0197595A1 (en) | 1986-10-15 |
| FR2580135B1 (en) | 1988-08-12 |
| FR2580135A1 (en) | 1986-10-10 |
| JPS61236197A (en) | 1986-10-21 |
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