JPS594096A - 異種回路基板相互の接続方法 - Google Patents

異種回路基板相互の接続方法

Info

Publication number
JPS594096A
JPS594096A JP57113009A JP11300982A JPS594096A JP S594096 A JPS594096 A JP S594096A JP 57113009 A JP57113009 A JP 57113009A JP 11300982 A JP11300982 A JP 11300982A JP S594096 A JPS594096 A JP S594096A
Authority
JP
Japan
Prior art keywords
circuit board
pattern
patterns
circuit boards
flexible circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP57113009A
Other languages
English (en)
Inventor
博文 松本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Mektron KK
Original Assignee
Nippon Mektron KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Mektron KK filed Critical Nippon Mektron KK
Priority to JP57113009A priority Critical patent/JPS594096A/ja
Priority to US06/508,281 priority patent/US4550357A/en
Priority to CA000431299A priority patent/CA1193370A/en
Priority to DE19833323469 priority patent/DE3323469A1/de
Priority to GB08317809A priority patent/GB2123224B/en
Publication of JPS594096A publication Critical patent/JPS594096A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/02—Soldered or welded connections
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/70—Insulation of connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H05K2201/0388—Other aspects of conductors
    • H05K2201/0397—Tab
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/05—Flexible printed circuits [FPCs]
    • H05K2201/055—Folded back on itself
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09145—Edge details
    • H05K2201/09172—Notches between edge pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10992—Using different connection materials, e.g. different solders, for the same connection
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • H05K3/363—Assembling flexible printed circuits with other printed circuits by soldering
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4092—Integral conductive tabs, i.e. conductive parts partly detached from the substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 本発明はフレキシブル回路基板と硬質回路基板との如き
異種回路基板相互の接続方法に関し、特には、上記両者
の各ベース部材上に設けたパターン同志の接続方法に関
する。
この種の接続方法としては、従来、種々の方法が提案さ
れ実行されているが、いずれもハンダ付けの如き熟練作
業を要し、また接続すべきパターン同志の重ね合わせの
信頼性を高めるため、特殊な構造′ｆ！：要し、従って
、コストが高くなり、しかも、フレキシブル回路基板及
び硬質回路基板のうち一方が故障した場合に、両者を分
隔して故障の生じたものだ行を交換するという作業には
非常に手ｍＪがかかる等の問題があった。
本発明は、仁のような点を加味して７レキシプル回路基
板のベース部材上に設けた回路パターンと硬質回路基板
のベース部材上に設けた回路パターンとを導電性を備え
た粘着剤によって接続することにより、安価で両パター
ンの接続９分離を容易に行なえるような異種回路基板相
互の接続方法を提供するものである。
第１図及び第２図は、本発明の第１の実施例を示したも
ので、フレキシブル回路基板ｌのベース部材コ上に設け
た所要数の回路パターン３の下面に導電性を備えたｙＡ
！３着剤ダを貼着しておく。一方、硬質回路基板乙のベ
ース部材７上には、上記フレキシブル回路基板／の各パ
ターン３に対応する所要数の回路パターンｔが設けられ
ている。フレキシブル回路基板／側のパターン３と硬質
回路基板に側のパターンざとを接続するには、目視等で
両パターン３及びｒの接続位置を確認した上、フレキシ
ブル回路基板／側のパターン３を硬質回路基板ｇ側のパ
ターンにに押付けるようにして重ね合わせ、これにより
前記の粘着剤ｌは硬質回路基板を側のパターンざに付着
し、従って、パターン３とパターンｒとの接続が行なわ
れるので、両パターン３及びｇ間の導通状態か得られる
。
第３図及び第μ図は、本発明の第２の実施例を示し、Ｆ
ＰＧ／（７のベース部材／ｌの端部全くし歯状に形成し
て、各くし歯状部分／／Ａの先端部までそれぞれパター
ン／、２を形成し、導電性の粘着剤／３は、パターン１
２の表面及びくし歯状部分／／Ａの下面に付着させてお
く。このように、ベース部材ｌ／をくし歯状に形成して
その端部までパターン１２を形成するのは、隣接する粘
着剤／３相互が接続して瞬接するパターン／２．ｌ−間
の短絡を生じないようにするためである。そして、くし
歯状部分／／Ａを第７図に示すように折り曲げることに
より、粘着剤１３の付着したパターン／、２の一部は図
中下方に曲げられ、くし歯状部分／／Ａの下面に付着さ
せた粘着剤１３は、図示の如く車なり合って一体化する
。
一方、フレキシブル回路基板１０と接続すべき硬質回路
基板／グのベース部側１５上には、上記パターン／２と
対応するパターン／Ｊを設けである。フレキシブル回路
基板ｌｏ側のパターン１２と硬質回路基＆／ｌＩ個のバ
タ“−ン／６とを接続するには、ｎｆＪ記第１の実施例
の場合と同様に、例えば目視等で両者間の位置合わせを
した後、対応する両パターン１２及び／６相互を押し付
けて重ね合わせるようにするものである。
以上のいずれの実施例においても、フレキシブル回路基
板１０側の各パターン３及び／、２と硬質回路基板側及
び／＋側の各パターンを及び／６は、導電性の粘着剤グ
及び１３により、容易に接合できると共に、一方の基板
の故障等必要に応じ容易に両パターン３及びｌコ並びＦ
ｃ１ｒ及び／を相互の分離が可能となるので好都合であ
る。そして、その場合に、粘着剤により接合したパター
ンの各上面に両パターンにわたって非導電性の粘着テー
プを貼着すれば、両パターン間の結合状Ｈが補強され、
振動等に対する上記接続部分の耐性が向上する。
また、上記両基板上の各回路が殆んど故障しないとみら
れる場合には、第５図に示すように、フレキシブル回路
基板ｌざのペース部材ｌｑ上に形成したパターン２０と
、硬質回路基板２／のベース部材２．２上に同じく形成
したパターン２３とを、前記同様、導電性の粘着剤２≠
によって接続した後、両パターン２０及び２３間にハン
ダ２左を設けることに、Ｊ：り、両ハターン２０及び−
３は完全に一体化接続する。
本発明によれば、導電性の粘着剤によって、フレキシブ
ル回路基板側のパターンと硬質回路基板側のパターンと
を簡便且つ安価に接続可能で、しかも接続後の両パター
ンを簡単に分離させることができるので、点検または部
品交換などの作業性向上に寄与するところ大きい。
【図面の簡単な説明】
第１図は、本発明に係るフレキシブル回路基板と硬質回
路基板との如き異種回路基板相互の接続方法の一実施例
による接続状態を示す斜視図、第２図は第１図中一部分
の概念的な拡大断面図、第３図は他の実施例に係る上記
接続方法を使用するためのフレキシブル回路基板の平面
図、第１１史に他の実施例によるフレキシブル回路基板
と硬質回路基板との接続状態全概念的妃示す拡大断面図
１、そして第５図は、フレキシブル回路基板七硬質回路
基板との接続部分を補強した状態を示す概念的断叩商で
ある。 ｉ、ｉｏ、ｉｔ　、、、、、　　フレキシブル回路基板
２．７．／ハ／左、／９，２２　　、。０１．ベース部
材３，１．／、２．／／、、２０，２３　、、、、、パ
ターング、／３，２Ｉ１．．．．．粘着剤 ｔ、／Ｉ１．，２／　　　　　　　　　、、、、、　　
硬質回路基板出願人　　日本メクトロン株式会社

Claims (1)

    【特許請求の範囲】
  1. フレキシブル回路基板の回路パターンと、硬質回路基板
    の回路パターンとを導電性粘着剤で接続することを特徴
    とする異種回路基板相互の接続方法。
JP57113009A 1982-06-30 1982-06-30 異種回路基板相互の接続方法 Pending JPS594096A (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP57113009A JPS594096A (ja) 1982-06-30 1982-06-30 異種回路基板相互の接続方法
US06/508,281 US4550357A (en) 1982-06-30 1983-06-27 Interconnected printed circuit boards and method of connecting circuit boards
CA000431299A CA1193370A (en) 1982-06-30 1983-06-28 Interconnected printed circuit boards and method of connecting circuit boards
DE19833323469 DE3323469A1 (de) 1982-06-30 1983-06-29 Verfahren zur verbindung zweier schaltungsplatten unterschiedlicher art
GB08317809A GB2123224B (en) 1982-06-30 1983-06-30 Connecting circuit boards using conductive adhesive

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57113009A JPS594096A (ja) 1982-06-30 1982-06-30 異種回路基板相互の接続方法

Publications (1)

Publication Number Publication Date
JPS594096A true JPS594096A (ja) 1984-01-10

Family

ID=14601147

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57113009A Pending JPS594096A (ja) 1982-06-30 1982-06-30 異種回路基板相互の接続方法

Country Status (5)

Country Link
US (1) US4550357A (ja)
JP (1) JPS594096A (ja)
CA (1) CA1193370A (ja)
DE (1) DE3323469A1 (ja)
GB (1) GB2123224B (ja)

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JP3042132B2 (ja) * 1992-02-10 2000-05-15 松下電器産業株式会社 回路基板への電気部品実装方法
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JP2721093B2 (ja) * 1992-07-21 1998-03-04 三菱電機株式会社 半導体装置
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US7529100B2 (en) * 2003-12-16 2009-05-05 Tpo Displays Corp. Flexible printed circuit board (FPC) for liquid crystal display (LCD) module
CN101374383B (zh) * 2007-08-24 2010-06-09 富葵精密组件(深圳)有限公司 绝缘基膜、电路板基板及电路板
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CN107359426B (zh) * 2017-06-29 2021-12-07 业成科技（成都）有限公司 电连接结构及软性电路板

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Also Published As

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GB8317809D0 (en) 1983-08-03
CA1193370A (en) 1985-09-10
GB2123224A (en) 1984-01-25
US4550357A (en) 1985-10-29
DE3323469A1 (de) 1984-01-05
GB2123224B (en) 1985-11-27

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