GB2068645A - Electrical interconnection - Google Patents
Electrical interconnection Download PDFInfo
- Publication number
- GB2068645A GB2068645A GB8100935A GB8100935A GB2068645A GB 2068645 A GB2068645 A GB 2068645A GB 8100935 A GB8100935 A GB 8100935A GB 8100935 A GB8100935 A GB 8100935A GB 2068645 A GB2068645 A GB 2068645A
- Authority
- GB
- United Kingdom
- Prior art keywords
- electrically conductive
- adhesive
- conductive
- particles
- conductive means
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 239000000853 adhesive Substances 0.000 claims abstract description 79
- 230000001070 adhesive effect Effects 0.000 claims abstract description 79
- 239000004020 conductor Substances 0.000 claims abstract description 45
- 239000002245 particle Substances 0.000 claims abstract description 40
- 238000000034 method Methods 0.000 claims description 15
- 239000011248 coating agent Substances 0.000 claims description 3
- 238000000576 coating method Methods 0.000 claims description 3
- 229920000136 polysorbate Polymers 0.000 claims 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 7
- 230000005855 radiation Effects 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 229910052709 silver Inorganic materials 0.000 description 6
- 239000004332 silver Substances 0.000 description 6
- 239000012815 thermoplastic material Substances 0.000 description 6
- 238000003848 UV Light-Curing Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 238000012216 screening Methods 0.000 description 4
- 229920002799 BoPET Polymers 0.000 description 3
- 239000005041 Mylar™ Substances 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- QXJJQWWVWRCVQT-UHFFFAOYSA-K calcium;sodium;phosphate Chemical compound [Na+].[Ca+2].[O-]P([O-])([O-])=O QXJJQWWVWRCVQT-UHFFFAOYSA-K 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 229920002457 flexible plastic Polymers 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 229910052729 chemical element Inorganic materials 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000008570 general process Effects 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 229920000058 polyacrylate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
- H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0263—Details about a collection of particles
- H05K2201/0266—Size distribution
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Conductive Materials (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
Conductors 14, 22 of a printed circuit arrangement are interconnected by application of a conductive adhesive 16 which in use is anisotropically conductive. The adhesive contains a relatively small number of relatively large (e.g. 0.0127 mm to 0.127 mm) conductive particles 24. Thus there is a conductive connection between conductors 22 and 14 which are in different planes, but none between spaced, coplanar conductors. <IMAGE>
Description
SPECIFICATION
Electrical interconnection and method of effecting
an electrical interconnection
This invention relates to electrical interconnection
and the method of effecting an electrical intercon
nection. More particularly, this invention relates to
electrical interconnection of one or more electrically
conductive elements through the application of an -electrically conductive adhesive. The adhesive is
rendered electrically conductive by the incorporation
of a relatively small number of relatively large size
conductive particles.
Printed circuit elements, both flexible and nonflexible, have, of course, been known for many
years. The term "printed circuit" is used herein to
include all devices having the general characteristic
of conductive patterns formed on an insulating
substrate, whether by subtractive processes of
etching or by additive processes of screening or
other techniques known in the art. The use of such
printed circuitry and the applications for these
devices have expanded significantly over the years,
particularly with regard to flexible printed circuitry in
which conductive elements are formed on a flexible
insulating base such as plastic.While the present
invention will be discussed in terms of flexible
printed circuitry, it will be understood that the
invention is equally applicable to other kinds of
circuit elements and is generally suitable for any
application where it is desired to interconnect two
electrically conductive elements, especially where
one or both of the conductive elements are flat.
Flexible printed circuit devices are used in many
applications for purposes of interconnection. The
commercial use of flexible printed circuit elements for interconnection purposes in low cost applications may be subject to an inherent limitation that is
not related to the cost of manufacture of the printed
circuit element per se. That limitation is a low cost,
reliable, and easy to use termination method. In
other words, as the manufacturing methods for the
printed circuit elements themselves improve and
come down in cost, a limiting factor to their use in
low cost systems may well be the cost of effecting
the necessary interconnections.
Conductive adhesives have been used in the past
for some applications for interconnecting printed
circuit components. One general type of such prior
art conductive adhesive has been silver filled ther
moset resins. These silver filled resins have a
number of disadvantages; they usually have rela
tively short pot and shelf lives; they are difficult to
dispense; they exhibit relatively low bond until cure
is complete; a relatively long period of time is
necessary to complete cure; and they are relatively
expensive due to the large amounts of silver powder
necessary to provide conductivity. Another general
type of adhesive system that has been suggested in
the past has been conductive thermoplastic adhe
sives or conductive pressure sensitive adhesives
which incorporate a relatively high weight percen
tage of small conductive particles such as silver or
carbon.
In all of these prior art adhesive systems, the adhesive has a relatively high weight percentage of a large number of very small conductive particles which, in effect, "fill" the adhesive. The high weight percentage of particulates are generally self defeating with regard to the other properties which are desired to be achieved in an effective adhesive. The particulates have an adverse effect on the adhesive and cohesive properties of the adhesive system.
Furthermore, and most significantly, since these prior art adhesives are isotropically conductive (i.e., they are conductive in all directions). They must be carefully applied, as by silk screening or otherwise, to avoid short circuiting between adjacent conductor lines when they are applied to printed circuits having parallel or other adjacent conductors.
The purpose of the present invention is to overcome or alleviate the above discussed and other problems of the prior art.
According to the invention, there is provided an interconnected electrical assembly including a first electrically conductive element and an anisotropically electrically conductive adhesive interconnecting said first and second elements.
There is also provided an interconnected assembly including first electrically conductive means having at least two spaced apart and generally coplanar electrically conductive elements, second electrically conductive means being in opposed facing relationship with said first electrically conductive means and abutting relationship for establishment of electrical connection between first and second electrically conductive means, and an anisotropically electrically conductive adhesive between said first and second electrically conductive means and between said spaced apart electrically conductive coplanar elements of said first electrically conductive means, said adhesive being effective to electrical contact between said first and second electrically conductive means without establishing electrical contacts between said spaced apart electrically conductive elements of said first electrically conductive means.
The inventions further provides a method of selectively establishing electrical contact between a first electrically conductive means having at least two spaced apart and generally coplanar electrically conductive elements and second electrically conductive means, including the steps of forming an anisotropically electrically conductive adhesive, applying said anisotropically conductive adhesive to at least one of said first and second electrically conductive means, and bonding said first and second electrically conductive means together to establish electrical contact between said first and second electrically conductive means without establishing electrical contact between said spaced apart electrically conductive elements of said first electrically conductive means.
Other features and advantages of the present invention will be apparent to and understood by those skilled in the art from the following detailed description and drawings, wherein like elements are numbered alike in the several Figures:
Figure 1 is an enlarged representation of a seg ment of a flexible printed circuit element with conductive adhesive applied thereto,
Figure 2 is an enlarged representation showing the printed circuit element of Figure 1 with an opposed flexible printed circuit element bonded thereto,
Figure 3 is an enlarged detail of the portion labeled 3-3 in Figure 2, and
Figure 4 is a flow diagram showing process steps.
Referring generally to Figures 1,2 and 3, an adhesive system in accordance with the present invention is shown. Figure 1 shows an enlarged cross sectional view of a part of a conventional flexible printed circuit element. The printed circuit element has a plastic substrate 10 of polyester (e.g.
Mylar) or other similar flexible plastic material. Lines of conductors 12 and 14 are located on one surface of substrate 10. It will be understood that the printed circuit element may be of any desired length (in the direction perpendicular to the plane of the paper) and the circuit patterns 12 and 14 may be of any desired configuration. For purposes of illustration, it will be assumed that the circuit patterns 12 and 14 are two straight parallel lines in an array of straight parallel lines. The conductive patterns 12 and 14 may be of any suitable material known in the art. For example, conductive lines 12 and 14may be copper lines etched from a copper laminate, or they may be silver or other conductive inks deposited by screening techniques.Typically, the width W of each conductive line will be about 1,27mm and the space
S between conductors will also be about 1,27 mm.
The thickness t of the conductor will typically be on the order of from 0,0127 mm to 0,076 mm.
As also shown in Figure 1, the flexible printed circuit element is coated with a layer of conductive adhesive 16 in preparation for bonding another circuit element to the flexible circuit element of
Figure 1. The conductive adhesive 16 is applied in a
layer thick enough to cover the entire upper surface of conductors 12 and 14 and also fill the space
between those conductors. The adhesive is shown as having a generally flat upper surface essentialiy parallel to the flat upper surface of plastic substrate
10, but it will be understood that the upper surface of the adhesive might be slightly contoured to reflect the presence of the conductors 12 and 14 under the
upper surface of the adhesive.
Referring to Figure 2, a second conductive element
consisting of a flexible plastic substrate 18 (e.g.,
Mylar) and conductive lines or paths 20 and 22 is shown bonded to the flexible conductor of Figure 1.
The flexible circuits are arranged so that the conductive elements are in facing or opposed relationship to effect electrical communication between the respective conductors aligned as shown in Figure 2.
The adhesive 16 fills all gaps between the substrates
10 and 18 as well as between the conductors 12 and 20 and 14 and 22 to bond the elements together.
Referring to Figure 3, a partial enlarged view is shown of the area enclosed within the circle labeled 3 in Figure 2. It will, however, be understood that the
showing of Figure 3 is intended to be an approximation to illustrate the adhesive system, and it is not
intended to be a precise detailed showing. When the two flexible printed circuits are placed in opposing relationship to be bonded together, they will, typically, be subjected to heat and/or pressure during the bonding process. Notwithstanding the application of heat and/or pressure, a very slight gap will exist between the opposed conductors 14 and 22, even after bonding has been completed. This slight gap will be on the order of 0,025 mm or less.When the parts are placed together and any pressure is applied, some of the adhesive between the opposed conductors 14 and 22 may be squeezed out and displaced into other areas, but a thin layer of adhesive will remain between the conductors 14 and 22, as shown in Figure 3. The adhesive 16 is populated with a relatively small number of relatively large conductive elements or particles 24. The conductive particles 24 are large enough so that at any location only a very few, even as few as one or two of the particles in full or partial alignment, are sufficient to bridge the gap to provide direct point to point contact between conductors 22 and 14 at a number of locations to establish effective electrical contact and electrical communication between conductors 14 and 22.Thus, as illustrated in Figure 3, at some locations, point contact is established directly by one particle 24 which bridges the gap to contact both conductors 14 and 22; while at another location contact is through two particles which are slightly offset but in contact with each other and with one being in contact with conductor 14 and the other with 22. On the other hand, the population density of the conductive particles 24 is low enough so that there is no continuity of contact, and hence no electrical conduction, between either of conductors 14 or 22 and either of conductors 12 or 20.This state of nonconduction is illustrated in Figure 3 by the fact that there is no continuous connected path between the conductive particles 24 in the plane of the conductors 14 and 22, while there is direct point to point contact from conductor 14 to conductor 24 through the conductive elements 24 in the direction perpendicular to the planes of the conductors. Thus, the adhesive system is anisotropically conductive conduction occurs between aligned conductive elements in the direction perpendicular to the planes of the conductive elements, but it does not occur between adjacent conductive elements.
Conductive adhesive 16 should be a thermoplastic material with a melt temperature between 177"C and 205"C. It should flow readily in the melt condition and bond aggresivelyto high and low energy
polymer surfaces, metal surfaces and glass. Also, the viscosity of the thermoplastic material should be such that the conductive particles 24 therein will
remain suspended in the uncured state. A suitable thermoplastic material for this purpose would be
GELVA MULTIPOLYMER number 263, available from
Monsanto Company, which is a pressure sensitive acrylic polymer.
The conductive particles 24 are preferably silver coated glass spheres which might range in diameter from about 0,0127 mm to 0,127 mm. Such silver
coated glass spheres are commercially available from Potters Industries Inc. These conductive parti
cles are held in suspension in the thermoplastic material and will be protected against corrosion during storage by being immersed in the thermo
plastic material; and they will also be protected
against corrosion in the completed adhesive system
since they will still be entirely encased in the thermoplastic material except for those points which are in intimate contact with the respected planar surfaces.
In the course of describing this invention, state
ments have been made to the effect that size of the conductive particles 24 is largerthan the conductive
particles typically present in prior art conductive
adhesives and that the population or weight density of the particles is substantially less. When those
relative terms are used, it should be understood that the size of the conductive particles are intended to be in the range of from 0,0127 mm to 0,127 mm, which
is considerably larger (on the order of 1,000 to 10,000 times) than particles typically used in the prior art which are more in the nature of a powder; and the weight ratio (and hence population density) of the
particles is on the order of 1% to 10% by weight of the adhesive (which is also about 1/70 to 1/6 of the typical weight ratio in the prior art).The important and critical parameter to note is that the size of
conductive particles 24 is such that one or two of them is sufficient to bridge the gap between
opposed planar conductors, such as conductors 14
and 22, in a completed adhesive bonded system to
effect redundant point to point electrical contact in the system, while the population density is suffi
ciently low to prevent the occurrence of a short circuit
path between adjacent conductors on the same
planar surface.
The adhesive system of the present invention
possesses an extremely important processing
advantage in that the conductive adhesive can be
applied as a general coating over an entire group of spaced conductors on a single planar surface without shorting out the adjacent conductors. In the past, it has been required that conductive adhesive be applied in a precise screening step so that the adhesive was aligned only with the conductive elements and did not extend to fill the gaps between the conductors. This precision was necessary because the conductive adhesives of the prior art were generally isotropically conductive, and hence bridg
ing the gap between adjacent conductors in a plane would result in short circuiting.However, since the
size and distribution of the conductive particles
within the polymer mix are controlled in the system
of the present invention, conductivity during the
bonding stage will be established and occur only in the direction perpendicular to the opposed conduc
tors, and not in the plane of the adjacent conductors.
Thus, inexpensive rolier coating operations or
equivalent inexpensive operations can be employed
to coat the adhesive onto the surface of a flexible
printed circuit element, and the printed circuit ele
ment to be bonded thereto can then simply be
aligned and bonded.
Figure 4 shows the general process which would
be employed in practicing the present invention. The
adhesive would be formed by blending the conductive particles into the polymeric base material as shown in step A. The adhesive would then be applied to exposed conductors on one surface of a printed circuit element in step B. The adhesive would then be allowed to dry to remove any solvents in step C. The printed circuit or other component to be bonded would then be aligned with the component on which the adhesive is placed in Step D. The components would then be bonded by application of heat and/or pressure to cure the adhesive and effect a permanent bond.
The adhesive system of the present invention is also capable of achieving the very particular advantage that ultraviolet radiation can be used to cure the polymer base material of the adhesive. In the prior art, UV curing was not possible because of the high population density of very small metal particles present in prior art conductive adhesives. These small metal particles acted as reflectors which, because of the high density of particle population, prevented UV radiation from penetrating the polymer material.
Because of this reflection, only the top skin of the adhesive was actually exposed to and cured by the
UV radiation, thus making conductive adhesives unsuitable for UV curing. By way of contrast, UV curing is easily achievable with the adhesive system of the present invention because of the low population density of the conductive particles. The UV radiation can travel through the polymer material in the many open paths between the conductor particles to effectively cure the entire thickness of the adhesive. The capability for UV curing is particularly significant with regard to the bonding of conductive leads from liquid crystals. The conductive leads from liquid crystals are typically very thin vacuumed deposited lines of indium-tin oxide which are transparent to UV radiation. Therefore, by way of example, if the conductors 20 and 22 of Figure 2 were indium-tin oxide or other UV transparent leads from a liquid crystal, the adhesive system could be cured and bonding could be effected by directing UV radiation through Mylar substrate 18 and the conductors 20 and 22 to cure the entire adhesive layer.
As will be readiiy appreciated by those skilled in the art, the ability to cure an adhesive system with UV radiation makes the adhesive system one which is particularly easy and inexpensive to handle. An example of a UV curable adhesive which could be used in this system is LO-80, obtainable from
LOCTITE CORPORATION, which is an acrylic resin polymer.
Claims (17)
1. An interconnected electrical assembly incluu- ing a first electrically conductive element, at least a second electrically conductive element and an anisotropically electrically conductive adhesive interconnecting said first and second elements.
2. An assembly as claimed in claim 1, wherein said anisotropically electrically conductive adhesive has a low population of relatively large conductive particles to establish electrical contact between said first and second elements in a desired direction.
3. An interconnected electrical assembly as claimed in claim 2, wherein said conductive particles range in size from about 0,0127 mm to about 0,127 mm.
4. An interconnected electrical assembly as claimed in claims 2 or 3, wherein said conductive particles constitute not more than 10% by weight of the conductive adhesive.
5. An assembly as claimed in any one of the claims 1 to 4, wherein said first and second conductive elements are in opposed facing and abutting relatipnship with not more than a naturally existing space therebetween, and said anisotropically electrically conductive adhesive has a low population of relatively large conductive particles to establish electrical contact between said elements across said space, said particles being of such size that one or two particles bridge said space between said first and second elements.
6. An interconnected electrical assembly including first electrically conductive means having at least two spaced apart and generally coplanar electrically conductive elements, second electrically conductive means being in opposed facing relationship with said first electrically conductive means and abutting relationship for establishment of electrical connection between first and second electrically conductive means, and an anisotropically electrically conductive adhesive between said first and second electrically conductive means and between said spaced apart electrically conductive coplanar elements of said first electrically conductive means, said adhesive being effective to electrical contact between said first and second electrically conductive means without establishing electrical contact between said spaced apart electrically conductive elements of said first electrically conductive means.
7. An assembly as claimed in claim 6, wherein said anisotropically electrically conductive adhesive has a low population of relatively large conductive particles to establish electrical contact between said first and second electrically conductive means in a desired direction.
8. An interconnected electrical assembly as claimed in claim 7, wherein said conductive particles range in size from about 0,0127 mm to about 0,127 mm.
9. An interconnected electrical assembly as claimed in claims 7 or 8, wherein said conductive particles constitute not more than 10% by weight of the conductive adhesive.
10. An assembly as claimed in any one of the claims 6 to 9, wherein said first and second electrically conductive means have not more than a naturally existing space therebetween, and said anisotropically electrically conductive adhesive has a low population of relatively large conductive particles to establish electrical contact between said first and second electrically conductive means across said space, said particles being of such size that one or two particles bridge said space between said first and second electrically conductive means.
11. An interconnected electrical assembly as claimed in any one of the claims 6 to 10, wherein said first electrically conductive means is a printed circuit having a plurality of spaced coplanar conductors, said second electrically conductive means is a
printed circuit having a plurality of spaced coplanar
conductors and said conductive adhesive is effective
to establish electrical contact between selected
conductors of said first conductive means and
selected conductors of said second conductive
means without establishing electrical contact be
tween adjacent conductors of either said first or
second electrically conductive means.
12. A method of selectively establishing electric
al contact between a first electrically conductive
means having at least two spaced apart and general- ly coplanar electrically conductive elements and
second electrically conductive means, including the=
steps of forming an anisotropically electrically con
ductive adhesive, applying said anisotropically con
ductive adhesive to at least one of said first and
second electrically conductive means, and bonding
said first and second electrically conductive means
together to establish electrical contact between said first and second electrically conductive means with
out establishing electrical contact between said
spaced apart electrically conductive elements of said
first electrically conductive means.
13. A method as claimed in claim 12, wherein the
step of forming an anisotropically conductive adhe
sive includes forming an adhesive having a low
population of relatively large conductive particles
suspended in the adhesive.
14. A method as claimed in claim 13, wherein the
step of forming an anisotropically conductive adhe
sive includes forming an adhesive having not more
than 10% by weight of conductive particles ranging
in size from about 0,0127 mm to about 0,127 mm.
15. A method as claimed in claim 14, wherein the
step of applying electrically conductive adhesive
includes applying a generally uniform coating of
adhesive to at least one of said conductive means
without regard to the location of electrically conduc
tive elements.
16. An interconnected electrical assembly sub- stantially as hereinbefore described with reference
to, and as illustrated in the accompanying drawings.
17. A method substantially as hereinbefore de
scribed with reference to and as illustrated in the
accompanying drawings.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US11706480A | 1980-01-31 | 1980-01-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| GB2068645A true GB2068645A (en) | 1981-08-12 |
Family
ID=22370802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8100935A Withdrawn GB2068645A (en) | 1980-01-31 | 1981-01-13 | Electrical interconnection |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPS56122193A (en) |
| BE (1) | BE887273A (en) |
| FR (1) | FR2475302A1 (en) |
| GB (1) | GB2068645A (en) |
| IT (1) | IT8119428A0 (en) |
Cited By (20)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2123224A (en) * | 1982-06-30 | 1984-01-25 | Nippon Mektron Kk | Connecting circuit boards using conductive adhesive |
| GB2150361A (en) * | 1983-11-26 | 1985-06-26 | Casio Computer Co Ltd | Circuit board |
| DE3701343A1 (en) * | 1986-01-22 | 1987-07-23 | Sharp Kk | METHOD FOR MOUNTING A LSI OR IC COMPONENT ON A WIRING PAD |
| DE3703903A1 (en) * | 1986-02-10 | 1987-08-13 | Alps Electric Co Ltd | ELECTRICAL ARRANGEMENT WITH A MULTIPLE NUMBER OF SLIDING ELEMENTS |
| DE3627595A1 (en) * | 1986-08-14 | 1988-02-18 | Licentia Gmbh | Method for fitting and making contact with an electrical circuit |
| US4737112A (en) * | 1986-09-05 | 1988-04-12 | American Telephone And Telegraph Company, At&T Bell Laboratories | Anisotropically conductive composite medium |
| GB2203442A (en) * | 1987-04-14 | 1988-10-19 | James Robert Clement | Electronic device including uniaxial conductive adhesive and method of making same |
| US4999460A (en) * | 1989-08-10 | 1991-03-12 | Casio Computer Co., Ltd. | Conductive connecting structure |
| US5001302A (en) * | 1988-12-29 | 1991-03-19 | Casio Computer Co., Ltd. | Connecting structure for an electronic part |
| US5123986A (en) * | 1989-08-10 | 1992-06-23 | Casio Computer Co., Ltd. | Conductive connecting method |
| US5180888A (en) * | 1989-08-10 | 1993-01-19 | Casio Computer Co., Ltd. | Conductive bonding agent and a conductive connecting method |
| US5225966A (en) * | 1991-07-24 | 1993-07-06 | At&T Bell Laboratories | Conductive adhesive film techniques |
| DE4206700A1 (en) * | 1992-03-04 | 1993-09-16 | Vdo Schindling | Contacting device for conductor paths arranged on carrier and flexible conductor sheet - has carrier and flexible sheet positioned so as to overlap each other and conductor paths respectively parallel to each other can be connected conducting with each other |
| US5428190A (en) * | 1993-07-02 | 1995-06-27 | Sheldahl, Inc. | Rigid-flex board with anisotropic interconnect and method of manufacture |
| US5502889A (en) * | 1988-06-10 | 1996-04-02 | Sheldahl, Inc. | Method for electrically and mechanically connecting at least two conductive layers |
| US5527998A (en) | 1993-10-22 | 1996-06-18 | Sheldahl, Inc. | Flexible multilayer printed circuit boards and methods of manufacture |
| DE4446289A1 (en) * | 1994-12-23 | 1996-06-27 | Finn David | Contact elements on micro-chip boards are connected together by heating a joining element between the contact element |
| DE19510186A1 (en) * | 1995-03-21 | 1996-09-26 | Licentia Gmbh | Connection method e.g. for flexible conductors joined to substrate contact surfaces |
| US5719749A (en) * | 1994-09-26 | 1998-02-17 | Sheldahl, Inc. | Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board |
| US5727310A (en) * | 1993-01-08 | 1998-03-17 | Sheldahl, Inc. | Method of manufacturing a multilayer electronic circuit |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60262430A (en) * | 1984-06-08 | 1985-12-25 | Matsushita Electric Ind Co Ltd | Manufacture of semiconductor device |
| US4588456A (en) * | 1984-10-04 | 1986-05-13 | Amp Incorporated | Method of making adhesive electrical interconnecting means |
| KR880700617A (en) * | 1985-04-30 | 1988-03-15 | 제이 엘.사이칙 | Circuit panel assembly and its manufacturing method |
| JPS61274394A (en) * | 1985-05-29 | 1986-12-04 | シャープ株式会社 | Connection of terminal |
| AU588925B2 (en) * | 1985-11-06 | 1989-09-28 | Minnesota Mining And Manufacturing Company | Anisotropically conductive polymeric matrix |
| CA1307594C (en) * | 1988-06-10 | 1992-09-15 | Kenneth B. Gilleo | Multilayer electronic circuit and method of manufacture |
| JPH0793482B2 (en) * | 1988-12-12 | 1995-10-09 | シャープ株式会社 | Circuit board connection method |
| US5049085A (en) * | 1989-12-22 | 1991-09-17 | Minnesota Mining And Manufacturing Company | Anisotropically conductive polymeric matrix |
| JPH06103706B2 (en) * | 1992-02-06 | 1994-12-14 | カシオ計算機株式会社 | Method of joining semiconductor device and substrate |
-
1981
- 1981-01-13 GB GB8100935A patent/GB2068645A/en not_active Withdrawn
- 1981-01-28 BE BE6/47380A patent/BE887273A/en unknown
- 1981-01-30 JP JP1281881A patent/JPS56122193A/en active Pending
- 1981-01-30 IT IT8119428A patent/IT8119428A0/en unknown
- 1981-01-30 FR FR8102183A patent/FR2475302A1/en not_active Withdrawn
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2123224A (en) * | 1982-06-30 | 1984-01-25 | Nippon Mektron Kk | Connecting circuit boards using conductive adhesive |
| GB2150361A (en) * | 1983-11-26 | 1985-06-26 | Casio Computer Co Ltd | Circuit board |
| DE3701343A1 (en) * | 1986-01-22 | 1987-07-23 | Sharp Kk | METHOD FOR MOUNTING A LSI OR IC COMPONENT ON A WIRING PAD |
| DE3703903A1 (en) * | 1986-02-10 | 1987-08-13 | Alps Electric Co Ltd | ELECTRICAL ARRANGEMENT WITH A MULTIPLE NUMBER OF SLIDING ELEMENTS |
| DE3627595A1 (en) * | 1986-08-14 | 1988-02-18 | Licentia Gmbh | Method for fitting and making contact with an electrical circuit |
| US4737112A (en) * | 1986-09-05 | 1988-04-12 | American Telephone And Telegraph Company, At&T Bell Laboratories | Anisotropically conductive composite medium |
| GB2203442A (en) * | 1987-04-14 | 1988-10-19 | James Robert Clement | Electronic device including uniaxial conductive adhesive and method of making same |
| GB2203442B (en) * | 1987-04-14 | 1991-10-16 | James Robert Clements | Electronic device including uniaxial conductive adhesive and method of making same |
| US5502889A (en) * | 1988-06-10 | 1996-04-02 | Sheldahl, Inc. | Method for electrically and mechanically connecting at least two conductive layers |
| US5688584A (en) * | 1988-06-10 | 1997-11-18 | Sheldahl, Inc. | Multilayer electronic circuit having a conductive adhesive |
| US5001302A (en) * | 1988-12-29 | 1991-03-19 | Casio Computer Co., Ltd. | Connecting structure for an electronic part |
| US4999460A (en) * | 1989-08-10 | 1991-03-12 | Casio Computer Co., Ltd. | Conductive connecting structure |
| US5123986A (en) * | 1989-08-10 | 1992-06-23 | Casio Computer Co., Ltd. | Conductive connecting method |
| US5180888A (en) * | 1989-08-10 | 1993-01-19 | Casio Computer Co., Ltd. | Conductive bonding agent and a conductive connecting method |
| US5225966A (en) * | 1991-07-24 | 1993-07-06 | At&T Bell Laboratories | Conductive adhesive film techniques |
| DE4206700A1 (en) * | 1992-03-04 | 1993-09-16 | Vdo Schindling | Contacting device for conductor paths arranged on carrier and flexible conductor sheet - has carrier and flexible sheet positioned so as to overlap each other and conductor paths respectively parallel to each other can be connected conducting with each other |
| US5727310A (en) * | 1993-01-08 | 1998-03-17 | Sheldahl, Inc. | Method of manufacturing a multilayer electronic circuit |
| US5428190A (en) * | 1993-07-02 | 1995-06-27 | Sheldahl, Inc. | Rigid-flex board with anisotropic interconnect and method of manufacture |
| US5527998A (en) | 1993-10-22 | 1996-06-18 | Sheldahl, Inc. | Flexible multilayer printed circuit boards and methods of manufacture |
| US5800650A (en) | 1993-10-22 | 1998-09-01 | Sheldahl, Inc. | Flexible multilayer printed circuit boards and methods of manufacture |
| US5719749A (en) * | 1994-09-26 | 1998-02-17 | Sheldahl, Inc. | Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board |
| DE4446289A1 (en) * | 1994-12-23 | 1996-06-27 | Finn David | Contact elements on micro-chip boards are connected together by heating a joining element between the contact element |
| DE4446289C2 (en) * | 1994-12-23 | 1999-02-11 | Finn David | Process for the micro connection of contact elements |
| DE19510186A1 (en) * | 1995-03-21 | 1996-09-26 | Licentia Gmbh | Connection method e.g. for flexible conductors joined to substrate contact surfaces |
| DE19510186C2 (en) * | 1995-03-21 | 2003-12-24 | Aeg Ges Moderne Inf Sys Mbh | Method for connecting a flexible connecting element to a substrate |
Also Published As
| Publication number | Publication date |
|---|---|
| IT8119428A0 (en) | 1981-01-30 |
| FR2475302A1 (en) | 1981-08-07 |
| BE887273A (en) | 1981-05-14 |
| JPS56122193A (en) | 1981-09-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |