IT8119428A0 - PROCEDURE FOR ELECTRICAL INTERCONNECTION AND INTERCONNECTED ELECTRICAL COMPLEX OBTAINED. - Google Patents

PROCEDURE FOR ELECTRICAL INTERCONNECTION AND INTERCONNECTED ELECTRICAL COMPLEX OBTAINED.

Info

Publication number
IT8119428A0
IT8119428A0 IT8119428A IT1942881A IT8119428A0 IT 8119428 A0 IT8119428 A0 IT 8119428A0 IT 8119428 A IT8119428 A IT 8119428A IT 1942881 A IT1942881 A IT 1942881A IT 8119428 A0 IT8119428 A0 IT 8119428A0
Authority
IT
Italy
Prior art keywords
electrical
procedure
complex obtained
interconnected
interconnection
Prior art date
Application number
IT8119428A
Other languages
Italian (it)
Inventor
William P Harper
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Corp filed Critical Rogers Corp
Publication of IT8119428A0 publication Critical patent/IT8119428A0/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
IT8119428A 1980-01-31 1981-01-30 PROCEDURE FOR ELECTRICAL INTERCONNECTION AND INTERCONNECTED ELECTRICAL COMPLEX OBTAINED. IT8119428A0 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11706480A 1980-01-31 1980-01-31

Publications (1)

Publication Number Publication Date
IT8119428A0 true IT8119428A0 (en) 1981-01-30

Family

ID=22370802

Family Applications (1)

Application Number Title Priority Date Filing Date
IT8119428A IT8119428A0 (en) 1980-01-31 1981-01-30 PROCEDURE FOR ELECTRICAL INTERCONNECTION AND INTERCONNECTED ELECTRICAL COMPLEX OBTAINED.

Country Status (5)

Country Link
JP (1) JPS56122193A (en)
BE (1) BE887273A (en)
FR (1) FR2475302A1 (en)
GB (1) GB2068645A (en)
IT (1) IT8119428A0 (en)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594096A (en) * 1982-06-30 1984-01-10 日本メクトロン株式会社 Method of connecting different type circuit boards to each other
JPS6090867U (en) * 1983-11-26 1985-06-21 カシオ計算機株式会社 Wiring board with electrical connection means
JPS60262430A (en) * 1984-06-08 1985-12-25 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
US4588456A (en) * 1984-10-04 1986-05-13 Amp Incorporated Method of making adhesive electrical interconnecting means
JPH07114314B2 (en) * 1985-04-30 1995-12-06 アンプ インコ−ポレ−テツド Circuit panel assembly
JPS61274394A (en) * 1985-05-29 1986-12-04 シャープ株式会社 Connection of terminal
AU588925B2 (en) * 1985-11-06 1989-09-28 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
JPS62169434A (en) * 1986-01-22 1987-07-25 Sharp Corp Method of lsi mounting
KR900002640Y1 (en) * 1986-02-10 1990-03-31 알프스 덴기 가부시기 가이샤 Variable resistor
DE3627595A1 (en) * 1986-08-14 1988-02-18 Licentia Gmbh Method for fitting and making contact with an electrical circuit
US4737112A (en) * 1986-09-05 1988-04-12 American Telephone And Telegraph Company, At&T Bell Laboratories Anisotropically conductive composite medium
GB2203442B (en) * 1987-04-14 1991-10-16 James Robert Clements Electronic device including uniaxial conductive adhesive and method of making same
CA1307594C (en) * 1988-06-10 1992-09-15 Kenneth B. Gilleo Multilayer electronic circuit and method of manufacture
US5502889A (en) * 1988-06-10 1996-04-02 Sheldahl, Inc. Method for electrically and mechanically connecting at least two conductive layers
JPH0793482B2 (en) * 1988-12-12 1995-10-09 シャープ株式会社 Circuit board connection method
JPH0291360U (en) * 1988-12-29 1990-07-19
US5123986A (en) * 1989-08-10 1992-06-23 Casio Computer Co., Ltd. Conductive connecting method
US4999460A (en) * 1989-08-10 1991-03-12 Casio Computer Co., Ltd. Conductive connecting structure
US5180888A (en) * 1989-08-10 1993-01-19 Casio Computer Co., Ltd. Conductive bonding agent and a conductive connecting method
US5049085A (en) * 1989-12-22 1991-09-17 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
US5225966A (en) * 1991-07-24 1993-07-06 At&T Bell Laboratories Conductive adhesive film techniques
JPH06103706B2 (en) * 1992-02-06 1994-12-14 カシオ計算機株式会社 Method of joining semiconductor device and substrate
DE4206700A1 (en) * 1992-03-04 1993-09-16 Vdo Schindling Contacting device for conductor paths arranged on carrier and flexible conductor sheet - has carrier and flexible sheet positioned so as to overlap each other and conductor paths respectively parallel to each other can be connected conducting with each other
US5727310A (en) * 1993-01-08 1998-03-17 Sheldahl, Inc. Method of manufacturing a multilayer electronic circuit
US5428190A (en) * 1993-07-02 1995-06-27 Sheldahl, Inc. Rigid-flex board with anisotropic interconnect and method of manufacture
US5527998A (en) 1993-10-22 1996-06-18 Sheldahl, Inc. Flexible multilayer printed circuit boards and methods of manufacture
US5719749A (en) * 1994-09-26 1998-02-17 Sheldahl, Inc. Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board
DE4446289C2 (en) * 1994-12-23 1999-02-11 Finn David Process for the micro connection of contact elements
DE19510186C2 (en) * 1995-03-21 2003-12-24 Aeg Ges Moderne Inf Sys Mbh Method for connecting a flexible connecting element to a substrate

Also Published As

Publication number Publication date
FR2475302A1 (en) 1981-08-07
BE887273A (en) 1981-05-14
GB2068645A (en) 1981-08-12
JPS56122193A (en) 1981-09-25

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