JPS56122193A - Electrically connected unit and method therefor - Google Patents

Electrically connected unit and method therefor

Info

Publication number
JPS56122193A
JPS56122193A JP1281881A JP1281881A JPS56122193A JP S56122193 A JPS56122193 A JP S56122193A JP 1281881 A JP1281881 A JP 1281881A JP 1281881 A JP1281881 A JP 1281881A JP S56122193 A JPS56122193 A JP S56122193A
Authority
JP
Japan
Prior art keywords
electrically connected
method therefor
connected unit
unit
therefor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1281881A
Other languages
Japanese (ja)
Inventor
Pii Haapaa Uiriamu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Rogers Corp
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Corp filed Critical Rogers Corp
Publication of JPS56122193A publication Critical patent/JPS56122193A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0263—Details about a collection of particles
    • H05K2201/0266—Size distribution
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Conductive Materials (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)
JP1281881A 1980-01-31 1981-01-30 Electrically connected unit and method therefor Pending JPS56122193A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11706480A 1980-01-31 1980-01-31

Publications (1)

Publication Number Publication Date
JPS56122193A true JPS56122193A (en) 1981-09-25

Family

ID=22370802

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1281881A Pending JPS56122193A (en) 1980-01-31 1981-01-30 Electrically connected unit and method therefor

Country Status (5)

Country Link
JP (1) JPS56122193A (en)
BE (1) BE887273A (en)
FR (1) FR2475302A1 (en)
GB (1) GB2068645A (en)
IT (1) IT8119428A0 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60262430A (en) * 1984-06-08 1985-12-25 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
JPS61274394A (en) * 1985-05-29 1986-12-04 シャープ株式会社 Connection of terminal
JPH02159090A (en) * 1988-12-12 1990-06-19 Sharp Corp Connection of circuit board
JPH0563031A (en) * 1992-02-06 1993-03-12 Casio Comput Co Ltd Bonding method for semiconductor device and substrate

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS594096A (en) * 1982-06-30 1984-01-10 日本メクトロン株式会社 Method of connecting different type circuit boards to each other
JPS6090867U (en) * 1983-11-26 1985-06-21 カシオ計算機株式会社 Wiring board with electrical connection means
US4588456A (en) * 1984-10-04 1986-05-13 Amp Incorporated Method of making adhesive electrical interconnecting means
KR880700617A (en) * 1985-04-30 1988-03-15 제이 엘.사이칙 Circuit panel assembly and its manufacturing method
AU588925B2 (en) * 1985-11-06 1989-09-28 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
JPS62169434A (en) * 1986-01-22 1987-07-25 Sharp Corp Method of lsi mounting
KR900002640Y1 (en) * 1986-02-10 1990-03-31 알프스 덴기 가부시기 가이샤 Variable resistor
DE3627595A1 (en) * 1986-08-14 1988-02-18 Licentia Gmbh Method for fitting and making contact with an electrical circuit
US4737112A (en) * 1986-09-05 1988-04-12 American Telephone And Telegraph Company, At&T Bell Laboratories Anisotropically conductive composite medium
GB2203442B (en) * 1987-04-14 1991-10-16 James Robert Clements Electronic device including uniaxial conductive adhesive and method of making same
CA1307594C (en) * 1988-06-10 1992-09-15 Kenneth B. Gilleo Multilayer electronic circuit and method of manufacture
US5502889A (en) * 1988-06-10 1996-04-02 Sheldahl, Inc. Method for electrically and mechanically connecting at least two conductive layers
JPH0291360U (en) * 1988-12-29 1990-07-19
US5180888A (en) * 1989-08-10 1993-01-19 Casio Computer Co., Ltd. Conductive bonding agent and a conductive connecting method
US5123986A (en) * 1989-08-10 1992-06-23 Casio Computer Co., Ltd. Conductive connecting method
US4999460A (en) * 1989-08-10 1991-03-12 Casio Computer Co., Ltd. Conductive connecting structure
US5049085A (en) * 1989-12-22 1991-09-17 Minnesota Mining And Manufacturing Company Anisotropically conductive polymeric matrix
US5225966A (en) * 1991-07-24 1993-07-06 At&T Bell Laboratories Conductive adhesive film techniques
DE4206700A1 (en) * 1992-03-04 1993-09-16 Vdo Schindling Contacting device for conductor paths arranged on carrier and flexible conductor sheet - has carrier and flexible sheet positioned so as to overlap each other and conductor paths respectively parallel to each other can be connected conducting with each other
US5727310A (en) * 1993-01-08 1998-03-17 Sheldahl, Inc. Method of manufacturing a multilayer electronic circuit
US5428190A (en) * 1993-07-02 1995-06-27 Sheldahl, Inc. Rigid-flex board with anisotropic interconnect and method of manufacture
US5527998A (en) 1993-10-22 1996-06-18 Sheldahl, Inc. Flexible multilayer printed circuit boards and methods of manufacture
US5719749A (en) * 1994-09-26 1998-02-17 Sheldahl, Inc. Printed circuit assembly with fine pitch flexible printed circuit overlay mounted to printed circuit board
DE4446289C2 (en) * 1994-12-23 1999-02-11 Finn David Process for the micro connection of contact elements
DE19510186C2 (en) * 1995-03-21 2003-12-24 Aeg Ges Moderne Inf Sys Mbh Method for connecting a flexible connecting element to a substrate

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60262430A (en) * 1984-06-08 1985-12-25 Matsushita Electric Ind Co Ltd Manufacture of semiconductor device
JPH027180B2 (en) * 1984-06-08 1990-02-15 Matsushita Electric Ind Co Ltd
JPS61274394A (en) * 1985-05-29 1986-12-04 シャープ株式会社 Connection of terminal
JPH0334240B2 (en) * 1985-05-29 1991-05-21 Sharp Kk
JPH02159090A (en) * 1988-12-12 1990-06-19 Sharp Corp Connection of circuit board
JPH0563031A (en) * 1992-02-06 1993-03-12 Casio Comput Co Ltd Bonding method for semiconductor device and substrate
JPH06103706B2 (en) * 1992-02-06 1994-12-14 カシオ計算機株式会社 Method of joining semiconductor device and substrate

Also Published As

Publication number Publication date
GB2068645A (en) 1981-08-12
BE887273A (en) 1981-05-14
IT8119428A0 (en) 1981-01-30
FR2475302A1 (en) 1981-08-07

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