DE3627595A1 - Method for fitting and making contact with an electrical circuit - Google Patents

Method for fitting and making contact with an electrical circuit

Info

Publication number
DE3627595A1
DE3627595A1 DE19863627595 DE3627595A DE3627595A1 DE 3627595 A1 DE3627595 A1 DE 3627595A1 DE 19863627595 DE19863627595 DE 19863627595 DE 3627595 A DE3627595 A DE 3627595A DE 3627595 A1 DE3627595 A1 DE 3627595A1
Authority
DE
Germany
Prior art keywords
adhesive
radiation
substrate
conductor
contact points
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
DE19863627595
Other languages
German (de)
Inventor
Otto Dipl Phys Bader
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Licentia Patent Verwaltungs GmbH
Original Assignee
Licentia Patent Verwaltungs GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Licentia Patent Verwaltungs GmbH filed Critical Licentia Patent Verwaltungs GmbH
Priority to DE19863627595 priority Critical patent/DE3627595A1/en
Publication of DE3627595A1 publication Critical patent/DE3627595A1/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/8319—Arrangement of the layer connectors prior to mounting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01005—Boron [B]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01029—Copper [Cu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01074—Tungsten [W]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)

Abstract

It is proposed to use an insulating adhesive for installing and making contact with ICs on a substrate in a simple and short-circuit-proof manner, and to carry out the contactmaking by pressing the contact parts against one another while the adhesive is curing.

Description

Die vorliegende Erfindung betrifft ein Verfahren nach dem Oberbegriff des Patentanspruchs 1.The present invention relates to a method according to the preamble of claim 1.

Es ist bereits bekannt, zur Kontaktierung und Befesti­ gung von integrierten Schaltkreisen (ICs) mit abstehen­ den flexiblen Leiterbändchen einen elektrisch leitenden Kleber zu verwenden. Nachteilig ist bei der Verwendung von elektrisch leitenden Klebern, daß der Kleberauftrag in exakt dosierter Weise und örtlich präzise aufge­ bracht werden muß. Die Gefahr von Kurzschlüssen zwi­ schen benachbarten Kontaktstellen ist verhältnismäßig groß.It is already known for contacting and fastening stand out from integrated circuits (ICs) the flexible conductor tapes are electrically conductive Use glue. A disadvantage is the use of electrically conductive glue that the glue application in a precisely metered manner and spatially precise must be brought. The risk of short circuits between neighboring contact points is proportional large.

Der vorliegenden Erfindung liegt die Aufgabe zugrunde, das Verfahren der eingangs genannten Art in der Weise zu verbessern, daß unerwünschte Verbindungen zwischen einzelnen Kontaktstellen weitgehend ausgeschlossen werden können. The present invention is based on the object the method of the type mentioned in the way improve that unwanted connections between individual contact points are largely excluded can.  

Diese Aufgabe wird gemäß der Erfindung durch die im Kennzeichen des Patentanspruches 1 beschriebenen Merkma­ le gelöst.This object is achieved according to the invention by the Characteristics of claim 1 described Merkma le solved.

Ein wesentlicher Vorteil der Erfindung wird darin gesehen, daß das Aufbringen des Klebers völlig unkri­ tisch ist, sowohl was die Dicke, als auch die flächen­ mäßige Ausdehnung der Kleberschicht betrifft, da infol­ ge der isolierenden Eigenschaften des Klebers ausge­ schlossen ist, daß unerwünschte elektrisch leitende Verbindungen zwischen den Leiterbahnen des Substrats entstehen können. Ein weiterer Vorteil besteht darin, daß ein solcher Kleber eine weitgehend strahlungsdurch­ lässige Konsistenz aufweisen kann, so daß eine sehr schnelle und durchdringende Aushärtung bei Anwendung einer Strahlung, wie z. B. UV-Strahlung, möglich ist. Ein weiterer Vorteil besteht darin, daß bereits vor Aushärten des Klebers ein Funktionstest der Kontakt­ verbindungen ermöglicht wird.A major advantage of the invention is therein seen that the application of the adhesive completely uncri is table, both in terms of thickness and areas moderate expansion of the adhesive layer concerns, as infol ge of the insulating properties of the adhesive concluded that unwanted electrically conductive Connections between the conductor tracks of the substrate can arise. Another advantage is that such an adhesive largely through radiation can have casual consistency, so that a very quick and penetrating curing when used radiation, e.g. B. UV radiation is possible. Another advantage is that already before Curing of the adhesive a functional test of the contact connections is made possible.

Die Erfindung wird nachfolgend anhand eines bevorzugten Ausführungsbeispiels näher erklärt. Das Substrat sei eine Glasplatte, die z. B. gleichzeitig ein Teil einer Deckplatte einer Flüssigkristall-Anzeigezelle ist. Auf dieser Glasplatte befinden sich elektrische Leiterbah­ nen, z. B. aus dünnen Metalloxidstreifen, wie z. B. aus Zinnoxid oder dergleichen. Diese Leiterbahnen können aber auch dicker und metallischer Struktur sein.The invention is described below with reference to a preferred one Embodiment explained in more detail. The substrate is a glass plate, the z. B. at the same time part of a Cover plate of a liquid crystal display cell. On This glass plate contains electrical conductors NEN, e.g. B. from thin metal oxide strips, such as. B. from Tin oxide or the like. These traces can but also be thicker and metallic structure.

Der elektrische Schaltkreis oder mehrerer solcher elektrischer Schaltkreise, die bevorzugt sogenannte IC's sind, weisen eine Vielzahl von dünnen Leiterbändchen, z. B. aus Kupfer oder Gold, auf. Gemäß der Erfindung wird nun auf die mit den Leiterbahnen versehene Oberfläche des Substrats eine oder mehrere nebeneinanderliegende Schichten eines bevorzugt transparenten Klebers mit isolie­ renden Eigenschaften aufgebracht. Der Kleber hat bevorzugt eine verhältnismäßig hohe Viskosität. Nunmehr wird der elektrische Schaltkreis auf die mit Kleber versehene Ober­ fläche des Substrates aufgesetzt und so ausgerichtet, daß die Leiterbändchen des Schaltkreises über die zugeordneten Leiterbahnen des Substrats zu liegen kommen. Mittels einer entsprechend geformten Anpreßvorrichtung werden nunmehr die Leiterbändchen auf die entsprechenden Leiterbahnen des Sub­ strats aufgedrückt, wodurch eine weitgehende Reduzierung oder Entfernung des Klebers erfolgt. Es ist besonders zweck­ mäßig, die Anpreßvorrichtung derart auszubilden, daß bereits in diesem Zustand des Anpressens ein Funktionstest der Kontaktstellen ermöglicht wird, z. B. in der Weise, daß der Anpreßstempel aus einem Isoliermaterial besteht. Nunmehr wird unter Beibehaltung des Anpreßdruckes der Kleber ausge­ härtet, insbesondere durch Zuführung einer Strahlung, wie z. B. einer UV-Strahlung.The electrical circuit or more electrical circuits, the so-called IC's have a large number of thin conductor strips, e.g. B. made of copper or gold. According to the invention  is now on the surface provided with the conductor tracks of the substrate one or more juxtaposed Layers of a preferably transparent adhesive with isolie applied properties. The adhesive preferred a relatively high viscosity. Now the electrical circuit on the glued top surface of the substrate placed and aligned so that the conductor strips of the circuit via the assigned Conductor tracks of the substrate come to rest. By means of a accordingly shaped pressing device are now the Conductor tapes on the corresponding conductor tracks of the sub strats pressed on, causing a substantial reduction or removal of the adhesive. It is especially useful moderate to design the pressure device such that already in this state of pressing a function test of the Contact points is made possible, e.g. B. in such a way that the Pressure stamp consists of an insulating material. Now the adhesive is removed while maintaining the contact pressure hardens, in particular by supplying radiation, such as e.g. B. UV radiation.

Bei Verwendung eines z. B. aus Glas bestehenden Substrats kann die UV-Strahlung durch das Glas hindurch den Klebstel­ len zugeführt werden. In diesem Fall ist es zweckmäßig, auch den Kleber für die Strahlung zumindest teilweise durchlässig zu machen. Der Anpreßdruck wird erst dann weggenommen, wenn der Kleber genügend ausgehärtet ist. Durch gezielte Strah­ lungsanwendung kann die Aushärtung bevorzugt an den ge­ wünschten Kontaktstellen vorgenommen werden. Es wird davon ausgegangen, daß in Anbetracht der äußerst geringen Ströme, die zum Betrieb eines IC's erforderlich sind, auch dann ein einwandfreier Betrieb stattfindet, wenn der Kontakt an den einzelnen Kontaktstellen kapazitiver Art ist.When using a z. B. glass substrate UV radiation can pass through the glass through the adhesive len are fed. In this case, it is useful, too the adhesive is at least partially permeable to the radiation close. The contact pressure is only removed when the adhesive has hardened sufficiently. By targeted beam application, the curing can preferably be carried out on the ge desired contact points can be made. It will assumed that, given the extremely low currents, which are required to operate an IC, even then  perfect operation takes place when the contact to the individual contact points is of a capacitive nature.

Gemäß einem weiteren Ausführungsbeispiel wird ein thermisch aushärtbarer Kleber verwendet.According to a further embodiment, a thermal curable adhesive used.

Claims (9)

1. Verfahren zum Aufbringen und Kontaktieren eines elektrischen Schaltkreises mit mehreren abstehenden flexiblen Leiterbändchen auf ein, elektrische Leiter­ bahnen aufweisendes Substrat aus Isoliermaterial, unter Verwendung eines Klebers, in der Weise, daß die Leiter­ bändchen auf zugeordneten Leiterbahnenabschnitten angeklebt werden, dadurch gekennzeichnet, daß auf das Substrat, im Vergleich zu den Kontaktstellen, großflä­ chig ein isolierender Kleber aufgebracht wird, daß dann der Schaltkreis auf das Substrat aufgebracht und aus­ gerichtet wird, daß dann die Leiterbändchen an den vorgesehenen Kontaktstellen auf die Leiterbahnen aufge­ preßt werden, und daß dann bei Aufrechterhaltung des Anpreßdruckes der Kleber ausgehärtet wird.1. A method for applying and contacting an electrical circuit with several protruding flexible conductor strips on a, electrical conductor tracks having substrate made of insulating material, using an adhesive, in such a way that the conductor tapes are glued to assigned conductor track sections, characterized in that on the substrate, in comparison to the contact points, an insulating adhesive is applied extensively, that the circuit is then applied to the substrate and directed out, that the conductor tapes are then pressed onto the conductor tracks at the intended contact points, and then in maintenance the contact pressure the adhesive is cured. 2. Verfahren nach Anspruch 1, dadurch gekennzeichnet, daß nach Aufpressen der Leiterbändchen und vor dem Aushärten des Klebers unter Beibehaltung des Anpreß­ druckes ein Funktionstest der Kontaktstellen durchge­ führt wird. 2. The method according to claim 1, characterized in that that after pressing the ribbon and before Hardening of the adhesive while maintaining the pressure pressure a function test of the contact points leads.   3. Verfahren nach Anspruch 1 oder Anspruch 2, dadurch gekennzeichnet, daß das Aushärten des Klebers unter Zuführung einer Strahlung, insbesondere einer UV-Strah­ lung, vorgenommen wird.3. The method according to claim 1 or claim 2, characterized characterized in that the curing of the adhesive under Supply of radiation, in particular UV radiation lung. 4. Verfahren nach einem der Ansprüche 1 bis 3, dadurch gekennzeichnet, daß der Schaltkreis auf ein für eine Strahlung zumindest teilweise durchlässiges Substrat, insbesondere aus Glas oder dergleichen, aufgebracht wird.4. The method according to any one of claims 1 to 3, characterized characterized in that the circuit is on one for one Radiation at least partially permeable substrate, in particular made of glass or the like becomes. 5. Verfahren nach Anspruch 3 oder Anspruch 4, dadurch gekennzeichnet, daß die Zuführung der Strahlung zur Aushärtung des Klebers durch das Substrat hindurch vorgenommen wird.5. The method according to claim 3 or claim 4, characterized characterized in that the supply of radiation to the The adhesive cures through the substrate is made. 6. Verfahren nach einem der Ansprüche 1 bis 5, dadurch gekennzeichnet, daß ein Substrat mit strahlungsdurch­ lässigen Leiterbahnen verwendet wird.6. The method according to any one of claims 1 to 5, characterized characterized in that a substrate with radiation casual conductor tracks is used. 7. Verfahren nach einem der Ansprüche 1 bis 6, dadurch gekennzeichnet, daß ein für eine Strahlung, insbeson­ dere UV-Strahlung, zumindest teildurchlässiger Kleber ver­ wendet wird. 7. The method according to any one of claims 1 to 6, characterized characterized in that one for radiation, in particular their UV radiation, at least partially permeable adhesive is applied. 8. Verfahren nach einem der Ansprüche 1 bis 3, dadurch ge­ kennzeichnet, daß das Aushärten des Klebers durch Zuführung von Wärme erfolgt.8. The method according to any one of claims 1 to 3, characterized ge indicates that the adhesive cures by feeding done by heat. 9. Verfahren nach einem der Ansprüche 1 bis 8, gekennzeichnet durch die Anwendung beim Aufbringen und Kontaktieren eines oder mehrerer ICs auf einem als Deckplatte oder Teil einer Deckplatte einer Flüssigkristallzelle ausgebildeten Substrats.9. The method according to any one of claims 1 to 8, characterized by applying when applying and contacting a or several ICs on one as a cover plate or part of one Cover plate of a liquid crystal cell formed substrate.
DE19863627595 1986-08-14 1986-08-14 Method for fitting and making contact with an electrical circuit Withdrawn DE3627595A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
DE19863627595 DE3627595A1 (en) 1986-08-14 1986-08-14 Method for fitting and making contact with an electrical circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19863627595 DE3627595A1 (en) 1986-08-14 1986-08-14 Method for fitting and making contact with an electrical circuit

Publications (1)

Publication Number Publication Date
DE3627595A1 true DE3627595A1 (en) 1988-02-18

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ID=6307388

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19863627595 Withdrawn DE3627595A1 (en) 1986-08-14 1986-08-14 Method for fitting and making contact with an electrical circuit

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DE (1) DE3627595A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0360971A2 (en) * 1988-08-31 1990-04-04 Mitsui Mining & Smelting Co., Ltd. Mounting substrate and its production method, and printed wiring board having connector function and its connection method

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2536361A1 (en) * 1974-08-14 1976-02-26 Seikosha Kk ELECTRICALLY CONDUCTIVE ADHESIVE
EP0005265A2 (en) * 1978-05-10 1979-11-14 Siemens Aktiengesellschaft Method for making contact on the adhesive side of the electrode of an electrical device
GB2068645A (en) * 1980-01-31 1981-08-12 Rogers Corp Electrical interconnection

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2536361A1 (en) * 1974-08-14 1976-02-26 Seikosha Kk ELECTRICALLY CONDUCTIVE ADHESIVE
EP0005265A2 (en) * 1978-05-10 1979-11-14 Siemens Aktiengesellschaft Method for making contact on the adhesive side of the electrode of an electrical device
GB2068645A (en) * 1980-01-31 1981-08-12 Rogers Corp Electrical interconnection

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0360971A2 (en) * 1988-08-31 1990-04-04 Mitsui Mining & Smelting Co., Ltd. Mounting substrate and its production method, and printed wiring board having connector function and its connection method
EP0360971A3 (en) * 1988-08-31 1991-07-17 Mitsui Mining & Smelting Co., Ltd. Mounting substrate and its production method, and printed wiring board having connector function and its connection method

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