ES2127125B1 - Unos perfeccionamientos introducidos en la fabricacion de circuitos impresos. - Google Patents

Unos perfeccionamientos introducidos en la fabricacion de circuitos impresos.

Info

Publication number
ES2127125B1
ES2127125B1 ES009700225A ES9700225A ES2127125B1 ES 2127125 B1 ES2127125 B1 ES 2127125B1 ES 009700225 A ES009700225 A ES 009700225A ES 9700225 A ES9700225 A ES 9700225A ES 2127125 B1 ES2127125 B1 ES 2127125B1
Authority
ES
Spain
Prior art keywords
manufacture
improvements introduced
printed circuits
adherent
same
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
ES009700225A
Other languages
English (en)
Other versions
ES2127125A1 (es
Inventor
Fernandez Salvador Gomez
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lear Automotive EEDS Spain SL
Original Assignee
Lear Automotive EEDS Spain SL
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Lear Automotive EEDS Spain SL filed Critical Lear Automotive EEDS Spain SL
Priority to ES009700225A priority Critical patent/ES2127125B1/es
Priority to EP98500015A priority patent/EP0858250A1/en
Priority to CA002279949A priority patent/CA2279949A1/en
Priority to PCT/US1998/001732 priority patent/WO1998034442A1/en
Priority to JP53306698A priority patent/JP2001527698A/ja
Publication of ES2127125A1 publication Critical patent/ES2127125A1/es
Priority to US09/365,668 priority patent/US6353188B1/en
Application granted granted Critical
Publication of ES2127125B1 publication Critical patent/ES2127125B1/es
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/028—Bending or folding regions of flexible printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0263—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board
    • H05K1/0265—High current adaptations, e.g. printed high current conductors or using auxiliary non-printed means; Fine and coarse circuit patterns on one circuit board characterized by the lay-out of or details of the printed conductors, e.g. reinforced conductors, redundant conductors, conductors having different cross-sections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/098—Special shape of the cross-section of conductors, e.g. very thick plated conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

Unos perfeccionamientos introducidos en la fabricación de circuitos impresos. El circuito impreso (10), se fabrica a base de un soporte flexible (11), sobre el cual y por procedimientos convencionales se adhiere una capa de material conductor (12), formado por pistas (13), mediante la aplicación por cualquier medio conocido de un adherente (14) de especial resistencia a la temperatura, para evitar el efecto de la misma sobre el adherente al tener que soportar el mismo esfuerzos al doblamiento y en algunos casos a la torsión al ser la capa conductora (12) a doblar de hasta 800 micras de espesor, sin que se produzca el fenómeno llamado de deslaminación, es decir la separación de (12) y (11) por falta de adherencia entre ambas capas.
ES009700225A 1997-02-05 1997-02-05 Unos perfeccionamientos introducidos en la fabricacion de circuitos impresos. Expired - Fee Related ES2127125B1 (es)

Priority Applications (6)

Application Number Priority Date Filing Date Title
ES009700225A ES2127125B1 (es) 1997-02-05 1997-02-05 Unos perfeccionamientos introducidos en la fabricacion de circuitos impresos.
EP98500015A EP0858250A1 (en) 1997-02-05 1998-01-23 Improvements introduced in printed circuit manufacturing
CA002279949A CA2279949A1 (en) 1997-02-05 1998-01-29 Printed circuit assembly with flexible support
PCT/US1998/001732 WO1998034442A1 (en) 1997-02-05 1998-01-29 Printed circuit assembly with flexible support
JP53306698A JP2001527698A (ja) 1997-02-05 1998-01-29 フレキシブルなサポートを備えたプリント回路アセンブリ
US09/365,668 US6353188B1 (en) 1997-02-05 1999-08-02 Printed circuit assembly with flexible support

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
ES009700225A ES2127125B1 (es) 1997-02-05 1997-02-05 Unos perfeccionamientos introducidos en la fabricacion de circuitos impresos.

Publications (2)

Publication Number Publication Date
ES2127125A1 ES2127125A1 (es) 1999-04-01
ES2127125B1 true ES2127125B1 (es) 1999-11-16

Family

ID=8298111

Family Applications (1)

Application Number Title Priority Date Filing Date
ES009700225A Expired - Fee Related ES2127125B1 (es) 1997-02-05 1997-02-05 Unos perfeccionamientos introducidos en la fabricacion de circuitos impresos.

Country Status (6)

Country Link
US (1) US6353188B1 (es)
EP (1) EP0858250A1 (es)
JP (1) JP2001527698A (es)
CA (1) CA2279949A1 (es)
ES (1) ES2127125B1 (es)
WO (1) WO1998034442A1 (es)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6803528B1 (en) * 1999-11-05 2004-10-12 3M Innovative Properties Company Multi-layer double-sided wiring board and method of fabricating the same
ES2187285B1 (es) * 2001-08-24 2004-08-16 Lear Automotive (Eeds) Spain, S.L. Procedimiento de multifresado para la fabricacion de circuitos impresos y circuito impreso asi obtenido.
US7491892B2 (en) * 2003-03-28 2009-02-17 Princeton University Stretchable and elastic interconnects
US7465678B2 (en) * 2003-03-28 2008-12-16 The Trustees Of Princeton University Deformable organic devices
US20070209830A1 (en) * 2006-03-13 2007-09-13 Walton Advanced Engineering, Inc. Semiconductor chip package having a slot type metal film carrying a wire-bonding chip
TW201039200A (en) * 2009-04-23 2010-11-01 Waltop Int Corp Soft digital tablet
JP2011018873A (ja) * 2009-05-22 2011-01-27 Sony Ericsson Mobilecommunications Japan Inc 電磁シールド方法および電磁シールド用フィルム
US8883287B2 (en) * 2009-06-29 2014-11-11 Infinite Corridor Technology, Llc Structured material substrates for flexible, stretchable electronics
US9266717B2 (en) 2013-03-15 2016-02-23 Versana Micro Inc Monolithically integrated multi-sensor device on a semiconductor substrate and method therefor
US9778772B2 (en) 2015-09-16 2017-10-03 Microsoft Technology Licensing, Llc Bendable device with display in movable connection with body

Family Cites Families (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2997521A (en) * 1960-04-11 1961-08-22 Sanders Associates Inc Insulated electric circuit assembly
US3168617A (en) * 1962-08-27 1965-02-02 Tape Cable Electronics Inc Electric cables and method of making the same
EP0048220B1 (de) * 1980-09-15 1986-10-22 Ciba-Geigy Ag Verwendung von flexiblem Basismaterial zur Herstellung von gedruckten Schaltungen
JPS594096A (ja) * 1982-06-30 1984-01-10 日本メクトロン株式会社 異種回路基板相互の接続方法
JPH046218Y2 (es) * 1985-02-01 1992-02-20
US4839232A (en) * 1985-10-31 1989-06-13 Mitsui Toatsu Chemicals, Incorporated Flexible laminate printed-circuit board and methods of making same
US4945029A (en) * 1988-05-06 1990-07-31 Rogers Corporation Process for the manufacture of multi-layer circuits with dynamic flexing regions and the flexible circuits made therefrom
DE69000924T2 (de) * 1989-04-28 1993-06-03 Nikken Ind Corp Leiterplatte und ueberzug.
JPH069165U (ja) * 1992-07-08 1994-02-04 旭光学工業株式会社 フレキシブルプリント基板
US5257718A (en) * 1993-03-26 1993-11-02 Chiu Ming T Method of bending and soldering corners of a folding printed-circuit board
US5375321A (en) * 1993-03-30 1994-12-27 United States Department Of Energy Method for fabricating fan-fold shielded electrical leads
JPH08125342A (ja) * 1994-10-21 1996-05-17 Nec Corp フレキシブル多層配線基板とその製造方法
JP3435245B2 (ja) * 1995-02-21 2003-08-11 ペンタックス株式会社 フレキシブルプリント配線板
WO1997001437A1 (en) * 1995-06-28 1997-01-16 Fraivillig Materials Company Circuit board laminates and method of making
US5612511A (en) * 1995-09-25 1997-03-18 Hewlett-Packard Company Double-sided electrical interconnect flexible circuit for ink-jet hard copy systems
JP3202935B2 (ja) * 1996-12-25 2001-08-27 日東電工株式会社 フレキシブル配線板及びその製造方法
US5903440A (en) * 1998-01-30 1999-05-11 Delco Electronics Corporaiton Method of forming assemblies of circuit boards in different planes

Also Published As

Publication number Publication date
CA2279949A1 (en) 1998-08-06
EP0858250A1 (en) 1998-08-12
JP2001527698A (ja) 2001-12-25
ES2127125A1 (es) 1999-04-01
US6353188B1 (en) 2002-03-05
WO1998034442A1 (en) 1998-08-06

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