JPS5615159B2 - - Google Patents

Info

Publication number
JPS5615159B2
JPS5615159B2 JP1032077A JP1032077A JPS5615159B2 JP S5615159 B2 JPS5615159 B2 JP S5615159B2 JP 1032077 A JP1032077 A JP 1032077A JP 1032077 A JP1032077 A JP 1032077A JP S5615159 B2 JPS5615159 B2 JP S5615159B2
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1032077A
Other versions
JPS5295058A (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPS5295058A publication Critical patent/JPS5295058A/ja
Publication of JPS5615159B2 publication Critical patent/JPS5615159B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/009—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone characterised by the material treated
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5122—Pd or Pt
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/45—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements
    • C04B41/50—Coating or impregnating, e.g. injection in masonry, partial coating of green or fired ceramics, organic coating compositions for adhering together two concrete elements with inorganic materials
    • C04B41/51—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal
    • C04B41/5133—Metallising, e.g. infiltration of sintered ceramic preforms with molten metal with a composition mainly composed of one or more of the refractory metals
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B41/00—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone
    • C04B41/80—After-treatment of mortars, concrete, artificial stone or ceramics; Treatment of natural stone of only ceramics
    • C04B41/81—Coating or impregnation
    • C04B41/85—Coating or impregnation with inorganic materials
    • C04B41/88—Metals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
    • H01L21/4857—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/12—Mountings, e.g. non-detachable insulating substrates
    • H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
    • H01L23/15—Ceramic or glass substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5383—Multilayer substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49128—Assembling formed circuit to base
JP1032077A 1976-02-03 1977-02-03 Method of producing multiilayer ceramic stacking member Granted JPS5295058A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/654,686 US4109377A (en) 1976-02-03 1976-02-03 Method for preparing a multilayer ceramic

Publications (2)

Publication Number Publication Date
JPS5295058A JPS5295058A (en) 1977-08-10
JPS5615159B2 true JPS5615159B2 (ja) 1981-04-08

Family

ID=24625850

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1032077A Granted JPS5295058A (en) 1976-02-03 1977-02-03 Method of producing multiilayer ceramic stacking member

Country Status (6)

Country Link
US (1) US4109377A (ja)
JP (1) JPS5295058A (ja)
CA (1) CA1078079A (ja)
DE (1) DE2703956C2 (ja)
FR (1) FR2340288A1 (ja)
GB (1) GB1565421A (ja)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57182971U (ja) * 1981-05-14 1982-11-19
JPS6127242Y2 (ja) * 1980-04-30 1986-08-14
WO2003101166A1 (fr) * 2002-05-28 2003-12-04 Sumitomo Electric Industries, Ltd. Pastille frittee a base de nitrure d'aluminium comportant une couche metallisee et procede de preparation associe

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US4388131A (en) * 1977-05-02 1983-06-14 Burroughs Corporation Method of fabricating magnets
US4243710A (en) * 1978-12-06 1981-01-06 Ferro Corporation Thermoplastic electrode ink for the manufacture of ceramic multi-layer capacitor
US4221047A (en) * 1979-03-23 1980-09-09 International Business Machines Corporation Multilayered glass-ceramic substrate for mounting of semiconductor device
US4313262A (en) * 1979-12-17 1982-02-02 General Electric Company Molybdenum substrate thick film circuit
US4355055A (en) * 1980-02-25 1982-10-19 E. I. Du Pont De Nemours And Company Use of prolonged tack toners for the preparation of multilayer electric circuits
US4364100A (en) * 1980-04-24 1982-12-14 International Business Machines Corporation Multi-layered metallized silicon matrix substrate
JPS5922385B2 (ja) * 1980-04-25 1984-05-26 日産自動車株式会社 セラミツク基板のスル−ホ−ル充填用導電体ペ−スト
US4320438A (en) * 1980-05-15 1982-03-16 Cts Corporation Multi-layer ceramic package
JPS5824037B2 (ja) * 1980-05-26 1983-05-18 富士通株式会社 導体ボ−ル配列方法
US4302625A (en) * 1980-06-30 1981-11-24 International Business Machines Corp. Multi-layer ceramic substrate
US4336088A (en) * 1980-06-30 1982-06-22 International Business Machines Corp. Method of fabricating an improved multi-layer ceramic substrate
US4349862A (en) * 1980-08-11 1982-09-14 International Business Machines Corporation Capacitive chip carrier and multilayer ceramic capacitors
FR2496341A1 (fr) * 1980-12-12 1982-06-18 Thomson Csf Composant d'interconnexion topologique
US4340618A (en) * 1981-03-20 1982-07-20 International Business Machines Corporation Process for forming refractory metal layers on ceramic substrate
DE3147790A1 (de) * 1981-12-03 1983-06-09 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungsmodul und verfahren zu seiner herstellung
DE3147789A1 (de) * 1981-12-03 1983-06-09 Brown, Boveri & Cie Ag, 6800 Mannheim Leistungsmodul und verfahren zu seiner herstellung
US4461077A (en) * 1982-10-04 1984-07-24 General Electric Ceramics, Inc. Method for preparing ceramic articles having raised, selectively metallized electrical contact points
JPS5987893A (ja) * 1982-11-12 1984-05-21 株式会社日立製作所 配線基板とその製造方法およびそれを用いた半導体装置
DE3305687A1 (de) * 1983-02-18 1984-08-23 Raymond E. San Diego Calif. Wiech jun. Verfahren zur herstellung komplexer mikroschaltungsplatten, -substrate und mikroschaltungen und nach dem verfahren hergestellte substrate und mikroschaltungen
JPS6028296A (ja) * 1983-07-27 1985-02-13 株式会社日立製作所 セラミツク多層配線回路板
US4540621A (en) * 1983-07-29 1985-09-10 Eggerding Carl L Dielectric substrates comprising cordierite and method of forming the same
US4546065A (en) * 1983-08-08 1985-10-08 International Business Machines Corporation Process for forming a pattern of metallurgy on the top of a ceramic substrate
FR2556503B1 (fr) * 1983-12-08 1986-12-12 Eurofarad Substrat d'interconnexion en alumine pour composant electronique
US4671928A (en) * 1984-04-26 1987-06-09 International Business Machines Corporation Method of controlling the sintering of metal particles
US4562513A (en) * 1984-05-21 1985-12-31 International Business Machines Corporation Process for forming a high density metallurgy system on a substrate and structure thereof
US4521449A (en) * 1984-05-21 1985-06-04 International Business Machines Corporation Process for forming a high density metallurgy system on a substrate and structure thereof
US4572754A (en) * 1984-05-21 1986-02-25 Ctx Corporation Method of making an electrically insulative substrate
JPS60250686A (ja) * 1984-05-25 1985-12-11 日本碍子株式会社 セラミツク配線基板の製造方法
US4598107A (en) * 1984-06-25 1986-07-01 International Business Machines Corporation Stepwise/ultimate density milling
US4657778A (en) * 1984-08-01 1987-04-14 Moran Peter L Multilayer systems and their method of production
FR2571545B1 (fr) * 1984-10-05 1987-11-27 Thomson Csf Procede de fabrication d'un substrat de circuit hybride de forme non plane, et circuit hybride non plan obtenu par ce procede
US4581098A (en) * 1984-10-19 1986-04-08 International Business Machines Corporation MLC green sheet process
US4645552A (en) * 1984-11-19 1987-02-24 Hughes Aircraft Company Process for fabricating dimensionally stable interconnect boards
JPH0610927B2 (ja) * 1985-04-05 1994-02-09 株式会社日立製作所 セラミック基板の製造方法
US4628406A (en) * 1985-05-20 1986-12-09 Tektronix, Inc. Method of packaging integrated circuit chips, and integrated circuit package
JPH0714105B2 (ja) * 1986-05-19 1995-02-15 日本電装株式会社 混成集積回路基板及びその製造方法
JPS62287658A (ja) * 1986-06-06 1987-12-14 Hitachi Ltd セラミックス多層回路板
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AU1346088A (en) * 1987-02-04 1988-08-24 Coors Porcelain Company Ceramic substrate with conductively-filled vias and method for producing
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US4837408A (en) * 1987-05-21 1989-06-06 Ngk Spark Plug Co., Ltd. High density multilayer wiring board and the manufacturing thereof
US4846869A (en) * 1987-08-21 1989-07-11 Delco Electronics Corporation Method of fabrication a curved glass sheet with a conductive oxide coating
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US4970122A (en) * 1987-08-21 1990-11-13 Delco Electronics Corporation Moisture sensor and method of fabrication thereof
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DE3923533A1 (de) * 1989-07-15 1991-01-24 Diehl Gmbh & Co Anordnung eines integrierten schaltkreises auf einem schaltungstraeger
JPH03125443A (ja) * 1989-10-09 1991-05-28 Sharp Corp 実装基板の電極及び該実装基板の電極を有する液晶表示装置
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JP2858073B2 (ja) * 1992-12-28 1999-02-17 ティーディーケイ株式会社 多層セラミック部品
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Citations (2)

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Publication number Priority date Publication date Assignee Title
US3093490A (en) * 1960-04-08 1963-06-11 Eitel Mccullough Inc Ceramic metalizing mixture and method of compounding it
JPS50100566A (ja) * 1972-07-12 1975-08-09

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US3838204A (en) * 1966-03-30 1974-09-24 Ibm Multilayer circuits
US3561110A (en) * 1967-08-31 1971-02-09 Ibm Method of making connections and conductive paths
US3798762A (en) * 1972-08-14 1974-03-26 Us Army Circuit board processing

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
US3093490A (en) * 1960-04-08 1963-06-11 Eitel Mccullough Inc Ceramic metalizing mixture and method of compounding it
JPS50100566A (ja) * 1972-07-12 1975-08-09

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6127242Y2 (ja) * 1980-04-30 1986-08-14
JPS57182971U (ja) * 1981-05-14 1982-11-19
WO2003101166A1 (fr) * 2002-05-28 2003-12-04 Sumitomo Electric Industries, Ltd. Pastille frittee a base de nitrure d'aluminium comportant une couche metallisee et procede de preparation associe

Also Published As

Publication number Publication date
DE2703956A1 (de) 1977-08-04
GB1565421A (en) 1980-04-23
CA1078079A (en) 1980-05-20
JPS5295058A (en) 1977-08-10
FR2340288A1 (fr) 1977-09-02
US4109377A (en) 1978-08-29
FR2340288B1 (ja) 1979-09-21
DE2703956C2 (de) 1986-01-02

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