JPS56136816A - Epoxy resin composition - Google Patents
Epoxy resin compositionInfo
- Publication number
- JPS56136816A JPS56136816A JP4185980A JP4185980A JPS56136816A JP S56136816 A JPS56136816 A JP S56136816A JP 4185980 A JP4185980 A JP 4185980A JP 4185980 A JP4185980 A JP 4185980A JP S56136816 A JPS56136816 A JP S56136816A
- Authority
- JP
- Japan
- Prior art keywords
- ingredient
- amount
- group
- epoxy
- give
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003822 epoxy resin Substances 0.000 title abstract 3
- 239000000203 mixture Substances 0.000 title abstract 3
- 229920000647 polyepoxide Polymers 0.000 title abstract 3
- 239000004615 ingredient Substances 0.000 abstract 5
- 125000003700 epoxy group Chemical group 0.000 abstract 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 abstract 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 2
- 239000011256 inorganic filler Substances 0.000 abstract 2
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 2
- 125000000962 organic group Chemical group 0.000 abstract 2
- 229920002050 silicone resin Polymers 0.000 abstract 2
- 239000004593 Epoxy Substances 0.000 abstract 1
- 125000003277 amino group Chemical group 0.000 abstract 1
- 230000000694 effects Effects 0.000 abstract 1
- 125000000524 functional group Chemical group 0.000 abstract 1
- -1 phenol compound Chemical class 0.000 abstract 1
- 239000000843 powder Substances 0.000 abstract 1
- 229920005989 resin Polymers 0.000 abstract 1
- 239000011347 resin Substances 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
- 239000004065 semiconductor Substances 0.000 abstract 1
- 239000000377 silicon dioxide Substances 0.000 abstract 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4185980A JPS56136816A (en) | 1980-03-31 | 1980-03-31 | Epoxy resin composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4185980A JPS56136816A (en) | 1980-03-31 | 1980-03-31 | Epoxy resin composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS56136816A true JPS56136816A (en) | 1981-10-26 |
| JPS6227095B2 JPS6227095B2 (enrdf_load_stackoverflow) | 1987-06-12 |
Family
ID=12619968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4185980A Granted JPS56136816A (en) | 1980-03-31 | 1980-03-31 | Epoxy resin composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS56136816A (enrdf_load_stackoverflow) |
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5876455A (ja) * | 1981-11-02 | 1983-05-09 | Matsushita Electric Works Ltd | 封止用熱硬化性樹脂成形材料及びこれを用いて成形された電子部品 |
| JPS598715A (ja) * | 1982-07-07 | 1984-01-18 | Mitsubishi Electric Corp | 半導体封止用エポキシ樹脂組成物 |
| JPS5933319A (ja) * | 1982-08-20 | 1984-02-23 | Shin Etsu Chem Co Ltd | 難燃性エポキシ樹脂組成物 |
| JPS59129252A (ja) * | 1983-01-14 | 1984-07-25 | Matsushita Electric Works Ltd | エポキシ樹脂成形材料 |
| JPS59197421A (ja) * | 1983-04-26 | 1984-11-09 | Shin Etsu Chem Co Ltd | 硬化性エポキシ樹脂組成物 |
| JPS6030157A (ja) * | 1983-07-29 | 1985-02-15 | Toshiba Chem Corp | 樹脂封止型半導体装置 |
| JPS6036527A (ja) * | 1983-08-09 | 1985-02-25 | Toshiba Chem Corp | 封止用樹脂組成物 |
| US4518631A (en) * | 1983-11-14 | 1985-05-21 | Dow Corning Corporation | Thixotropic curable coating compositions |
| JPS6118158A (ja) * | 1984-07-04 | 1986-01-27 | Sumitomo Bakelite Co Ltd | 半導体装置の製造方法 |
| JPS6166712A (ja) * | 1984-09-11 | 1986-04-05 | Mitsubishi Electric Corp | 半導体封止用エポキシ樹脂組成物 |
| JPS61101520A (ja) * | 1984-10-23 | 1986-05-20 | Toshiba Chem Corp | 封止用樹脂組成物 |
| JPS61166823A (ja) * | 1985-01-19 | 1986-07-28 | Toshiba Chem Corp | 封止用樹脂組成物 |
| JPS62116654A (ja) * | 1985-10-07 | 1987-05-28 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物 |
| JPS62184017A (ja) * | 1986-02-08 | 1987-08-12 | Matsushita Electric Works Ltd | エポキシ樹脂成形材料 |
| JPS62187721A (ja) * | 1986-02-14 | 1987-08-17 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物 |
| JPS63275624A (ja) * | 1987-05-08 | 1988-11-14 | Hitachi Ltd | 半導体封止用エポキシ樹脂組成物及び樹脂封止型半導体装置 |
| JPH01215820A (ja) * | 1988-02-24 | 1989-08-29 | Hitachi Ltd | 半導体封止用エポキシ樹脂組成物および樹脂封止型半導体装置 |
| US5041474A (en) * | 1988-02-15 | 1991-08-20 | Lucky Ltd. | Epoxy resin compositions for sealing semiconductor devices |
| US5516858A (en) * | 1993-04-15 | 1996-05-14 | Dow Corning Toray Silicone Co., Ltd. | Epoxy group-containing silicone resin and compositions based thereon |
| US5530075A (en) * | 1992-04-21 | 1996-06-25 | Dow Corning Toray Silicone Co., Ltd. | Curable resin composition |
| JPH1054979A (ja) * | 1996-08-12 | 1998-02-24 | Nitto Denko Corp | 液晶表示素子用基板 |
| US5952439A (en) * | 1993-04-15 | 1999-09-14 | Dow Corning Toray Silicone Co., Ltd. | Epoxy group-containing silicone resin and compositions based thereon |
| JP2006176595A (ja) * | 2004-12-21 | 2006-07-06 | Matsushita Electric Works Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
| WO2009090867A1 (ja) * | 2008-01-15 | 2009-07-23 | Sekisui Chemical Co., Ltd. | レジスト材料及び積層体 |
| EP1736500A4 (en) * | 2004-04-16 | 2010-03-24 | Jsr Corp | COMPOSITION FOR SEALING AN OPTICAL SEMICONDUCTOR, MATERIAL FOR SEALING AN OPTICAL SEMICONDUCTOR AND METHOD FOR PRODUCING A COMPOSITION FOR SEALING AN OPTICAL SEMICONDUCTOR |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2013227446A (ja) | 2012-04-26 | 2013-11-07 | Dow Corning Toray Co Ltd | 新規なオルガノポリシロキサン、それを含む熱硬化性樹脂用添加剤、およびそれを含む熱硬化性樹脂組成物 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4828543A (enrdf_load_stackoverflow) * | 1971-08-19 | 1973-04-16 | ||
| JPS52112698A (en) * | 1976-03-19 | 1977-09-21 | Toray Ind Inc | Curable resin compositions |
-
1980
- 1980-03-31 JP JP4185980A patent/JPS56136816A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4828543A (enrdf_load_stackoverflow) * | 1971-08-19 | 1973-04-16 | ||
| JPS52112698A (en) * | 1976-03-19 | 1977-09-21 | Toray Ind Inc | Curable resin compositions |
Cited By (25)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5876455A (ja) * | 1981-11-02 | 1983-05-09 | Matsushita Electric Works Ltd | 封止用熱硬化性樹脂成形材料及びこれを用いて成形された電子部品 |
| JPS598715A (ja) * | 1982-07-07 | 1984-01-18 | Mitsubishi Electric Corp | 半導体封止用エポキシ樹脂組成物 |
| JPS5933319A (ja) * | 1982-08-20 | 1984-02-23 | Shin Etsu Chem Co Ltd | 難燃性エポキシ樹脂組成物 |
| JPS59129252A (ja) * | 1983-01-14 | 1984-07-25 | Matsushita Electric Works Ltd | エポキシ樹脂成形材料 |
| JPS59197421A (ja) * | 1983-04-26 | 1984-11-09 | Shin Etsu Chem Co Ltd | 硬化性エポキシ樹脂組成物 |
| JPS6030157A (ja) * | 1983-07-29 | 1985-02-15 | Toshiba Chem Corp | 樹脂封止型半導体装置 |
| JPS6036527A (ja) * | 1983-08-09 | 1985-02-25 | Toshiba Chem Corp | 封止用樹脂組成物 |
| US4518631A (en) * | 1983-11-14 | 1985-05-21 | Dow Corning Corporation | Thixotropic curable coating compositions |
| JPS6118158A (ja) * | 1984-07-04 | 1986-01-27 | Sumitomo Bakelite Co Ltd | 半導体装置の製造方法 |
| JPS6166712A (ja) * | 1984-09-11 | 1986-04-05 | Mitsubishi Electric Corp | 半導体封止用エポキシ樹脂組成物 |
| JPS61101520A (ja) * | 1984-10-23 | 1986-05-20 | Toshiba Chem Corp | 封止用樹脂組成物 |
| JPS61166823A (ja) * | 1985-01-19 | 1986-07-28 | Toshiba Chem Corp | 封止用樹脂組成物 |
| JPS62116654A (ja) * | 1985-10-07 | 1987-05-28 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物 |
| JPS62184017A (ja) * | 1986-02-08 | 1987-08-12 | Matsushita Electric Works Ltd | エポキシ樹脂成形材料 |
| JPS62187721A (ja) * | 1986-02-14 | 1987-08-17 | Shin Etsu Chem Co Ltd | エポキシ樹脂組成物 |
| JPS63275624A (ja) * | 1987-05-08 | 1988-11-14 | Hitachi Ltd | 半導体封止用エポキシ樹脂組成物及び樹脂封止型半導体装置 |
| US5041474A (en) * | 1988-02-15 | 1991-08-20 | Lucky Ltd. | Epoxy resin compositions for sealing semiconductor devices |
| JPH01215820A (ja) * | 1988-02-24 | 1989-08-29 | Hitachi Ltd | 半導体封止用エポキシ樹脂組成物および樹脂封止型半導体装置 |
| US5530075A (en) * | 1992-04-21 | 1996-06-25 | Dow Corning Toray Silicone Co., Ltd. | Curable resin composition |
| US5516858A (en) * | 1993-04-15 | 1996-05-14 | Dow Corning Toray Silicone Co., Ltd. | Epoxy group-containing silicone resin and compositions based thereon |
| US5952439A (en) * | 1993-04-15 | 1999-09-14 | Dow Corning Toray Silicone Co., Ltd. | Epoxy group-containing silicone resin and compositions based thereon |
| JPH1054979A (ja) * | 1996-08-12 | 1998-02-24 | Nitto Denko Corp | 液晶表示素子用基板 |
| EP1736500A4 (en) * | 2004-04-16 | 2010-03-24 | Jsr Corp | COMPOSITION FOR SEALING AN OPTICAL SEMICONDUCTOR, MATERIAL FOR SEALING AN OPTICAL SEMICONDUCTOR AND METHOD FOR PRODUCING A COMPOSITION FOR SEALING AN OPTICAL SEMICONDUCTOR |
| JP2006176595A (ja) * | 2004-12-21 | 2006-07-06 | Matsushita Electric Works Ltd | 半導体封止用エポキシ樹脂組成物及び半導体装置 |
| WO2009090867A1 (ja) * | 2008-01-15 | 2009-07-23 | Sekisui Chemical Co., Ltd. | レジスト材料及び積層体 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6227095B2 (enrdf_load_stackoverflow) | 1987-06-12 |
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