JPH1174333A5 - - Google Patents
Info
- Publication number
- JPH1174333A5 JPH1174333A5 JP1998194362A JP19436298A JPH1174333A5 JP H1174333 A5 JPH1174333 A5 JP H1174333A5 JP 1998194362 A JP1998194362 A JP 1998194362A JP 19436298 A JP19436298 A JP 19436298A JP H1174333 A5 JPH1174333 A5 JP H1174333A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- support
- support layer
- plasma
- processing chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US08/890743 | 1997-07-11 | ||
| US08/890,743 US6177023B1 (en) | 1997-07-11 | 1997-07-11 | Method and apparatus for electrostatically maintaining substrate flatness |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1174333A JPH1174333A (ja) | 1999-03-16 |
| JPH1174333A5 true JPH1174333A5 (enExample) | 2005-10-27 |
Family
ID=25397090
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10194362A Pending JPH1174333A (ja) | 1997-07-11 | 1998-07-09 | 基板の平面度を静電的に維持する方法及び装置 |
Country Status (2)
| Country | Link |
|---|---|
| US (4) | US6177023B1 (enExample) |
| JP (1) | JPH1174333A (enExample) |
Families Citing this family (40)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6177023B1 (en) | 1997-07-11 | 2001-01-23 | Applied Komatsu Technology, Inc. | Method and apparatus for electrostatically maintaining substrate flatness |
| US6228438B1 (en) * | 1999-08-10 | 2001-05-08 | Unakis Balzers Aktiengesellschaft | Plasma reactor for the treatment of large size substrates |
| KR100503897B1 (ko) * | 2000-02-19 | 2005-07-25 | 엘지.필립스 엘시디 주식회사 | 건식식각 장치의 기판 파손방지 방법 및 건식식각 장치 |
| EP1174910A3 (en) * | 2000-07-20 | 2010-01-06 | Applied Materials, Inc. | Method and apparatus for dechucking a substrate |
| US7160671B2 (en) * | 2001-06-27 | 2007-01-09 | Lam Research Corporation | Method for argon plasma induced ultraviolet light curing step for increasing silicon-containing photoresist selectivity |
| US7390755B1 (en) | 2002-03-26 | 2008-06-24 | Novellus Systems, Inc. | Methods for post etch cleans |
| WO2004025710A2 (en) * | 2002-09-10 | 2004-03-25 | Axcelis Technologies, Inc. | Method of heating a substrate in a variable temperature process using a fixed temperature chuck |
| US20040096636A1 (en) * | 2002-11-18 | 2004-05-20 | Applied Materials, Inc. | Lifting glass substrate without center lift pins |
| KR20040048018A (ko) * | 2002-12-02 | 2004-06-07 | 주식회사 에이디피엔지니어링 | Fpd 제조장치 |
| JP2005064284A (ja) * | 2003-08-14 | 2005-03-10 | Asm Japan Kk | 半導体基板保持装置 |
| US7198276B2 (en) * | 2003-10-24 | 2007-04-03 | International Business Machines Corporation | Adaptive electrostatic pin chuck |
| JP4485828B2 (ja) * | 2004-03-26 | 2010-06-23 | 財団法人国際科学振興財団 | 雰囲気制御された樹脂の接合装置,接合方法および接合された樹脂部材 |
| US20050223986A1 (en) * | 2004-04-12 | 2005-10-13 | Choi Soo Y | Gas diffusion shower head design for large area plasma enhanced chemical vapor deposition |
| US7434712B2 (en) * | 2004-07-09 | 2008-10-14 | Blackhawk Industries Product Group Unlimited Llc | Hooded holster |
| US20060005770A1 (en) * | 2004-07-09 | 2006-01-12 | Robin Tiner | Independently moving substrate supports |
| US7288484B1 (en) | 2004-07-13 | 2007-10-30 | Novellus Systems, Inc. | Photoresist strip method for low-k dielectrics |
| JP4986625B2 (ja) * | 2004-10-19 | 2012-07-25 | 三菱電機株式会社 | 膜の製造方法および当該方法で製造された膜を用いた半導体装置 |
| US8193096B2 (en) * | 2004-12-13 | 2012-06-05 | Novellus Systems, Inc. | High dose implantation strip (HDIS) in H2 base chemistry |
| US8129281B1 (en) | 2005-05-12 | 2012-03-06 | Novellus Systems, Inc. | Plasma based photoresist removal system for cleaning post ash residue |
| JP4836512B2 (ja) * | 2005-07-29 | 2011-12-14 | 東京エレクトロン株式会社 | 基板昇降装置および基板処理装置 |
| US20070137576A1 (en) * | 2005-12-19 | 2007-06-21 | Varian Semiconductor Equipment Associates, Inc. | Technique for providing an inductively coupled radio frequency plasma flood gun |
| KR101197020B1 (ko) * | 2006-06-09 | 2012-11-06 | 주성엔지니어링(주) | 균일한 플라즈마 방전을 위한 기판처리장치 및 이를이용하여 플라즈마 방전세기를 조절하는 방법 |
| US20080029032A1 (en) * | 2006-08-01 | 2008-02-07 | Sun Jennifer Y | Substrate support with protective layer for plasma resistance |
| US7740768B1 (en) * | 2006-10-12 | 2010-06-22 | Novellus Systems, Inc. | Simultaneous front side ash and backside clean |
| US7959735B2 (en) * | 2007-02-08 | 2011-06-14 | Applied Materials, Inc. | Susceptor with insulative inserts |
| US8435895B2 (en) * | 2007-04-04 | 2013-05-07 | Novellus Systems, Inc. | Methods for stripping photoresist and/or cleaning metal regions |
| JP4617364B2 (ja) * | 2008-02-29 | 2011-01-26 | キヤノンアネルバ株式会社 | 基板加熱装置及び処理方法 |
| JP5565892B2 (ja) * | 2008-06-13 | 2014-08-06 | 芝浦メカトロニクス株式会社 | プラズマ処理装置、プラズマ処理方法、および電子デバイスの製造方法 |
| US8591661B2 (en) | 2009-12-11 | 2013-11-26 | Novellus Systems, Inc. | Low damage photoresist strip method for low-K dielectrics |
| US10896842B2 (en) | 2009-10-20 | 2021-01-19 | Tokyo Electron Limited | Manufacturing method of sample table |
| JP5628507B2 (ja) * | 2009-10-20 | 2014-11-19 | 東京エレクトロン株式会社 | 試料台及びマイクロ波プラズマ処理装置 |
| US20110143548A1 (en) | 2009-12-11 | 2011-06-16 | David Cheung | Ultra low silicon loss high dose implant strip |
| JP5770740B2 (ja) * | 2009-12-11 | 2015-08-26 | ノベラス・システムズ・インコーポレーテッドNovellus Systems Incorporated | 高ドーズインプラントストリップの前に行われる、シリコンを保護するためのパッシベーションプロセスの改善方法およびそのための装置 |
| TWI400138B (zh) * | 2010-11-18 | 2013-07-01 | Ind Tech Res Inst | 雷射背面加工吸附方法及其裝置 |
| US9613825B2 (en) | 2011-08-26 | 2017-04-04 | Novellus Systems, Inc. | Photoresist strip processes for improved device integrity |
| DE102012103099B4 (de) | 2012-04-11 | 2015-01-22 | Denso International America, Inc. | Batterieheiz- und -kühlsystem |
| US9916998B2 (en) | 2012-12-04 | 2018-03-13 | Applied Materials, Inc. | Substrate support assembly having a plasma resistant protective layer |
| US9685356B2 (en) | 2012-12-11 | 2017-06-20 | Applied Materials, Inc. | Substrate support assembly having metal bonded protective layer |
| US9514954B2 (en) | 2014-06-10 | 2016-12-06 | Lam Research Corporation | Peroxide-vapor treatment for enhancing photoresist-strip performance and modifying organic films |
| US10020218B2 (en) | 2015-11-17 | 2018-07-10 | Applied Materials, Inc. | Substrate support assembly with deposited surface features |
Family Cites Families (41)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US531453A (en) * | 1894-12-25 | Fastener for meeting-rails of sashes | ||
| US4184188A (en) | 1978-01-16 | 1980-01-15 | Veeco Instruments Inc. | Substrate clamping technique in IC fabrication processes |
| US4298443A (en) * | 1979-08-09 | 1981-11-03 | Bell Telephone Laboratories, Incorporated | High capacity etching apparatus and method |
| CS258107B2 (en) * | 1980-02-11 | 1988-07-15 | Siemens Ag | Turbo-set with hydraulic propeller turbine |
| US4384918A (en) | 1980-09-30 | 1983-05-24 | Fujitsu Limited | Method and apparatus for dry etching and electrostatic chucking device used therein |
| JPS5816078A (ja) | 1981-07-17 | 1983-01-29 | Toshiba Corp | プラズマエツチング装置 |
| KR970003885B1 (ko) | 1987-12-25 | 1997-03-22 | 도오교오 에레구토론 가부시끼 가이샤 | 에칭 방법 및 그 장치 |
| JPH0828205B2 (ja) | 1989-10-27 | 1996-03-21 | 株式会社日立製作所 | ウエハ搬送装置 |
| US5179498A (en) | 1990-05-17 | 1993-01-12 | Tokyo Electron Limited | Electrostatic chuck device |
| EP0458342A1 (en) * | 1990-05-25 | 1991-11-27 | Idemitsu Petrochemical Company Limited | Method for preparation of diamond film-coated body |
| US5310453A (en) | 1992-02-13 | 1994-05-10 | Tokyo Electron Yamanashi Limited | Plasma process method using an electrostatic chuck |
| JPH06244269A (ja) * | 1992-09-07 | 1994-09-02 | Mitsubishi Electric Corp | 半導体製造装置並びに半導体製造装置におけるウエハ真空チャック装置及びガスクリーニング方法及び窒化膜形成方法 |
| JPH06112303A (ja) * | 1992-09-29 | 1994-04-22 | Sony Corp | ウエハ処理装置及びウエハ処理方法 |
| US6001432A (en) * | 1992-11-19 | 1999-12-14 | Semiconductor Energy Laboratory Co., Ltd. | Apparatus for forming films on a substrate |
| JPH06158361A (ja) * | 1992-11-20 | 1994-06-07 | Hitachi Ltd | プラズマ処理装置 |
| US5413360A (en) * | 1992-12-01 | 1995-05-09 | Kyocera Corporation | Electrostatic chuck |
| US5684669A (en) * | 1995-06-07 | 1997-11-04 | Applied Materials, Inc. | Method for dechucking a workpiece from an electrostatic chuck |
| JP2875945B2 (ja) * | 1993-01-28 | 1999-03-31 | アプライド マテリアルズ インコーポレイテッド | Cvdにより大面積のガラス基板上に高堆積速度でシリコン窒化薄膜を堆積する方法 |
| US5366585A (en) * | 1993-01-28 | 1994-11-22 | Applied Materials, Inc. | Method and apparatus for protection of conductive surfaces in a plasma processing reactor |
| JPH06244147A (ja) | 1993-02-16 | 1994-09-02 | Tokyo Electron Ltd | プラズマ処理装置 |
| TW277139B (enExample) * | 1993-09-16 | 1996-06-01 | Hitachi Seisakusyo Kk | |
| JPH07249586A (ja) * | 1993-12-22 | 1995-09-26 | Tokyo Electron Ltd | 処理装置及びその製造方法並びに被処理体の処理方法 |
| US5531835A (en) * | 1994-05-18 | 1996-07-02 | Applied Materials, Inc. | Patterned susceptor to reduce electrostatic force in a CVD chamber |
| US5558717A (en) * | 1994-11-30 | 1996-09-24 | Applied Materials | CVD Processing chamber |
| US5707485A (en) * | 1995-12-20 | 1998-01-13 | Micron Technology, Inc. | Method and apparatus for facilitating removal of material from the backside of wafers via a plasma etch |
| US5897711A (en) * | 1995-12-22 | 1999-04-27 | Lam Research Corporation | Method and apparatus for improving refractive index of dielectric films |
| US5900062A (en) * | 1995-12-28 | 1999-05-04 | Applied Materials, Inc. | Lift pin for dechucking substrates |
| JPH09213777A (ja) * | 1996-01-31 | 1997-08-15 | Kyocera Corp | 静電チャック |
| EP0803900A3 (en) * | 1996-04-26 | 1999-12-29 | Applied Materials, Inc. | Surface preparation to enhance the adhesion of a dielectric layer |
| US5993916A (en) * | 1996-07-12 | 1999-11-30 | Applied Materials, Inc. | Method for substrate processing with improved throughput and yield |
| US5790365A (en) * | 1996-07-31 | 1998-08-04 | Applied Materials, Inc. | Method and apparatus for releasing a workpiece from and electrostatic chuck |
| US5904779A (en) * | 1996-12-19 | 1999-05-18 | Lam Research Corporation | Wafer electrical discharge control by wafer lifter system |
| JPH10237662A (ja) * | 1996-12-24 | 1998-09-08 | Sony Corp | 金属膜のプラズマcvd方法、および金属窒化物膜の形成方法ならびに半導体装置 |
| KR100267784B1 (ko) * | 1996-12-26 | 2001-04-02 | 김영환 | 정전척의 정전력 회복방법 |
| JP3624628B2 (ja) * | 1997-05-20 | 2005-03-02 | 東京エレクトロン株式会社 | 成膜方法及び成膜装置 |
| US5933314A (en) * | 1997-06-27 | 1999-08-03 | Lam Research Corp. | Method and an apparatus for offsetting plasma bias voltage in bi-polar electro-static chucks |
| US6177023B1 (en) | 1997-07-11 | 2001-01-23 | Applied Komatsu Technology, Inc. | Method and apparatus for electrostatically maintaining substrate flatness |
| US6099697A (en) * | 1999-04-13 | 2000-08-08 | Applied Materials, Inc. | Method of and apparatus for restoring a support surface in a semiconductor wafer processing system |
| EP1090417A1 (en) * | 1999-04-20 | 2001-04-11 | Tokyo Electron Limited | Method for single chamber processing of pecvd-ti and cvd-tin films in ic manufacturing |
| KR100709801B1 (ko) * | 1999-11-17 | 2007-04-23 | 동경 엘렉트론 주식회사 | 프리코트막의 형성방법, 성막장치의 아이들링 방법,재치대 구조, 성막장치 및 성막방법 |
| JP4505915B2 (ja) * | 2000-01-13 | 2010-07-21 | 東京エレクトロン株式会社 | 成膜方法 |
-
1997
- 1997-07-11 US US08/890,743 patent/US6177023B1/en not_active Expired - Fee Related
-
1998
- 1998-07-09 JP JP10194362A patent/JPH1174333A/ja active Pending
-
2000
- 2000-11-15 US US09/714,023 patent/US6500265B1/en not_active Expired - Fee Related
-
2002
- 2002-11-18 US US10/299,876 patent/US6902682B2/en not_active Expired - Fee Related
-
2005
- 2005-05-24 US US11/136,662 patent/US20050272273A1/en not_active Abandoned
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