JP4485828B2 - 雰囲気制御された樹脂の接合装置,接合方法および接合された樹脂部材 - Google Patents
雰囲気制御された樹脂の接合装置,接合方法および接合された樹脂部材 Download PDFInfo
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- JP4485828B2 JP4485828B2 JP2004093240A JP2004093240A JP4485828B2 JP 4485828 B2 JP4485828 B2 JP 4485828B2 JP 2004093240 A JP2004093240 A JP 2004093240A JP 2004093240 A JP2004093240 A JP 2004093240A JP 4485828 B2 JP4485828 B2 JP 4485828B2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/001—Joining in special atmospheres
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C65/00—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor
- B29C65/02—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure
- B29C65/14—Joining or sealing of preformed parts, e.g. welding of plastics materials; Apparatus therefor by heating, with or without pressure using wave energy, i.e. electromagnetic radiation, or particle radiation
- B29C65/16—Laser beams
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/01—General aspects dealing with the joint area or with the area to be joined
- B29C66/05—Particular design of joint configurations
- B29C66/10—Particular design of joint configurations particular design of the joint cross-sections
- B29C66/11—Joint cross-sections comprising a single joint-segment, i.e. one of the parts to be joined comprising a single joint-segment in the joint cross-section
- B29C66/114—Single butt joints
- B29C66/1142—Single butt to butt joints
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/50—General aspects of joining tubular articles; General aspects of joining long products, i.e. bars or profiled elements; General aspects of joining single elements to tubular articles, hollow articles or bars; General aspects of joining several hollow-preforms to form hollow or tubular articles
- B29C66/51—Joining tubular articles, profiled elements or bars; Joining single elements to tubular articles, hollow articles or bars; Joining several hollow-preforms to form hollow or tubular articles
- B29C66/52—Joining tubular articles, bars or profiled elements
- B29C66/522—Joining tubular articles
- B29C66/5221—Joining tubular articles for forming coaxial connections, i.e. the tubular articles to be joined forming a zero angle relative to each other
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C66/00—General aspects of processes or apparatus for joining preformed parts
- B29C66/70—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material
- B29C66/71—General aspects of processes or apparatus for joining preformed parts characterised by the composition, physical properties or the structure of the material of the parts to be joined; Joining with non-plastics material characterised by the composition of the plastics material of the parts to be joined
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
- B29K2023/04—Polymers of ethylene
- B29K2023/06—PE, i.e. polyethylene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
- B29K2023/10—Polymers of propylene
- B29K2023/12—PP, i.e. polypropylene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2023/00—Use of polyalkenes or derivatives thereof as moulding material
- B29K2023/38—Polymers of cycloalkenes, e.g. norbornene or cyclopentene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2027/00—Use of polyvinylhalogenides or derivatives thereof as moulding material
- B29K2027/06—PVC, i.e. polyvinylchloride
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2027/00—Use of polyvinylhalogenides or derivatives thereof as moulding material
- B29K2027/12—Use of polyvinylhalogenides or derivatives thereof as moulding material containing fluorine
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2027/00—Use of polyvinylhalogenides or derivatives thereof as moulding material
- B29K2027/12—Use of polyvinylhalogenides or derivatives thereof as moulding material containing fluorine
- B29K2027/14—PVF, i.e. polyvinyl fluoride
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2027/00—Use of polyvinylhalogenides or derivatives thereof as moulding material
- B29K2027/12—Use of polyvinylhalogenides or derivatives thereof as moulding material containing fluorine
- B29K2027/16—PVDF, i.e. polyvinylidene fluoride
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2027/00—Use of polyvinylhalogenides or derivatives thereof as moulding material
- B29K2027/12—Use of polyvinylhalogenides or derivatives thereof as moulding material containing fluorine
- B29K2027/18—PTFE, i.e. polytetrafluorethene, e.g. ePTFE, i.e. expanded polytetrafluorethene
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2071/00—Use of polyethers, e.g. PEEK, i.e. polyether-etherketone or PEK, i.e. polyetherketone or derivatives thereof, as moulding material
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Lining Or Joining Of Plastics Or The Like (AREA)
Description
装置:バイオラット社製、FTS-50A
(分析条件2)大気圧イオン化質量分析(以下「API-MS分析」と略す。)
装置:ルネサステクノロジー社製、UG-400
(分析条件3)全有機炭素分析(以下「TOC分析」と略す。)
装置:O・Iコーポレーション社製、O・I−1010(湿式酸化法)
実施例1の評価機で、接合部5を大気開放にした状態で熱溶着を実施した場合には、COPの熱分解温度は150〜160℃であった。結果を図2に示す。
実施例1の評価機で、あらかじめ接合部カバー3内部に不活性ガスを流通し酸素フリー(<1体積ppb)にし、接合部カバー3内部の水分濃度を体積1.5%に制御した系で接合を実施した場合には、COPの熱分解温度は120〜130℃であった。結果を図3に示す。
接合部カバー3を開け、大気開放条件(酸素濃度体積20%、水分濃度体積1.5%)で実施した以外は実施例6と同様に熱溶着を行った。実施例7で示した分析装置を用い同様の分析を行った結果、TOC濃度は6.9μg/Lであった。分析結果を表に示す。
Claims (25)
- 樹脂材同士を接合する接合装置において、
接合部を覆う容器を有し、
前記容器内部へは、ヘリウム、ネオン、アルゴン、クリプトン、キセノンの少なくとも一つを含む不活性ガス、および水素ガスが流通されており、
接合部を前記容器が覆った状態で接合することを特徴とする、接合装置。 - 請求項1に記載の接合装置において、接合部を昇温する手段を有する、接合装置。
- 請求項2に記載の接合装置において、接合部を昇温する手段がヒーター、レーザーのうち、少なくとも一つを具備することを特徴とする、接合装置。
- 請求項1乃至3のいずれかに記載の接合装置において、接合部を覆った内部雰囲気の酸素濃度が体積1%以下であることを特徴とする、接合装置。
- 請求項1乃至4のいずれかに記載の接合装置において、接合部を覆った内部雰囲気の水分濃度が体積0.1%以下であることを特徴とする、接合装置。
- 請求項1乃至5のいずれかに記載の接合装置において、接合部を覆う容器には不活性ガスおよび水素ガスを供給する供給口と排気する排気口を有することを特徴とする、接合装置。
- 請求項1乃至6のいずれかに記載の接合装置において、不活性ガスおよび水素ガス中に含まれる酸素濃度が体積100ppm以下であることを特徴とする、接合装置。
- 請求項1乃至7のいずれかに記載の接合装置において、不活性ガスおよび水素ガス中に含まれる水分濃度が体積100ppm以下であることを特徴とする、接合装置。
- 請求項1乃至8のいずれかに記載の接合装置において、接合部を覆った内部雰囲気の酸素濃度、水分濃度の少なくとも一つを測定できる計測機器を具備することを特徴とする、接合装置。
- 請求項1乃至9のいずれかに記載の接合装置において、接合する樹脂部材がハイドロカーボンを含む樹脂部材、またはフロロカーボンを含む樹脂部材であることを特徴とする、接合装置。
- 請求項1乃至10のいずれかに記載の接合装置において、接合部を覆った内部は、減圧にすることが出来ることを特徴とする接合装置。
- 請求項1乃至11のいずれかに記載の接合装置において、接合部を覆った内部は、不活性ガスおよび水素ガスの流入と、減圧とを繰り返すことが出来ることを特徴とする、接合装置。
- 樹脂材同士を接合する方法において、接合部を覆い、接合部を覆った内部へ、ヘリウム、ネオン、アルゴン、クリプトン、キセノンの少なくとも一つを含む不活性ガス、および水素ガスとを流通させ、接合部を覆った状態で接合することを特徴とする、接合方法。
- 請求項13に記載の接合方法において、接合部を昇温する手段を有する、接合方法。
- 請求項14に記載の接合方法において、接合部を昇温する手段がヒーター、レーザーのうち、少なくとも一つ用いることを特徴とする、接合方法。
- 請求項13乃至15のいずれかに記載の接合方法において、接合部を覆った内部雰囲気の酸素濃度が体積1%以下であることを特徴とする、接合方法。
- 請求項13乃至16のいずれかに記載の接合方法において、接合部を覆った内部雰囲気の水分濃度が体積0.1%以下であることを特徴とする、接合方法。
- 請求項13乃至17のいずれかに記載の接合方法において、接合部を覆う容器を有し、接合部を覆う容器には不活性ガスおよび水素ガス中を供給する供給口と排気する排気口を有することを特徴とする、接合方法。
- 請求項13乃至18のいずれかに記載の接合方法において、不活性ガスおよび水素ガス中に含まれる酸素濃度が体積100ppm以下であることを特徴とする、接合方法。
- 請求項13乃至19のいずれかに記載の接合方法において、不活性ガスおよび水素ガス中に含まれる水分濃度が体積100ppm以下であることを特徴とする、接合方法。
- 請求項13乃至20のいずれかに記載の接合方法において、接合部を覆った内部雰囲気の酸素濃度、水分濃度の少なくとも一つを測定できる計測機器を具備することを特徴とする、接合方法。
- 請求項13乃至21のいずれかに記載の接合方法において、接合する樹脂部材がハイドロカーボンを含む樹脂部材、またはフロロカーボンを含む樹脂部材であることを特徴とする、接合方法。
- 請求項13乃至22のいずれかに記載の接合方法において、接合部を覆った内部は、減圧にすることが出来ることを特徴とする、接合方法。
- 請求項13乃至23のいずれかに記載の接合方法において、接合部を覆った内部は、不活性ガスおよび水素ガスの流入と、減圧とを繰り返すことが出来ることを特徴とする、接合方法。
- 接合する樹脂部材の接合部を覆う第一の工程と、接合部を覆った内部に不活性ガスおよび水素ガスを流通させ酸素濃度を1%以下、水分濃度を0.1%以下に下げる第二の工程と、接合部を加熱し溶融接合する第三の工程と、接合部が冷却される第四の工程からなる、接合方法。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004093240A JP4485828B2 (ja) | 2004-03-26 | 2004-03-26 | 雰囲気制御された樹脂の接合装置,接合方法および接合された樹脂部材 |
US11/223,141 US20060196593A1 (en) | 2004-03-26 | 2005-09-12 | Atmosphere-controlled resin-bonding apparatus, bonding method and resin member bonded thereby |
US13/034,504 US20110139334A1 (en) | 2004-03-26 | 2011-02-24 | Bonding method and resin member bonded thereby |
Applications Claiming Priority (1)
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JP2004093240A JP4485828B2 (ja) | 2004-03-26 | 2004-03-26 | 雰囲気制御された樹脂の接合装置,接合方法および接合された樹脂部材 |
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JP2005279955A JP2005279955A (ja) | 2005-10-13 |
JP4485828B2 true JP4485828B2 (ja) | 2010-06-23 |
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US7943884B2 (en) | 2005-03-02 | 2011-05-17 | Toyota Jidosha Kabushiki Kaisha | Gas container and method of producing the same |
JP2007111926A (ja) * | 2005-10-19 | 2007-05-10 | Toyota Motor Corp | 熱可塑性樹脂部材のレーザ溶着方法およびレーザ溶着装置 |
JP2008114420A (ja) * | 2006-11-01 | 2008-05-22 | Hamamatsu Photonics Kk | レーザ溶着方法及びレーザ溶着装置、並びに樹脂製品の製造方法 |
JP2009066906A (ja) * | 2007-09-13 | 2009-04-02 | Nippon Avionics Co Ltd | 熱可塑性樹脂の熱かしめ方法およびその装置 |
MY194306A (en) * | 2014-07-28 | 2022-11-27 | Nat Univ Singapore | Rapid cleaning method for ultrapure water piping system |
KR20170071539A (ko) * | 2014-10-15 | 2017-06-23 | 우시오덴키 가부시키가이샤 | 워크의 붙임 방법 |
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US5074951A (en) * | 1988-09-23 | 1991-12-24 | The Dow Chemical Company | Apparatus for inert atmosphere sealing |
JPH06109200A (ja) * | 1991-11-20 | 1994-04-19 | Tadahiro Omi | 超高純度流体供給配管系及びその施工方法 |
US5795399A (en) * | 1994-06-30 | 1998-08-18 | Kabushiki Kaisha Toshiba | Semiconductor device manufacturing apparatus, method for removing reaction product, and method of suppressing deposition of reaction product |
US5814175A (en) * | 1995-06-07 | 1998-09-29 | Edlon Inc. | Welded thermoplastic polymer article and a method and apparatus for making same |
US6177023B1 (en) * | 1997-07-11 | 2001-01-23 | Applied Komatsu Technology, Inc. | Method and apparatus for electrostatically maintaining substrate flatness |
TWI225499B (en) * | 1999-04-15 | 2004-12-21 | Konishiroku Photo Ind | Protective film for polarizing plate |
US6838115B2 (en) * | 2000-07-12 | 2005-01-04 | Fsi International, Inc. | Thermal processing system and methods for forming low-k dielectric films suitable for incorporation into microelectronic devices |
JP4822577B2 (ja) * | 2000-08-18 | 2011-11-24 | 東レエンジニアリング株式会社 | 実装方法および装置 |
US6770562B2 (en) * | 2000-10-26 | 2004-08-03 | Semiconductor Energy Laboratory Co., Ltd. | Film formation apparatus and film formation method |
DE10100427A1 (de) * | 2001-01-08 | 2002-07-18 | Steag Hamatech Ag | Verfahren und Vorrichtung zum Zusammenfügen von Substraten |
SG143063A1 (en) * | 2002-01-24 | 2008-06-27 | Semiconductor Energy Lab | Light emitting device and method of manufacturing the same |
TWI258316B (en) * | 2002-10-25 | 2006-07-11 | Ritdisplay Corp | FPD encapsulation apparatus and method for encapsulating ehereof |
US7221463B2 (en) * | 2003-03-14 | 2007-05-22 | Canon Kabushiki Kaisha | Positioning apparatus, exposure apparatus, and method for producing device |
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2004
- 2004-03-26 JP JP2004093240A patent/JP4485828B2/ja not_active Expired - Fee Related
-
2005
- 2005-09-12 US US11/223,141 patent/US20060196593A1/en not_active Abandoned
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2011
- 2011-02-24 US US13/034,504 patent/US20110139334A1/en not_active Abandoned
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US20110139334A1 (en) | 2011-06-16 |
JP2005279955A (ja) | 2005-10-13 |
US20060196593A1 (en) | 2006-09-07 |
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