JPH10261756A5 - - Google Patents

Info

Publication number
JPH10261756A5
JPH10261756A5 JP1997085868A JP8586897A JPH10261756A5 JP H10261756 A5 JPH10261756 A5 JP H10261756A5 JP 1997085868 A JP1997085868 A JP 1997085868A JP 8586897 A JP8586897 A JP 8586897A JP H10261756 A5 JPH10261756 A5 JP H10261756A5
Authority
JP
Japan
Prior art keywords
large current
semiconductor pellet
semiconductor
semiconductor device
wires
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1997085868A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10261756A (ja
JP3675603B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority to JP08586897A priority Critical patent/JP3675603B2/ja
Priority claimed from JP08586897A external-priority patent/JP3675603B2/ja
Publication of JPH10261756A publication Critical patent/JPH10261756A/ja
Publication of JPH10261756A5 publication Critical patent/JPH10261756A5/ja
Application granted granted Critical
Publication of JP3675603B2 publication Critical patent/JP3675603B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP08586897A 1997-03-19 1997-03-19 半導体装置 Expired - Fee Related JP3675603B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP08586897A JP3675603B2 (ja) 1997-03-19 1997-03-19 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP08586897A JP3675603B2 (ja) 1997-03-19 1997-03-19 半導体装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2004301278A Division JP2005064532A (ja) 2004-10-15 2004-10-15 半導体装置

Publications (3)

Publication Number Publication Date
JPH10261756A JPH10261756A (ja) 1998-09-29
JPH10261756A5 true JPH10261756A5 (OSRAM) 2004-10-21
JP3675603B2 JP3675603B2 (ja) 2005-07-27

Family

ID=13870883

Family Applications (1)

Application Number Title Priority Date Filing Date
JP08586897A Expired - Fee Related JP3675603B2 (ja) 1997-03-19 1997-03-19 半導体装置

Country Status (1)

Country Link
JP (1) JP3675603B2 (OSRAM)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6396127B1 (en) 1998-09-25 2002-05-28 International Rectifier Corporation Semiconductor package
JP3563387B2 (ja) * 2001-01-23 2004-09-08 Ｎｅｃエレクトロニクス株式会社 半導体装置用導電性硬化樹脂及び半導体装置
JP4112816B2 (ja) 2001-04-18 2008-07-02 株式会社東芝 半導体装置および半導体装置の製造方法
JP4801278B2 (ja) 2001-04-23 2011-10-26 株式会社半導体エネルギー研究所 発光装置及びその作製方法
JP4248953B2 (ja) 2003-06-30 2009-04-02 株式会社ルネサステクノロジ 半導体装置およびその製造方法
EP1825524A4 (en) * 2004-12-16 2010-06-16 Seoul Semiconductor Co Ltd CONNECTING COMBUSTION WITH A REFRIGERATOR BODY HOLDERING, METHOD OF MANUFACTURING LIGHT DIODE SEALING THEREFOR AND BY THE PROCESS MANUFACTURED LIGHT DIODE SEALING
US7375424B2 (en) * 2005-05-03 2008-05-20 International Rectifier Corporation Wirebonded device packages for semiconductor devices having elongated electrodes
JP2007067342A (ja) * 2005-09-02 2007-03-15 Ultrasonic Engineering Co Ltd ワイヤボンディング方法およびワイヤボンディング装置
JP5151537B2 (ja) * 2008-02-20 2013-02-27 三菱電機株式会社 パワー半導体素子
JP2012190936A (ja) * 2011-03-09 2012-10-04 Sharp Corp 半導体装置のデバイス実装構造
US8946876B2 (en) * 2011-09-29 2015-02-03 Sharp Kabushiki Kaisha Semiconductor device
JP5448110B2 (ja) * 2012-03-12 2014-03-19 ルネサスエレクトロニクス株式会社 半導体装置
JP5387715B2 (ja) 2012-04-06 2014-01-15 住友電気工業株式会社 半導体デバイス
JP2013222781A (ja) * 2012-04-16 2013-10-28 Sharp Corp 半導体装置のデバイス実装構造
CN105723619A (zh) * 2013-11-20 2016-06-29 罗姆股份有限公司 开关器件及电子电路
JP2015019115A (ja) * 2014-10-28 2015-01-29 ルネサスエレクトロニクス株式会社 半導体装置
JP2016040839A (ja) * 2015-10-27 2016-03-24 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
DE102019128394A1 (de) * 2019-10-21 2021-04-22 Infineon Technologies Ag Halbleiter-die, halbleitervorrichtung und igbt-modul

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