JP2007067342A - ワイヤボンディング方法およびワイヤボンディング装置 - Google Patents
ワイヤボンディング方法およびワイヤボンディング装置 Download PDFInfo
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- JP2007067342A JP2007067342A JP2005255050A JP2005255050A JP2007067342A JP 2007067342 A JP2007067342 A JP 2007067342A JP 2005255050 A JP2005255050 A JP 2005255050A JP 2005255050 A JP2005255050 A JP 2005255050A JP 2007067342 A JP2007067342 A JP 2007067342A
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- 238000000034 method Methods 0.000 title claims abstract description 47
- 239000004065 semiconductor Substances 0.000 abstract description 24
- 238000004519 manufacturing process Methods 0.000 abstract description 7
- 239000010408 film Substances 0.000 description 7
- 239000004033 plastic Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 230000006378 damage Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
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- 239000003822 epoxy resin Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
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Abstract
【解決手段】 1本のボンディングツールを使用して半導体デバイス上の2つの電極を接続するワイヤボンディング方法であって、第1の電極4の上面に複数のワイヤ6を同時に超音波ボンディングする過程と、ボンディングツール7が第2の電極5の上面へ移動しながら複数のワイヤにループを形成する過程と、第2の電極5の上面に、ループを形成した複数のワイヤ6を同時に超音波ボンディングする過程とを有するワイヤボンディング方法、およびこれを実施するワイヤボンディング装置を提供する。
【選択図】 図1
Description
円形断面のワイヤを用いてボンディングを行った場合、ワイヤと電極との接合強度については通常問題ないが、先行技術であるリボンと比較してみると、前述した直径が0.4mmのワイヤを4本使用した場合、ボンディング後の接合幅は一本当たり0.44mm〜0.6mmであって、4本の合計幅は1.76〜2.4mmである。一方、一般的に用いられているリボンの断面寸法は2mm*0.2mm程度であって、ボンディング後も接合幅は略変わらない。したがって、接合面積はマルチワイヤの方が確保しやすく、接合強度も優れている。
2 ダイパッド
3 半導体チップ
4 ボンディングパッド
5 リード
6 ワイヤ
7 ボンディングツール
8 ワイヤガイド
9 ガイドホルダ
10 ワイヤクランプ
11 カッタ
21 超音波発振器
22 BLT振動子
23 コーン
24 ホーン
25 ボンディングツール固定ねじ
26 ブロック
27 ワイヤスプール
28 第2のワイヤガイド
Claims (9)
- 2つの電極をワイヤによって接続するワイヤボンディング方法であって、
第1の電極の上面に、ボンディングツールにより複数のワイヤを同時に超音波ボンディングする第1の工程と、
前記ボンディングツールが第2の電極の上面へ移動しながら前記複数のワイヤにループを形成する第2の工程と、
前記ループを形成した複数のワイヤを、前記第2の電極の上面に、前記ボンディングツールにより同時に超音波ボンディングする第3の工程と
を有することを特徴とするワイヤボンディング方法。 - 前記第1および第3の工程において、前記複数のワイヤを互いに接触させて配置し、或いはボンディング中に接触する程に近接配置してボンディングすることを特徴とする、請求項1に記載のワイヤボンディング方法。
- 前記第1および第3の工程において、前記複数のワイヤを互いに接触させないように配置してボンディングすることを特徴とする、請求項1に記載のワイヤボンディング方法。
- 前記第1の電極と第2の電極とを結んだ直線の方向が、平面視において、前記第1の電極の上面にボンディングされた部分のワイヤの軸方向と異なることを特徴とする、請求項1〜請求項3のいずれか一項に記載のワイヤボンディング方法。
- 前記第1および第3の工程の少なくとも一方において、前記ボンディングツールが所定量ずつ移動しながら前記ボンディングを複数回行うことを特徴とする、請求項1〜請求項4のいずれか一項に記載のワイヤボンディング方法。
- 超音波により複数のワイヤを同時にボンディングするためのボンディングツールであって、
前記超音波の振動方向と直交する向きに延在する先端部を有し、該先端部に前記超音波の振動方向に延在してそれぞれワイヤに係合する複数の溝を備えたことを特徴とするボンディングツール。 - ボンディングツールの先端付近に配設され、複数のワイヤを同時にボンディングするために当該複数のワイヤを前記ボンディングツールの先端に導くワイヤガイドであって、
前記複数のワイヤを所定位置に導くガイド手段を備えたことを特徴とするワイヤガイド。 - 超音波により複数のワイヤを同時にボンディングするためのワイヤボンディング装置であって、
前記複数のワイヤを供給するワイヤ供給機構と、
前記超音波の振動方向と直交する向きに延在する先端部を有し、該先端部に前記超音波の振動方向に延在してそれぞれワイヤに係合する複数の溝を備えたボンディングツールと
を有することを特徴とするワイヤボンディング装置。 - 前記ボンディングツールの先端付近に配設され、前記複数のワイヤを所定位置に導くガイド手段を備えたワイヤガイドをさらに有することを特徴とする、請求項8に記載のワイヤボンディング装置。
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US8084847B2 (en) | 2008-06-18 | 2011-12-27 | Samsung Electronics Co., Ltd. | Prefabricated lead frame and bonding method using the same |
JP2012195459A (ja) * | 2011-03-16 | 2012-10-11 | Sharp Corp | ワイヤーボンディング方法、及び、半導体装置 |
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CN103219255A (zh) * | 2013-03-15 | 2013-07-24 | 李尚哲 | 一种带多个焊线槽的超声波焊接劈刀 |
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JP2019102382A (ja) * | 2017-12-07 | 2019-06-24 | トヨタ自動車株式会社 | 電池モジュールの製造方法 |
CN111063622A (zh) * | 2019-12-09 | 2020-04-24 | 常州市润祥电子科技有限公司 | 一种用于半导体封装的高效焊接方法 |
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CN111063622A (zh) * | 2019-12-09 | 2020-04-24 | 常州市润祥电子科技有限公司 | 一种用于半导体封装的高效焊接方法 |
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