JPH10116789A5 - - Google Patents

Info

Publication number
JPH10116789A5
JPH10116789A5 JP1996328943A JP32894396A JPH10116789A5 JP H10116789 A5 JPH10116789 A5 JP H10116789A5 JP 1996328943 A JP1996328943 A JP 1996328943A JP 32894396 A JP32894396 A JP 32894396A JP H10116789 A5 JPH10116789 A5 JP H10116789A5
Authority
JP
Japan
Prior art keywords
substrate
rotation
chamber
rotating
sun gear
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1996328943A
Other languages
English (en)
Japanese (ja)
Other versions
JPH10116789A (ja
JP4037932B2 (ja
Filing date
Publication date
Priority claimed from US08/570,220 external-priority patent/US5795448A/en
Application filed filed Critical
Publication of JPH10116789A publication Critical patent/JPH10116789A/ja
Publication of JPH10116789A5 publication Critical patent/JPH10116789A5/ja
Application granted granted Critical
Publication of JP4037932B2 publication Critical patent/JP4037932B2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

JP32894396A 1995-12-08 1996-12-09 基板回転装置及び基板回転方法 Expired - Fee Related JP4037932B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/570220 1995-12-08
US08/570,220 US5795448A (en) 1995-12-08 1995-12-08 Magnetic device for rotating a substrate

Publications (3)

Publication Number Publication Date
JPH10116789A JPH10116789A (ja) 1998-05-06
JPH10116789A5 true JPH10116789A5 (enExample) 2004-11-25
JP4037932B2 JP4037932B2 (ja) 2008-01-23

Family

ID=24278751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32894396A Expired - Fee Related JP4037932B2 (ja) 1995-12-08 1996-12-09 基板回転装置及び基板回転方法

Country Status (4)

Country Link
US (1) US5795448A (enExample)
JP (1) JP4037932B2 (enExample)
CH (1) CH691596A5 (enExample)
DE (1) DE19649412B4 (enExample)

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KR100531555B1 (ko) * 2002-02-14 2005-11-28 주성엔지니어링(주) 회전가능한 1개 이상의 가스분사기가 구비된 박막증착장치 및 이를 이용한 박막 증착방법
US7954219B2 (en) * 2004-08-20 2011-06-07 Jds Uniphase Corporation Substrate holder assembly device
US7879209B2 (en) 2004-08-20 2011-02-01 Jds Uniphase Corporation Cathode for sputter coating
US7785456B2 (en) * 2004-10-19 2010-08-31 Jds Uniphase Corporation Magnetic latch for a vapour deposition system
US8500973B2 (en) * 2004-08-20 2013-08-06 Jds Uniphase Corporation Anode for sputter coating
US20060049041A1 (en) * 2004-08-20 2006-03-09 Jds Uniphase Corporation Anode for sputter coating
PL1630260T3 (pl) * 2004-08-20 2011-12-30 Jds Uniphase Inc Zatrzask magnetyczny dla układu do osadzania próżniowego
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US8282768B1 (en) 2005-04-26 2012-10-09 Novellus Systems, Inc. Purging of porogen from UV cure chamber
US8137465B1 (en) * 2005-04-26 2012-03-20 Novellus Systems, Inc. Single-chamber sequential curing of semiconductor wafers
US8454750B1 (en) 2005-04-26 2013-06-04 Novellus Systems, Inc. Multi-station sequential curing of dielectric films
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US8398816B1 (en) 2006-03-28 2013-03-19 Novellus Systems, Inc. Method and apparatuses for reducing porogen accumulation from a UV-cure chamber
JP4552861B2 (ja) * 2006-01-06 2010-09-29 富士電機デバイステクノロジー株式会社 磁気記録媒体の製造方法および製造装置
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JP4657959B2 (ja) * 2006-03-20 2011-03-23 ダブリュディ・メディア・シンガポール・プライベートリミテッド 成膜装置及び磁気ディスクの製造方法
EP1999292B1 (en) * 2006-03-28 2014-01-22 Sulzer Metaplas GmbH Sputtering apparatus
EP1903603A3 (en) * 2006-09-20 2009-09-16 JDS Uniphase Corporation Substrate holder assembly device
US8101055B2 (en) * 2007-12-19 2012-01-24 Kojima Press Industry Co., Ltd. Sputtering apparatus and method for forming coating film by sputtering
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CN101899642B (zh) * 2009-05-25 2013-03-20 鸿富锦精密工业(深圳)有限公司 镀膜装置
JP5310512B2 (ja) * 2009-12-02 2013-10-09 東京エレクトロン株式会社 基板処理装置
US8647437B2 (en) * 2010-05-31 2014-02-11 Ci Systems (Israel) Ltd. Apparatus, tool and methods for depositing annular or circular wedge coatings
DE102011007735A1 (de) 2010-06-14 2011-12-15 S.O.I. Tec Silicon On Insulator Technologies Systeme und Verfahren zur Gasbehandlung einer Anzahl von Substraten
US9281231B2 (en) 2011-10-12 2016-03-08 Ferrotec (Usa) Corporation Non-contact magnetic drive assembly with mechanical stop elements
US9028765B2 (en) 2013-08-23 2015-05-12 Lam Research Corporation Exhaust flow spreading baffle-riser to optimize remote plasma window clean
WO2015179387A1 (en) * 2014-05-21 2015-11-26 Brewer Science Inc. Multi-size adaptable spin chuck system
JP6330623B2 (ja) * 2014-10-31 2018-05-30 東京エレクトロン株式会社 成膜装置、成膜方法及び記憶媒体
JP6330630B2 (ja) * 2014-11-13 2018-05-30 東京エレクトロン株式会社 成膜装置
KR102508025B1 (ko) 2015-05-11 2023-03-10 주성엔지니어링(주) 공정챔버 내부에 배치되는 기판 처리장치 및 그 작동방법
CN105063550B (zh) * 2015-08-20 2017-11-28 包头天和磁材技术有限责任公司 渗透装置及方法
JP6507953B2 (ja) * 2015-09-08 2019-05-08 東京エレクトロン株式会社 基板処理装置及び基板処理方法
US10388546B2 (en) 2015-11-16 2019-08-20 Lam Research Corporation Apparatus for UV flowable dielectric
KR102510956B1 (ko) * 2016-01-21 2023-03-16 주성엔지니어링(주) 기판 처리장치
CN107022754B (zh) * 2016-02-02 2020-06-02 东京毅力科创株式会社 基板处理装置
JP6740881B2 (ja) * 2016-02-02 2020-08-19 東京エレクトロン株式会社 基板処理装置
KR20180128889A (ko) * 2016-03-29 2018-12-04 가부시키가이샤 알박 성막 장치 및 성막 방법
KR102669903B1 (ko) * 2016-08-30 2024-05-28 주성엔지니어링(주) 기판 처리 장치
JP6777055B2 (ja) * 2017-01-11 2020-10-28 東京エレクトロン株式会社 基板処理装置
JP6922408B2 (ja) * 2017-05-18 2021-08-18 東京エレクトロン株式会社 基板処理装置
US11072117B2 (en) * 2017-11-27 2021-07-27 Arcam Ab Platform device
US10109517B1 (en) * 2018-01-10 2018-10-23 Lam Research Corporation Rotational indexer with additional rotational axes
US11313039B2 (en) 2018-05-04 2022-04-26 Jiangsu Favored Nanotechnology Co., LTD Nano-coating protection method for electrical devices
CN112204169A (zh) * 2018-05-16 2021-01-08 应用材料公司 原子层自对准的基板处理和整合式成套工具
JP7187385B2 (ja) * 2019-05-22 2022-12-12 東京エレクトロン株式会社 磁気駆動装置、着磁方法及び磁気駆動装置の製造方法
JP7325313B2 (ja) * 2019-12-11 2023-08-14 東京エレクトロン株式会社 回転駆動装置、基板処理装置及び回転駆動方法
JP7382836B2 (ja) * 2020-01-15 2023-11-17 東京エレクトロン株式会社 基板処理装置及び回転駆動方法
US12467129B2 (en) * 2022-11-09 2025-11-11 Battelle Savannah River Alliance, Llc Sputtering apparatus and related systems and methods for sputtering substrates
WO2024118468A1 (en) * 2022-11-28 2024-06-06 Veeco Instruments Inc. Multi-disc chemical vapor deposition system
KR20240162391A (ko) * 2023-05-08 2024-11-15 주식회사 원익아이피에스 기판 처리 장치
GB202319929D0 (en) 2023-12-22 2024-02-07 Spts Technologies Ltd Pvd apparatus and method

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JPH01184277A (ja) * 1988-01-18 1989-07-21 Matsushita Electric Ind Co Ltd 基板回転装置
US5124013A (en) * 1988-02-08 1992-06-23 Optical Coating Laboratory, Inc. High ratio planetary drive system and method for vacuum chamber
DE4025659A1 (de) * 1990-08-14 1992-02-20 Leybold Ag Umlaufraedergetriebe mit einem raedersatz, insbesondere fuer vorrichtungen zum beschichten von substraten
US5525199A (en) * 1991-11-13 1996-06-11 Optical Corporation Of America Low pressure reactive magnetron sputtering apparatus and method
US5377816A (en) * 1993-07-15 1995-01-03 Materials Research Corp. Spiral magnetic linear translating mechanism
US5468299A (en) * 1995-01-09 1995-11-21 Tsai; Charles S. Device comprising a flat susceptor rotating parallel to a reference surface about a shaft perpendicular to this surface

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