DE19649412B4 - Vorrichtung und Verfahren zum Bewegen eines Substrats - Google Patents

Vorrichtung und Verfahren zum Bewegen eines Substrats Download PDF

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Publication number
DE19649412B4
DE19649412B4 DE19649412A DE19649412A DE19649412B4 DE 19649412 B4 DE19649412 B4 DE 19649412B4 DE 19649412 A DE19649412 A DE 19649412A DE 19649412 A DE19649412 A DE 19649412A DE 19649412 B4 DE19649412 B4 DE 19649412B4
Authority
DE
Germany
Prior art keywords
substrate
chamber
rotation
axis
planetary gear
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE19649412A
Other languages
German (de)
English (en)
Other versions
DE19649412A1 (de
Inventor
Steven Hurwitt
Ira Reiss
Marian Zielinski
Swie-In San Jose Tan
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Read Rite Corp
Materials Research Corp
Original Assignee
Read Rite Corp
Materials Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Read Rite Corp, Materials Research Corp filed Critical Read Rite Corp
Publication of DE19649412A1 publication Critical patent/DE19649412A1/de
Application granted granted Critical
Publication of DE19649412B4 publication Critical patent/DE19649412B4/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
DE19649412A 1995-12-08 1996-11-28 Vorrichtung und Verfahren zum Bewegen eines Substrats Expired - Fee Related DE19649412B4 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/570,220 1995-12-08
US08/570,220 US5795448A (en) 1995-12-08 1995-12-08 Magnetic device for rotating a substrate

Publications (2)

Publication Number Publication Date
DE19649412A1 DE19649412A1 (de) 1997-06-12
DE19649412B4 true DE19649412B4 (de) 2009-07-02

Family

ID=24278751

Family Applications (1)

Application Number Title Priority Date Filing Date
DE19649412A Expired - Fee Related DE19649412B4 (de) 1995-12-08 1996-11-28 Vorrichtung und Verfahren zum Bewegen eines Substrats

Country Status (4)

Country Link
US (1) US5795448A (enExample)
JP (1) JP4037932B2 (enExample)
CH (1) CH691596A5 (enExample)
DE (1) DE19649412B4 (enExample)

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JP4537566B2 (ja) * 2000-12-07 2010-09-01 大陽日酸株式会社 基板回転機構を備えた成膜装置
US6770146B2 (en) 2001-02-02 2004-08-03 Mattson Technology, Inc. Method and system for rotating a semiconductor wafer in processing chambers
US6592675B2 (en) * 2001-08-09 2003-07-15 Moore Epitaxial, Inc. Rotating susceptor
JP4449293B2 (ja) * 2001-12-19 2010-04-14 株式会社ニコン 成膜装置、及び光学部材の製造方法
KR100531555B1 (ko) * 2002-02-14 2005-11-28 주성엔지니어링(주) 회전가능한 1개 이상의 가스분사기가 구비된 박막증착장치 및 이를 이용한 박막 증착방법
US7785456B2 (en) * 2004-10-19 2010-08-31 Jds Uniphase Corporation Magnetic latch for a vapour deposition system
US7879209B2 (en) * 2004-08-20 2011-02-01 Jds Uniphase Corporation Cathode for sputter coating
US20060049041A1 (en) * 2004-08-20 2006-03-09 Jds Uniphase Corporation Anode for sputter coating
EP1630260B1 (en) * 2004-08-20 2011-07-13 JDS Uniphase Inc. Magnetic latch for a vapour deposition system
US7954219B2 (en) * 2004-08-20 2011-06-07 Jds Uniphase Corporation Substrate holder assembly device
US8500973B2 (en) * 2004-08-20 2013-08-06 Jds Uniphase Corporation Anode for sputter coating
US20060054494A1 (en) * 2004-09-16 2006-03-16 Veeco Instruments Inc. Physical vapor deposition apparatus for depositing thin multilayer films and methods of depositing such films
US8137465B1 (en) * 2005-04-26 2012-03-20 Novellus Systems, Inc. Single-chamber sequential curing of semiconductor wafers
US8454750B1 (en) 2005-04-26 2013-06-04 Novellus Systems, Inc. Multi-station sequential curing of dielectric films
US8282768B1 (en) 2005-04-26 2012-10-09 Novellus Systems, Inc. Purging of porogen from UV cure chamber
US20070045102A1 (en) * 2005-08-23 2007-03-01 Veeco Instruments Inc. Method of sputter depositing an alloy on a substrate
US8398816B1 (en) 2006-03-28 2013-03-19 Novellus Systems, Inc. Method and apparatuses for reducing porogen accumulation from a UV-cure chamber
JP4552861B2 (ja) * 2006-01-06 2010-09-29 富士電機デバイステクノロジー株式会社 磁気記録媒体の製造方法および製造装置
US20070209932A1 (en) * 2006-03-10 2007-09-13 Veeco Instruments Inc. Sputter deposition system and methods of use
JP4657959B2 (ja) * 2006-03-20 2011-03-23 ダブリュディ・メディア・シンガポール・プライベートリミテッド 成膜装置及び磁気ディスクの製造方法
JP5355382B2 (ja) * 2006-03-28 2013-11-27 スルザー メタプラス ゲーエムベーハー スパッタリング装置
EP1903603A3 (en) * 2006-09-20 2009-09-16 JDS Uniphase Corporation Substrate holder assembly device
US8101055B2 (en) * 2007-12-19 2012-01-24 Kojima Press Industry Co., Ltd. Sputtering apparatus and method for forming coating film by sputtering
NL1036693C2 (nl) * 2009-03-10 2010-09-13 Dofra B V Inrichting geschikt voor het bewerken van landbouwgewassen zoals bolgewassen alsmede een dergelijke werkwijze.
CN101899642B (zh) * 2009-05-25 2013-03-20 鸿富锦精密工业（深圳）有限公司 镀膜装置
JP5310512B2 (ja) * 2009-12-02 2013-10-09 東京エレクトロン株式会社 基板処理装置
US8647437B2 (en) * 2010-05-31 2014-02-11 Ci Systems (Israel) Ltd. Apparatus, tool and methods for depositing annular or circular wedge coatings
DE102011007735A1 (de) 2010-06-14 2011-12-15 S.O.I. Tec Silicon On Insulator Technologies Systeme und Verfahren zur Gasbehandlung einer Anzahl von Substraten
US9281231B2 (en) 2011-10-12 2016-03-08 Ferrotec (Usa) Corporation Non-contact magnetic drive assembly with mechanical stop elements
US9028765B2 (en) 2013-08-23 2015-05-12 Lam Research Corporation Exhaust flow spreading baffle-riser to optimize remote plasma window clean
US10204820B2 (en) * 2014-05-21 2019-02-12 Cost Effective Equipment Llc Multi-size adaptable spin chuck system
JP6330623B2 (ja) * 2014-10-31 2018-05-30 東京エレクトロン株式会社 成膜装置、成膜方法及び記憶媒体
JP6330630B2 (ja) * 2014-11-13 2018-05-30 東京エレクトロン株式会社 成膜装置
KR102508025B1 (ko) * 2015-05-11 2023-03-10 주성엔지니어링(주) 공정챔버 내부에 배치되는 기판 처리장치 및 그 작동방법
CN105063550B (zh) * 2015-08-20 2017-11-28 包头天和磁材技术有限责任公司 渗透装置及方法
JP6507953B2 (ja) * 2015-09-08 2019-05-08 東京エレクトロン株式会社 基板処理装置及び基板処理方法
US10388546B2 (en) 2015-11-16 2019-08-20 Lam Research Corporation Apparatus for UV flowable dielectric
KR102510956B1 (ko) * 2016-01-21 2023-03-16 주성엔지니어링(주) 기판 처리장치
CN107022754B (zh) * 2016-02-02 2020-06-02 东京毅力科创株式会社 基板处理装置
JP6740881B2 (ja) * 2016-02-02 2020-08-19 東京エレクトロン株式会社 基板処理装置
JP6542466B2 (ja) * 2016-03-29 2019-07-10 株式会社アルバック 成膜装置、および、成膜方法
KR102669903B1 (ko) * 2016-08-30 2024-05-28 주성엔지니어링(주) 기판 처리 장치
JP6777055B2 (ja) * 2017-01-11 2020-10-28 東京エレクトロン株式会社 基板処理装置
JP6922408B2 (ja) * 2017-05-18 2021-08-18 東京エレクトロン株式会社 基板処理装置
US11072117B2 (en) * 2017-11-27 2021-07-27 Arcam Ab Platform device
US10109517B1 (en) 2018-01-10 2018-10-23 Lam Research Corporation Rotational indexer with additional rotational axes
JP2021520446A (ja) 2018-05-04 2021-08-19 ジアンスゥ フェイバード ナノテクノロジー カンパニー リミテッドＪｉａｎｇｓｕ Ｆａｖｏｒｅｄ Ｎａｎｏｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ． ナノコーティングによる電気機器の保護方法
KR20200142601A (ko) * 2018-05-16 2020-12-22 어플라이드 머티어리얼스, 인코포레이티드 원자 층 자기 정렬 기판 프로세싱 및 통합 툴셋
JP7187385B2 (ja) * 2019-05-22 2022-12-12 東京エレクトロン株式会社 磁気駆動装置、着磁方法及び磁気駆動装置の製造方法
JP7325313B2 (ja) * 2019-12-11 2023-08-14 東京エレクトロン株式会社 回転駆動装置、基板処理装置及び回転駆動方法
JP7382836B2 (ja) * 2020-01-15 2023-11-17 東京エレクトロン株式会社 基板処理装置及び回転駆動方法
US12467129B2 (en) * 2022-11-09 2025-11-11 Battelle Savannah River Alliance, Llc Sputtering apparatus and related systems and methods for sputtering substrates
WO2024118472A1 (en) * 2022-11-28 2024-06-06 Veeco Instruments Inc. Multi-disc chemical vapor deposition system with cross flow gas injection
KR20240162391A (ko) * 2023-05-08 2024-11-15 주식회사 원익아이피에스 기판 처리 장치
GB202319929D0 (en) * 2023-12-22 2024-02-07 Spts Technologies Ltd Pvd apparatus and method

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01184277A (ja) * 1988-01-18 1989-07-21 Matsushita Electric Ind Co Ltd 基板回転装置

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Patent Citations (1)

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Publication number Priority date Publication date Assignee Title
JPH01184277A (ja) * 1988-01-18 1989-07-21 Matsushita Electric Ind Co Ltd 基板回転装置

Non-Patent Citations (2)

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Title
PAJ-Abstract von & JP 01184277 A *
PAJ-Abstract von JP 01184277 A

Also Published As

Publication number Publication date
US5795448A (en) 1998-08-18
JPH10116789A (ja) 1998-05-06
DE19649412A1 (de) 1997-06-12
CH691596A5 (de) 2001-08-31
JP4037932B2 (ja) 2008-01-23

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Legal Events

Date Code Title Description
8180 Miscellaneous part 1

Free format text: DER VERTRETER IST ZU AENDERN IN: PATENTANWAELTE MUELLER & HOFFMANN, 81667 MUENCHEN

8110 Request for examination paragraph 44
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee