JP4037932B2 - 基板回転装置及び基板回転方法 - Google Patents

基板回転装置及び基板回転方法 Download PDF

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Publication number
JP4037932B2
JP4037932B2 JP32894396A JP32894396A JP4037932B2 JP 4037932 B2 JP4037932 B2 JP 4037932B2 JP 32894396 A JP32894396 A JP 32894396A JP 32894396 A JP32894396 A JP 32894396A JP 4037932 B2 JP4037932 B2 JP 4037932B2
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Japan
Prior art keywords
substrate
chamber
rotating
magnet
rotation
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Expired - Fee Related
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JP32894396A
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English (en)
Japanese (ja)
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JPH10116789A (ja
JPH10116789A5 (enExample
Inventor
ハーヴィッツ スティーブン
レイス アイラ
ズィリンスキ マーティン
タン スウェイン
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Read Rite Corp
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Read Rite Corp
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Publication of JPH10116789A5 publication Critical patent/JPH10116789A5/ja
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
JP32894396A 1995-12-08 1996-12-09 基板回転装置及び基板回転方法 Expired - Fee Related JP4037932B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US08/570,220 US5795448A (en) 1995-12-08 1995-12-08 Magnetic device for rotating a substrate
US08/570220 1995-12-08

Publications (3)

Publication Number Publication Date
JPH10116789A JPH10116789A (ja) 1998-05-06
JPH10116789A5 JPH10116789A5 (enExample) 2004-11-25
JP4037932B2 true JP4037932B2 (ja) 2008-01-23

Family

ID=24278751

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32894396A Expired - Fee Related JP4037932B2 (ja) 1995-12-08 1996-12-09 基板回転装置及び基板回転方法

Country Status (4)

Country Link
US (1) US5795448A (enExample)
JP (1) JP4037932B2 (enExample)
CH (1) CH691596A5 (enExample)
DE (1) DE19649412B4 (enExample)

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US7785456B2 (en) * 2004-10-19 2010-08-31 Jds Uniphase Corporation Magnetic latch for a vapour deposition system
US7954219B2 (en) * 2004-08-20 2011-06-07 Jds Uniphase Corporation Substrate holder assembly device
PL1630260T3 (pl) * 2004-08-20 2011-12-30 Jds Uniphase Inc Zatrzask magnetyczny dla układu do osadzania próżniowego
US8500973B2 (en) * 2004-08-20 2013-08-06 Jds Uniphase Corporation Anode for sputter coating
US7879209B2 (en) 2004-08-20 2011-02-01 Jds Uniphase Corporation Cathode for sputter coating
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US20060054494A1 (en) * 2004-09-16 2006-03-16 Veeco Instruments Inc. Physical vapor deposition apparatus for depositing thin multilayer films and methods of depositing such films
US8137465B1 (en) * 2005-04-26 2012-03-20 Novellus Systems, Inc. Single-chamber sequential curing of semiconductor wafers
US8454750B1 (en) 2005-04-26 2013-06-04 Novellus Systems, Inc. Multi-station sequential curing of dielectric films
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US8398816B1 (en) 2006-03-28 2013-03-19 Novellus Systems, Inc. Method and apparatuses for reducing porogen accumulation from a UV-cure chamber
JP4552861B2 (ja) * 2006-01-06 2010-09-29 富士電機デバイステクノロジー株式会社 磁気記録媒体の製造方法および製造装置
US20070209932A1 (en) * 2006-03-10 2007-09-13 Veeco Instruments Inc. Sputter deposition system and methods of use
JP4657959B2 (ja) * 2006-03-20 2011-03-23 ダブリュディ・メディア・シンガポール・プライベートリミテッド 成膜装置及び磁気ディスクの製造方法
EP1999292B1 (en) * 2006-03-28 2014-01-22 Sulzer Metaplas GmbH Sputtering apparatus
EP1903603A3 (en) * 2006-09-20 2009-09-16 JDS Uniphase Corporation Substrate holder assembly device
US8101055B2 (en) * 2007-12-19 2012-01-24 Kojima Press Industry Co., Ltd. Sputtering apparatus and method for forming coating film by sputtering
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CN101899642B (zh) * 2009-05-25 2013-03-20 鸿富锦精密工业（深圳）有限公司 镀膜装置
JP5310512B2 (ja) * 2009-12-02 2013-10-09 東京エレクトロン株式会社 基板処理装置
US8647437B2 (en) 2010-05-31 2014-02-11 Ci Systems (Israel) Ltd. Apparatus, tool and methods for depositing annular or circular wedge coatings
DE102011007735A1 (de) 2010-06-14 2011-12-15 S.O.I. Tec Silicon On Insulator Technologies Systeme und Verfahren zur Gasbehandlung einer Anzahl von Substraten
US9281231B2 (en) * 2011-10-12 2016-03-08 Ferrotec (Usa) Corporation Non-contact magnetic drive assembly with mechanical stop elements
US9028765B2 (en) 2013-08-23 2015-05-12 Lam Research Corporation Exhaust flow spreading baffle-riser to optimize remote plasma window clean
WO2015179387A1 (en) * 2014-05-21 2015-11-26 Brewer Science Inc. Multi-size adaptable spin chuck system
JP6330623B2 (ja) * 2014-10-31 2018-05-30 東京エレクトロン株式会社 成膜装置、成膜方法及び記憶媒体
JP6330630B2 (ja) * 2014-11-13 2018-05-30 東京エレクトロン株式会社 成膜装置
KR102508025B1 (ko) 2015-05-11 2023-03-10 주성엔지니어링(주) 공정챔버 내부에 배치되는 기판 처리장치 및 그 작동방법
CN105063550B (zh) * 2015-08-20 2017-11-28 包头天和磁材技术有限责任公司 渗透装置及方法
JP6507953B2 (ja) * 2015-09-08 2019-05-08 東京エレクトロン株式会社 基板処理装置及び基板処理方法
US10388546B2 (en) 2015-11-16 2019-08-20 Lam Research Corporation Apparatus for UV flowable dielectric
KR102510956B1 (ko) * 2016-01-21 2023-03-16 주성엔지니어링(주) 기판 처리장치
CN107022754B (zh) * 2016-02-02 2020-06-02 东京毅力科创株式会社 基板处理装置
JP6740881B2 (ja) * 2016-02-02 2020-08-19 東京エレクトロン株式会社 基板処理装置
WO2017169448A1 (ja) * 2016-03-29 2017-10-05 株式会社 アルバック 成膜装置、および、成膜方法
KR102669903B1 (ko) * 2016-08-30 2024-05-28 주성엔지니어링(주) 기판 처리 장치
JP6777055B2 (ja) * 2017-01-11 2020-10-28 東京エレクトロン株式会社 基板処理装置
JP6922408B2 (ja) * 2017-05-18 2021-08-18 東京エレクトロン株式会社 基板処理装置
US11072117B2 (en) * 2017-11-27 2021-07-27 Arcam Ab Platform device
US10109517B1 (en) * 2018-01-10 2018-10-23 Lam Research Corporation Rotational indexer with additional rotational axes
JP2021520446A (ja) 2018-05-04 2021-08-19 ジアンスゥ フェイバード ナノテクノロジー カンパニー リミテッドＪｉａｎｇｓｕ Ｆａｖｏｒｅｄ Ｎａｎｏｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ． ナノコーティングによる電気機器の保護方法
WO2019222320A1 (en) * 2018-05-16 2019-11-21 Applied Materials, Inc. Atomic layer self aligned substrate processing and integrated toolset
JP7187385B2 (ja) * 2019-05-22 2022-12-12 東京エレクトロン株式会社 磁気駆動装置、着磁方法及び磁気駆動装置の製造方法
JP7325313B2 (ja) * 2019-12-11 2023-08-14 東京エレクトロン株式会社 回転駆動装置、基板処理装置及び回転駆動方法
JP7382836B2 (ja) * 2020-01-15 2023-11-17 東京エレクトロン株式会社 基板処理装置及び回転駆動方法
US12467129B2 (en) * 2022-11-09 2025-11-11 Battelle Savannah River Alliance, Llc Sputtering apparatus and related systems and methods for sputtering substrates
WO2024118468A1 (en) * 2022-11-28 2024-06-06 Veeco Instruments Inc. Multi-disc chemical vapor deposition system
KR20240162391A (ko) * 2023-05-08 2024-11-15 주식회사 원익아이피에스 기판 처리 장치
GB202319929D0 (en) 2023-12-22 2024-02-07 Spts Technologies Ltd Pvd apparatus and method

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Also Published As

Publication number Publication date
JPH10116789A (ja) 1998-05-06
DE19649412A1 (de) 1997-06-12
DE19649412B4 (de) 2009-07-02
US5795448A (en) 1998-08-18
CH691596A5 (de) 2001-08-31

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