CH691596A5 - Vorrichtung und Verfahren zum Bewegen speziell zum Drehen eines Substrats. - Google Patents

Vorrichtung und Verfahren zum Bewegen speziell zum Drehen eines Substrats. Download PDF

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Publication number
CH691596A5
CH691596A5 CH03005/96A CH300596A CH691596A5 CH 691596 A5 CH691596 A5 CH 691596A5 CH 03005/96 A CH03005/96 A CH 03005/96A CH 300596 A CH300596 A CH 300596A CH 691596 A5 CH691596 A5 CH 691596A5
Authority
CH
Switzerland
Prior art keywords
substrate
chamber
rotation
axis
magnet
Prior art date
Application number
CH03005/96A
Other languages
German (de)
English (en)
Inventor
Steven Hurwitt
Ira Reiss
Marian Zielinski
Swie-In Tan
Original Assignee
Read Rite Corp
Materials Research Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Read Rite Corp, Materials Research Corp filed Critical Read Rite Corp
Publication of CH691596A5 publication Critical patent/CH691596A5/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/50—Substrate holders
    • C23C14/505—Substrate holders for rotation of the substrates

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
CH03005/96A 1995-12-08 1996-12-06 Vorrichtung und Verfahren zum Bewegen speziell zum Drehen eines Substrats. CH691596A5 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/570,220 US5795448A (en) 1995-12-08 1995-12-08 Magnetic device for rotating a substrate

Publications (1)

Publication Number Publication Date
CH691596A5 true CH691596A5 (de) 2001-08-31

Family

ID=24278751

Family Applications (1)

Application Number Title Priority Date Filing Date
CH03005/96A CH691596A5 (de) 1995-12-08 1996-12-06 Vorrichtung und Verfahren zum Bewegen speziell zum Drehen eines Substrats.

Country Status (4)

Country Link
US (1) US5795448A (enExample)
JP (1) JP4037932B2 (enExample)
CH (1) CH691596A5 (enExample)
DE (1) DE19649412B4 (enExample)

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US20060049041A1 (en) * 2004-08-20 2006-03-09 Jds Uniphase Corporation Anode for sputter coating
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US7954219B2 (en) * 2004-08-20 2011-06-07 Jds Uniphase Corporation Substrate holder assembly device
US8500973B2 (en) * 2004-08-20 2013-08-06 Jds Uniphase Corporation Anode for sputter coating
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JP5355382B2 (ja) * 2006-03-28 2013-11-27 スルザー メタプラス ゲーエムベーハー スパッタリング装置
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US8101055B2 (en) * 2007-12-19 2012-01-24 Kojima Press Industry Co., Ltd. Sputtering apparatus and method for forming coating film by sputtering
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CN101899642B (zh) * 2009-05-25 2013-03-20 鸿富锦精密工业（深圳）有限公司 镀膜装置
JP5310512B2 (ja) * 2009-12-02 2013-10-09 東京エレクトロン株式会社 基板処理装置
US8647437B2 (en) * 2010-05-31 2014-02-11 Ci Systems (Israel) Ltd. Apparatus, tool and methods for depositing annular or circular wedge coatings
DE102011007735A1 (de) 2010-06-14 2011-12-15 S.O.I. Tec Silicon On Insulator Technologies Systeme und Verfahren zur Gasbehandlung einer Anzahl von Substraten
US9281231B2 (en) 2011-10-12 2016-03-08 Ferrotec (Usa) Corporation Non-contact magnetic drive assembly with mechanical stop elements
US9028765B2 (en) 2013-08-23 2015-05-12 Lam Research Corporation Exhaust flow spreading baffle-riser to optimize remote plasma window clean
US10204820B2 (en) * 2014-05-21 2019-02-12 Cost Effective Equipment Llc Multi-size adaptable spin chuck system
JP6330623B2 (ja) * 2014-10-31 2018-05-30 東京エレクトロン株式会社 成膜装置、成膜方法及び記憶媒体
JP6330630B2 (ja) * 2014-11-13 2018-05-30 東京エレクトロン株式会社 成膜装置
KR102508025B1 (ko) * 2015-05-11 2023-03-10 주성엔지니어링(주) 공정챔버 내부에 배치되는 기판 처리장치 및 그 작동방법
CN105063550B (zh) * 2015-08-20 2017-11-28 包头天和磁材技术有限责任公司 渗透装置及方法
JP6507953B2 (ja) * 2015-09-08 2019-05-08 東京エレクトロン株式会社 基板処理装置及び基板処理方法
US10388546B2 (en) 2015-11-16 2019-08-20 Lam Research Corporation Apparatus for UV flowable dielectric
KR102510956B1 (ko) * 2016-01-21 2023-03-16 주성엔지니어링(주) 기판 처리장치
CN107022754B (zh) * 2016-02-02 2020-06-02 东京毅力科创株式会社 基板处理装置
JP6740881B2 (ja) * 2016-02-02 2020-08-19 東京エレクトロン株式会社 基板処理装置
JP6542466B2 (ja) * 2016-03-29 2019-07-10 株式会社アルバック 成膜装置、および、成膜方法
KR102669903B1 (ko) * 2016-08-30 2024-05-28 주성엔지니어링(주) 기판 처리 장치
JP6777055B2 (ja) * 2017-01-11 2020-10-28 東京エレクトロン株式会社 基板処理装置
JP6922408B2 (ja) * 2017-05-18 2021-08-18 東京エレクトロン株式会社 基板処理装置
US11072117B2 (en) * 2017-11-27 2021-07-27 Arcam Ab Platform device
US10109517B1 (en) 2018-01-10 2018-10-23 Lam Research Corporation Rotational indexer with additional rotational axes
JP2021520446A (ja) 2018-05-04 2021-08-19 ジアンスゥ フェイバード ナノテクノロジー カンパニー リミテッドＪｉａｎｇｓｕ Ｆａｖｏｒｅｄ Ｎａｎｏｔｅｃｈｎｏｌｏｇｙ Ｃｏ．，Ｌｔｄ． ナノコーティングによる電気機器の保護方法
KR20200142601A (ko) * 2018-05-16 2020-12-22 어플라이드 머티어리얼스, 인코포레이티드 원자 층 자기 정렬 기판 프로세싱 및 통합 툴셋
JP7187385B2 (ja) * 2019-05-22 2022-12-12 東京エレクトロン株式会社 磁気駆動装置、着磁方法及び磁気駆動装置の製造方法
JP7325313B2 (ja) * 2019-12-11 2023-08-14 東京エレクトロン株式会社 回転駆動装置、基板処理装置及び回転駆動方法
JP7382836B2 (ja) * 2020-01-15 2023-11-17 東京エレクトロン株式会社 基板処理装置及び回転駆動方法
US12467129B2 (en) * 2022-11-09 2025-11-11 Battelle Savannah River Alliance, Llc Sputtering apparatus and related systems and methods for sputtering substrates
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KR20240162391A (ko) * 2023-05-08 2024-11-15 주식회사 원익아이피에스 기판 처리 장치
GB202319929D0 (en) * 2023-12-22 2024-02-07 Spts Technologies Ltd Pvd apparatus and method

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Also Published As

Publication number Publication date
US5795448A (en) 1998-08-18
DE19649412B4 (de) 2009-07-02
JPH10116789A (ja) 1998-05-06
DE19649412A1 (de) 1997-06-12
JP4037932B2 (ja) 2008-01-23

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Legal Events

Date Code Title Description
PFA Name/firm changed

Owner name: READ-RITE CORPORATION,345 LOS COCHES STREET,MILPIT

PCAR Change of the address of the representative

Free format text: ISLER & PEDRAZZINI AG;POSTFACH 1772;8027 ZUERICH (CH)

PL Patent ceased