JPH07507655A - 導電性ポリマー組成物 - Google Patents
導電性ポリマー組成物Info
- Publication number
- JPH07507655A JPH07507655A JP6501597A JP50159794A JPH07507655A JP H07507655 A JPH07507655 A JP H07507655A JP 6501597 A JP6501597 A JP 6501597A JP 50159794 A JP50159794 A JP 50159794A JP H07507655 A JPH07507655 A JP H07507655A
- Authority
- JP
- Japan
- Prior art keywords
- conductive
- composition
- polymer
- pressure
- filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims description 94
- 229920001940 conductive polymer Polymers 0.000 title claims description 44
- 229910052751 metal Inorganic materials 0.000 claims description 56
- 239000002184 metal Substances 0.000 claims description 56
- 239000000945 filler Substances 0.000 claims description 39
- 229920000642 polymer Polymers 0.000 claims description 37
- 239000002245 particle Substances 0.000 claims description 34
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 32
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 claims description 32
- 239000011231 conductive filler Substances 0.000 claims description 23
- 150000004684 trihydrates Chemical class 0.000 claims description 23
- 238000000034 method Methods 0.000 claims description 22
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- 238000004519 manufacturing process Methods 0.000 claims description 9
- 239000007822 coupling agent Substances 0.000 claims description 8
- 238000002156 mixing Methods 0.000 claims description 7
- 238000003475 lamination Methods 0.000 claims description 6
- 229920000620 organic polymer Polymers 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 4
- 230000008859 change Effects 0.000 claims description 3
- 238000010276 construction Methods 0.000 claims description 3
- 238000002474 experimental method Methods 0.000 claims description 3
- 241000257465 Echinoidea Species 0.000 claims description 2
- 238000001816 cooling Methods 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims description 2
- 239000008240 homogeneous mixture Substances 0.000 claims 1
- 238000012360 testing method Methods 0.000 description 18
- 239000011888 foil Substances 0.000 description 13
- 239000011148 porous material Substances 0.000 description 8
- 239000006229 carbon black Substances 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 7
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 150000002739 metals Chemical class 0.000 description 7
- 238000013329 compounding Methods 0.000 description 6
- 238000009472 formulation Methods 0.000 description 6
- 230000001965 increasing effect Effects 0.000 description 6
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical class [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 239000004698 Polyethylene Substances 0.000 description 5
- -1 polyethylene Polymers 0.000 description 5
- 229920000573 polyethylene Polymers 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 230000015572 biosynthetic process Effects 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 150000001875 compounds Chemical class 0.000 description 4
- 229920001903 high density polyethylene Polymers 0.000 description 4
- 239000004700 high-density polyethylene Substances 0.000 description 4
- 239000004615 ingredient Substances 0.000 description 4
- 239000000155 melt Substances 0.000 description 4
- 229910044991 metal oxide Inorganic materials 0.000 description 4
- 150000004706 metal oxides Chemical class 0.000 description 4
- 239000002923 metal particle Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- 230000009466 transformation Effects 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 3
- 239000005977 Ethylene Substances 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 238000001125 extrusion Methods 0.000 description 3
- 230000007246 mechanism Effects 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 210000002784 stomach Anatomy 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 239000002033 PVDF binder Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 230000006378 damage Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 238000011049 filling Methods 0.000 description 2
- 239000007789 gas Substances 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 230000001939 inductive effect Effects 0.000 description 2
- 239000011256 inorganic filler Substances 0.000 description 2
- 229910003475 inorganic filler Inorganic materials 0.000 description 2
- 238000011068 loading method Methods 0.000 description 2
- 238000010128 melt processing Methods 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 229920002981 polyvinylidene fluoride Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 230000001012 protector Effects 0.000 description 2
- BQCIDUSAKPWEOX-UHFFFAOYSA-N 1,1-Difluoroethene Chemical compound FC(F)=C BQCIDUSAKPWEOX-UHFFFAOYSA-N 0.000 description 1
- CSDQQAQKBAQLLE-UHFFFAOYSA-N 4-(4-chlorophenyl)-4,5,6,7-tetrahydrothieno[3,2-c]pyridine Chemical compound C1=CC(Cl)=CC=C1C1C(C=CS2)=C2CCN1 CSDQQAQKBAQLLE-UHFFFAOYSA-N 0.000 description 1
- 241000726096 Aratinga Species 0.000 description 1
- 206010008631 Cholera Diseases 0.000 description 1
- 239000004971 Cross linker Substances 0.000 description 1
- 229920006370 Kynar Polymers 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 241000287462 Phalacrocorax carbo Species 0.000 description 1
- 241000872198 Serjania polyphylla Species 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 238000005054 agglomeration Methods 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229920006125 amorphous polymer Polymers 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
- 238000005859 coupling reaction Methods 0.000 description 1
- 230000001351 cycling effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000003795 desorption Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 150000002118 epoxides Chemical class 0.000 description 1
- CGPRUXZTHGTMKW-UHFFFAOYSA-N ethene;ethyl prop-2-enoate Chemical compound C=C.CCOC(=O)C=C CGPRUXZTHGTMKW-UHFFFAOYSA-N 0.000 description 1
- QHZOMAXECYYXGP-UHFFFAOYSA-N ethene;prop-2-enoic acid Chemical compound C=C.OC(=O)C=C QHZOMAXECYYXGP-UHFFFAOYSA-N 0.000 description 1
- VXNZUUAINFGPBY-UHFFFAOYSA-N ethyl ethylene Natural products CCC=C VXNZUUAINFGPBY-UHFFFAOYSA-N 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 239000004811 fluoropolymer Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 230000029052 metamorphosis Effects 0.000 description 1
- 239000012778 molding material Substances 0.000 description 1
- 229910052750 molybdenum Inorganic materials 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012120 mounting media Substances 0.000 description 1
- 150000002815 nickel Chemical class 0.000 description 1
- 229910000480 nickel oxide Inorganic materials 0.000 description 1
- 239000012811 non-conductive material Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- GNRSAWUEBMWBQH-UHFFFAOYSA-N oxonickel Chemical compound [Ni]=O GNRSAWUEBMWBQH-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 235000015170 shellfish Nutrition 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052715 tantalum Inorganic materials 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 229920001897 terpolymer Polymers 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- VSRBKQFNFZQRBM-UHFFFAOYSA-N tuaminoheptane Chemical compound CCCCCC(C)N VSRBKQFNFZQRBM-UHFFFAOYSA-N 0.000 description 1
- 229960003986 tuaminoheptane Drugs 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
- 238000013022 venting Methods 0.000 description 1
- 229920006163 vinyl copolymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
- 239000010457 zeolite Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
- H01C7/02—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient
- H01C7/027—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material having positive temperature coefficient consisting of conducting or semi-conducting material dispersed in a non-conductive organic material
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K7/00—Use of ingredients characterised by shape
- C08K7/02—Fibres or whiskers
- C08K7/04—Fibres or whiskers inorganic
- C08K7/06—Elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
- H01B1/20—Conductive material dispersed in non-conductive organic material
- H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Dispersion Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Organic Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Electromagnetism (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Conductive Materials (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Thermistors And Varistors (AREA)
Abstract
Description
Claims (1)
- 【特許請求の範囲】 1.導電性ポリマー組成物であって、 (1)結晶性有機ポリマーを40〜75容量%、および(2)前記有機ポリマー 中に分散された導電性粒状充填剤を25〜40容量%、を含み、その組成物中、 下記の条件; (A)導電性粒子が、 (i)金属を含んで成る;および (ii)同じ形状をし、同じ金属から成る粒子が、ASTM B329によって 測定される嵩密度Dsが、真密度Dtのq倍であり、このqが0.15未満であ るような形状をしている、および (B)導電性粒子が、 (i)ニッケルを含む;および (ii)フィラメント状構造をしている、およびその組成物がさらに (i)x−アルミナを1〜20容量%、および(ii)カップリング剤を0〜5 容量%含む、 の少なくとも1つが満たされている導電性ポリマー組成物。 2.条件Aが満たされ、組成物がさらに非導電性充填剤を含む請求項1に記載の 組成物。 3.非導電性充填剤がx−アルミナまたはアルミナ三水和物を含む請求項2に記 載の組成物。 4.導電性粒子が、少なくとも1.0μmの粒度を持つ請求項1に記載の組成物 。 5.導電性粒子が、嵩密度1.0g/cm3未満である請求項1に記載の組成物 。 6.条件Bが満たされ、カップリング剤がジルコネートカップリング剤である請 求項1に記載の組成物。 7.請求項1に記載の導電性ポリマー組成物の製造方法であって、(a)導電性 充填剤およびポリマー、およびもし存在すれば非導電性充填剤をプレブレンドし て、均一な混合物を形成し;(b)均一な混合物を混合して、ポリマーを溶融さ せ、溶融ポリマー中に導電性充填剤およびいずれかの非導電性充填剤を分散させ ;および(c)溶融混合物を冷却する; ことから成る方法。 8.導電性ポリマー物品の製造方法であって、その物品が、(a)請求項1に記 載の組成物を含むPTC要素、および(b)PTC要素に付着された2つの層状 電極、から成り、その方法が、 (1)物品を形成するための第一圧力および加熱下に、請求項1の組成物から成 る導電性ポリマーシートに、電極を積層する第一積層段階、および(2)冷間で 第二圧力下に物品を維持する第二積層段階で、第二圧力は0.5〜0.95Pc ritで、Pcritは、(i)第二段階の圧力が変化すること以外は、第一段 階および第二段階で実際に採用される方法と同一の一連の実験を行うこと、(i i)第二段階の後にプレスの中心近くの同一の位置における導電性ポリマーシー トの抵抗率を測定すること、(iii)平均圧力kg/cm2の関数としての2 3℃での抵抗率(オーム−cm)のグラフを描くこと、および(iv)Pcri tを、抵抗率が、圧力がPcritの0.9倍であるときの抵抗率の1.1倍で あるときの最低圧力とみなすこと、によって決定される圧力である、から成る製 造方法。 9.導電性ポリマー物品の製造方法であって、その物品が、(a)請求項1に記 載の組成物から成るPTC要素、および(b)PTC要素に付着された2つの層 状電極、から成り、その方法が、 (1)電極をPTC要素に積層して、物品を形成し;(2)複数の物品を1つず つ上に積み重ねて、積み重ねを形成し;(3)この積み重ねに、第一段階で、特 定の照射量を照射し;(4)積み重ねの中の製品の順序を変え;そして(5)順 序を変えた積み重ねに、第二段階で、特定の照射量を、製品のどの地点における 最大照射量も、製品のどの地点における最少照射量の多くとも1.5倍になるよ うに照射する;ことから成る製造方法。 10.回路保護装置であって、 (a)請求項1に記載の組成物から成るPTC要素、および(b)PTC要素に 付着された2つの層状電極、から成り、その組成物が (i)0.010オーム−cm未満の抵抗率を持ち、(ii)少なくとも10メ ガラドで照射されている、回路保護装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US894,119 | 1992-06-05 | ||
US07/894,119 US5378407A (en) | 1992-06-05 | 1992-06-05 | Conductive polymer composition |
PCT/US1993/005335 WO1993026014A1 (en) | 1992-06-05 | 1993-06-03 | Conductive polymer composition |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004269983A Division JP3785415B2 (ja) | 1992-06-05 | 2004-09-16 | 導電性ポリマー組成物 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07507655A true JPH07507655A (ja) | 1995-08-24 |
JP3635089B2 JP3635089B2 (ja) | 2005-03-30 |
Family
ID=25402637
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP50159794A Expired - Fee Related JP3635089B2 (ja) | 1992-06-05 | 1993-06-03 | 導電性ポリマー組成物 |
JP2004269983A Expired - Lifetime JP3785415B2 (ja) | 1992-06-05 | 2004-09-16 | 導電性ポリマー組成物 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004269983A Expired - Lifetime JP3785415B2 (ja) | 1992-06-05 | 2004-09-16 | 導電性ポリマー組成物 |
Country Status (7)
Country | Link |
---|---|
US (1) | US5378407A (ja) |
EP (1) | EP0643869B1 (ja) |
JP (2) | JP3635089B2 (ja) |
AT (1) | ATE208533T1 (ja) |
CA (1) | CA2134561A1 (ja) |
DE (1) | DE69331099T2 (ja) |
WO (1) | WO1993026014A1 (ja) |
Families Citing this family (127)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB9215502D0 (en) * | 1992-07-21 | 1992-09-02 | Ici Plc | Cathodic protection system and a coating and coating composition therefor |
CA2170048A1 (en) | 1993-08-23 | 1995-03-02 | Malcolm R. Walsh | Use of ptc devices in wiring harnesses |
US5547610A (en) * | 1994-05-03 | 1996-08-20 | Forbo Industries, Inc. | Conductive polymeric adhesive for flooring containing silver-coated non-conductive fiber cores |
US5582770A (en) * | 1994-06-08 | 1996-12-10 | Raychem Corporation | Conductive polymer composition |
DE4427161A1 (de) * | 1994-08-01 | 1996-02-08 | Abb Research Ltd | Verfahren zur Herstellung eines PTC-Widerstandes und danach hergestellter Widerstand |
TW317689B (ja) * | 1995-03-10 | 1997-10-11 | Du Pont | |
JP3930905B2 (ja) * | 1995-03-22 | 2007-06-13 | レイケム・コーポレイション | 導電性ポリマー組成物およびデバイス |
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- 1993-06-03 AT AT93914382T patent/ATE208533T1/de not_active IP Right Cessation
- 1993-06-03 WO PCT/US1993/005335 patent/WO1993026014A1/en active IP Right Grant
- 1993-06-03 DE DE69331099T patent/DE69331099T2/de not_active Expired - Fee Related
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Also Published As
Publication number | Publication date |
---|---|
EP0643869B1 (en) | 2001-11-07 |
WO1993026014A1 (en) | 1993-12-23 |
ATE208533T1 (de) | 2001-11-15 |
EP0643869A1 (en) | 1995-03-22 |
JP2005048191A (ja) | 2005-02-24 |
CA2134561A1 (en) | 1993-12-23 |
DE69331099T2 (de) | 2002-08-14 |
JP3785415B2 (ja) | 2006-06-14 |
DE69331099D1 (de) | 2001-12-13 |
JP3635089B2 (ja) | 2005-03-30 |
US5378407A (en) | 1995-01-03 |
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