JPH07503740A - 光硬化性シクロブタレーン組成物 - Google Patents
光硬化性シクロブタレーン組成物Info
- Publication number
- JPH07503740A JPH07503740A JP5511057A JP51105793A JPH07503740A JP H07503740 A JPH07503740 A JP H07503740A JP 5511057 A JP5511057 A JP 5511057A JP 51105793 A JP51105793 A JP 51105793A JP H07503740 A JPH07503740 A JP H07503740A
- Authority
- JP
- Japan
- Prior art keywords
- solvent
- film
- minutes
- mixture
- oligomerized
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims description 92
- 239000010408 film Substances 0.000 claims description 161
- 239000002904 solvent Substances 0.000 claims description 83
- 229920000642 polymer Polymers 0.000 claims description 62
- 238000000034 method Methods 0.000 claims description 54
- 239000000758 substrate Substances 0.000 claims description 39
- 239000007787 solid Substances 0.000 claims description 35
- 239000003504 photosensitizing agent Substances 0.000 claims description 29
- 238000001723 curing Methods 0.000 claims description 25
- AUHZEENZYGFFBQ-UHFFFAOYSA-N mesitylene Substances CC1=CC(C)=CC(C)=C1 AUHZEENZYGFFBQ-UHFFFAOYSA-N 0.000 claims description 25
- 125000001827 mesitylenyl group Chemical group [H]C1=C(C(*)=C(C([H])=C1C([H])([H])[H])C([H])([H])[H])C([H])([H])[H] 0.000 claims description 25
- 239000000178 monomer Substances 0.000 claims description 21
- 238000006116 polymerization reaction Methods 0.000 claims description 11
- 239000000539 dimer Substances 0.000 claims description 10
- ZNRLMGFXSPUZNR-UHFFFAOYSA-N 2,2,4-trimethyl-1h-quinoline Chemical compound C1=CC=C2C(C)=CC(C)(C)NC2=C1 ZNRLMGFXSPUZNR-UHFFFAOYSA-N 0.000 claims description 9
- 239000003112 inhibitor Substances 0.000 claims description 7
- 230000003647 oxidation Effects 0.000 claims description 7
- 238000007254 oxidation reaction Methods 0.000 claims description 7
- 239000010409 thin film Substances 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims description 6
- LHCUYYJTVIYFEQ-UHFFFAOYSA-N 1-azido-3-(3-azidophenyl)sulfonylbenzene Chemical compound [N-]=[N+]=NC1=CC=CC(S(=O)(=O)C=2C=C(C=CC=2)N=[N+]=[N-])=C1 LHCUYYJTVIYFEQ-UHFFFAOYSA-N 0.000 claims description 5
- IJDNQMDRQITEOD-UHFFFAOYSA-N n-butane Chemical compound CCCC IJDNQMDRQITEOD-UHFFFAOYSA-N 0.000 claims description 5
- 238000001556 precipitation Methods 0.000 claims description 5
- 229930195733 hydrocarbon Natural products 0.000 claims description 4
- 150000002430 hydrocarbons Chemical group 0.000 claims description 4
- 239000002244 precipitate Substances 0.000 claims description 4
- 230000004044 response Effects 0.000 claims description 4
- 238000000016 photochemical curing Methods 0.000 claims description 3
- 230000001376 precipitating effect Effects 0.000 claims description 3
- 238000001029 thermal curing Methods 0.000 claims description 3
- 239000004215 Carbon black (E152) Substances 0.000 claims description 2
- 239000004793 Polystyrene Substances 0.000 claims description 2
- 150000001875 compounds Chemical class 0.000 claims description 2
- 238000002156 mixing Methods 0.000 claims description 2
- 229920002223 polystyrene Polymers 0.000 claims description 2
- FSIJKGMIQTVTNP-UHFFFAOYSA-N bis(ethenyl)-methyl-trimethylsilyloxysilane Chemical group C[Si](C)(C)O[Si](C)(C=C)C=C FSIJKGMIQTVTNP-UHFFFAOYSA-N 0.000 claims 4
- 239000001273 butane Substances 0.000 claims 3
- OFBQJSOFQDEBGM-UHFFFAOYSA-N n-pentane Natural products CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 claims 3
- CEDIMZGEUYNYCB-UHFFFAOYSA-N 1-azido-4-[[3-[(4-azidophenyl)methylidene]-5-methylcyclohexylidene]methyl]benzene Chemical group C1C(C)CC(=CC=2C=CC(=CC=2)N=[N+]=[N-])CC1=CC1=CC=C(N=[N+]=[N-])C=C1 CEDIMZGEUYNYCB-UHFFFAOYSA-N 0.000 claims 1
- CQKOEPBDZWNFFC-UHFFFAOYSA-N 2,6-bis[3-(4-azidophenyl)prop-2-enylidene]-4-methylcyclohexan-1-one Chemical group O=C1C(=CC=CC=2C=CC(=CC=2)N=[N+]=[N-])CC(C)CC1=CC=CC1=CC=C(N=[N+]=[N-])C=C1 CQKOEPBDZWNFFC-UHFFFAOYSA-N 0.000 claims 1
- SANIRTQDABNCHF-UHFFFAOYSA-N 7-(diethylamino)-3-[7-(diethylamino)-2-oxochromene-3-carbonyl]chromen-2-one Chemical group C1=C(N(CC)CC)C=C2OC(=O)C(C(=O)C3=CC4=CC=C(C=C4OC3=O)N(CC)CC)=CC2=C1 SANIRTQDABNCHF-UHFFFAOYSA-N 0.000 claims 1
- LVZWSLJZHVFIQJ-UHFFFAOYSA-N Cyclopropane Chemical compound C1CC1 LVZWSLJZHVFIQJ-UHFFFAOYSA-N 0.000 claims 1
- 125000003158 alcohol group Chemical group 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 76
- 239000000243 solution Substances 0.000 description 73
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 50
- 238000011161 development Methods 0.000 description 39
- 229920005989 resin Polymers 0.000 description 37
- 239000011347 resin Substances 0.000 description 37
- 239000000463 material Substances 0.000 description 25
- 229910052757 nitrogen Inorganic materials 0.000 description 25
- 238000009472 formulation Methods 0.000 description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 20
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 17
- 229910052710 silicon Inorganic materials 0.000 description 17
- 239000010703 silicon Substances 0.000 description 17
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 16
- 238000001816 cooling Methods 0.000 description 15
- 230000000694 effects Effects 0.000 description 15
- 125000003118 aryl group Chemical group 0.000 description 13
- 239000010410 layer Substances 0.000 description 13
- 230000008569 process Effects 0.000 description 13
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 12
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 12
- 229910052782 aluminium Inorganic materials 0.000 description 12
- XUPYJHCZDLZNFP-UHFFFAOYSA-N butyl butanoate Chemical compound CCCCOC(=O)CCC XUPYJHCZDLZNFP-UHFFFAOYSA-N 0.000 description 12
- 238000004519 manufacturing process Methods 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 11
- 238000007654 immersion Methods 0.000 description 11
- 150000001540 azides Chemical class 0.000 description 10
- 238000000576 coating method Methods 0.000 description 10
- SBZXBUIDTXKZTM-UHFFFAOYSA-N diglyme Chemical compound COCCOCCOC SBZXBUIDTXKZTM-UHFFFAOYSA-N 0.000 description 10
- 238000012545 processing Methods 0.000 description 10
- 239000000523 sample Substances 0.000 description 10
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 9
- 239000003795 chemical substances by application Substances 0.000 description 9
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 8
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 8
- 239000003963 antioxidant agent Substances 0.000 description 8
- 230000015572 biosynthetic process Effects 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000009826 distribution Methods 0.000 description 8
- 238000013007 heat curing Methods 0.000 description 8
- -1 laminates Substances 0.000 description 8
- 239000007921 spray Substances 0.000 description 8
- 238000003786 synthesis reaction Methods 0.000 description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 239000000126 substance Substances 0.000 description 7
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 6
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 6
- 239000007864 aqueous solution Substances 0.000 description 6
- 239000013068 control sample Substances 0.000 description 6
- 238000001035 drying Methods 0.000 description 6
- LZCLXQDLBQLTDK-UHFFFAOYSA-N ethyl 2-hydroxypropanoate Chemical compound CCOC(=O)C(C)O LZCLXQDLBQLTDK-UHFFFAOYSA-N 0.000 description 6
- 239000004615 ingredient Substances 0.000 description 6
- 238000005259 measurement Methods 0.000 description 6
- 229920002120 photoresistant polymer Polymers 0.000 description 6
- 230000000704 physical effect Effects 0.000 description 6
- 239000008096 xylene Substances 0.000 description 6
- HSFWRNGVRCDJHI-UHFFFAOYSA-N alpha-acetylene Natural products C#C HSFWRNGVRCDJHI-UHFFFAOYSA-N 0.000 description 5
- 125000004432 carbon atom Chemical group C* 0.000 description 5
- 239000000834 fixative Substances 0.000 description 5
- 239000012299 nitrogen atmosphere Substances 0.000 description 5
- 238000002360 preparation method Methods 0.000 description 5
- 150000003254 radicals Chemical class 0.000 description 5
- 238000004528 spin coating Methods 0.000 description 5
- 239000013638 trimer Substances 0.000 description 5
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 description 4
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 4
- 230000003078 antioxidant effect Effects 0.000 description 4
- BTANRVKWQNVYAZ-UHFFFAOYSA-N butan-2-ol Chemical compound CCC(C)O BTANRVKWQNVYAZ-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 239000006184 cosolvent Substances 0.000 description 4
- 239000008367 deionised water Substances 0.000 description 4
- 229910021641 deionized water Inorganic materials 0.000 description 4
- 238000005227 gel permeation chromatography Methods 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000013557 residual solvent Substances 0.000 description 4
- 230000035945 sensitivity Effects 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- HOXGZVUCAYFWGR-KQQUZDAGSA-N (3e,5e)-octa-1,3,5-triene Chemical compound CC\C=C\C=C\C=C HOXGZVUCAYFWGR-KQQUZDAGSA-N 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 3
- MSXVEPNJUHWQHW-UHFFFAOYSA-N 2-methylbutan-2-ol Chemical compound CCC(C)(C)O MSXVEPNJUHWQHW-UHFFFAOYSA-N 0.000 description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical group [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 3
- 150000001298 alcohols Chemical class 0.000 description 3
- SJTNBKXQJWDEHH-UHFFFAOYSA-N bicyclo[4.2.0]octa-1,3,5-triene;bis(ethenyl)-methyl-trimethylsilyloxysilane Chemical compound C1=CC=C2CCC2=C1.C1=CC=C2CCC2=C1.C[Si](C)(C)O[Si](C)(C=C)C=C SJTNBKXQJWDEHH-UHFFFAOYSA-N 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000006185 dispersion Substances 0.000 description 3
- 229940116333 ethyl lactate Drugs 0.000 description 3
- 125000001072 heteroaryl group Chemical group 0.000 description 3
- 239000012456 homogeneous solution Substances 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229920006254 polymer film Polymers 0.000 description 3
- 238000010992 reflux Methods 0.000 description 3
- WYTZZXDRDKSJID-UHFFFAOYSA-N (3-aminopropyl)triethoxysilane Chemical compound CCO[Si](OCC)(OCC)CCCN WYTZZXDRDKSJID-UHFFFAOYSA-N 0.000 description 2
- ILBBNQMSDGAAPF-UHFFFAOYSA-N 1-(6-hydroxy-6-methylcyclohexa-2,4-dien-1-yl)propan-1-one Chemical compound CCC(=O)C1C=CC=CC1(C)O ILBBNQMSDGAAPF-UHFFFAOYSA-N 0.000 description 2
- ZFPGARUNNKGOBB-UHFFFAOYSA-N 1-Ethyl-2-pyrrolidinone Chemical compound CCN1CCCC1=O ZFPGARUNNKGOBB-UHFFFAOYSA-N 0.000 description 2
- RRQYJINTUHWNHW-UHFFFAOYSA-N 1-ethoxy-2-(2-ethoxyethoxy)ethane Chemical compound CCOCCOCCOCC RRQYJINTUHWNHW-UHFFFAOYSA-N 0.000 description 2
- MLIWQXBKMZNZNF-UHFFFAOYSA-N 2,6-bis[(4-azidophenyl)methylidene]-4-methylcyclohexan-1-one Chemical compound O=C1C(=CC=2C=CC(=CC=2)N=[N+]=[N-])CC(C)CC1=CC1=CC=C(N=[N+]=[N-])C=C1 MLIWQXBKMZNZNF-UHFFFAOYSA-N 0.000 description 2
- ODRDTKMYQDXVGG-UHFFFAOYSA-N 8-methoxycoumarin Natural products C1=CC(=O)OC2=C1C=CC=C2OC ODRDTKMYQDXVGG-UHFFFAOYSA-N 0.000 description 2
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N Butadiene Chemical group C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 description 2
- FERIUCNNQQJTOY-UHFFFAOYSA-M Butyrate Chemical compound CCCC([O-])=O FERIUCNNQQJTOY-UHFFFAOYSA-M 0.000 description 2
- PMPVIKIVABFJJI-UHFFFAOYSA-N Cyclobutane Chemical compound C1CCC1 PMPVIKIVABFJJI-UHFFFAOYSA-N 0.000 description 2
- 241000257465 Echinoidea Species 0.000 description 2
- AMQJEAYHLZJPGS-UHFFFAOYSA-N N-Pentanol Chemical compound CCCCCO AMQJEAYHLZJPGS-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- 206010070834 Sensitisation Diseases 0.000 description 2
- 239000002318 adhesion promoter Substances 0.000 description 2
- 150000001336 alkenes Chemical class 0.000 description 2
- 125000000217 alkyl group Chemical group 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 238000004458 analytical method Methods 0.000 description 2
- 229910052786 argon Inorganic materials 0.000 description 2
- 239000012298 atmosphere Substances 0.000 description 2
- 239000011324 bead Substances 0.000 description 2
- UMIVXZPTRXBADB-UHFFFAOYSA-N benzocyclobutene Chemical compound C1=CC=C2CCC2=C1 UMIVXZPTRXBADB-UHFFFAOYSA-N 0.000 description 2
- 150000001721 carbon Chemical group 0.000 description 2
- 238000005266 casting Methods 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 238000002508 contact lithography Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- CFBGXYDUODCMNS-UHFFFAOYSA-N cyclobutene Chemical compound C1CC=C1 CFBGXYDUODCMNS-UHFFFAOYSA-N 0.000 description 2
- 125000001995 cyclobutyl group Chemical group [H]C1([H])C([H])([H])C([H])(*)C1([H])[H] 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000004090 dissolution Methods 0.000 description 2
- 150000002148 esters Chemical group 0.000 description 2
- FWDBOZPQNFPOLF-UHFFFAOYSA-N ethenyl(triethoxy)silane Chemical compound CCO[Si](OCC)(OCC)C=C FWDBOZPQNFPOLF-UHFFFAOYSA-N 0.000 description 2
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 description 2
- 238000000605 extraction Methods 0.000 description 2
- 239000007888 film coating Substances 0.000 description 2
- 238000009501 film coating Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000009477 glass transition Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- LIIALPBMIOVAHH-UHFFFAOYSA-N herniarin Chemical compound C1=CC(=O)OC2=CC(OC)=CC=C21 LIIALPBMIOVAHH-UHFFFAOYSA-N 0.000 description 2
- JHGVLAHJJNKSAW-UHFFFAOYSA-N herniarin Natural products C1CC(=O)OC2=CC(OC)=CC=C21 JHGVLAHJJNKSAW-UHFFFAOYSA-N 0.000 description 2
- 125000005842 heteroatom Chemical group 0.000 description 2
- 230000000977 initiatory effect Effects 0.000 description 2
- 239000000543 intermediate Substances 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 2
- 229910052753 mercury Inorganic materials 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- 239000004570 mortar (masonry) Substances 0.000 description 2
- 229920006113 non-polar polymer Polymers 0.000 description 2
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 230000035515 penetration Effects 0.000 description 2
- JYVLIDXNZAXMDK-UHFFFAOYSA-N pentan-2-ol Chemical compound CCCC(C)O JYVLIDXNZAXMDK-UHFFFAOYSA-N 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N phthalic acid di-n-butyl ester Natural products CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 229920006112 polar polymer Polymers 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- 125000004805 propylene group Chemical group [H]C([H])([H])C([H])([*:1])C([H])([H])[*:2] 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 230000008313 sensitization Effects 0.000 description 2
- 239000006104 solid solution Substances 0.000 description 2
- 238000000638 solvent extraction Methods 0.000 description 2
- 238000000527 sonication Methods 0.000 description 2
- 238000013517 stratification Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- NBXZNTLFQLUFES-UHFFFAOYSA-N triethoxy(propyl)silane Chemical compound CCC[Si](OCC)(OCC)OCC NBXZNTLFQLUFES-UHFFFAOYSA-N 0.000 description 2
- JWZZKOKVBUJMES-UHFFFAOYSA-N (+-)-Isoprenaline Chemical compound CC(C)NCC(O)C1=CC=C(O)C(O)=C1 JWZZKOKVBUJMES-UHFFFAOYSA-N 0.000 description 1
- GGQQNYXPYWCUHG-RMTFUQJTSA-N (3e,6e)-deca-3,6-diene Chemical compound CCC\C=C\C\C=C\CC GGQQNYXPYWCUHG-RMTFUQJTSA-N 0.000 description 1
- WDQFELCEOPFLCZ-UHFFFAOYSA-N 1-(2-hydroxyethyl)pyrrolidin-2-one Chemical compound OCCN1CCCC1=O WDQFELCEOPFLCZ-UHFFFAOYSA-N 0.000 description 1
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 1
- BNXZHVUCNYMNOS-UHFFFAOYSA-N 1-butylpyrrolidin-2-one Chemical compound CCCCN1CCCC1=O BNXZHVUCNYMNOS-UHFFFAOYSA-N 0.000 description 1
- CNJRPYFBORAQAU-UHFFFAOYSA-N 1-ethoxy-2-(2-methoxyethoxy)ethane Chemical compound CCOCCOCCOC CNJRPYFBORAQAU-UHFFFAOYSA-N 0.000 description 1
- CAQYAZNFWDDMIT-UHFFFAOYSA-N 1-ethoxy-2-methoxyethane Chemical compound CCOCCOC CAQYAZNFWDDMIT-UHFFFAOYSA-N 0.000 description 1
- BEFAQJJPFPNXIG-UHFFFAOYSA-N 1-nitro-9h-fluorene Chemical compound C1C2=CC=CC=C2C2=C1C([N+](=O)[O-])=CC=C2 BEFAQJJPFPNXIG-UHFFFAOYSA-N 0.000 description 1
- WCVOGSZTONGSQY-UHFFFAOYSA-N 2,4,6-trichloroanisole Chemical compound COC1=C(Cl)C=C(Cl)C=C1Cl WCVOGSZTONGSQY-UHFFFAOYSA-N 0.000 description 1
- VFBJXXJYHWLXRM-UHFFFAOYSA-N 2-[2-[3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoyloxy]ethylsulfanyl]ethyl 3-(3,5-ditert-butyl-4-hydroxyphenyl)propanoate Chemical compound CC(C)(C)C1=C(O)C(C(C)(C)C)=CC(CCC(=O)OCCSCCOC(=O)CCC=2C=C(C(O)=C(C=2)C(C)(C)C)C(C)(C)C)=C1 VFBJXXJYHWLXRM-UHFFFAOYSA-N 0.000 description 1
- HHBZZTKMMLDNDN-UHFFFAOYSA-N 2-butan-2-yloxybutane Chemical compound CCC(C)OC(C)CC HHBZZTKMMLDNDN-UHFFFAOYSA-N 0.000 description 1
- WDWQXEUJKGYNPZ-UHFFFAOYSA-N 2-chloro-3h-benzimidazole-5-carbonitrile Chemical compound N#CC1=CC=C2NC(Cl)=NC2=C1 WDWQXEUJKGYNPZ-UHFFFAOYSA-N 0.000 description 1
- 125000004398 2-methyl-2-butyl group Chemical group CC(C)(CC)* 0.000 description 1
- VATRWWPJWVCZTA-UHFFFAOYSA-N 3-oxo-n-[2-(trifluoromethyl)phenyl]butanamide Chemical compound CC(=O)CC(=O)NC1=CC=CC=C1C(F)(F)F VATRWWPJWVCZTA-UHFFFAOYSA-N 0.000 description 1
- XMIIGOLPHOKFCH-UHFFFAOYSA-N 3-phenylpropionic acid Chemical compound OC(=O)CCC1=CC=CC=C1 XMIIGOLPHOKFCH-UHFFFAOYSA-N 0.000 description 1
- OFXPOJNEGQRTCW-UHFFFAOYSA-N 7-bicyclo[4.2.0]octa-1,3,5-trienyl(7-bicyclo[4.2.0]octa-1,3,5-trienyloxy)silane Chemical compound C12=CC=CC=C2CC1O[SiH2]C1C2=CC=CC=C2C1 OFXPOJNEGQRTCW-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 101100460146 Arabidopsis thaliana NEET gene Proteins 0.000 description 1
- FERIUCNNQQJTOY-UHFFFAOYSA-N Butyric acid Natural products CCCC(O)=O FERIUCNNQQJTOY-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BWGNESOTFCXPMA-UHFFFAOYSA-N Dihydrogen disulfide Chemical compound SS BWGNESOTFCXPMA-UHFFFAOYSA-N 0.000 description 1
- 102100025027 E3 ubiquitin-protein ligase TRIM69 Human genes 0.000 description 1
- 101000830203 Homo sapiens E3 ubiquitin-protein ligase TRIM69 Proteins 0.000 description 1
- 239000004594 Masterbatch (MB) Substances 0.000 description 1
- XOBKSJJDNFUZPF-UHFFFAOYSA-N Methoxyethane Chemical compound CCOC XOBKSJJDNFUZPF-UHFFFAOYSA-N 0.000 description 1
- GRYLNZFGIOXLOG-UHFFFAOYSA-N Nitric acid Chemical compound O[N+]([O-])=O GRYLNZFGIOXLOG-UHFFFAOYSA-N 0.000 description 1
- 206010034972 Photosensitivity reaction Diseases 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 241001504505 Troglodytes troglodytes Species 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000003570 air Substances 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 150000001448 anilines Chemical class 0.000 description 1
- 150000008365 aromatic ketones Chemical class 0.000 description 1
- 238000005899 aromatization reaction Methods 0.000 description 1
- 125000004429 atom Chemical group 0.000 description 1
- 125000000852 azido group Chemical group *N=[N+]=[N-] 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 1
- UOCJDOLVGGIYIQ-PBFPGSCMSA-N cefatrizine Chemical group S([C@@H]1[C@@H](C(N1C=1C(O)=O)=O)NC(=O)[C@H](N)C=2C=CC(O)=CC=2)CC=1CSC=1C=NNN=1 UOCJDOLVGGIYIQ-PBFPGSCMSA-N 0.000 description 1
- 238000012512 characterization method Methods 0.000 description 1
- 238000004587 chromatography analysis Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 230000021615 conjugation Effects 0.000 description 1
- 229920001577 copolymer Polymers 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 230000009089 cytolysis Effects 0.000 description 1
- DIOQZVSQGTUSAI-UHFFFAOYSA-N decane Chemical compound CCCCCCCCCC DIOQZVSQGTUSAI-UHFFFAOYSA-N 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- KZTYYGOKRVBIMI-UHFFFAOYSA-N diphenyl sulfone Chemical compound C=1C=CC=CC=1S(=O)(=O)C1=CC=CC=C1 KZTYYGOKRVBIMI-UHFFFAOYSA-N 0.000 description 1
- SZXQTJUDPRGNJN-UHFFFAOYSA-N dipropylene glycol Chemical compound OCCCOCCCO SZXQTJUDPRGNJN-UHFFFAOYSA-N 0.000 description 1
- 150000002019 disulfides Chemical class 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 125000002534 ethynyl group Chemical group [H]C#C* 0.000 description 1
- 238000002270 exclusion chromatography Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000006870 function Effects 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 150000004795 grignard reagents Chemical class 0.000 description 1
- 238000003306 harvesting Methods 0.000 description 1
- 239000001307 helium Substances 0.000 description 1
- 229910052734 helium Inorganic materials 0.000 description 1
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 238000005984 hydrogenation reaction Methods 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 238000001764 infiltration Methods 0.000 description 1
- 230000008595 infiltration Effects 0.000 description 1
- 239000002198 insoluble material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 125000005647 linker group Chemical group 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000011068 loading method Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000010907 mechanical stirring Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- VSQYNPJPULBZKU-UHFFFAOYSA-N mercury xenon Chemical compound [Xe].[Hg] VSQYNPJPULBZKU-UHFFFAOYSA-N 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 125000005395 methacrylic acid group Chemical group 0.000 description 1
- 125000001570 methylene group Chemical group [H]C([H])([*:1])[*:2] 0.000 description 1
- VYQNWZOUAUKGHI-UHFFFAOYSA-N monobenzone Chemical compound C1=CC(O)=CC=C1OCC1=CC=CC=C1 VYQNWZOUAUKGHI-UHFFFAOYSA-N 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910017604 nitric acid Inorganic materials 0.000 description 1
- 238000006384 oligomerization reaction Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 150000002894 organic compounds Chemical class 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- NFHFRUOZVGFOOS-UHFFFAOYSA-N palladium;triphenylphosphane Chemical compound [Pd].C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1.C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 NFHFRUOZVGFOOS-UHFFFAOYSA-N 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- AQSJGOWTSHOLKH-UHFFFAOYSA-N phosphite(3-) Chemical class [O-]P([O-])[O-] AQSJGOWTSHOLKH-UHFFFAOYSA-N 0.000 description 1
- OJMIONKXNSYLSR-UHFFFAOYSA-N phosphorous acid Chemical compound OP(O)O OJMIONKXNSYLSR-UHFFFAOYSA-N 0.000 description 1
- 230000036211 photosensitivity Effects 0.000 description 1
- 208000017983 photosensitivity disease Diseases 0.000 description 1
- 231100000434 photosensitization Toxicity 0.000 description 1
- 229920005575 poly(amic acid) Polymers 0.000 description 1
- 229920003192 poly(bis maleimide) Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920002959 polymer blend Polymers 0.000 description 1
- 238000000710 polymer precipitation Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000001314 profilometry Methods 0.000 description 1
- WGYKZJWCGVVSQN-UHFFFAOYSA-N propylamine Chemical group CCCN WGYKZJWCGVVSQN-UHFFFAOYSA-N 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 238000010926 purge Methods 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 125000001453 quaternary ammonium group Chemical group 0.000 description 1
- 150000004053 quinones Chemical class 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 238000001542 size-exclusion chromatography Methods 0.000 description 1
- 238000002791 soaking Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 241000894007 species Species 0.000 description 1
- 238000004611 spectroscopical analysis Methods 0.000 description 1
- 238000009987 spinning Methods 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 150000003457 sulfones Chemical class 0.000 description 1
- 125000000383 tetramethylene group Chemical group [H]C([H])([*:1])C([H])([H])C([H])([H])C([H])([H])[*:2] 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- 150000003568 thioethers Chemical class 0.000 description 1
- 125000002088 tosyl group Chemical group [H]C1=C([H])C(=C([H])C([H])=C1C([H])([H])[H])S(*)(=O)=O 0.000 description 1
- QQQSFSZALRVCSZ-UHFFFAOYSA-N triethoxysilane Chemical compound CCO[SiH](OCC)OCC QQQSFSZALRVCSZ-UHFFFAOYSA-N 0.000 description 1
- 239000000052 vinegar Substances 0.000 description 1
- 235000021419 vinegar Nutrition 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
- 229910052724 xenon Inorganic materials 0.000 description 1
- FHNFHKCVQCLJFQ-UHFFFAOYSA-N xenon atom Chemical compound [Xe] FHNFHKCVQCLJFQ-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C247/00—Compounds containing azido groups
- C07C247/16—Compounds containing azido groups with azido groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0834—Compounds having one or more O-Si linkage
- C07F7/0838—Compounds with one or more Si-O-Si sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C2601/00—Systems containing only non-condensed rings
- C07C2601/12—Systems containing only non-condensed rings with a six-membered ring
- C07C2601/14—The ring being saturated
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Formation Of Insulating Films (AREA)
- Materials For Photolithography (AREA)
- Laminated Bodies (AREA)
Abstract
Description
Claims (24)
- 1.主要成分として少なくとも1種のオリゴマー化シクロブタレーン、および、 少なくとも1種の感光剤を含む光硬化性の有機可溶性混合物であって、ここで、 混合物を光子照射にさらしたときに有機不溶性固体に混合物を変換するために充 分な量の感光剤を含む混合物。
- 2.オリゴマー化シクロプタレーンが3以上の重合度のオリゴマーを少なくとも 80重量%以上含む請求項1に記載の混合物。
- 3.請求項2に記載の混合物を硬化させる量の光子照射にさらすことにより形成 された光硬化したポリマー。
- 4.オリゴマーの一部分のみを硬化させる量の光子照射にさらし、それから、前 記のフィルムを現像溶剤にさらすことにより請求項2に記載のオリゴマーの薄膜 上に潜像(1atentpattem)を形成することにより形成される光硬化 したパターンコートされた基材。
- 5.請求項4に記載の光硬化したパターンコートされた基材を熱硬化にさらすこ とにより形成される光および熱硬化したパターンコートされた基材。
- 6.シクロブタレーンがジビニルテトラメチルジシロキサンビスベンゾシクロブ タンである請求項5に記載の光および熱硬化したパターンコートされた基材。
- 7.感光剤が2,6−ビス(4−アジドベンジリデン)−4−メチルシクロヘキ サノンである請求項6に記載の光および熱硬化したパターンコートされたポリマ ー。
- 8.感光剤が2,6−ビス(4−アジドベンジリデン)−4−メチルシクロヘキ サノンである請求項1に記載の混合物。
- 9.感光剤が2,6−ビス[3−(4−アジドフェニル)−2−プロペニリデン ]−4−メチルシクロヘキサノンである請求項1に記載の混合物。
- 10.感光剤が2,6−ビス(4−アジドベンジリデン)−4−メチルシクロヘ キサノンおよびm−アジドフェニルスルホンの混合物である請求項1に記載の混 合物。
- 11.1,2−ジヒドロ−2,2,4−トリメチルキノリンから誘導される酸化 防止剤を含む請求項1に記載の混合物。
- 12.増感剤を含む請求項1に記載の混合物。
- 13.増感剤が3,3′−カルボニルビス(7−ジエチルアミノクマリン)であ る請求項12に記載の混合物。
- 14.請求項1に記載の混合物から製造される誘電体層を有するエレクトロニク スデバイス。
- 15.オリゴマー化シクロブタレーンの低分子量部分を除去する方法であって、 溶剤中にオリゴマー化シクロブタレーンを溶解させること、それから、より高分 子量フラクションのオリゴマー化シクロブタレーンが沈殿するが、モノマーおよ びダイマーが可溶性である第二の溶剤と得られた溶液とを混合することを含む方 法。
- 16.沈殿したオリゴマー化シクロプタレーンが溶剤から分離される請求項15 に記載の方法。
- 17.溶解溶剤が炭化水素溶剤である請求項15に記載の方法。
- 18.沈殿溶剤がアルコールである請求項17に記載の方法。
- 19.シクロブタレーンがジビニルテトラメチルジシロキサンビスベンゾシクロ ブタンである請求項18に記載の方法。
- 20.溶解溶剤がメシチレンであり、且つ、沈殿溶剤が2−メチル−2−ブタノ ールである請求項19に記載の方法。
- 21.3以上の重合度のオリゴマーを90重量%以上含むオリゴマー化シクロブ タレーン。
- 22.屈折率検出器を用いた、応答ファクターで未補正で、且つ、ポリスチレン 標準で測定されたGPCのピーク面積から決定されて、1,000以上の分子量 のオリゴマーを90重量%以上含むオリゴマー化シクロブタレーン。
- 23.シクロブタレーンがジビニルテトラメチルジシロキサンビスベンゾシクロ ブタンである請求項21に記載のオリゴマー化シクロブタレーン。
- 24.シクロブタレーンがジビニルテトラメチルジシロキサンビスベンゾシクロ ブタンである請求項22に記載のオリゴマー化シクロブタレーン。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US80539591A | 1991-12-10 | 1991-12-10 | |
US805.395 | 1991-12-10 | ||
PCT/US1992/010649 WO1993012055A2 (en) | 1991-12-10 | 1992-12-10 | Photocurable cyclobutarene compositions |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH07503740A true JPH07503740A (ja) | 1995-04-20 |
JP3213001B2 JP3213001B2 (ja) | 2001-09-25 |
Family
ID=25191455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51105793A Expired - Lifetime JP3213001B2 (ja) | 1991-12-10 | 1992-12-10 | 光硬化性シクロブタレーン組成物 |
Country Status (8)
Country | Link |
---|---|
US (2) | US6083661A (ja) |
EP (1) | EP0616701B1 (ja) |
JP (1) | JP3213001B2 (ja) |
KR (2) | KR100324184B1 (ja) |
CA (1) | CA2125567A1 (ja) |
DE (1) | DE69232419T2 (ja) |
SG (1) | SG49761A1 (ja) |
WO (1) | WO1993012055A2 (ja) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002265762A (ja) * | 2001-03-08 | 2002-09-18 | Nippon Kayaku Co Ltd | ベンゾシクロブテン樹脂組成物、樹脂結合型金属成型部品 |
JP2006503167A (ja) * | 2002-10-18 | 2006-01-26 | ダウ グローバル テクノロジーズ インコーポレイティド | 高い防湿性を有する、水性現像可能な感光性ベンゾシクロブテン系オリゴマー及びポリマー |
WO2009154254A1 (ja) | 2008-06-19 | 2009-12-23 | 旭硝子株式会社 | 硬化性組成物およびそれを用いた硬化膜 |
JP2018536165A (ja) * | 2015-12-02 | 2018-12-06 | ベーリンガー インゲルハイム フェトメディカ ゲーエムベーハーBoehringer Ingelheim Vetmedica GmbH | チップ上に複数の測定領域を作製するための方法、及び複数の測定領域を有するチップ |
Families Citing this family (42)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5854302A (en) * | 1993-04-29 | 1998-12-29 | The Dow Chemical Company | Partially polymerized divinylsiloxane linked bisbenzocyclobutene resins and methods for making said resins |
JP3417008B2 (ja) * | 1993-11-04 | 2003-06-16 | 株式会社デンソー | 半導体ウエハのエッチング方法 |
US5994489A (en) * | 1994-10-24 | 1999-11-30 | The Dow Chemical Company | Adhesion promoter and self-priming arylcyclobutene resin compositions |
US5668210A (en) * | 1994-10-24 | 1997-09-16 | The Dow Chemical Company | Adhesion promoter and self-priming arylcyclobutene resin compositions |
EP0727711A3 (en) * | 1995-02-17 | 1997-04-09 | Ocg Microelectronic Materials | Photoresist compositions containing supercritical fluid fractionated polymeric resin binders |
JP3802062B2 (ja) | 1995-04-03 | 2006-07-26 | ダウ グローバル テクノロジーズ インコーポレイティド | 光解像性組成物 |
US6273985B1 (en) | 1998-06-26 | 2001-08-14 | Xerox Corporation | Bonding process |
US6184284B1 (en) | 1998-08-24 | 2001-02-06 | The Dow Chemical Company | Adhesion promoter and self-priming resin compositions and articles made therefrom |
US6277203B1 (en) | 1998-09-29 | 2001-08-21 | Lam Research Corporation | Method and apparatus for cleaning low K dielectric and metal wafer surfaces |
US6361926B1 (en) * | 1998-10-23 | 2002-03-26 | The Dow Chemical Company | Acid functional polymers based on benzocyclobutene |
US6420093B1 (en) | 2000-02-02 | 2002-07-16 | The Dow Chemical Company | Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards |
JP2001308082A (ja) * | 2000-04-20 | 2001-11-02 | Nec Corp | 液体有機原料の気化方法及び絶縁膜の成長方法 |
US6991887B1 (en) * | 2000-11-01 | 2006-01-31 | Battelle Memorial Institute | Photopatternable sorbent and functionalized films |
AU2002305835A1 (en) * | 2001-06-08 | 2002-12-23 | The Regents Of The University Of Michigan | Low-temperature patterned wafer bonding with photosensitive benzocylobutene (bcb) and 3d microelectromechanical systems fabrication |
WO2002101463A1 (en) * | 2001-06-08 | 2002-12-19 | The Penn State Research Foundation | Patterning compositions using e-beam lithography and structures and devices made thereby |
AU2002317579A1 (en) * | 2001-07-26 | 2003-02-17 | The Penn State Research Foundation | Optical waveguides and grating structures fabricated using polymeric dielectric compositions |
US6780567B2 (en) * | 2001-08-02 | 2004-08-24 | Fuji Photo Film Co., Ltd. | Lithographic process using reaction of o-quinodimethane |
US7585785B2 (en) * | 2003-02-05 | 2009-09-08 | Dow Global Technologies | Sacrificial benzocyclobutene copolymers for making air gap semiconductor devices |
US7164197B2 (en) | 2003-06-19 | 2007-01-16 | 3M Innovative Properties Company | Dielectric composite material |
US7316844B2 (en) | 2004-01-16 | 2008-01-08 | Brewer Science Inc. | Spin-on protective coatings for wet-etch processing of microelectronic substrates |
ATE476468T1 (de) * | 2004-10-13 | 2010-08-15 | Dow Global Technologies Inc | Polymerformulierungen auf benzocyclobutenbasis und verfahren zur verarbeitung derartiger formulierungen in oxidativen umgebungen |
JP4876426B2 (ja) * | 2005-04-08 | 2012-02-15 | 日亜化学工業株式会社 | 耐熱性及び耐光性に優れる発光装置 |
US7695890B2 (en) * | 2005-09-09 | 2010-04-13 | Brewer Science Inc. | Negative photoresist for silicon KOH etch without silicon nitride |
TWI391436B (zh) * | 2005-10-13 | 2013-04-01 | Dow Global Technologies Llc | 以苯環丁烯為基底的聚合物配方及在氧化環境中加工該等配方的方法 |
JP4730436B2 (ja) | 2006-03-16 | 2011-07-20 | 旭硝子株式会社 | ネガ型感光性含フッ素芳香族系樹脂組成物 |
US7709178B2 (en) | 2007-04-17 | 2010-05-04 | Brewer Science Inc. | Alkaline-resistant negative photoresist for silicon wet-etch without silicon nitride |
WO2009023638A1 (en) * | 2007-08-10 | 2009-02-19 | Gagne Robert R | Lightweight ballistic protection materials |
US8192642B2 (en) | 2007-09-13 | 2012-06-05 | Brewer Science Inc. | Spin-on protective coatings for wet-etch processing of microelectronic substrates |
TWI399873B (zh) * | 2009-03-03 | 2013-06-21 | Everlight Electronics Co Ltd | 發光二極體封裝結構及其製作方法 |
JP5397175B2 (ja) * | 2009-11-13 | 2014-01-22 | セイコーエプソン株式会社 | 半導体装置用基板及びその製造方法、半導体装置並びに電子機器 |
US9562136B2 (en) | 2011-07-04 | 2017-02-07 | Cambridge Display Technology, Ltd. | Polymers, monomers and methods of forming polymers |
US9182204B2 (en) | 2011-07-28 | 2015-11-10 | Mac, Llc | Subsonic ammunition casing |
WO2013016730A1 (en) | 2011-07-28 | 2013-01-31 | Mac, Llc | Polymeric ammunition casing geometry |
CN102520584B (zh) * | 2011-09-13 | 2014-05-07 | 复旦大学 | 光敏苯并环丁烯树脂组合物及制备方法以及其图案化方法 |
DE102013210138A1 (de) | 2013-05-30 | 2014-12-04 | Boehringer Ingelheim Vetmedica Gmbh | Verfahren zum Erzeugen einer Vielzahl von Messbereichen auf einem Chip sowie Chip mit Messbereichen |
US9528799B2 (en) | 2014-01-13 | 2016-12-27 | Mac Llc | Neck polymeric ammunition casing geometry |
WO2015154079A1 (en) | 2014-04-04 | 2015-10-08 | Mac, Llc | Method for producing subsonic ammunition casing |
US9441055B1 (en) * | 2015-09-18 | 2016-09-13 | Dow Global Technologies Llc | Arylcyclobutenes |
KR102426440B1 (ko) * | 2016-09-01 | 2022-07-29 | 제이에스알 가부시끼가이샤 | 기재 표면의 선택적 수식 방법 및 조성물 |
KR102419938B1 (ko) * | 2020-02-18 | 2022-07-12 | 김만현 | 차량 시트용 가죽의 스티치 형성방법 |
CN117111405A (zh) * | 2023-08-04 | 2023-11-24 | 西南科技大学 | 线性聚硅氧烷低介电损耗光敏树脂的制备及光刻图案化的应用 |
CN116880126A (zh) * | 2023-08-08 | 2023-10-13 | 西南科技大学 | 支化型苯并环丁烯基聚硅氧烷低介电损耗光敏树脂的制备及应用 |
Family Cites Families (21)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2852379A (en) * | 1955-05-04 | 1958-09-16 | Eastman Kodak Co | Azide resin photolithographic composition |
US2940853A (en) * | 1958-08-21 | 1960-06-14 | Eastman Kodak Co | Azide sensitized resin photographic resist |
US4106943A (en) * | 1973-09-27 | 1978-08-15 | Japan Synthetic Rubber Co., Ltd. | Photosensitive cross-linkable azide containing polymeric composition |
JPS6057584B2 (ja) * | 1979-04-24 | 1985-12-16 | ジェイエスアール株式会社 | ホトレジスト組成物 |
JPS57168942A (en) * | 1981-04-13 | 1982-10-18 | Hitachi Ltd | Photosensitive polymer composition |
US4564576A (en) * | 1983-05-27 | 1986-01-14 | Nec Corporation | Resist material comprising polymer of allylsilyl compound and pattern forming method using the resist material |
US4571375A (en) * | 1983-10-24 | 1986-02-18 | Benedikt George M | Ring-opened polynorbornene negative photoresist with bisazide |
US4724260A (en) * | 1984-08-27 | 1988-02-09 | The Dow Chemical Company | Unsaturated alkyl monoarylcyclobutane monomers |
US4743399A (en) * | 1984-08-27 | 1988-05-10 | The Dow Chemical Company | Adhesive compositions from arylcyclobutene monomeric compositions |
US4642329A (en) * | 1984-08-27 | 1987-02-10 | The Dow Chemical Company | Prepolymer processing of arylcyclobutene monomeric compositions |
US4540763A (en) * | 1984-09-14 | 1985-09-10 | The Dow Chemical Company | Polymers derived from poly(arylcyclobutenes) |
US4730030A (en) * | 1986-07-25 | 1988-03-08 | The Dow Chemical Company | Arylcyclobutane/dienophile copolymer |
US4759874A (en) * | 1987-08-03 | 1988-07-26 | The Dow Chemical Company | Benzocyclobutene-based die attach adhesive compositions |
US4812588A (en) * | 1987-12-14 | 1989-03-14 | The Dow Chemical Company | Polyorganosiloxane-bridged bisbenzocyclobutene monomers |
US4831172A (en) * | 1988-03-23 | 1989-05-16 | The Dow Chemical Company | Benzocyclobutene-based organosilane adhesion aids |
JP2643261B2 (ja) * | 1988-03-23 | 1997-08-20 | 株式会社日立製作所 | ネガ型感光性組成物及びパタン形成方法 |
US4864010A (en) * | 1988-06-09 | 1989-09-05 | The Dow Chemical Company | Monomers, oligomers, and polymers of biscyclobutarenes bridged by at least one benzoxazole linkage |
US5041600A (en) * | 1990-01-29 | 1991-08-20 | Shell Oil Company | Bisphenol ethers |
JP2770615B2 (ja) * | 1991-08-09 | 1998-07-02 | 日本電気株式会社 | ベンゾシクロブテン樹脂前駆体混合組成物およびそれを用いたベンゾシクロブテン樹脂膜の製造方法 |
US5156656A (en) * | 1991-09-13 | 1992-10-20 | The Dow Chemical Company | Semi-permeable membranes derived from reactive oligomers |
US5854302A (en) * | 1993-04-29 | 1998-12-29 | The Dow Chemical Company | Partially polymerized divinylsiloxane linked bisbenzocyclobutene resins and methods for making said resins |
-
1992
- 1992-12-10 SG SG1996004925A patent/SG49761A1/en unknown
- 1992-12-10 DE DE69232419T patent/DE69232419T2/de not_active Expired - Lifetime
- 1992-12-10 JP JP51105793A patent/JP3213001B2/ja not_active Expired - Lifetime
- 1992-12-10 EP EP93901377A patent/EP0616701B1/en not_active Expired - Lifetime
- 1992-12-10 WO PCT/US1992/010649 patent/WO1993012055A2/en active IP Right Grant
- 1992-12-10 CA CA002125567A patent/CA2125567A1/en not_active Abandoned
-
1994
- 1994-06-09 KR KR1019940701959A patent/KR100324184B1/ko not_active IP Right Cessation
- 1994-08-15 US US08/290,197 patent/US6083661A/en not_active Expired - Lifetime
-
1995
- 1995-06-05 US US08/465,666 patent/US5585450A/en not_active Expired - Lifetime
-
2000
- 2000-03-29 KR KR20007003388A patent/KR100307647B1/ko not_active IP Right Cessation
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002265762A (ja) * | 2001-03-08 | 2002-09-18 | Nippon Kayaku Co Ltd | ベンゾシクロブテン樹脂組成物、樹脂結合型金属成型部品 |
JP2006503167A (ja) * | 2002-10-18 | 2006-01-26 | ダウ グローバル テクノロジーズ インコーポレイティド | 高い防湿性を有する、水性現像可能な感光性ベンゾシクロブテン系オリゴマー及びポリマー |
JP2013014774A (ja) * | 2002-10-18 | 2013-01-24 | Dow Global Technologies Llc | 高い防湿性を有する、水性現像可能な感光性ベンゾシクロブテン系オリゴマー又はポリマーの製造方法 |
WO2009154254A1 (ja) | 2008-06-19 | 2009-12-23 | 旭硝子株式会社 | 硬化性組成物およびそれを用いた硬化膜 |
JP2018536165A (ja) * | 2015-12-02 | 2018-12-06 | ベーリンガー インゲルハイム フェトメディカ ゲーエムベーハーBoehringer Ingelheim Vetmedica GmbH | チップ上に複数の測定領域を作製するための方法、及び複数の測定領域を有するチップ |
Also Published As
Publication number | Publication date |
---|---|
US5585450A (en) | 1996-12-17 |
DE69232419T2 (de) | 2002-09-19 |
SG49761A1 (en) | 1998-06-15 |
KR100324184B1 (ko) | 2002-07-27 |
KR100307647B1 (ko) | 2001-09-24 |
WO1993012055A3 (en) | 1993-08-05 |
US6083661A (en) | 2000-07-04 |
EP0616701A1 (en) | 1994-09-28 |
EP0616701A4 (en) | 1995-06-14 |
DE69232419D1 (de) | 2002-03-21 |
EP0616701B1 (en) | 2002-02-13 |
JP3213001B2 (ja) | 2001-09-25 |
CA2125567A1 (en) | 1993-06-24 |
WO1993012055A2 (en) | 1993-06-24 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH07503740A (ja) | 光硬化性シクロブタレーン組成物 | |
TWI761897B (zh) | 負型感光性樹脂組合物、聚醯亞胺之製造方法、硬化浮凸圖案之製造方法、及半導體裝置 | |
KR100305127B1 (ko) | 부분적으로중합된수지 | |
JP2006267800A (ja) | 感光性ポリイミド樹脂組成物 | |
JP4761989B2 (ja) | ポリアミド酸エステル組成物 | |
TW202000739A (zh) | 感光性樹脂組合物、硬化浮凸圖案之製造方法及半導體裝置 | |
JPH0876376A (ja) | 感光性樹脂組成物及びそれを用いるパターン化されたポリイミド皮膜の形成方法 | |
JPWO2008126499A1 (ja) | ポリマー光導波路形成用材料、ポリマー光導波路、及びポリマー光導波路製造方法 | |
JP2007058017A (ja) | 感光性樹脂組成物 | |
JPH1192660A (ja) | 感光性樹脂組成物 | |
KR100395832B1 (ko) | 광선명화가능한조성물 | |
WO2007148384A1 (ja) | ネガ型感光性樹脂組成物、パターンの製造方法及び電子部品 | |
TWI709814B (zh) | 感光性樹脂組合物、硬化浮凸圖案之製造方法、及半導體裝置 | |
CN116880123B (zh) | 一种聚苯并噁唑类感光性树脂组合物及其制备方法和应用 | |
WO2021215374A1 (ja) | 感光性樹脂組成物、パターン硬化膜の製造方法、硬化膜、層間絶縁膜、カバーコート層、表面保護膜及び電子部品 | |
JPH01172426A (ja) | 放射線感応性耐熱樹脂組成物 | |
JP2890491B2 (ja) | 化学線感応性重合体組成物 | |
JPH09146274A (ja) | 感光性樹脂組成物及びそのパターン形成方法 | |
TW202112900A (zh) | 感光性樹脂組成物、圖案硬化膜的製造方法、硬化膜、層間絕緣膜、面塗層、表面保護膜及電子零件 | |
JP3342297B2 (ja) | 感光性樹脂組成物 | |
JP2000214586A (ja) | 感光性樹脂組成物、パタ―ンの製造法及び電子部品 | |
JP2005266757A (ja) | 感光性樹脂組成物 | |
TW202348687A (zh) | 樹脂組合物、聚醯亞胺之製造方法、硬化浮凸圖案之製造方法、及半導體裝置 | |
CN114253076A (zh) | 感光性树脂组合物 | |
JPH01129246A (ja) | 感光性耐熱樹脂組成物 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20070719 Year of fee payment: 6 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080719 Year of fee payment: 7 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20080719 Year of fee payment: 7 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090719 Year of fee payment: 8 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20090719 Year of fee payment: 8 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20100719 Year of fee payment: 9 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110719 Year of fee payment: 10 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20110719 Year of fee payment: 10 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120719 Year of fee payment: 11 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120719 Year of fee payment: 11 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130719 Year of fee payment: 12 |
|
EXPY | Cancellation because of completion of term | ||
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130719 Year of fee payment: 12 |