KR100324184B1 - 광경화성사이클로부타렌조성물 - Google Patents

광경화성사이클로부타렌조성물 Download PDF

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Publication number
KR100324184B1
KR100324184B1 KR1019940701959A KR19940701959A KR100324184B1 KR 100324184 B1 KR100324184 B1 KR 100324184B1 KR 1019940701959 A KR1019940701959 A KR 1019940701959A KR 19940701959 A KR19940701959 A KR 19940701959A KR 100324184 B1 KR100324184 B1 KR 100324184B1
Authority
KR
South Korea
Prior art keywords
cyclobutene
photocurable
composition
photocurable cyclobutene
cyclobutene composition
Prior art date
Application number
KR1019940701959A
Other languages
English (en)
Inventor
프랭크엘.오우크스
모이어 에릭에스
에드워드더블유.루터
해리스 로버트에프
Original Assignee
더 다우 케미칼 캄파니
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 더 다우 케미칼 캄파니 filed Critical 더 다우 케미칼 캄파니
Application granted granted Critical
Publication of KR100324184B1 publication Critical patent/KR100324184B1/ko

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Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C247/00—Compounds containing azido groups
    • C07C247/16—Compounds containing azido groups with azido groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/0834—Compounds having one or more O-Si linkage
    • C07F7/0838—Compounds with one or more Si-O-Si sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C2601/00—Systems containing only non-condensed rings
    • C07C2601/12—Systems containing only non-condensed rings with a six-membered ring
    • C07C2601/14—The ring being saturated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Polymers & Plastics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Formation Of Insulating Films (AREA)
  • Laminated Bodies (AREA)
  • Materials For Photolithography (AREA)
KR1019940701959A 1991-12-10 1994-06-09 광경화성사이클로부타렌조성물 KR100324184B1 (ko)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US80539591A 1991-12-10 1991-12-10

Related Child Applications (1)

Application Number Title Priority Date Filing Date
KR20007003388A Division KR100307647B1 (ko) 1991-12-10 2000-03-29 광경화된 사이클로부타렌 중합체, 이를 함유하는 패턴 피복된 기판 및 이를 함유하는 유전층을 갖는 전자 장치

Publications (1)

Publication Number Publication Date
KR100324184B1 true KR100324184B1 (ko) 2002-07-27

Family

ID=25191455

Family Applications (2)

Application Number Title Priority Date Filing Date
KR1019940701959A KR100324184B1 (ko) 1991-12-10 1994-06-09 광경화성사이클로부타렌조성물
KR20007003388A KR100307647B1 (ko) 1991-12-10 2000-03-29 광경화된 사이클로부타렌 중합체, 이를 함유하는 패턴 피복된 기판 및 이를 함유하는 유전층을 갖는 전자 장치

Family Applications After (1)

Application Number Title Priority Date Filing Date
KR20007003388A KR100307647B1 (ko) 1991-12-10 2000-03-29 광경화된 사이클로부타렌 중합체, 이를 함유하는 패턴 피복된 기판 및 이를 함유하는 유전층을 갖는 전자 장치

Country Status (8)

Country Link
US (2) US6083661A (ko)
EP (1) EP0616701B1 (ko)
JP (1) JP3213001B2 (ko)
KR (2) KR100324184B1 (ko)
CA (1) CA2125567A1 (ko)
DE (1) DE69232419T2 (ko)
SG (1) SG49761A1 (ko)
WO (1) WO1993012055A2 (ko)

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US5994489A (en) * 1994-10-24 1999-11-30 The Dow Chemical Company Adhesion promoter and self-priming arylcyclobutene resin compositions
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US6277203B1 (en) 1998-09-29 2001-08-21 Lam Research Corporation Method and apparatus for cleaning low K dielectric and metal wafer surfaces
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US7316844B2 (en) * 2004-01-16 2008-01-08 Brewer Science Inc. Spin-on protective coatings for wet-etch processing of microelectronic substrates
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JP4876426B2 (ja) * 2005-04-08 2012-02-15 日亜化学工業株式会社 耐熱性及び耐光性に優れる発光装置
US7695890B2 (en) * 2005-09-09 2010-04-13 Brewer Science Inc. Negative photoresist for silicon KOH etch without silicon nitride
TWI391436B (zh) * 2005-10-13 2013-04-01 Dow Global Technologies Llc 以苯環丁烯為基底的聚合物配方及在氧化環境中加工該等配方的方法
WO2007119384A1 (ja) 2006-03-16 2007-10-25 Asahi Glass Company, Limited ネガ型感光性含フッ素芳香族系樹脂組成物
US7709178B2 (en) 2007-04-17 2010-05-04 Brewer Science Inc. Alkaline-resistant negative photoresist for silicon wet-etch without silicon nitride
US20120052222A1 (en) * 2007-08-10 2012-03-01 Gagne Robert R Lightweight ballistic protection materials,
US8192642B2 (en) * 2007-09-13 2012-06-05 Brewer Science Inc. Spin-on protective coatings for wet-etch processing of microelectronic substrates
CN102066443B (zh) 2008-06-19 2014-01-15 旭硝子株式会社 固化性组合物及使用了该组合物的固化膜
TWI399873B (zh) * 2009-03-03 2013-06-21 Everlight Electronics Co Ltd 發光二極體封裝結構及其製作方法
JP5397175B2 (ja) * 2009-11-13 2014-01-22 セイコーエプソン株式会社 半導体装置用基板及びその製造方法、半導体装置並びに電子機器
US9493613B2 (en) 2011-07-04 2016-11-15 Cambridge Display Technology, Ltd. Organic light emitting composition, device and method
US9188412B2 (en) 2011-07-28 2015-11-17 Mac, Llc Polymeric ammunition casing geometry
US9182204B2 (en) 2011-07-28 2015-11-10 Mac, Llc Subsonic ammunition casing
CN102520584B (zh) * 2011-09-13 2014-05-07 复旦大学 光敏苯并环丁烯树脂组合物及制备方法以及其图案化方法
DE102013210138A1 (de) 2013-05-30 2014-12-04 Boehringer Ingelheim Vetmedica Gmbh Verfahren zum Erzeugen einer Vielzahl von Messbereichen auf einem Chip sowie Chip mit Messbereichen
EP3094944B1 (en) 2014-01-13 2019-02-27 Mac Llc Polymeric ammunition casing
US9453714B2 (en) 2014-04-04 2016-09-27 Mac, Llc Method for producing subsonic ammunition casing
US9441055B1 (en) * 2015-09-18 2016-09-13 Dow Global Technologies Llc Arylcyclobutenes
CN108367289B (zh) 2015-12-02 2022-01-18 勃林格殷格翰维特梅迪卡有限公司 用于在芯片上产生多个测量区域的方法及具有多个测量区域的芯片
JP6882689B2 (ja) * 2016-09-01 2021-06-02 Jsr株式会社 基材表面の選択的修飾方法及び組成物
AT521919B1 (de) * 2018-12-13 2022-07-15 Johann Kuebel Ing Vorrichtung zur Abgabe von Licht
KR102419938B1 (ko) * 2020-02-18 2022-07-12 김만현 차량 시트용 가죽의 스티치 형성방법
CN115826359A (zh) * 2022-11-22 2023-03-21 西南科技大学 用于光刻图案化的全碳氢低介电损耗光敏树脂的制备及应用
CN117111405B (zh) * 2023-08-04 2024-09-24 西南科技大学 线性聚硅氧烷低介电损耗光敏树脂的制备及光刻图案化的应用
CN116880126A (zh) * 2023-08-08 2023-10-13 西南科技大学 支化型苯并环丁烯基聚硅氧烷低介电损耗光敏树脂的制备及应用

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Also Published As

Publication number Publication date
US6083661A (en) 2000-07-04
WO1993012055A2 (en) 1993-06-24
CA2125567A1 (en) 1993-06-24
SG49761A1 (en) 1998-06-15
EP0616701B1 (en) 2002-02-13
DE69232419D1 (de) 2002-03-21
US5585450A (en) 1996-12-17
JP3213001B2 (ja) 2001-09-25
WO1993012055A3 (en) 1993-08-05
DE69232419T2 (de) 2002-09-19
KR100307647B1 (ko) 2001-09-24
JPH07503740A (ja) 1995-04-20
EP0616701A4 (en) 1995-06-14
EP0616701A1 (en) 1994-09-28

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