KR100324184B1 - 광경화성사이클로부타렌조성물 - Google Patents
광경화성사이클로부타렌조성물 Download PDFInfo
- Publication number
- KR100324184B1 KR100324184B1 KR1019940701959A KR19940701959A KR100324184B1 KR 100324184 B1 KR100324184 B1 KR 100324184B1 KR 1019940701959 A KR1019940701959 A KR 1019940701959A KR 19940701959 A KR19940701959 A KR 19940701959A KR 100324184 B1 KR100324184 B1 KR 100324184B1
- Authority
- KR
- South Korea
- Prior art keywords
- cyclobutene
- photocurable
- composition
- photocurable cyclobutene
- cyclobutene composition
- Prior art date
Links
- CFBGXYDUODCMNS-UHFFFAOYSA-N cyclobutene Chemical compound C1CC=C1 CFBGXYDUODCMNS-UHFFFAOYSA-N 0.000 title 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C247/00—Compounds containing azido groups
- C07C247/16—Compounds containing azido groups with azido groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/0834—Compounds having one or more O-Si linkage
- C07F7/0838—Compounds with one or more Si-O-Si sequences
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
- C07C2601/00—Systems containing only non-condensed rings
- C07C2601/12—Systems containing only non-condensed rings with a six-membered ring
- C07C2601/14—The ring being saturated
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Polymers & Plastics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
- Formation Of Insulating Films (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Laminated Bodies (AREA)
- Materials For Photolithography (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US80539591A | 1991-12-10 | 1991-12-10 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR20007003388A Division KR100307647B1 (ko) | 1991-12-10 | 2000-03-29 | 광경화된 사이클로부타렌 중합체, 이를 함유하는 패턴 피복된 기판 및 이를 함유하는 유전층을 갖는 전자 장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
KR100324184B1 true KR100324184B1 (ko) | 2002-07-27 |
Family
ID=25191455
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019940701959A KR100324184B1 (ko) | 1991-12-10 | 1994-06-09 | 광경화성사이클로부타렌조성물 |
KR20007003388A KR100307647B1 (ko) | 1991-12-10 | 2000-03-29 | 광경화된 사이클로부타렌 중합체, 이를 함유하는 패턴 피복된 기판 및 이를 함유하는 유전층을 갖는 전자 장치 |
Family Applications After (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR20007003388A KR100307647B1 (ko) | 1991-12-10 | 2000-03-29 | 광경화된 사이클로부타렌 중합체, 이를 함유하는 패턴 피복된 기판 및 이를 함유하는 유전층을 갖는 전자 장치 |
Country Status (8)
Country | Link |
---|---|
US (2) | US6083661A (ko) |
EP (1) | EP0616701B1 (ko) |
JP (1) | JP3213001B2 (ko) |
KR (2) | KR100324184B1 (ko) |
CA (1) | CA2125567A1 (ko) |
DE (1) | DE69232419T2 (ko) |
SG (1) | SG49761A1 (ko) |
WO (1) | WO1993012055A2 (ko) |
Families Citing this family (48)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5854302A (en) * | 1993-04-29 | 1998-12-29 | The Dow Chemical Company | Partially polymerized divinylsiloxane linked bisbenzocyclobutene resins and methods for making said resins |
JP3417008B2 (ja) * | 1993-11-04 | 2003-06-16 | 株式会社デンソー | 半導体ウエハのエッチング方法 |
US5994489A (en) * | 1994-10-24 | 1999-11-30 | The Dow Chemical Company | Adhesion promoter and self-priming arylcyclobutene resin compositions |
US5668210A (en) * | 1994-10-24 | 1997-09-16 | The Dow Chemical Company | Adhesion promoter and self-priming arylcyclobutene resin compositions |
EP0727711A3 (en) * | 1995-02-17 | 1997-04-09 | Ocg Microelectronic Materials | Photoresist compositions containing supercritical fluid fractionated polymeric resin binders |
EP0819266B1 (en) | 1995-04-03 | 2000-08-23 | The Dow Chemical Company | Photodefineable compositions |
US6273985B1 (en) * | 1998-06-26 | 2001-08-14 | Xerox Corporation | Bonding process |
US6184284B1 (en) | 1998-08-24 | 2001-02-06 | The Dow Chemical Company | Adhesion promoter and self-priming resin compositions and articles made therefrom |
US6277203B1 (en) | 1998-09-29 | 2001-08-21 | Lam Research Corporation | Method and apparatus for cleaning low K dielectric and metal wafer surfaces |
US6361926B1 (en) | 1998-10-23 | 2002-03-26 | The Dow Chemical Company | Acid functional polymers based on benzocyclobutene |
US6420093B1 (en) | 2000-02-02 | 2002-07-16 | The Dow Chemical Company | Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards |
JP2001308082A (ja) * | 2000-04-20 | 2001-11-02 | Nec Corp | 液体有機原料の気化方法及び絶縁膜の成長方法 |
US6991887B1 (en) * | 2000-11-01 | 2006-01-31 | Battelle Memorial Institute | Photopatternable sorbent and functionalized films |
JP2002265762A (ja) * | 2001-03-08 | 2002-09-18 | Nippon Kayaku Co Ltd | ベンゾシクロブテン樹脂組成物、樹脂結合型金属成型部品 |
US6942750B2 (en) * | 2001-06-08 | 2005-09-13 | The Regents Of The University Of Michigan | Low-temperature patterned wafer bonding with photosensitive benzocyclobutene (BCB) and 3D MEMS (microelectromechanical systems) structure fabrication |
WO2002101463A1 (en) * | 2001-06-08 | 2002-12-19 | The Penn State Research Foundation | Patterning compositions using e-beam lithography and structures and devices made thereby |
WO2003010565A2 (en) * | 2001-07-26 | 2003-02-06 | The Penn State Research Foundation | Optical waveguides and grating structures fabricated using polymeric dielectric compositions |
US6780567B2 (en) * | 2001-08-02 | 2004-08-24 | Fuji Photo Film Co., Ltd. | Lithographic process using reaction of o-quinodimethane |
US7019093B2 (en) * | 2002-10-18 | 2006-03-28 | Dow Global Technologies Inc. | Aqueous developable, photosensitive benzocyclobutene-based oligomers and polymers with high moisture resistance |
WO2004073061A1 (en) * | 2003-02-05 | 2004-08-26 | Dow Global Technologies Inc. | Sacrificial benzocyclobutene copolymers for making air gap semiconductor devices |
US7164197B2 (en) | 2003-06-19 | 2007-01-16 | 3M Innovative Properties Company | Dielectric composite material |
US7316844B2 (en) | 2004-01-16 | 2008-01-08 | Brewer Science Inc. | Spin-on protective coatings for wet-etch processing of microelectronic substrates |
JP5231017B2 (ja) * | 2004-10-13 | 2013-07-10 | ダウ グローバル テクノロジーズ エルエルシー | ベンゾシクロブテン系ポリマー配合物、及び酸化環境内での該配合物の製造方法 |
JP4876426B2 (ja) * | 2005-04-08 | 2012-02-15 | 日亜化学工業株式会社 | 耐熱性及び耐光性に優れる発光装置 |
US7695890B2 (en) * | 2005-09-09 | 2010-04-13 | Brewer Science Inc. | Negative photoresist for silicon KOH etch without silicon nitride |
TWI391436B (zh) * | 2005-10-13 | 2013-04-01 | Dow Global Technologies Llc | 以苯環丁烯為基底的聚合物配方及在氧化環境中加工該等配方的方法 |
KR20080104308A (ko) | 2006-03-16 | 2008-12-02 | 아사히 가라스 가부시키가이샤 | 네거티브형 감광성 함불소 방향족계 수지 조성물 |
US7709178B2 (en) | 2007-04-17 | 2010-05-04 | Brewer Science Inc. | Alkaline-resistant negative photoresist for silicon wet-etch without silicon nitride |
US20120052222A1 (en) * | 2007-08-10 | 2012-03-01 | Gagne Robert R | Lightweight ballistic protection materials, |
US8192642B2 (en) * | 2007-09-13 | 2012-06-05 | Brewer Science Inc. | Spin-on protective coatings for wet-etch processing of microelectronic substrates |
WO2009154254A1 (ja) | 2008-06-19 | 2009-12-23 | 旭硝子株式会社 | 硬化性組成物およびそれを用いた硬化膜 |
TWI399873B (zh) * | 2009-03-03 | 2013-06-21 | Everlight Electronics Co Ltd | 發光二極體封裝結構及其製作方法 |
JP5397175B2 (ja) * | 2009-11-13 | 2014-01-22 | セイコーエプソン株式会社 | 半導体装置用基板及びその製造方法、半導体装置並びに電子機器 |
KR101986859B1 (ko) | 2011-07-04 | 2019-06-07 | 캠브리지 디스플레이 테크놀로지 리미티드 | 중합체, 단량체 및 중합체의 형성 방법 |
US9188412B2 (en) | 2011-07-28 | 2015-11-17 | Mac, Llc | Polymeric ammunition casing geometry |
US9182204B2 (en) | 2011-07-28 | 2015-11-10 | Mac, Llc | Subsonic ammunition casing |
CN102520584B (zh) * | 2011-09-13 | 2014-05-07 | 复旦大学 | 光敏苯并环丁烯树脂组合物及制备方法以及其图案化方法 |
DE102013210138A1 (de) | 2013-05-30 | 2014-12-04 | Boehringer Ingelheim Vetmedica Gmbh | Verfahren zum Erzeugen einer Vielzahl von Messbereichen auf einem Chip sowie Chip mit Messbereichen |
PL3094944T3 (pl) | 2014-01-13 | 2019-10-31 | Mac Llc | Łuska amunicji polimerowej |
WO2015154079A1 (en) | 2014-04-04 | 2015-10-08 | Mac, Llc | Method for producing subsonic ammunition casing |
US9441055B1 (en) * | 2015-09-18 | 2016-09-13 | Dow Global Technologies Llc | Arylcyclobutenes |
KR20180088722A (ko) * | 2015-12-02 | 2018-08-06 | 베링거잉겔하임베트메디카게엠베하 | 칩 상에 다수의 측정 영역들을 제조하는 방법 및 다수의 측정 영역들을 갖는 칩 |
WO2018043304A1 (ja) * | 2016-09-01 | 2018-03-08 | Jsr株式会社 | 基材表面の選択的修飾方法及び組成物 |
AT521919B1 (de) * | 2018-12-13 | 2022-07-15 | Johann Kuebel Ing | Vorrichtung zur Abgabe von Licht |
KR102419938B1 (ko) * | 2020-02-18 | 2022-07-12 | 김만현 | 차량 시트용 가죽의 스티치 형성방법 |
CN115826359A (zh) * | 2022-11-22 | 2023-03-21 | 西南科技大学 | 用于光刻图案化的全碳氢低介电损耗光敏树脂的制备及应用 |
CN117111405B (zh) * | 2023-08-04 | 2024-09-24 | 西南科技大学 | 线性聚硅氧烷低介电损耗光敏树脂的制备及光刻图案化的应用 |
CN116880126A (zh) * | 2023-08-08 | 2023-10-13 | 西南科技大学 | 支化型苯并环丁烯基聚硅氧烷低介电损耗光敏树脂的制备及应用 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4106943A (en) * | 1973-09-27 | 1978-08-15 | Japan Synthetic Rubber Co., Ltd. | Photosensitive cross-linkable azide containing polymeric composition |
US4864010A (en) * | 1988-06-09 | 1989-09-05 | The Dow Chemical Company | Monomers, oligomers, and polymers of biscyclobutarenes bridged by at least one benzoxazole linkage |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2852379A (en) * | 1955-05-04 | 1958-09-16 | Eastman Kodak Co | Azide resin photolithographic composition |
US2940853A (en) * | 1958-08-21 | 1960-06-14 | Eastman Kodak Co | Azide sensitized resin photographic resist |
JPS6057584B2 (ja) * | 1979-04-24 | 1985-12-16 | ジェイエスアール株式会社 | ホトレジスト組成物 |
JPS57168942A (en) * | 1981-04-13 | 1982-10-18 | Hitachi Ltd | Photosensitive polymer composition |
US4564576A (en) * | 1983-05-27 | 1986-01-14 | Nec Corporation | Resist material comprising polymer of allylsilyl compound and pattern forming method using the resist material |
US4571375A (en) * | 1983-10-24 | 1986-02-18 | Benedikt George M | Ring-opened polynorbornene negative photoresist with bisazide |
US4743399A (en) * | 1984-08-27 | 1988-05-10 | The Dow Chemical Company | Adhesive compositions from arylcyclobutene monomeric compositions |
US4642329A (en) * | 1984-08-27 | 1987-02-10 | The Dow Chemical Company | Prepolymer processing of arylcyclobutene monomeric compositions |
US4724260A (en) * | 1984-08-27 | 1988-02-09 | The Dow Chemical Company | Unsaturated alkyl monoarylcyclobutane monomers |
US4540763A (en) * | 1984-09-14 | 1985-09-10 | The Dow Chemical Company | Polymers derived from poly(arylcyclobutenes) |
US4730030A (en) * | 1986-07-25 | 1988-03-08 | The Dow Chemical Company | Arylcyclobutane/dienophile copolymer |
US4759874A (en) * | 1987-08-03 | 1988-07-26 | The Dow Chemical Company | Benzocyclobutene-based die attach adhesive compositions |
US4812588A (en) * | 1987-12-14 | 1989-03-14 | The Dow Chemical Company | Polyorganosiloxane-bridged bisbenzocyclobutene monomers |
JP2643261B2 (ja) * | 1988-03-23 | 1997-08-20 | 株式会社日立製作所 | ネガ型感光性組成物及びパタン形成方法 |
US4831172A (en) * | 1988-03-23 | 1989-05-16 | The Dow Chemical Company | Benzocyclobutene-based organosilane adhesion aids |
US5041600A (en) * | 1990-01-29 | 1991-08-20 | Shell Oil Company | Bisphenol ethers |
JP2770615B2 (ja) * | 1991-08-09 | 1998-07-02 | 日本電気株式会社 | ベンゾシクロブテン樹脂前駆体混合組成物およびそれを用いたベンゾシクロブテン樹脂膜の製造方法 |
US5156656A (en) * | 1991-09-13 | 1992-10-20 | The Dow Chemical Company | Semi-permeable membranes derived from reactive oligomers |
US5854302A (en) * | 1993-04-29 | 1998-12-29 | The Dow Chemical Company | Partially polymerized divinylsiloxane linked bisbenzocyclobutene resins and methods for making said resins |
-
1992
- 1992-12-10 JP JP51105793A patent/JP3213001B2/ja not_active Expired - Lifetime
- 1992-12-10 WO PCT/US1992/010649 patent/WO1993012055A2/en active IP Right Grant
- 1992-12-10 EP EP93901377A patent/EP0616701B1/en not_active Expired - Lifetime
- 1992-12-10 DE DE69232419T patent/DE69232419T2/de not_active Expired - Lifetime
- 1992-12-10 CA CA002125567A patent/CA2125567A1/en not_active Abandoned
- 1992-12-10 SG SG1996004925A patent/SG49761A1/en unknown
-
1994
- 1994-06-09 KR KR1019940701959A patent/KR100324184B1/ko not_active IP Right Cessation
- 1994-08-15 US US08/290,197 patent/US6083661A/en not_active Expired - Lifetime
-
1995
- 1995-06-05 US US08/465,666 patent/US5585450A/en not_active Expired - Lifetime
-
2000
- 2000-03-29 KR KR20007003388A patent/KR100307647B1/ko not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4106943A (en) * | 1973-09-27 | 1978-08-15 | Japan Synthetic Rubber Co., Ltd. | Photosensitive cross-linkable azide containing polymeric composition |
US4864010A (en) * | 1988-06-09 | 1989-09-05 | The Dow Chemical Company | Monomers, oligomers, and polymers of biscyclobutarenes bridged by at least one benzoxazole linkage |
Also Published As
Publication number | Publication date |
---|---|
EP0616701B1 (en) | 2002-02-13 |
DE69232419T2 (de) | 2002-09-19 |
SG49761A1 (en) | 1998-06-15 |
US6083661A (en) | 2000-07-04 |
KR100307647B1 (ko) | 2001-09-24 |
WO1993012055A2 (en) | 1993-06-24 |
EP0616701A1 (en) | 1994-09-28 |
DE69232419D1 (de) | 2002-03-21 |
JP3213001B2 (ja) | 2001-09-25 |
WO1993012055A3 (en) | 1993-08-05 |
EP0616701A4 (en) | 1995-06-14 |
US5585450A (en) | 1996-12-17 |
CA2125567A1 (en) | 1993-06-24 |
JPH07503740A (ja) | 1995-04-20 |
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Legal Events
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A201 | Request for examination | ||
WITN | Application deemed withdrawn, e.g. because no request for examination was filed or no examination fee was paid | ||
E902 | Notification of reason for refusal | ||
A107 | Divisional application of patent | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20120106 Year of fee payment: 11 |
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EXPY | Expiration of term |