SG49761A1 - Photocurable cyclobutarene compositions - Google Patents

Photocurable cyclobutarene compositions

Info

Publication number
SG49761A1
SG49761A1 SG1996004925A SG1996004925A SG49761A1 SG 49761 A1 SG49761 A1 SG 49761A1 SG 1996004925 A SG1996004925 A SG 1996004925A SG 1996004925 A SG1996004925 A SG 1996004925A SG 49761 A1 SG49761 A1 SG 49761A1
Authority
SG
Singapore
Prior art keywords
cyclobutarene
photocurable
compositions
photocurable cyclobutarene
cyclobutarene compositions
Prior art date
Application number
SG1996004925A
Other languages
English (en)
Inventor
Frank L Oaks
Eric S Moyer
Edward W Rutter
Robert F Harris
Original Assignee
Dow Chemical Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Chemical Co filed Critical Dow Chemical Co
Publication of SG49761A1 publication Critical patent/SG49761A1/en

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C247/00—Compounds containing azido groups
    • C07C247/16—Compounds containing azido groups with azido groups bound to carbon atoms of six-membered aromatic rings of a carbon skeleton
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
    • C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
    • C07F7/02—Silicon compounds
    • C07F7/08—Compounds having one or more C—Si linkages
    • C07F7/0834—Compounds having one or more O-Si linkage
    • C07F7/0838—Compounds with one or more Si-O-Si sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G61/00—Macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain of the macromolecule
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • C—CHEMISTRY; METALLURGY
    • C07—ORGANIC CHEMISTRY
    • C07C—ACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C2601/00—Systems containing only non-condensed rings
    • C07C2601/12—Systems containing only non-condensed rings with a six-membered ring
    • C07C2601/14—The ring being saturated

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Formation Of Insulating Films (AREA)
  • Materials For Photolithography (AREA)
  • Laminated Bodies (AREA)
SG1996004925A 1991-12-10 1992-12-10 Photocurable cyclobutarene compositions SG49761A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US80539591A 1991-12-10 1991-12-10

Publications (1)

Publication Number Publication Date
SG49761A1 true SG49761A1 (en) 1998-06-15

Family

ID=25191455

Family Applications (1)

Application Number Title Priority Date Filing Date
SG1996004925A SG49761A1 (en) 1991-12-10 1992-12-10 Photocurable cyclobutarene compositions

Country Status (8)

Country Link
US (2) US6083661A (ko)
EP (1) EP0616701B1 (ko)
JP (1) JP3213001B2 (ko)
KR (2) KR100324184B1 (ko)
CA (1) CA2125567A1 (ko)
DE (1) DE69232419T2 (ko)
SG (1) SG49761A1 (ko)
WO (1) WO1993012055A2 (ko)

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JP3417008B2 (ja) * 1993-11-04 2003-06-16 株式会社デンソー 半導体ウエハのエッチング方法
US5668210A (en) * 1994-10-24 1997-09-16 The Dow Chemical Company Adhesion promoter and self-priming arylcyclobutene resin compositions
US5994489A (en) * 1994-10-24 1999-11-30 The Dow Chemical Company Adhesion promoter and self-priming arylcyclobutene resin compositions
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DE69609952T2 (de) 1995-04-03 2001-03-22 Dow Chemical Co Photostrukturierbare zusammensetzungen
US6273985B1 (en) 1998-06-26 2001-08-14 Xerox Corporation Bonding process
US6184284B1 (en) 1998-08-24 2001-02-06 The Dow Chemical Company Adhesion promoter and self-priming resin compositions and articles made therefrom
US6277203B1 (en) 1998-09-29 2001-08-21 Lam Research Corporation Method and apparatus for cleaning low K dielectric and metal wafer surfaces
US6361926B1 (en) * 1998-10-23 2002-03-26 The Dow Chemical Company Acid functional polymers based on benzocyclobutene
US6420093B1 (en) 2000-02-02 2002-07-16 The Dow Chemical Company Toughened benzocyclobutene based polymers and their use in building-up printed wiring boards
JP2001308082A (ja) * 2000-04-20 2001-11-02 Nec Corp 液体有機原料の気化方法及び絶縁膜の成長方法
US6991887B1 (en) * 2000-11-01 2006-01-31 Battelle Memorial Institute Photopatternable sorbent and functionalized films
JP2002265762A (ja) * 2001-03-08 2002-09-18 Nippon Kayaku Co Ltd ベンゾシクロブテン樹脂組成物、樹脂結合型金属成型部品
US6919164B2 (en) * 2001-06-08 2005-07-19 The Penn State Research Foundation Patterning compositions using E-beam lithography and structures and devices made thereby
AU2002305835A1 (en) * 2001-06-08 2002-12-23 The Regents Of The University Of Michigan Low-temperature patterned wafer bonding with photosensitive benzocylobutene (bcb) and 3d microelectromechanical systems fabrication
WO2003010565A2 (en) * 2001-07-26 2003-02-06 The Penn State Research Foundation Optical waveguides and grating structures fabricated using polymeric dielectric compositions
US6780567B2 (en) * 2001-08-02 2004-08-24 Fuji Photo Film Co., Ltd. Lithographic process using reaction of o-quinodimethane
US7019093B2 (en) 2002-10-18 2006-03-28 Dow Global Technologies Inc. Aqueous developable, photosensitive benzocyclobutene-based oligomers and polymers with high moisture resistance
US7585785B2 (en) * 2003-02-05 2009-09-08 Dow Global Technologies Sacrificial benzocyclobutene copolymers for making air gap semiconductor devices
US7164197B2 (en) 2003-06-19 2007-01-16 3M Innovative Properties Company Dielectric composite material
US7316844B2 (en) 2004-01-16 2008-01-08 Brewer Science Inc. Spin-on protective coatings for wet-etch processing of microelectronic substrates
US8143324B2 (en) 2004-10-13 2012-03-27 Dow Global Technologies Llc Benzocyclobutene based polymer formulations and methods for processing such formulations in oxidative environments
JP4876426B2 (ja) * 2005-04-08 2012-02-15 日亜化学工業株式会社 耐熱性及び耐光性に優れる発光装置
US7695890B2 (en) * 2005-09-09 2010-04-13 Brewer Science Inc. Negative photoresist for silicon KOH etch without silicon nitride
TWI391436B (zh) * 2005-10-13 2013-04-01 Dow Global Technologies Llc 以苯環丁烯為基底的聚合物配方及在氧化環境中加工該等配方的方法
KR20140009592A (ko) 2006-03-16 2014-01-22 아사히 가라스 가부시키가이샤 네거티브형 감광성 함불소 방향족계 수지 조성물
US7709178B2 (en) 2007-04-17 2010-05-04 Brewer Science Inc. Alkaline-resistant negative photoresist for silicon wet-etch without silicon nitride
US20120052222A1 (en) * 2007-08-10 2012-03-01 Gagne Robert R Lightweight ballistic protection materials,
US8192642B2 (en) * 2007-09-13 2012-06-05 Brewer Science Inc. Spin-on protective coatings for wet-etch processing of microelectronic substrates
KR101570553B1 (ko) 2008-06-19 2015-11-19 아사히 가라스 가부시키가이샤 경화성 조성물 및 그것을 사용한 경화막
TWI399873B (zh) * 2009-03-03 2013-06-21 Everlight Electronics Co Ltd 發光二極體封裝結構及其製作方法
JP5397175B2 (ja) * 2009-11-13 2014-01-22 セイコーエプソン株式会社 半導体装置用基板及びその製造方法、半導体装置並びに電子機器
GB2505834A (en) * 2011-07-04 2014-03-12 Cambridge Display Tech Ltd Organic light emitting composition, device and method
US9188412B2 (en) 2011-07-28 2015-11-17 Mac, Llc Polymeric ammunition casing geometry
US9182204B2 (en) 2011-07-28 2015-11-10 Mac, Llc Subsonic ammunition casing
CN102520584B (zh) * 2011-09-13 2014-05-07 复旦大学 光敏苯并环丁烯树脂组合物及制备方法以及其图案化方法
DE102013210138A1 (de) 2013-05-30 2014-12-04 Boehringer Ingelheim Vetmedica Gmbh Verfahren zum Erzeugen einer Vielzahl von Messbereichen auf einem Chip sowie Chip mit Messbereichen
ES2728242T3 (es) 2014-01-13 2019-10-23 Mac Llc Vaina de munición polimérica
US9453714B2 (en) 2014-04-04 2016-09-27 Mac, Llc Method for producing subsonic ammunition casing
US9441055B1 (en) * 2015-09-18 2016-09-13 Dow Global Technologies Llc Arylcyclobutenes
KR20180088722A (ko) * 2015-12-02 2018-08-06 베링거잉겔하임베트메디카게엠베하 칩 상에 다수의 측정 영역들을 제조하는 방법 및 다수의 측정 영역들을 갖는 칩
WO2018043304A1 (ja) * 2016-09-01 2018-03-08 Jsr株式会社 基材表面の選択的修飾方法及び組成物
AT521919B1 (de) * 2018-12-13 2022-07-15 Johann Kuebel Ing Vorrichtung zur Abgabe von Licht
KR102419938B1 (ko) * 2020-02-18 2022-07-12 김만현 차량 시트용 가죽의 스티치 형성방법
CN115826359A (zh) * 2022-11-22 2023-03-21 西南科技大学 用于光刻图案化的全碳氢低介电损耗光敏树脂的制备及应用
CN117111405A (zh) * 2023-08-04 2023-11-24 西南科技大学 线性聚硅氧烷低介电损耗光敏树脂的制备及光刻图案化的应用
CN116880126A (zh) * 2023-08-08 2023-10-13 西南科技大学 支化型苯并环丁烯基聚硅氧烷低介电损耗光敏树脂的制备及应用

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US4106943A (en) * 1973-09-27 1978-08-15 Japan Synthetic Rubber Co., Ltd. Photosensitive cross-linkable azide containing polymeric composition
JPS6057584B2 (ja) * 1979-04-24 1985-12-16 ジェイエスアール株式会社 ホトレジスト組成物
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US4743399A (en) * 1984-08-27 1988-05-10 The Dow Chemical Company Adhesive compositions from arylcyclobutene monomeric compositions
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US4730030A (en) * 1986-07-25 1988-03-08 The Dow Chemical Company Arylcyclobutane/dienophile copolymer
US4759874A (en) * 1987-08-03 1988-07-26 The Dow Chemical Company Benzocyclobutene-based die attach adhesive compositions
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Also Published As

Publication number Publication date
US5585450A (en) 1996-12-17
JPH07503740A (ja) 1995-04-20
EP0616701B1 (en) 2002-02-13
KR100307647B1 (ko) 2001-09-24
DE69232419T2 (de) 2002-09-19
DE69232419D1 (de) 2002-03-21
EP0616701A1 (en) 1994-09-28
WO1993012055A2 (en) 1993-06-24
EP0616701A4 (en) 1995-06-14
CA2125567A1 (en) 1993-06-24
KR100324184B1 (ko) 2002-07-27
US6083661A (en) 2000-07-04
JP3213001B2 (ja) 2001-09-25
WO1993012055A3 (en) 1993-08-05

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