JPH0691153B2 - 保護フイルムの剥離方法 - Google Patents

保護フイルムの剥離方法

Info

Publication number
JPH0691153B2
JPH0691153B2 JP63285480A JP28548088A JPH0691153B2 JP H0691153 B2 JPH0691153 B2 JP H0691153B2 JP 63285480 A JP63285480 A JP 63285480A JP 28548088 A JP28548088 A JP 28548088A JP H0691153 B2 JPH0691153 B2 JP H0691153B2
Authority
JP
Japan
Prior art keywords
wafer
protective film
peeling
adhesive tape
roller
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP63285480A
Other languages
English (en)
Japanese (ja)
Other versions
JPH01272129A (ja
Inventor
稔 雨谷
啓吾 船越
秋彦 吉良
孝夫 松下
敬三 白倉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Priority to JP63285480A priority Critical patent/JPH0691153B2/ja
Priority to DE8888119424T priority patent/DE3879890T2/de
Priority to EP88119424A priority patent/EP0318806B1/de
Priority to US07/276,587 priority patent/US5009735A/en
Publication of JPH01272129A publication Critical patent/JPH01272129A/ja
Publication of JPH0691153B2 publication Critical patent/JPH0691153B2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004—Component parts, details or accessories; Auxiliary operations
    • B29C63/0013—Removing old coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
    • Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP63285480A 1987-11-28 1988-11-10 保護フイルムの剥離方法 Expired - Lifetime JPH0691153B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP63285480A JPH0691153B2 (ja) 1987-11-28 1988-11-10 保護フイルムの剥離方法
DE8888119424T DE3879890T2 (de) 1987-11-28 1988-11-22 Verfahren zum abziehen eines schutzfilms von einem plaettchen.
EP88119424A EP0318806B1 (de) 1987-11-28 1988-11-22 Verfahren zum Abziehen eines Schutzfilms von einem Plättchen
US07/276,587 US5009735A (en) 1987-11-28 1988-11-28 Process for peeling protective film off a wafer

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP62-300621 1987-11-28
JP30062187 1987-11-28
JP63285480A JPH0691153B2 (ja) 1987-11-28 1988-11-10 保護フイルムの剥離方法

Publications (2)

Publication Number Publication Date
JPH01272129A JPH01272129A (ja) 1989-10-31
JPH0691153B2 true JPH0691153B2 (ja) 1994-11-14

Family

ID=26555908

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63285480A Expired - Lifetime JPH0691153B2 (ja) 1987-11-28 1988-11-10 保護フイルムの剥離方法

Country Status (4)

Country Link
US (1) US5009735A (de)
EP (1) EP0318806B1 (de)
JP (1) JPH0691153B2 (de)
DE (1) DE3879890T2 (de)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1617463A2 (de) 2004-07-16 2006-01-18 Tokyo Seimitsu Co.,Ltd. Verfahren und Vorrichtung zum Abziehen eines Films

Families Citing this family (43)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0682750B2 (ja) * 1989-08-30 1994-10-19 日東電工株式会社 ウエハ保護シートの剥離方法
JPH0749796Y2 (ja) * 1989-11-07 1995-11-13 松下電子工業株式会社 ウエハの保護シート剥がし装置
JPH04336428A (ja) * 1991-05-13 1992-11-24 Nitto Denko Corp ウエハのテープ貼合わせ剥離装置
JP3123263B2 (ja) * 1992-11-17 2001-01-09 松下電器産業株式会社 導電膜の貼着状態の良否判定方法
JP3156419B2 (ja) * 1993-02-15 2001-04-16 松下電器産業株式会社 異方性導電フィルム保護用セパレータの剥離方法
US5482899A (en) * 1994-03-21 1996-01-09 Texas Instruments Incorporated Leveling block for semiconductor demounter
US5460683A (en) * 1994-08-19 1995-10-24 Sumitomo Electric Lightwave Corp. Method for midspan entry of optical ribbon fiber
KR19990028523A (ko) * 1995-08-31 1999-04-15 야마모토 히데키 반도체웨이퍼의 보호점착테이프의 박리방법 및 그 장치
US5810962A (en) * 1996-09-30 1998-09-22 Magnatech Computer Services, Inc. Apparatus and process for removing computer diskette labels
US5830306A (en) * 1996-10-16 1998-11-03 Alcatel Na Cable Systems, Inc. Method and kit for accessing optical fibers in an optical fiber ribbon
US5833073A (en) * 1997-06-02 1998-11-10 Fluoroware, Inc. Tacky film frame for electronic device
US6149758A (en) * 1997-06-20 2000-11-21 Lintec Corporation Sheet removing apparatus and method
JPH11162805A (ja) * 1997-12-02 1999-06-18 Nitto Denko Corp レジスト除去方法
JP3619058B2 (ja) * 1998-06-18 2005-02-09 キヤノン株式会社 半導体薄膜の製造方法
US6056847A (en) * 1998-07-02 2000-05-02 Alcatel Method and kit for applying solvent to the matrix of an optical fiber ribbon
JP3560823B2 (ja) * 1998-08-18 2004-09-02 リンテック株式会社 ウェハ転写装置
KR100386633B1 (ko) * 1999-12-30 2003-06-02 앰코 테크놀로지 코리아 주식회사 반도체칩 부착용 접착부재의 커버 필름 제거장치 및 이를이용한 커버 필름 제거 방법
JP4166920B2 (ja) * 2000-02-24 2008-10-15 リンテック株式会社 シート剥離装置および方法
JP4266106B2 (ja) * 2001-09-27 2009-05-20 株式会社東芝 粘着性テープの剥離装置、粘着性テープの剥離方法、半導体チップのピックアップ装置、半導体チップのピックアップ方法及び半導体装置の製造方法
JP3831287B2 (ja) * 2002-04-08 2006-10-11 株式会社日立製作所 半導体装置の製造方法
US6715524B2 (en) * 2002-06-07 2004-04-06 Taiwan Semiconductor Manufacturing Co., Ltd. DFR laminating and film removing system
KR100486290B1 (ko) * 2002-12-23 2005-04-29 삼성전자주식회사 반도체 패키지 조립방법 및 반도체 패키지 공정의보호테이프 제거장치
US7846289B2 (en) * 2004-04-28 2010-12-07 Lintec Corporation Sheet peeling apparatus and sheet peeling method
JP4485248B2 (ja) * 2004-04-28 2010-06-16 リンテック株式会社 剥離装置及び剥離方法
JP2006100728A (ja) * 2004-09-30 2006-04-13 Nitto Denko Corp 保護テープ剥離方法およびこれを用いた装置
JP4323443B2 (ja) * 2005-02-28 2009-09-02 リンテック株式会社 剥離装置及び剥離方法
JP4326519B2 (ja) * 2005-03-31 2009-09-09 日東電工株式会社 保護テープ剥離方法およびこれを用いた装置
JP4597061B2 (ja) * 2006-02-09 2010-12-15 株式会社ディスコ 保護テープの剥離方法
JP4688728B2 (ja) * 2006-05-19 2011-05-25 株式会社東京精密 表面保護フィルム剥離方法および表面保護フィルム剥離装置
JP5074125B2 (ja) * 2007-08-09 2012-11-14 リンテック株式会社 固定治具並びにワークの処理方法
JP4642057B2 (ja) * 2007-10-15 2011-03-02 リンテック株式会社 シート剥離装置および方法
JP5103322B2 (ja) * 2008-08-08 2012-12-19 リンテック株式会社 シート剥離装置および剥離方法
JP4759629B2 (ja) * 2009-06-16 2011-08-31 リンテック株式会社 シート剥離装置および方法
JP5570271B2 (ja) * 2010-03-29 2014-08-13 リンテック株式会社 マウント装置およびマウント方法
ITMI20101890A1 (it) * 2010-10-15 2012-04-16 Microcontrol Electronic Srl Procedimento ed apparecchiatura per la rimozione di metallizzazioni su un substrato quale un wafer.
JP2012028814A (ja) * 2011-10-24 2012-02-09 Lintec Corp シート剥離装置
KR101414402B1 (ko) * 2012-06-05 2014-07-01 노바테크 (주) 필름 박리 방법 및 필름 박리 시스템
TWI685905B (zh) * 2017-07-12 2020-02-21 日商新川股份有限公司 接合裝置和接合方法
TWI651256B (zh) * 2018-07-20 2019-02-21 友達光電股份有限公司 料件分離方法及其設備
CN108946281A (zh) * 2018-08-14 2018-12-07 东莞市翔实信息科技有限公司 一种自动剥膜机及其使用方法
CN110104496B (zh) * 2019-04-15 2020-03-17 福耀玻璃工业集团股份有限公司 一种胶带粘贴装置
CN111791571B (zh) * 2020-08-31 2023-09-15 秦皇岛金辰太阳能设备有限公司 光伏组件与传输布分离装置及分离方法
US11505457B2 (en) * 2021-04-16 2022-11-22 Xintec Inc. Semiconductor removing apparatus and operation method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4285759A (en) * 1979-11-19 1981-08-25 E. I. Du Pont De Nemours And Company Apparatus for stripping a cover sheet
GB2128580B (en) * 1982-09-06 1986-07-02 Kulicke & Soffa Handling system for laminar objects
GB2157193B (en) * 1984-04-10 1987-08-19 Nitto Electric Ind Co Process for peeling protective film off a thin article
JPS6337352A (ja) * 1986-07-31 1988-02-18 Somar Corp 薄膜剥離装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1617463A2 (de) 2004-07-16 2006-01-18 Tokyo Seimitsu Co.,Ltd. Verfahren und Vorrichtung zum Abziehen eines Films

Also Published As

Publication number Publication date
JPH01272129A (ja) 1989-10-31
DE3879890D1 (de) 1993-05-06
EP0318806B1 (de) 1993-03-31
EP0318806A2 (de) 1989-06-07
EP0318806A3 (en) 1990-01-31
DE3879890T2 (de) 1993-07-08
US5009735A (en) 1991-04-23

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Legal Events

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R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term