DE3879890D1 - Verfahren zum abziehen eines schutzfilms von einem plaettchen. - Google Patents

Verfahren zum abziehen eines schutzfilms von einem plaettchen.

Info

Publication number
DE3879890D1
DE3879890D1 DE8888119424T DE3879890T DE3879890D1 DE 3879890 D1 DE3879890 D1 DE 3879890D1 DE 8888119424 T DE8888119424 T DE 8888119424T DE 3879890 T DE3879890 T DE 3879890T DE 3879890 D1 DE3879890 D1 DE 3879890D1
Authority
DE
Germany
Prior art keywords
plate
protective film
protective
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8888119424T
Other languages
English (en)
Other versions
DE3879890T2 (de
Inventor
Minoru Ametani
Keigo Funakoshi
Akihiko Kira
Takao Matsushita
Keizo Shirakura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Denko Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Denko Corp filed Critical Nitto Denko Corp
Publication of DE3879890D1 publication Critical patent/DE3879890D1/de
Application granted granted Critical
Publication of DE3879890T2 publication Critical patent/DE3879890T2/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C63/00—Lining or sheathing, i.e. applying preformed layers or sheathings of plastics; Apparatus therefor
    • B29C63/0004—Component parts, details or accessories; Auxiliary operations
    • B29C63/0013—Removing old coatings
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10S156/918—Delaminating processes adapted for specified product, e.g. delaminating medical specimen slide
    • Y10S156/93—Semiconductive product delaminating, e.g. delaminating emiconductive wafer from underlayer
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1168—Gripping and pulling work apart during delaminating
    • Y10T156/1179—Gripping and pulling work apart during delaminating with poking during delaminating [e.g., jabbing, etc.]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Separation, Sorting, Adjustment, Or Bending Of Sheets To Be Conveyed (AREA)
  • Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
DE8888119424T 1987-11-28 1988-11-22 Verfahren zum abziehen eines schutzfilms von einem plaettchen. Expired - Fee Related DE3879890T2 (de)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP30062187 1987-11-28
JP63285480A JPH0691153B2 (ja) 1987-11-28 1988-11-10 保護フイルムの剥離方法

Publications (2)

Publication Number Publication Date
DE3879890D1 true DE3879890D1 (de) 1993-05-06
DE3879890T2 DE3879890T2 (de) 1993-07-08

Family

ID=26555908

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8888119424T Expired - Fee Related DE3879890T2 (de) 1987-11-28 1988-11-22 Verfahren zum abziehen eines schutzfilms von einem plaettchen.

Country Status (4)

Country Link
US (1) US5009735A (de)
EP (1) EP0318806B1 (de)
JP (1) JPH0691153B2 (de)
DE (1) DE3879890T2 (de)

Families Citing this family (44)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0682750B2 (ja) * 1989-08-30 1994-10-19 日東電工株式会社 ウエハ保護シートの剥離方法
JPH0749796Y2 (ja) * 1989-11-07 1995-11-13 松下電子工業株式会社 ウエハの保護シート剥がし装置
JPH04336428A (ja) * 1991-05-13 1992-11-24 Nitto Denko Corp ウエハのテープ貼合わせ剥離装置
JP3123263B2 (ja) * 1992-11-17 2001-01-09 松下電器産業株式会社 導電膜の貼着状態の良否判定方法
JP3156419B2 (ja) * 1993-02-15 2001-04-16 松下電器産業株式会社 異方性導電フィルム保護用セパレータの剥離方法
US5482899A (en) * 1994-03-21 1996-01-09 Texas Instruments Incorporated Leveling block for semiconductor demounter
US5460683A (en) * 1994-08-19 1995-10-24 Sumitomo Electric Lightwave Corp. Method for midspan entry of optical ribbon fiber
EP0848415A1 (de) * 1995-08-31 1998-06-17 Nitto Denko Corporation Verfahren und gerät zum abtrennen einer schutzklebefolie von einer halbleitenden scheibe
US5810962A (en) * 1996-09-30 1998-09-22 Magnatech Computer Services, Inc. Apparatus and process for removing computer diskette labels
US5830306A (en) * 1996-10-16 1998-11-03 Alcatel Na Cable Systems, Inc. Method and kit for accessing optical fibers in an optical fiber ribbon
US5833073A (en) * 1997-06-02 1998-11-10 Fluoroware, Inc. Tacky film frame for electronic device
US6149758A (en) * 1997-06-20 2000-11-21 Lintec Corporation Sheet removing apparatus and method
JPH11162805A (ja) * 1997-12-02 1999-06-18 Nitto Denko Corp レジスト除去方法
JP3619058B2 (ja) * 1998-06-18 2005-02-09 キヤノン株式会社 半導体薄膜の製造方法
US6056847A (en) * 1998-07-02 2000-05-02 Alcatel Method and kit for applying solvent to the matrix of an optical fiber ribbon
JP3560823B2 (ja) * 1998-08-18 2004-09-02 リンテック株式会社 ウェハ転写装置
KR100386633B1 (ko) * 1999-12-30 2003-06-02 앰코 테크놀로지 코리아 주식회사 반도체칩 부착용 접착부재의 커버 필름 제거장치 및 이를이용한 커버 필름 제거 방법
JP4166920B2 (ja) * 2000-02-24 2008-10-15 リンテック株式会社 シート剥離装置および方法
JP4266106B2 (ja) * 2001-09-27 2009-05-20 株式会社東芝 粘着性テープの剥離装置、粘着性テープの剥離方法、半導体チップのピックアップ装置、半導体チップのピックアップ方法及び半導体装置の製造方法
JP3831287B2 (ja) * 2002-04-08 2006-10-11 株式会社日立製作所 半導体装置の製造方法
US6715524B2 (en) * 2002-06-07 2004-04-06 Taiwan Semiconductor Manufacturing Co., Ltd. DFR laminating and film removing system
KR100486290B1 (ko) * 2002-12-23 2005-04-29 삼성전자주식회사 반도체 패키지 조립방법 및 반도체 패키지 공정의보호테이프 제거장치
JP4485248B2 (ja) * 2004-04-28 2010-06-16 リンテック株式会社 剥離装置及び剥離方法
TW200539296A (en) * 2004-04-28 2005-12-01 Lintec Corp Sheet peeling apparatus and peeling method
JP4326418B2 (ja) 2004-07-16 2009-09-09 株式会社東京精密 フィルム剥離方法およびフィルム剥離装置
JP2006100728A (ja) * 2004-09-30 2006-04-13 Nitto Denko Corp 保護テープ剥離方法およびこれを用いた装置
JP4323443B2 (ja) * 2005-02-28 2009-09-02 リンテック株式会社 剥離装置及び剥離方法
JP4326519B2 (ja) * 2005-03-31 2009-09-09 日東電工株式会社 保護テープ剥離方法およびこれを用いた装置
JP4597061B2 (ja) * 2006-02-09 2010-12-15 株式会社ディスコ 保護テープの剥離方法
JP4688728B2 (ja) * 2006-05-19 2011-05-25 株式会社東京精密 表面保護フィルム剥離方法および表面保護フィルム剥離装置
JP5074125B2 (ja) * 2007-08-09 2012-11-14 リンテック株式会社 固定治具並びにワークの処理方法
JP4642057B2 (ja) * 2007-10-15 2011-03-02 リンテック株式会社 シート剥離装置および方法
JP5103322B2 (ja) * 2008-08-08 2012-12-19 リンテック株式会社 シート剥離装置および剥離方法
JP4759629B2 (ja) * 2009-06-16 2011-08-31 リンテック株式会社 シート剥離装置および方法
JP5570271B2 (ja) * 2010-03-29 2014-08-13 リンテック株式会社 マウント装置およびマウント方法
ITMI20101890A1 (it) * 2010-10-15 2012-04-16 Microcontrol Electronic Srl Procedimento ed apparecchiatura per la rimozione di metallizzazioni su un substrato quale un wafer.
JP2012028814A (ja) * 2011-10-24 2012-02-09 Lintec Corp シート剥離装置
KR101414402B1 (ko) * 2012-06-05 2014-07-01 노바테크 (주) 필름 박리 방법 및 필름 박리 시스템
TWI685905B (zh) * 2017-07-12 2020-02-21 日商新川股份有限公司 接合裝置和接合方法
TWI651256B (zh) * 2018-07-20 2019-02-21 友達光電股份有限公司 料件分離方法及其設備
CN108946281A (zh) * 2018-08-14 2018-12-07 东莞市翔实信息科技有限公司 一种自动剥膜机及其使用方法
CN110104496B (zh) * 2019-04-15 2020-03-17 福耀玻璃工业集团股份有限公司 一种胶带粘贴装置
CN111791571B (zh) * 2020-08-31 2023-09-15 秦皇岛金辰太阳能设备有限公司 光伏组件与传输布分离装置及分离方法
US11505457B2 (en) * 2021-04-16 2022-11-22 Xintec Inc. Semiconductor removing apparatus and operation method thereof

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4285759A (en) * 1979-11-19 1981-08-25 E. I. Du Pont De Nemours And Company Apparatus for stripping a cover sheet
GB2128580B (en) * 1982-09-06 1986-07-02 Kulicke & Soffa Handling system for laminar objects
GB2157193B (en) * 1984-04-10 1987-08-19 Nitto Electric Ind Co Process for peeling protective film off a thin article
JPS6337352A (ja) * 1986-07-31 1988-02-18 Somar Corp 薄膜剥離装置

Also Published As

Publication number Publication date
JPH01272129A (ja) 1989-10-31
JPH0691153B2 (ja) 1994-11-14
EP0318806A3 (en) 1990-01-31
US5009735A (en) 1991-04-23
DE3879890T2 (de) 1993-07-08
EP0318806A2 (de) 1989-06-07
EP0318806B1 (de) 1993-03-31

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Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8339 Ceased/non-payment of the annual fee