JPH0461502B2 - - Google Patents
Info
- Publication number
- JPH0461502B2 JPH0461502B2 JP62058045A JP5804587A JPH0461502B2 JP H0461502 B2 JPH0461502 B2 JP H0461502B2 JP 62058045 A JP62058045 A JP 62058045A JP 5804587 A JP5804587 A JP 5804587A JP H0461502 B2 JPH0461502 B2 JP H0461502B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- cap
- cut
- semiconductor device
- view
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Solid State Image Pick-Up Elements (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5804587A JPS63224345A (ja) | 1987-03-13 | 1987-03-13 | 半導体装置の製造方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5804587A JPS63224345A (ja) | 1987-03-13 | 1987-03-13 | 半導体装置の製造方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63224345A JPS63224345A (ja) | 1988-09-19 |
| JPH0461502B2 true JPH0461502B2 (cs) | 1992-10-01 |
Family
ID=13072960
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5804587A Granted JPS63224345A (ja) | 1987-03-13 | 1987-03-13 | 半導体装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63224345A (cs) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI830740B (zh) * | 2018-06-25 | 2024-02-01 | 日商日本電氣硝子股份有限公司 | 蓋構件 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5436833A (en) * | 1977-08-25 | 1979-03-17 | Ricoh Kk | Sheet type recording and regenerating apparatus |
| JPS5621350A (en) * | 1979-07-31 | 1981-02-27 | Fujitsu Ltd | Manufacture of semiconductor device |
| JPS58191645U (ja) * | 1982-06-15 | 1983-12-20 | 三菱電機株式会社 | 半導体装置のパツケ−ジ |
| JPH0342699A (ja) * | 1989-07-10 | 1991-02-22 | Toshiba Corp | カーソル表示制御装置 |
-
1987
- 1987-03-13 JP JP5804587A patent/JPS63224345A/ja active Granted
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI830740B (zh) * | 2018-06-25 | 2024-02-01 | 日商日本電氣硝子股份有限公司 | 蓋構件 |
| TWI837067B (zh) * | 2018-06-25 | 2024-03-21 | 日商日本電氣硝子股份有限公司 | 蓋構件的製造方法 |
| TWI839309B (zh) * | 2018-06-25 | 2024-04-11 | 日商日本電氣硝子股份有限公司 | 電子零件封裝的製造方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63224345A (ja) | 1988-09-19 |
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