JPH0461502B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a semiconductor device, and particularly to the shape of a resin coating pattern on a cap.

[Conventional technology]

Conventionally, resin-sealed caps are shown in Fig. 5 a and b, for example.
As shown in the figure, the periphery of the flat plate 1 or concave plate 1 made of glass, ceramic, metal, etc. is coated with epoxy or
A resin such as BT (bismaleimide triazine) resin is applied to form a cap, and the cap is placed over the recess 5 of the ceramic substrate 4 on which the semiconductor element 3 is mounted, as shown in FIG. 6, to harden the resin. It was sealed. The resin used for this type of cap is usually thermosetting, that is, it is first softened by raising the temperature, and then hardened by further raising the temperature or taking time.

[Problem that the invention seeks to solve]

However, when using the conventional resin-sealed cap described above, the resin is coated all around the outer edge of the cap, so once the resin is heated and melted, it is trapped in the recess 5 called the cavity. The air expands and exerts a force to push out the resin, leaving traces of resin extrusion called "shrinkage" 6 in the final finished state, as shown in FIG. The example shown in FIG. 6 is an example of a package in which a solid-state image sensor is mounted, and the flat plate 1 constituting the cap is made of transparent glass, and the spreading state of the resin 2 can be observed in the plan view a. The shrinkage 6 is the result of the air trapped inside expanding and trying to push out the resin, and in its cross section, as shown in Figure b, there is almost no resin.

When such a situation occurs, the seal path at this portion becomes short, resulting in a disadvantage that the airtightness and moisture resistance are poor.

[Means for solving problems]

The present invention was made in order to solve the above-mentioned conventional problems.The present invention is made by providing a cut in a part of the resin applied to the outer edge of the plate constituting the cap, and performing the sealing work using this cap. In a method of manufacturing a semiconductor device.

〔Example〕

Hereinafter, the present invention will be explained with reference to the drawings.

FIG. 2 is a perspective view of a cap used in one embodiment of the present invention. A resin 2 is applied with the same width along the outer periphery of a flat plate 1 made of glass, ceramic, metal, etc., and a cut 7 is formed in the center of the short side.
7' is provided.

Generally, this type of cap is made by applying a resin dissolved in a solvent using screen printing, so this cut can be easily made if it is 0.1 mm or more. For example, as shown in Fig. 1, this cap is stacked on a ceramic substrate on which semiconductor elements 3 are mounted, a load is applied with a clip, etc., and heat treatment is performed at approximately 150°C for 1 hour, resulting in a good product with no "shrinkage". A sealed state is obtained. This is because, as described above, even if the air inside the cavity expands as the temperature rises, the air leaks to the outside until the cut is closed, reducing the increase in internal pressure.

The wider the width of this cut, the longer the time for air to leak when the temperature rises, and the increase in internal pressure can be suppressed, but if it is too wide, the resin may harden before the cut is closed, resulting in poor sealing. . Therefore, the width of the cut must be set to an optimum value in consideration of various conditions such as the curing temperature of the resin, temperature increase rate, and load. However, in general, this width is
Approximately 0.2 to 0.6 mm is good.

If you really want to make the cut wider,
By widening the resin application width near the cut as shown in FIG. 3, it is possible to increase the amount of resin flowing into the cut and make it easier to close the cut. In this example, the cut is on the short side of the cap, so the resin coating width on the short side is made larger than on the long side.

Further, by applying the resin twice, the amount of resin near the cut can be increased. As mentioned above, since the resin is applied by screen printing, after the first printing and drying, by printing and drying only the vicinity of the cut again, the resin protrusion 8 can be provided near the cut as shown in Fig. 4. becomes possible.

The places where the resin is cut are not limited to the short sides and long sides, but may be made at the corners. Furthermore, the number of cuts is not limited to two, but may be one, or three or more.

〔Effect of the invention〕

As described above, according to the present invention, it is possible to obtain a good sealing state without "shrinkage" during resin sealing.

[Brief explanation of the drawing]

FIG. 1 is a sectional view of a semiconductor device manufactured by a method according to an embodiment of the present invention, FIGS. 2 to 4 are perspective views each showing an example of a cap used in an embodiment of the present invention, and FIG. FIG. 6 is a perspective view and a sectional view showing a cap used in the prior art, and FIG. 6 is a plan view and a sectional view of a semiconductor device according to the prior art method. 1...Flat plate, 2...Resin, 3...Semiconductor element,
4... Ceramic substrate, 5... Recess, 6... Draw, 7... Cut, 8... Protrusion provided on resin.

Claims (1)

[Claims] 1. In a method for manufacturing a semiconductor device in which a cap is used to seal a container in which a semiconductor element is mounted, a resin having a cut in a portion is formed on the outer edge of the back surface of the cap, and the resin is used to seal the cap in the manner described above. A method for manufacturing a semiconductor device, characterized in that it is fixed to a container.