JPH0427706B2 - - Google Patents
Info
- Publication number
- JPH0427706B2 JPH0427706B2 JP57112422A JP11242282A JPH0427706B2 JP H0427706 B2 JPH0427706 B2 JP H0427706B2 JP 57112422 A JP57112422 A JP 57112422A JP 11242282 A JP11242282 A JP 11242282A JP H0427706 B2 JPH0427706 B2 JP H0427706B2
- Authority
- JP
- Japan
- Prior art keywords
- region
- depth
- gate
- amorphous
- film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H10W10/0125—
-
- H10W10/13—
Landscapes
- Local Oxidation Of Silicon (AREA)
- Drying Of Semiconductors (AREA)
- Element Separation (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Junction Field-Effect Transistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57112422A JPS592346A (ja) | 1982-06-28 | 1982-06-28 | 半導体集積回路 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP57112422A JPS592346A (ja) | 1982-06-28 | 1982-06-28 | 半導体集積回路 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS592346A JPS592346A (ja) | 1984-01-07 |
| JPH0427706B2 true JPH0427706B2 (enExample) | 1992-05-12 |
Family
ID=14586248
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP57112422A Granted JPS592346A (ja) | 1982-06-28 | 1982-06-28 | 半導体集積回路 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS592346A (enExample) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011071512A (ja) * | 2009-09-24 | 2011-04-07 | Samsung Electronics Co Ltd | 電力電子素子及びその製造方法並びに電力電子素子を含む集積回路モジュール |
| WO2013108911A1 (ja) * | 2012-01-19 | 2013-07-25 | 富士電機株式会社 | 半導体装置およびその製造方法 |
| WO2013141221A1 (ja) * | 2012-03-19 | 2013-09-26 | 富士電機株式会社 | 半導体装置の製造方法 |
| WO2013141141A1 (ja) * | 2012-03-19 | 2013-09-26 | 富士電機株式会社 | 半導体装置の製造方法 |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4583282A (en) * | 1984-09-14 | 1986-04-22 | Motorola, Inc. | Process for self-aligned buried layer, field guard, and isolation |
| CN103972147A (zh) * | 2014-05-08 | 2014-08-06 | 上海华力微电子有限公司 | 一种窄沟槽制作方法 |
| EP3337546B1 (en) | 2015-08-21 | 2020-09-23 | 3M Innovative Properties Company | Nasogastric tube securement systems |
| WO2017034911A1 (en) | 2015-08-21 | 2017-03-02 | 3M Innovative Properties Company | Nasogastric tube securement systems and methods of using same |
| EP3337545B1 (en) | 2015-08-21 | 2021-01-13 | 3M Innovative Properties Company | Nasogastric tube securement systems |
| USD928312S1 (en) | 2019-10-30 | 2021-08-17 | 3M Innovative Properties Company | Tube securement device |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4915114A (enExample) * | 1972-06-02 | 1974-02-09 | ||
| JPS50785A (enExample) * | 1973-05-02 | 1975-01-07 | ||
| JPS545955B2 (enExample) * | 1973-05-09 | 1979-03-23 | ||
| JPS514977A (en) * | 1974-07-01 | 1976-01-16 | Iwatsu Electric Co Ltd | Zetsuensono keiseihoho |
| JPS5245188B2 (enExample) * | 1974-11-06 | 1977-11-14 | ||
| JPS55103759A (en) * | 1979-02-02 | 1980-08-08 | Semiconductor Res Found | Electrostatic induction transistor integrated circuit |
| JPS55150269A (en) * | 1979-05-11 | 1980-11-22 | Semiconductor Res Found | Semiconductor integrated circuit |
| JPS55154748A (en) * | 1979-05-23 | 1980-12-02 | Toshiba Corp | Complementary mos semiconductor device |
-
1982
- 1982-06-28 JP JP57112422A patent/JPS592346A/ja active Granted
Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011071512A (ja) * | 2009-09-24 | 2011-04-07 | Samsung Electronics Co Ltd | 電力電子素子及びその製造方法並びに電力電子素子を含む集積回路モジュール |
| JPWO2013108911A1 (ja) * | 2012-01-19 | 2015-05-11 | 富士電機株式会社 | 半導体装置およびその製造方法 |
| WO2013108911A1 (ja) * | 2012-01-19 | 2013-07-25 | 富士電機株式会社 | 半導体装置およびその製造方法 |
| US10128360B2 (en) | 2012-01-19 | 2018-11-13 | Fuji Electric Co., Ltd. | Semiconductor device and method for producing the same |
| US9520475B2 (en) | 2012-01-19 | 2016-12-13 | Fuji Electric Co., Ltd. | Semiconductor device and method for producing the same |
| JPWO2013141141A1 (ja) * | 2012-03-19 | 2015-08-03 | 富士電機株式会社 | 半導体装置の製造方法 |
| CN104040692A (zh) * | 2012-03-19 | 2014-09-10 | 富士电机株式会社 | 半导体装置的制造方法 |
| JPWO2013141221A1 (ja) * | 2012-03-19 | 2015-08-03 | 富士電機株式会社 | 半導体装置の製造方法 |
| WO2013141141A1 (ja) * | 2012-03-19 | 2013-09-26 | 富士電機株式会社 | 半導体装置の製造方法 |
| US9530672B2 (en) | 2012-03-19 | 2016-12-27 | Fuji Electric Co., Ltd. | Production method for a semiconductor device |
| US9947761B2 (en) | 2012-03-19 | 2018-04-17 | Fuji Electric Co., Ltd. | Production method for semiconductor device |
| WO2013141221A1 (ja) * | 2012-03-19 | 2013-09-26 | 富士電機株式会社 | 半導体装置の製造方法 |
| US10566440B2 (en) | 2012-03-19 | 2020-02-18 | Fuji Electric Co., Ltd. | Production method for semiconductor device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS592346A (ja) | 1984-01-07 |
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