JPH0351314B2 - - Google Patents
Info
- Publication number
- JPH0351314B2 JPH0351314B2 JP61278513A JP27851386A JPH0351314B2 JP H0351314 B2 JPH0351314 B2 JP H0351314B2 JP 61278513 A JP61278513 A JP 61278513A JP 27851386 A JP27851386 A JP 27851386A JP H0351314 B2 JPH0351314 B2 JP H0351314B2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- region
- voltage
- polycrystalline silicon
- cell
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 6
- 239000010410 layer Substances 0.000 description 78
- 210000004027 cell Anatomy 0.000 description 42
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 42
- 239000003990 capacitor Substances 0.000 description 25
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 21
- 229910052814 silicon oxide Inorganic materials 0.000 description 21
- 238000003860 storage Methods 0.000 description 18
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 17
- 229920002120 photoresistant polymer Polymers 0.000 description 17
- 229910052710 silicon Inorganic materials 0.000 description 16
- 239000010703 silicon Substances 0.000 description 16
- 238000009792 diffusion process Methods 0.000 description 13
- 238000005468 ion implantation Methods 0.000 description 13
- 229910052581 Si3N4 Inorganic materials 0.000 description 8
- 229910052751 metal Inorganic materials 0.000 description 8
- 239000002184 metal Substances 0.000 description 8
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 8
- 238000004519 manufacturing process Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 5
- 230000003647 oxidation Effects 0.000 description 5
- 238000007254 oxidation reaction Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 230000005684 electric field Effects 0.000 description 4
- 229920005591 polysilicon Polymers 0.000 description 4
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 3
- 229910052698 phosphorus Inorganic materials 0.000 description 3
- 239000011574 phosphorus Substances 0.000 description 3
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical group [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000077 silane Inorganic materials 0.000 description 2
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 1
- 101150090280 MOS1 gene Proteins 0.000 description 1
- 101100401568 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) MIC10 gene Proteins 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 229910021529 ammonia Inorganic materials 0.000 description 1
- 229910052796 boron Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005137 deposition process Methods 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 description 1
- 238000002513 implantation Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical class [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 239000007858 starting material Substances 0.000 description 1
- 210000000352 storage cell Anatomy 0.000 description 1
- 230000001052 transient effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/01—Manufacture or treatment
- H10B12/02—Manufacture or treatment for one transistor one-capacitor [1T-1C] memory cells
- H10B12/03—Making the capacitor or connections thereto
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/403—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh
- G11C11/404—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells with charge regeneration common to a multiplicity of memory cells, i.e. external refresh with one charge-transfer gate, e.g. MOS transistor, per cell
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11C—STATIC STORES
- G11C11/00—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor
- G11C11/21—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements
- G11C11/34—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices
- G11C11/40—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors
- G11C11/401—Digital stores characterised by the use of particular electric or magnetic storage elements; Storage elements therefor using electric elements using semiconductor devices using transistors forming cells needing refreshing or charge regeneration, i.e. dynamic cells
- G11C11/4063—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing
- G11C11/407—Auxiliary circuits, e.g. for addressing, decoding, driving, writing, sensing or timing for memory cells of the field-effect type
- G11C11/4074—Power supply or voltage generation circuits, e.g. bias voltage generators, substrate voltage generators, back-up power, power control circuits
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10B—ELECTRONIC MEMORY DEVICES
- H10B12/00—Dynamic random access memory [DRAM] devices
- H10B12/30—DRAM devices comprising one-transistor - one-capacitor [1T-1C] memory cells
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Semiconductor Memories (AREA)
- Semiconductor Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US05/722,841 US4240092A (en) | 1976-09-13 | 1976-09-13 | Random access memory cell with different capacitor and transistor oxide thickness |
US722841 | 1976-09-13 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62162354A JPS62162354A (ja) | 1987-07-18 |
JPH0351314B2 true JPH0351314B2 (US08063081-20111122-C00044.png) | 1991-08-06 |
Family
ID=24903624
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52109753A Expired JPS6050065B2 (ja) | 1976-09-13 | 1977-09-12 | メモリセル |
JP60140091A Pending JPS6150361A (ja) | 1976-09-13 | 1985-06-26 | メモリセル |
JP61278513A Granted JPS62162354A (ja) | 1976-09-13 | 1986-11-21 | 半導体装置 |
Family Applications Before (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP52109753A Expired JPS6050065B2 (ja) | 1976-09-13 | 1977-09-12 | メモリセル |
JP60140091A Pending JPS6150361A (ja) | 1976-09-13 | 1985-06-26 | メモリセル |
Country Status (4)
Country | Link |
---|---|
US (1) | US4240092A (US08063081-20111122-C00044.png) |
JP (3) | JPS6050065B2 (US08063081-20111122-C00044.png) |
DE (1) | DE2741152A1 (US08063081-20111122-C00044.png) |
FR (1) | FR2364541A1 (US08063081-20111122-C00044.png) |
Families Citing this family (59)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4827448A (en) * | 1976-09-13 | 1989-05-02 | Texas Instruments Incorporated | Random access memory cell with implanted capacitor region |
JPS5376687A (en) * | 1976-12-17 | 1978-07-07 | Nec Corp | Semiconductor memory device |
IT1089299B (it) | 1977-01-26 | 1985-06-18 | Mostek Corp | Procedimento per fabbricare un dispositivo semiconduttore |
DE2858815C2 (de) * | 1977-01-26 | 1996-01-18 | Sgs Thomson Microelectronics | Verfahren zur Ausbildung eines Feldeffekttransistors in einer Halbleitervorrichtung |
US4219834A (en) * | 1977-11-11 | 1980-08-26 | International Business Machines Corporation | One-device monolithic random access memory and method of fabricating same |
DE2842545C2 (de) * | 1978-09-29 | 1980-07-31 | Siemens Ag, 1000 Berlin Und 8000 Muenchen | Halbleiterspeicher mit Depletion-Varaktoren als Speicherkondensatoren |
JPS5565458A (en) * | 1978-11-10 | 1980-05-16 | Nec Corp | Memory cell |
JPS55153368A (en) * | 1979-05-18 | 1980-11-29 | Fujitsu Ltd | Semiconductor memory device |
DE2926417A1 (de) * | 1979-06-29 | 1981-01-22 | Siemens Ag | Dynamische halbleiterspeicherzelle und verfahren zu ihrer herstellung |
JPS5662319A (en) * | 1979-10-26 | 1981-05-28 | Hitachi Ltd | Impurity dispersion method |
US4380863A (en) * | 1979-12-10 | 1983-04-26 | Texas Instruments Incorporated | Method of making double level polysilicon series transistor devices |
JPS5927102B2 (ja) * | 1979-12-24 | 1984-07-03 | 富士通株式会社 | 半導体記憶装置 |
JPS6023504B2 (ja) * | 1980-01-24 | 1985-06-07 | 富士通株式会社 | 半導体メモリ装置 |
EP0033130B1 (en) * | 1980-01-25 | 1986-01-08 | Kabushiki Kaisha Toshiba | Semiconductor memory device |
US4388121A (en) * | 1980-03-21 | 1983-06-14 | Texas Instruments Incorporated | Reduced field implant for dynamic memory cell array |
JPS5948477B2 (ja) * | 1980-03-31 | 1984-11-27 | 富士通株式会社 | 半導体記憶装置 |
US4345364A (en) * | 1980-04-07 | 1982-08-24 | Texas Instruments Incorporated | Method of making a dynamic memory array |
US4608751A (en) * | 1980-04-07 | 1986-09-02 | Texas Instruments Incorporated | Method of making dynamic memory array |
US4883543A (en) * | 1980-06-05 | 1989-11-28 | Texas Instruments Incroporated | Shielding for implant in manufacture of dynamic memory |
JPS5718356A (en) * | 1980-07-07 | 1982-01-30 | Mitsubishi Electric Corp | Semiconductor memory storage |
DE3032632A1 (de) * | 1980-08-29 | 1982-04-08 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur herstellung integrierter dynamischer ram-eintransistor-speicherzellen |
US4457066A (en) * | 1980-10-15 | 1984-07-03 | Texas Instruments Incorporated | Method of making single-level polysilicon dynamic memory array |
JPS5771580A (en) * | 1980-10-22 | 1982-05-04 | Fujitsu Ltd | Semiconductor memory device |
NL186886C (nl) * | 1980-11-28 | 1992-03-16 | Philips Nv | Halfgeleiderinrichting. |
US4403394A (en) * | 1980-12-17 | 1983-09-13 | International Business Machines Corporation | Formation of bit lines for ram device |
JPS57113264A (en) * | 1980-12-29 | 1982-07-14 | Fujitsu Ltd | Manufacture of mis type capacitor |
FR2499766A1 (en) * | 1981-02-11 | 1982-08-13 | Texas Instruments France | NMOS integrated circuit capacitors using poly-silicon gates - uses auxiliary ion implant for capacitors and auto alignment diffusion for telephone analogue=to=digital converter |
JPS57133589A (en) * | 1981-02-12 | 1982-08-18 | Fujitsu Ltd | Semiconductor circuit |
US4459609A (en) * | 1981-09-14 | 1984-07-10 | International Business Machines Corporation | Charge-stabilized memory |
US4472873A (en) * | 1981-10-22 | 1984-09-25 | Fairchild Camera And Instrument Corporation | Method for forming submicron bipolar transistors without epitaxial growth and the resulting structure |
EP0102696B1 (en) * | 1982-06-30 | 1989-09-13 | Kabushiki Kaisha Toshiba | Dynamic semiconductor memory and manufacturing method thereof |
US4419812A (en) * | 1982-08-23 | 1983-12-13 | Ncr Corporation | Method of fabricating an integrated circuit voltage multiplier containing a parallel plate capacitor |
JPH0612619B2 (ja) * | 1982-09-22 | 1994-02-16 | 株式会社日立製作所 | 半導体メモリ装置 |
JPS5994454A (ja) * | 1982-11-19 | 1984-05-31 | Nec Kyushu Ltd | 半導体装置とその製造方法 |
JPS59121691A (ja) * | 1982-12-01 | 1984-07-13 | Fujitsu Ltd | ダイナミツク型半導体記憶装置 |
US4542481A (en) * | 1983-01-31 | 1985-09-17 | International Business Machines Corporation | One-device random access memory cell having enhanced capacitance |
US4466177A (en) * | 1983-06-30 | 1984-08-21 | International Business Machines Corporation | Storage capacitor optimization for one device FET dynamic RAM cell |
JPS6012752A (ja) * | 1983-07-01 | 1985-01-23 | Nippon Telegr & Teleph Corp <Ntt> | 半導体記憶装置およびその製造方法 |
JPH0782753B2 (ja) * | 1984-08-31 | 1995-09-06 | 三菱電機株式会社 | ダイナミックメモリ装置 |
CN1034533C (zh) * | 1985-05-01 | 1997-04-09 | 得克萨斯仪器公司 | 超大规模集成电路静态随机存储器 |
JPS62251260A (ja) * | 1986-04-24 | 1987-11-02 | Nissan Motor Co Ltd | 車両用ウインドシ−ルドガラス洗浄装置 |
KR890003217B1 (ko) * | 1987-02-24 | 1989-08-26 | 삼성전자 주식회사 | 디램 쎌의 제조방법 |
US4916524A (en) * | 1987-03-16 | 1990-04-10 | Texas Instruments Incorporated | Dram cell and method |
US5051995A (en) * | 1988-03-14 | 1991-09-24 | Mitsubishi Denki Kabushiki Kaisha | Semiconductor memory device having a test mode setting circuit |
WO1990005377A1 (en) * | 1988-10-31 | 1990-05-17 | Micron Technology, Inc. | Local encroachment reduction |
US5013692A (en) * | 1988-12-08 | 1991-05-07 | Sharp Kabushiki Kaisha | Process for preparing a silicon nitride insulating film for semiconductor memory device |
JPH0346188A (ja) * | 1989-07-13 | 1991-02-27 | Mitsubishi Electric Corp | 半導体記憶回路 |
US5332682A (en) * | 1990-08-31 | 1994-07-26 | Micron Semiconductor, Inc. | Local encroachment reduction |
JPH04218959A (ja) * | 1990-10-18 | 1992-08-10 | Mitsubishi Electric Corp | 半導体装置およびその制御方法 |
JPH05136363A (ja) * | 1991-11-15 | 1993-06-01 | Sharp Corp | 半導体記憶装置 |
US7064376B2 (en) * | 1996-05-24 | 2006-06-20 | Jeng-Jye Shau | High performance embedded semiconductor memory devices with multiple dimension first-level bit-lines |
US5748547A (en) * | 1996-05-24 | 1998-05-05 | Shau; Jeng-Jye | High performance semiconductor memory devices having multiple dimension bit lines |
US20050036363A1 (en) * | 1996-05-24 | 2005-02-17 | Jeng-Jye Shau | High performance embedded semiconductor memory devices with multiple dimension first-level bit-lines |
US6133077A (en) | 1998-01-13 | 2000-10-17 | Lsi Logic Corporation | Formation of high-voltage and low-voltage devices on a semiconductor substrate |
US6093585A (en) * | 1998-05-08 | 2000-07-25 | Lsi Logic Corporation | High voltage tolerant thin film transistor |
US6235590B1 (en) | 1998-12-18 | 2001-05-22 | Lsi Logic Corporation | Fabrication of differential gate oxide thicknesses on a single integrated circuit chip |
JP2004233526A (ja) * | 2003-01-29 | 2004-08-19 | Mitsubishi Electric Corp | 液晶表示装置 |
US6900097B2 (en) * | 2003-05-12 | 2005-05-31 | United Microelectronics Corp. | Method for forming single-level electrically erasable and programmable read only memory operated in environment with high/low-voltage |
US20050269614A1 (en) * | 2004-06-08 | 2005-12-08 | Chung-Cheng Tsou | Non-junction-leakage 1T-RAM cell |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3387286A (en) * | 1967-07-14 | 1968-06-04 | Ibm | Field-effect transistor memory |
GB1357515A (en) * | 1972-03-10 | 1974-06-26 | Matsushita Electronics Corp | Method for manufacturing an mos integrated circuit |
JPS50125684A (US08063081-20111122-C00044.png) * | 1974-03-20 | 1975-10-02 | ||
JPS525224A (en) * | 1975-07-02 | 1977-01-14 | Hitachi Ltd | 1trs-type memory cell |
JPS5853512B2 (ja) * | 1976-02-13 | 1983-11-29 | 株式会社東芝 | 半導体記憶装置の製造方法 |
JPS6053470B2 (ja) * | 1976-06-09 | 1985-11-26 | 株式会社日立製作所 | 半導体メモリの製造方法 |
DE2723254A1 (de) * | 1976-07-02 | 1978-01-12 | Ibm | Halbleiterstruktur mit vom halbleitermaterial isolierten polysiliciumelektroden und verfahren zu ihrer herstellung |
-
1976
- 1976-09-13 US US05/722,841 patent/US4240092A/en not_active Expired - Lifetime
-
1977
- 1977-09-12 JP JP52109753A patent/JPS6050065B2/ja not_active Expired
- 1977-09-13 FR FR7727612A patent/FR2364541A1/fr active Granted
- 1977-09-13 DE DE19772741152 patent/DE2741152A1/de not_active Withdrawn
-
1985
- 1985-06-26 JP JP60140091A patent/JPS6150361A/ja active Pending
-
1986
- 1986-11-21 JP JP61278513A patent/JPS62162354A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
DE2741152A1 (de) | 1978-03-16 |
JPS6150361A (ja) | 1986-03-12 |
US4240092A (en) | 1980-12-16 |
JPS62162354A (ja) | 1987-07-18 |
FR2364541A1 (fr) | 1978-04-07 |
FR2364541B3 (US08063081-20111122-C00044.png) | 1980-06-27 |
JPS6050065B2 (ja) | 1985-11-06 |
JPS5359384A (en) | 1978-05-29 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH0351314B2 (US08063081-20111122-C00044.png) | ||
US4225945A (en) | Random access MOS memory cell using double level polysilicon | |
US5017981A (en) | Semiconductor memory and method for fabricating the same | |
KR0167467B1 (ko) | 이중 채널을 갖는 soi 상의 트렌치 eeprom 구조와 이의 제조방법 | |
EP0042084B1 (en) | Semiconductor device especially a memory cell in v-mos technology | |
EP0137207B1 (en) | Stacked double dense read only memory | |
KR100295000B1 (ko) | 반도체소자및그제조방법 | |
US4021789A (en) | Self-aligned integrated circuits | |
KR0128062B1 (ko) | 반도체 집적회로 장치의 제조방법 | |
KR900000170B1 (ko) | 다이내믹형 메모리셀과 그 제조방법 | |
US4574465A (en) | Differing field oxide thicknesses in dynamic memory device | |
US4467450A (en) | Random access MOS memory cell using double level polysilicon | |
US4878100A (en) | Triple-implanted drain in transistor made by oxide sidewall-spacer method | |
JPH02132855A (ja) | 絶縁トレンチ・キャパシタを持つダイナミックramセル | |
US5811865A (en) | Dielectric in an integrated circuit | |
JPS62105444A (ja) | 半導体構造の形成方法 | |
JPH021988A (ja) | 電気的にプログラム可能なメモリ・セル | |
EP0028654B1 (en) | Semiconductive memory device and fabricating method therefor | |
KR0140044B1 (ko) | 메모리 셀중에 절연 구조를 가지는 반도체 메모리 소자 | |
US4388121A (en) | Reduced field implant for dynamic memory cell array | |
US5434438A (en) | Random access memory cell with a capacitor | |
US5245212A (en) | Self-aligned field-plate isolation between active elements | |
US5236858A (en) | Method of manufacturing a semiconductor device with vertically stacked structure | |
JP2689923B2 (ja) | 半導体装置およびその製造方法 | |
US5168075A (en) | Random access memory cell with implanted capacitor region |