JPH0310221B2 - - Google Patents
Info
- Publication number
- JPH0310221B2 JPH0310221B2 JP57103657A JP10365782A JPH0310221B2 JP H0310221 B2 JPH0310221 B2 JP H0310221B2 JP 57103657 A JP57103657 A JP 57103657A JP 10365782 A JP10365782 A JP 10365782A JP H0310221 B2 JPH0310221 B2 JP H0310221B2
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- camera
- alignment
- reticle
- platform
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004065 semiconductor Substances 0.000 claims description 18
- 230000007246 mechanism Effects 0.000 claims description 8
- 229920002120 photoresistant polymer Polymers 0.000 claims description 8
- 230000000295 complement effect Effects 0.000 claims description 4
- 238000007664 blowing Methods 0.000 claims 1
- 235000012431 wafers Nutrition 0.000 description 161
- 230000000873 masking effect Effects 0.000 description 15
- 238000000034 method Methods 0.000 description 15
- 238000004519 manufacturing process Methods 0.000 description 13
- 230000003287 optical effect Effects 0.000 description 8
- 239000002184 metal Substances 0.000 description 7
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 4
- 238000012937 correction Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 229910052710 silicon Inorganic materials 0.000 description 4
- 239000010703 silicon Substances 0.000 description 4
- 230000005669 field effect Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 231100000812 repeated exposure Toxicity 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 230000007723 transport mechanism Effects 0.000 description 2
- 230000008901 benefit Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 239000002019 doping agent Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000010438 granite Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000011112 process operation Methods 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 235000012239 silicon dioxide Nutrition 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000005382 thermal cycling Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7049—Technique, e.g. interferometric
- G03F9/7053—Non-optical, e.g. mechanical, capacitive, using an electron beam, acoustic or thermal waves
- G03F9/7057—Gas flow, e.g. for focusing, leveling or gap setting
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/707—Chucks, e.g. chucking or un-chucking operations or structural details
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
- G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
- G03F7/70866—Environment aspects, e.g. pressure of beam-path gas, temperature of mask or workpiece
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Atmospheric Sciences (AREA)
- Toxicology (AREA)
- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Epidemiology (AREA)
- Public Health (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Light Sources And Details Of Projection-Printing Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US3834979A | 1979-05-11 | 1979-05-11 | |
| US38349 | 1979-05-11 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5816531A JPS5816531A (ja) | 1983-01-31 |
| JPH0310221B2 true JPH0310221B2 (nl) | 1991-02-13 |
Family
ID=21899427
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5406980A Granted JPS5617019A (en) | 1979-05-11 | 1980-04-23 | Method and apparatus for exposing semiconductor wafer |
| JP57103658A Granted JPS5816532A (ja) | 1979-05-11 | 1982-06-16 | 位置決め装置 |
| JP57103657A Granted JPS5816531A (ja) | 1979-05-11 | 1982-06-16 | 半導体ウエハ露光装置の位置決め装置 |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5406980A Granted JPS5617019A (en) | 1979-05-11 | 1980-04-23 | Method and apparatus for exposing semiconductor wafer |
| JP57103658A Granted JPS5816532A (ja) | 1979-05-11 | 1982-06-16 | 位置決め装置 |
Country Status (8)
| Country | Link |
|---|---|
| JP (3) | JPS5617019A (nl) |
| DE (1) | DE3017582C2 (nl) |
| FR (1) | FR2456338B1 (nl) |
| GB (2) | GB2052767B (nl) |
| IL (1) | IL59629A (nl) |
| IT (1) | IT1212414B (nl) |
| NL (1) | NL8002009A (nl) |
| SE (3) | SE457034B (nl) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1688343A1 (en) | 2005-02-02 | 2006-08-09 | Yamaha Hatsudoki Kabushiki Kaisha | Straddle-type vehicle |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4475122A (en) * | 1981-11-09 | 1984-10-02 | Tre Semiconductor Equipment Corporation | Automatic wafer alignment technique |
| JPS5946026A (ja) * | 1982-09-09 | 1984-03-15 | Toshiba Corp | 試料位置測定方法 |
| GB2150105B (en) * | 1983-11-23 | 1987-04-29 | Alan Leslie Smith | Device for expelling fluent contents from a container |
| JP2593440B2 (ja) * | 1985-12-19 | 1997-03-26 | 株式会社ニコン | 投影型露光装置 |
| GB8803171D0 (en) * | 1988-02-11 | 1988-03-09 | English Electric Valve Co Ltd | Imaging apparatus |
| JP2682002B2 (ja) * | 1988-02-22 | 1997-11-26 | 日本精工株式会社 | 露光装置の位置合わせ方法及び装置 |
| KR0144082B1 (ko) * | 1994-04-01 | 1998-08-17 | 김주용 | 레티클 및 그 레티클을 사용한 가림막 세팅 방법 |
| JP2546537B2 (ja) * | 1994-06-20 | 1996-10-23 | 株式会社ニコン | 投影露光装置及び方法 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51124938A (en) * | 1975-04-25 | 1976-10-30 | Hitachi Ltd | Automatic focusing apparatus |
| JPS5215322A (en) * | 1975-07-25 | 1977-02-04 | Hitachi Ltd | Automatic focusing device |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2052603A (en) * | 1932-09-09 | 1936-09-01 | Johns Manville | Article of manufacture |
| DE2222249C3 (de) * | 1972-05-05 | 1979-04-12 | Anatolij Petrovitsch Kornilov | Doppelobjektiv-Einrichtung zum Indeckungbringen einer Photomaske mit einer Unterlage wie einem Halbleiter-Plättchen |
| JPS4921467A (nl) * | 1972-06-20 | 1974-02-25 | ||
| JPS593791B2 (ja) * | 1975-04-07 | 1984-01-26 | キヤノン株式会社 | 物体の像認識方法 |
| JPS51123565A (en) * | 1975-04-21 | 1976-10-28 | Nippon Telegr & Teleph Corp <Ntt> | Three-dimention-position differential adjustment of processing article |
| JPS602772B2 (ja) * | 1976-11-01 | 1985-01-23 | 株式会社日立製作所 | 露光装置 |
| DE2845603C2 (de) * | 1978-10-19 | 1982-12-09 | Censor Patent- und Versuchs-Anstalt, 9490 Vaduz | Verfahren und Einrichtung zum Projektionskopieren |
-
1980
- 1980-03-14 IL IL59629A patent/IL59629A/xx unknown
- 1980-04-03 NL NL8002009A patent/NL8002009A/nl not_active Application Discontinuation
- 1980-04-23 JP JP5406980A patent/JPS5617019A/ja active Granted
- 1980-05-06 GB GB8014982A patent/GB2052767B/en not_active Expired
- 1980-05-07 SE SE8003424A patent/SE457034B/sv not_active IP Right Cessation
- 1980-05-08 DE DE3017582A patent/DE3017582C2/de not_active Expired
- 1980-05-09 FR FR8010517A patent/FR2456338B1/fr not_active Expired
- 1980-05-09 IT IT8021931A patent/IT1212414B/it active
-
1982
- 1982-06-16 JP JP57103658A patent/JPS5816532A/ja active Granted
- 1982-06-16 JP JP57103657A patent/JPS5816531A/ja active Granted
- 1982-09-24 GB GB08227345A patent/GB2111695B/en not_active Expired
-
1988
- 1988-03-09 SE SE8800836A patent/SE456872B/sv not_active IP Right Cessation
- 1988-03-09 SE SE8800837A patent/SE456873B/sv not_active IP Right Cessation
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51124938A (en) * | 1975-04-25 | 1976-10-30 | Hitachi Ltd | Automatic focusing apparatus |
| JPS5215322A (en) * | 1975-07-25 | 1977-02-04 | Hitachi Ltd | Automatic focusing device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1688343A1 (en) | 2005-02-02 | 2006-08-09 | Yamaha Hatsudoki Kabushiki Kaisha | Straddle-type vehicle |
Also Published As
| Publication number | Publication date |
|---|---|
| IL59629A0 (en) | 1980-06-30 |
| SE457034B (sv) | 1988-11-21 |
| GB2052767A (en) | 1981-01-28 |
| IT1212414B (it) | 1989-11-22 |
| SE8800837L (sv) | 1988-03-09 |
| JPS638609B2 (nl) | 1988-02-23 |
| GB2111695A (en) | 1983-07-06 |
| DE3017582C2 (de) | 1986-07-31 |
| NL8002009A (nl) | 1980-11-13 |
| GB2111695B (en) | 1984-01-11 |
| SE8800836L (sv) | 1988-03-09 |
| GB2052767B (en) | 1983-06-08 |
| SE8800836D0 (sv) | 1988-03-09 |
| SE456873B (sv) | 1988-11-07 |
| JPS5617019A (en) | 1981-02-18 |
| IL59629A (en) | 1983-03-31 |
| FR2456338B1 (fr) | 1986-05-09 |
| SE8003424L (sv) | 1980-11-12 |
| FR2456338A1 (fr) | 1980-12-05 |
| SE8800837D0 (sv) | 1988-03-09 |
| JPH0125220B2 (nl) | 1989-05-16 |
| JPS5816532A (ja) | 1983-01-31 |
| SE456872B (sv) | 1988-11-07 |
| DE3017582A1 (de) | 1980-11-13 |
| JPS5816531A (ja) | 1983-01-31 |
| IT8021931A0 (it) | 1980-05-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4557599A (en) | Calibration and alignment target plate | |
| TWI714048B (zh) | 基材載體、圖案化數個基材的方法、及處理系統 | |
| US4172656A (en) | Method of positioning a thin semiconductor plate and patterns to be projected thereon in a photorepeater and a photorepeater for carrying out this method | |
| JP2646412B2 (ja) | 露光装置 | |
| JPH0310221B2 (nl) | ||
| US4521114A (en) | Single lens repeater | |
| JPH09260250A (ja) | 露光装置および露光方法 | |
| US4477182A (en) | Pattern exposing apparatus | |
| US20170212425A1 (en) | Exposure apparatus | |
| JPS5918950A (ja) | 加工片上へのマスクの投影転写装置およびその調整方法 | |
| US4669868A (en) | Step and repeat exposure apparatus and method | |
| JPH0774084A (ja) | 基板処理装置 | |
| Mayer et al. | A new step-by-step aligner for very large scale integration (VLSI) production | |
| JPH09219437A (ja) | 位置決め装置 | |
| JPS60123028A (ja) | 露光装置 | |
| JPH0154854B2 (nl) | ||
| JPH01228130A (ja) | 投影露光方法およびその装置 | |
| JPS60177625A (ja) | 投影露光装置 | |
| JP4487700B2 (ja) | 近接露光装置 | |
| JPH1152545A (ja) | レチクルおよびそれによって転写されたパターンならびにレチクルと半導体ウエハとの位置合わせ方法 | |
| JPH0689032A (ja) | フィルムとプリント回路基板の相互位置を調整する方法、並びに前記方法を実施するための装置 | |
| JPS6345819A (ja) | 投影露光装置におけるステ−ジ誤差測定装置 | |
| TWI758281B (zh) | 曝光裝置、平台校正系統、平台校正方法以及校正治具 | |
| JPH06302500A (ja) | 投影露光装置及びそれを用いた半導体素子の製造方法 | |
| JPH0653116A (ja) | マスク交換装置 |