JP7416600B2 - 切削装置 - Google Patents
切削装置 Download PDFInfo
- Publication number
- JP7416600B2 JP7416600B2 JP2019193785A JP2019193785A JP7416600B2 JP 7416600 B2 JP7416600 B2 JP 7416600B2 JP 2019193785 A JP2019193785 A JP 2019193785A JP 2019193785 A JP2019193785 A JP 2019193785A JP 7416600 B2 JP7416600 B2 JP 7416600B2
- Authority
- JP
- Japan
- Prior art keywords
- cutting
- mist
- duct
- unit
- water
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000005520 cutting process Methods 0.000 title claims description 257
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 87
- 239000003595 mist Substances 0.000 claims description 69
- 239000007788 liquid Substances 0.000 claims description 39
- 238000000926 separation method Methods 0.000 claims description 14
- 238000003754 machining Methods 0.000 description 22
- 238000012545 processing Methods 0.000 description 21
- 238000001514 detection method Methods 0.000 description 10
- 230000000694 effects Effects 0.000 description 8
- 238000003384 imaging method Methods 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 239000002390 adhesive tape Substances 0.000 description 5
- 238000004140 cleaning Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000004590 computer program Methods 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 239000002173 cutting fluid Substances 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 230000009931 harmful effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910052594 sapphire Inorganic materials 0.000 description 1
- 239000010980 sapphire Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/028—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a ring blade having an inside cutting edge
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
- B28D7/02—Accessories specially adapted for use with machines or devices of the preceding groups for removing or laying dust, e.g. by spraying liquids; for cooling work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Dicing (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019193785A JP7416600B2 (ja) | 2019-10-24 | 2019-10-24 | 切削装置 |
KR1020200118044A KR20210048982A (ko) | 2019-10-24 | 2020-09-15 | 절삭 장치 |
SG10202010111XA SG10202010111XA (en) | 2019-10-24 | 2020-10-12 | Cutting apparatus |
TW109136573A TW202117826A (zh) | 2019-10-24 | 2020-10-21 | 切割裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019193785A JP7416600B2 (ja) | 2019-10-24 | 2019-10-24 | 切削装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2021065983A JP2021065983A (ja) | 2021-04-30 |
JP7416600B2 true JP7416600B2 (ja) | 2024-01-17 |
Family
ID=75637836
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019193785A Active JP7416600B2 (ja) | 2019-10-24 | 2019-10-24 | 切削装置 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7416600B2 (zh) |
KR (1) | KR20210048982A (zh) |
SG (1) | SG10202010111XA (zh) |
TW (1) | TW202117826A (zh) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006237206A (ja) | 2005-02-24 | 2006-09-07 | Disco Abrasive Syst Ltd | 切削装置 |
JP2011014670A (ja) | 2009-07-01 | 2011-01-20 | Disco Abrasive Syst Ltd | 切削装置 |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2694931B2 (ja) * | 1991-02-22 | 1997-12-24 | 株式会社東京精密 | ダイシング装置 |
JP6388813B2 (ja) | 2014-10-17 | 2018-09-12 | 株式会社ディスコ | 切削装置 |
-
2019
- 2019-10-24 JP JP2019193785A patent/JP7416600B2/ja active Active
-
2020
- 2020-09-15 KR KR1020200118044A patent/KR20210048982A/ko unknown
- 2020-10-12 SG SG10202010111XA patent/SG10202010111XA/en unknown
- 2020-10-21 TW TW109136573A patent/TW202117826A/zh unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006237206A (ja) | 2005-02-24 | 2006-09-07 | Disco Abrasive Syst Ltd | 切削装置 |
JP2011014670A (ja) | 2009-07-01 | 2011-01-20 | Disco Abrasive Syst Ltd | 切削装置 |
Also Published As
Publication number | Publication date |
---|---|
SG10202010111XA (en) | 2021-05-28 |
JP2021065983A (ja) | 2021-04-30 |
KR20210048982A (ko) | 2021-05-04 |
TW202117826A (zh) | 2021-05-01 |
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