JP7270373B2 - 樹脂を含む複合基板の研削方法及び研削装置 - Google Patents

樹脂を含む複合基板の研削方法及び研削装置 Download PDF

Info

Publication number
JP7270373B2
JP7270373B2 JP2018238095A JP2018238095A JP7270373B2 JP 7270373 B2 JP7270373 B2 JP 7270373B2 JP 2018238095 A JP2018238095 A JP 2018238095A JP 2018238095 A JP2018238095 A JP 2018238095A JP 7270373 B2 JP7270373 B2 JP 7270373B2
Authority
JP
Japan
Prior art keywords
pressure water
composite substrate
grinding
water supply
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2018238095A
Other languages
English (en)
Japanese (ja)
Other versions
JP2020102481A5 (https=
JP2020102481A (ja
Inventor
栄一 山本
貴彦 三井
翼 坂東
悟 井出
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Okamoto Machine Tool Works Ltd
Original Assignee
Okamoto Machine Tool Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Okamoto Machine Tool Works Ltd filed Critical Okamoto Machine Tool Works Ltd
Priority to JP2018238095A priority Critical patent/JP7270373B2/ja
Priority to KR1020190151901A priority patent/KR102799435B1/ko
Priority to US16/708,528 priority patent/US11745299B2/en
Priority to CN201911280524.XA priority patent/CN111347304B/zh
Priority to TW108146967A priority patent/TWI822931B/zh
Publication of JP2020102481A publication Critical patent/JP2020102481A/ja
Publication of JP2020102481A5 publication Critical patent/JP2020102481A5/ja
Application granted granted Critical
Publication of JP7270373B2 publication Critical patent/JP7270373B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP2018238095A 2018-12-20 2018-12-20 樹脂を含む複合基板の研削方法及び研削装置 Active JP7270373B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2018238095A JP7270373B2 (ja) 2018-12-20 2018-12-20 樹脂を含む複合基板の研削方法及び研削装置
KR1020190151901A KR102799435B1 (ko) 2018-12-20 2019-11-25 수지를 포함하는 복합 기판의 연삭 방법 및 연삭 장치
US16/708,528 US11745299B2 (en) 2018-12-20 2019-12-10 Grinding method of composite substrate including resin and grinding apparatus thereof
CN201911280524.XA CN111347304B (zh) 2018-12-20 2019-12-13 包含树脂的复合基板的磨削方法和磨削装置
TW108146967A TWI822931B (zh) 2018-12-20 2019-12-20 包含樹脂的複合基板的磨削方法和磨削裝置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2018238095A JP7270373B2 (ja) 2018-12-20 2018-12-20 樹脂を含む複合基板の研削方法及び研削装置

Publications (3)

Publication Number Publication Date
JP2020102481A JP2020102481A (ja) 2020-07-02
JP2020102481A5 JP2020102481A5 (https=) 2022-01-04
JP7270373B2 true JP7270373B2 (ja) 2023-05-10

Family

ID=71099076

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2018238095A Active JP7270373B2 (ja) 2018-12-20 2018-12-20 樹脂を含む複合基板の研削方法及び研削装置

Country Status (5)

Country Link
US (1) US11745299B2 (https=)
JP (1) JP7270373B2 (https=)
KR (1) KR102799435B1 (https=)
CN (1) CN111347304B (https=)
TW (1) TWI822931B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7451324B2 (ja) * 2020-06-26 2024-03-18 株式会社荏原製作所 基板処理装置および基板処理方法
JP7648403B2 (ja) * 2021-02-19 2025-03-18 株式会社岡本工作機械製作所 研削方法及び研削装置
JP7831971B2 (ja) * 2021-09-06 2026-03-17 株式会社ディスコ チップの製造方法
CN116921306B (zh) * 2022-03-30 2025-11-07 华为技术有限公司 一种清洗装置
JP2023158692A (ja) * 2022-04-19 2023-10-31 株式会社ディスコ 被加工物の研削方法
CN120206405B (zh) * 2025-05-26 2025-08-19 华海清科(北京)科技有限公司 磨轮自锐性增强方法、装置及晶圆减薄设备

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007157930A (ja) 2005-12-02 2007-06-21 Tokyo Seimitsu Co Ltd ウェーハ洗浄装置
JP2014028425A (ja) 2012-06-27 2014-02-13 Okamoto Machine Tool Works Ltd 半導体デバイス基板の研削方法
JP2015090945A (ja) 2013-11-07 2015-05-11 株式会社岡本工作機械製作所 再生半導体ウエハの製造方法
JP2016058655A (ja) 2014-09-11 2016-04-21 株式会社ジェイデバイス 半導体装置の製造方法
JP2018049973A (ja) 2016-09-23 2018-03-29 株式会社岡本工作機械製作所 半導体装置の製造方法及び半導体製造装置
JP2018186217A (ja) 2017-04-27 2018-11-22 株式会社岡本工作機械製作所 静電吸着チャック及びその製造方法並びに半導体装置の製造方法

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3366061B2 (ja) * 1993-06-30 2003-01-14 澄夫 田中 両面研磨機定盤の洗浄装置
JP2005246491A (ja) 2004-03-01 2005-09-15 Disco Abrasive Syst Ltd 研削装置及びウェーハの研削方法
WO2005092564A1 (ja) * 2004-03-25 2005-10-06 Ibiden Co., Ltd. 真空チャックおよび吸着板
JP5084050B2 (ja) 2008-07-31 2012-11-28 株式会社Ａｑｕａｐａｓｓ 物品表面の小径の孔・袋穴の洗浄方法
JP6166106B2 (ja) 2013-06-14 2017-07-19 株式会社ディスコ サファイア基板の加工方法
JP5827277B2 (ja) 2013-08-02 2015-12-02 株式会社岡本工作機械製作所 半導体装置の製造方法
JP6255254B2 (ja) 2014-01-27 2017-12-27 株式会社ディスコ バイト切削装置
JP6366308B2 (ja) 2014-03-12 2018-08-01 株式会社ディスコ 加工方法
JP2017056522A (ja) 2015-09-17 2017-03-23 株式会社ディスコ 研削ホイール及び研削方法
JP6671167B2 (ja) 2015-12-16 2020-03-25 株式会社ディスコ 積層基板の加工方法
KR102214510B1 (ko) 2016-01-18 2021-02-09 삼성전자 주식회사 기판 씨닝 장치, 이를 이용한 기판의 씨닝 방법, 및 반도체 패키지의 제조 방법
JP2017154186A (ja) 2016-02-29 2017-09-07 株式会社ディスコ 研削装置
KR102453451B1 (ko) 2017-03-31 2022-10-12 린텍 가부시키가이샤 반도체 장치의 제조 방법 및 점착 시트

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007157930A (ja) 2005-12-02 2007-06-21 Tokyo Seimitsu Co Ltd ウェーハ洗浄装置
JP2014028425A (ja) 2012-06-27 2014-02-13 Okamoto Machine Tool Works Ltd 半導体デバイス基板の研削方法
JP2015090945A (ja) 2013-11-07 2015-05-11 株式会社岡本工作機械製作所 再生半導体ウエハの製造方法
JP2016058655A (ja) 2014-09-11 2016-04-21 株式会社ジェイデバイス 半導体装置の製造方法
JP2018049973A (ja) 2016-09-23 2018-03-29 株式会社岡本工作機械製作所 半導体装置の製造方法及び半導体製造装置
JP2018186217A (ja) 2017-04-27 2018-11-22 株式会社岡本工作機械製作所 静電吸着チャック及びその製造方法並びに半導体装置の製造方法

Also Published As

Publication number Publication date
US11745299B2 (en) 2023-09-05
TWI822931B (zh) 2023-11-21
CN111347304A (zh) 2020-06-30
TW202103842A (zh) 2021-02-01
KR20200077404A (ko) 2020-06-30
US20200198083A1 (en) 2020-06-25
JP2020102481A (ja) 2020-07-02
KR102799435B1 (ko) 2025-04-22
CN111347304B (zh) 2023-12-22

Similar Documents

Publication Publication Date Title
JP7270373B2 (ja) 樹脂を含む複合基板の研削方法及び研削装置
CN113400101B (zh) 磨削方法
JP2014054713A (ja) ウェーハの加工方法
KR102356850B1 (ko) 절삭 방법 및 절삭 장치
US20190111537A1 (en) Workpiece grinding method
JP7152937B2 (ja) 研削方法及び研削装置
TWI890916B (zh) 被加工物之研削方法
JP2013225612A (ja) ウェーハの加工方法
JP2016221636A (ja) 研削装置
KR102725508B1 (ko) 기판 연삭 장치 및 기판 연삭 방법
JP6680639B2 (ja) 加工方法
CN116038462A (zh) 一种晶圆减薄方法及减薄装置
JPH01140967A (ja) 研削装置
JP6165020B2 (ja) 加工方法
JP2023180612A (ja) 被加工物の研削方法
JP7783076B2 (ja) 被加工物の研削方法
JP7736591B2 (ja) 被加工物の研削方法
US20220274224A1 (en) Grinding method for workpiece
JP2020078835A (ja) 切削ブレードのドレッシング方法及びドレッサーボード
JP2012109394A (ja) 保護膜剥離方法および保護膜剥離装置
JP2009214278A (ja) 研削用砥石
JP2024062729A (ja) 被加工物の研削方法
JP2026013467A (ja) 砥石のドレス方法
JP2024062728A (ja) 被加工物の研削方法
TW202336851A (zh) 封裝器件之製造方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20211118

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20211118

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20221108

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20221122

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20230119

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20230411

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20230425

R150 Certificate of patent or registration of utility model

Ref document number: 7270373

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150