TWI822931B - 包含樹脂的複合基板的磨削方法和磨削裝置 - Google Patents

包含樹脂的複合基板的磨削方法和磨削裝置 Download PDF

Info

Publication number
TWI822931B
TWI822931B TW108146967A TW108146967A TWI822931B TW I822931 B TWI822931 B TW I822931B TW 108146967 A TW108146967 A TW 108146967A TW 108146967 A TW108146967 A TW 108146967A TW I822931 B TWI822931 B TW I822931B
Authority
TW
Taiwan
Prior art keywords
grinding
composite substrate
pressure water
water supply
resin
Prior art date
Application number
TW108146967A
Other languages
English (en)
Chinese (zh)
Other versions
TW202103842A (zh
Inventor
山本榮一
三井貴彦
坂東翼
井出悟
Original Assignee
日商岡本工作機械製作所股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商岡本工作機械製作所股份有限公司 filed Critical 日商岡本工作機械製作所股份有限公司
Publication of TW202103842A publication Critical patent/TW202103842A/zh
Application granted granted Critical
Publication of TWI822931B publication Critical patent/TWI822931B/zh

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
TW108146967A 2018-12-20 2019-12-20 包含樹脂的複合基板的磨削方法和磨削裝置 TWI822931B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018238095A JP7270373B2 (ja) 2018-12-20 2018-12-20 樹脂を含む複合基板の研削方法及び研削装置
JP2018-238095 2018-12-20

Publications (2)

Publication Number Publication Date
TW202103842A TW202103842A (zh) 2021-02-01
TWI822931B true TWI822931B (zh) 2023-11-21

Family

ID=71099076

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108146967A TWI822931B (zh) 2018-12-20 2019-12-20 包含樹脂的複合基板的磨削方法和磨削裝置

Country Status (5)

Country Link
US (1) US11745299B2 (https=)
JP (1) JP7270373B2 (https=)
KR (1) KR102799435B1 (https=)
CN (1) CN111347304B (https=)
TW (1) TWI822931B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7451324B2 (ja) * 2020-06-26 2024-03-18 株式会社荏原製作所 基板処理装置および基板処理方法
JP7648403B2 (ja) * 2021-02-19 2025-03-18 株式会社岡本工作機械製作所 研削方法及び研削装置
JP7831971B2 (ja) * 2021-09-06 2026-03-17 株式会社ディスコ チップの製造方法
CN116921306B (zh) * 2022-03-30 2025-11-07 华为技术有限公司 一种清洗装置
JP2023158692A (ja) * 2022-04-19 2023-10-31 株式会社ディスコ 被加工物の研削方法
CN121083522A (zh) * 2025-05-26 2025-12-09 华海清科(北京)科技有限公司 磨轮自锐性增强方法、装置及晶圆减薄设备

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014028425A (ja) * 2012-06-27 2014-02-13 Okamoto Machine Tool Works Ltd 半導体デバイス基板の研削方法
TW201544235A (zh) * 2014-03-12 2015-12-01 迪思科股份有限公司 加工方法
US20170207108A1 (en) * 2016-01-18 2017-07-20 Samsung Electronics Co., Ltd. Substrate thinning apparatus, method of thinning substrate by using the same, and method of fabricating semiconductor package
TW201842596A (zh) * 2017-03-31 2018-12-01 日商琳得科股份有限公司 半導體裝置之製造方法及黏著薄片

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3366061B2 (ja) * 1993-06-30 2003-01-14 澄夫 田中 両面研磨機定盤の洗浄装置
JP2005246491A (ja) 2004-03-01 2005-09-15 Disco Abrasive Syst Ltd 研削装置及びウェーハの研削方法
KR100753302B1 (ko) * 2004-03-25 2007-08-29 이비덴 가부시키가이샤 진공 척, 흡착판, 연마 장치 및 반도체 웨이퍼의 제조 방법
JP2007157930A (ja) * 2005-12-02 2007-06-21 Tokyo Seimitsu Co Ltd ウェーハ洗浄装置
JP5084050B2 (ja) 2008-07-31 2012-11-28 株式会社Ａｑｕａｐａｓｓ 物品表面の小径の孔・袋穴の洗浄方法
JP6166106B2 (ja) 2013-06-14 2017-07-19 株式会社ディスコ サファイア基板の加工方法
JP5827277B2 (ja) 2013-08-02 2015-12-02 株式会社岡本工作機械製作所 半導体装置の製造方法
JP6205619B2 (ja) * 2013-11-07 2017-10-04 株式会社岡本工作機械製作所 再生半導体ウエハの製造方法
JP6255254B2 (ja) 2014-01-27 2017-12-27 株式会社ディスコ バイト切削装置
JP2016058655A (ja) * 2014-09-11 2016-04-21 株式会社ジェイデバイス 半導体装置の製造方法
JP2017056522A (ja) 2015-09-17 2017-03-23 株式会社ディスコ 研削ホイール及び研削方法
JP6671167B2 (ja) 2015-12-16 2020-03-25 株式会社ディスコ 積層基板の加工方法
JP2017154186A (ja) 2016-02-29 2017-09-07 株式会社ディスコ 研削装置
JP6850099B2 (ja) * 2016-09-23 2021-03-31 株式会社岡本工作機械製作所 半導体装置の製造方法及び半導体製造装置
JP7012454B2 (ja) * 2017-04-27 2022-01-28 株式会社岡本工作機械製作所 静電吸着チャックの製造方法並びに半導体装置の製造方法

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2014028425A (ja) * 2012-06-27 2014-02-13 Okamoto Machine Tool Works Ltd 半導体デバイス基板の研削方法
TW201544235A (zh) * 2014-03-12 2015-12-01 迪思科股份有限公司 加工方法
US20170207108A1 (en) * 2016-01-18 2017-07-20 Samsung Electronics Co., Ltd. Substrate thinning apparatus, method of thinning substrate by using the same, and method of fabricating semiconductor package
TW201842596A (zh) * 2017-03-31 2018-12-01 日商琳得科股份有限公司 半導體裝置之製造方法及黏著薄片

Also Published As

Publication number Publication date
CN111347304B (zh) 2023-12-22
US20200198083A1 (en) 2020-06-25
US11745299B2 (en) 2023-09-05
TW202103842A (zh) 2021-02-01
JP7270373B2 (ja) 2023-05-10
KR20200077404A (ko) 2020-06-30
JP2020102481A (ja) 2020-07-02
CN111347304A (zh) 2020-06-30
KR102799435B1 (ko) 2025-04-22

Similar Documents

Publication Publication Date Title
TWI822931B (zh) 包含樹脂的複合基板的磨削方法和磨削裝置
JP6850099B2 (ja) 半導体装置の製造方法及び半導体製造装置
JP7391476B2 (ja) 研削方法
JP2014028425A (ja) 半導体デバイス基板の研削方法
JP6999322B2 (ja) ウエーハの研削方法
JP5172457B2 (ja) 研削装置及び研削方法
KR102725508B1 (ko) 기판 연삭 장치 및 기판 연삭 방법
CN116237870A (zh) 修整工具和修整方法
JP6189032B2 (ja) 銀貫通電極付きセラミック基板の研削方法
TW202230504A (zh) 被加工物之研削方法
US12358099B2 (en) Dressing ring
JP6680639B2 (ja) 加工方法
CN116038462A (zh) 一种晶圆减薄方法及减薄装置
JP2023180612A (ja) 被加工物の研削方法
JP7766435B2 (ja) 基板研削装置及び基板研削方法
JP7783076B2 (ja) 被加工物の研削方法
JP7764264B2 (ja) 被加工物の加工方法
US20220274224A1 (en) Grinding method for workpiece
JP7736591B2 (ja) 被加工物の研削方法
CN114650895B (zh) 研磨系统
JP2020078835A (ja) 切削ブレードのドレッシング方法及びドレッサーボード
JP2006198737A (ja) ビトリファイドボンド砥石
JP2023180487A (ja) 搬送ユニット及び加工装置
TW202239518A (zh) 磨削方法
KR20050042386A (ko) 드레서 세정장치