CN111347304B - 包含树脂的复合基板的磨削方法和磨削装置 - Google Patents

包含树脂的复合基板的磨削方法和磨削装置 Download PDF

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Publication number
CN111347304B
CN111347304B CN201911280524.XA CN201911280524A CN111347304B CN 111347304 B CN111347304 B CN 111347304B CN 201911280524 A CN201911280524 A CN 201911280524A CN 111347304 B CN111347304 B CN 111347304B
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China
Prior art keywords
pressure water
grinding
water supply
composite substrate
supply nozzle
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CN201911280524.XA
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English (en)
Chinese (zh)
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CN111347304A (zh
Inventor
山本荣一
三井贵彦
坂东翼
井出悟
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Okamoto Machine Tool Works Ltd
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Okamoto Machine Tool Works Ltd
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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B27/00—Other grinding machines or devices
    • B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
    • B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/06—Work supports, e.g. adjustable steadies
    • B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
    • B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
    • B24B55/06—Dust extraction equipment on grinding or polishing machines
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P52/00—Grinding, lapping or polishing of wafers, substrates or parts of devices
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0402—Apparatus for fluid treatment
    • H10P72/0406—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H10P72/0411—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
    • H10P72/0414—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0428—Apparatus for mechanical treatment or grinding or cutting
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/78—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using vacuum or suction, e.g. Bernoulli chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00—Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass
    • H10P95/06—Planarisation of inorganic insulating materials

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
CN201911280524.XA 2018-12-20 2019-12-13 包含树脂的复合基板的磨削方法和磨削装置 Active CN111347304B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018238095A JP7270373B2 (ja) 2018-12-20 2018-12-20 樹脂を含む複合基板の研削方法及び研削装置
JP2018-238095 2018-12-20

Publications (2)

Publication Number Publication Date
CN111347304A CN111347304A (zh) 2020-06-30
CN111347304B true CN111347304B (zh) 2023-12-22

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Country Link
US (1) US11745299B2 (https=)
JP (1) JP7270373B2 (https=)
KR (1) KR102799435B1 (https=)
CN (1) CN111347304B (https=)
TW (1) TWI822931B (https=)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7451324B2 (ja) * 2020-06-26 2024-03-18 株式会社荏原製作所 基板処理装置および基板処理方法
JP7648403B2 (ja) * 2021-02-19 2025-03-18 株式会社岡本工作機械製作所 研削方法及び研削装置
JP7831971B2 (ja) * 2021-09-06 2026-03-17 株式会社ディスコ チップの製造方法
CN116921306B (zh) * 2022-03-30 2025-11-07 华为技术有限公司 一种清洗装置
JP2023158692A (ja) * 2022-04-19 2023-10-31 株式会社ディスコ 被加工物の研削方法
CN121083522A (zh) * 2025-05-26 2025-12-09 华海清科(北京)科技有限公司 磨轮自锐性增强方法、装置及晶圆减薄设备

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CN1664993A (zh) * 2004-03-01 2005-09-07 株式会社迪思科 晶片的磨削装置及磨削方法
JP2010051947A (ja) * 2008-07-31 2010-03-11 Imaizumi Tekkosho:Kk 物品表面の小径の孔・袋穴の洗浄方法及び装置
JP2014028425A (ja) * 2012-06-27 2014-02-13 Okamoto Machine Tool Works Ltd 半導体デバイス基板の研削方法
CN104227547A (zh) * 2013-06-14 2014-12-24 株式会社迪思科 蓝宝石基板的加工方法
CN106985003A (zh) * 2015-09-17 2017-07-28 株式会社迪思科 磨削磨轮以及磨削方法
JP2017154186A (ja) * 2016-02-29 2017-09-07 株式会社ディスコ 研削装置
JP2018049973A (ja) * 2016-09-23 2018-03-29 株式会社岡本工作機械製作所 半導体装置の製造方法及び半導体製造装置

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JP3366061B2 (ja) * 1993-06-30 2003-01-14 澄夫 田中 両面研磨機定盤の洗浄装置
KR100753302B1 (ko) * 2004-03-25 2007-08-29 이비덴 가부시키가이샤 진공 척, 흡착판, 연마 장치 및 반도체 웨이퍼의 제조 방법
JP2007157930A (ja) * 2005-12-02 2007-06-21 Tokyo Seimitsu Co Ltd ウェーハ洗浄装置
JP5827277B2 (ja) 2013-08-02 2015-12-02 株式会社岡本工作機械製作所 半導体装置の製造方法
JP6205619B2 (ja) * 2013-11-07 2017-10-04 株式会社岡本工作機械製作所 再生半導体ウエハの製造方法
JP6255254B2 (ja) 2014-01-27 2017-12-27 株式会社ディスコ バイト切削装置
JP6366308B2 (ja) 2014-03-12 2018-08-01 株式会社ディスコ 加工方法
JP2016058655A (ja) * 2014-09-11 2016-04-21 株式会社ジェイデバイス 半導体装置の製造方法
JP6671167B2 (ja) 2015-12-16 2020-03-25 株式会社ディスコ 積層基板の加工方法
KR102214510B1 (ko) 2016-01-18 2021-02-09 삼성전자 주식회사 기판 씨닝 장치, 이를 이용한 기판의 씨닝 방법, 및 반도체 패키지의 제조 방법
JP6761116B2 (ja) 2017-03-31 2020-09-23 リンテック株式会社 半導体装置の製造方法及び粘着シート
JP7012454B2 (ja) * 2017-04-27 2022-01-28 株式会社岡本工作機械製作所 静電吸着チャックの製造方法並びに半導体装置の製造方法

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Publication number Priority date Publication date Assignee Title
CN1664993A (zh) * 2004-03-01 2005-09-07 株式会社迪思科 晶片的磨削装置及磨削方法
JP2010051947A (ja) * 2008-07-31 2010-03-11 Imaizumi Tekkosho:Kk 物品表面の小径の孔・袋穴の洗浄方法及び装置
JP2014028425A (ja) * 2012-06-27 2014-02-13 Okamoto Machine Tool Works Ltd 半導体デバイス基板の研削方法
CN104227547A (zh) * 2013-06-14 2014-12-24 株式会社迪思科 蓝宝石基板的加工方法
CN106985003A (zh) * 2015-09-17 2017-07-28 株式会社迪思科 磨削磨轮以及磨削方法
JP2017154186A (ja) * 2016-02-29 2017-09-07 株式会社ディスコ 研削装置
JP2018049973A (ja) * 2016-09-23 2018-03-29 株式会社岡本工作機械製作所 半導体装置の製造方法及び半導体製造装置

Also Published As

Publication number Publication date
US20200198083A1 (en) 2020-06-25
US11745299B2 (en) 2023-09-05
TW202103842A (zh) 2021-02-01
JP7270373B2 (ja) 2023-05-10
KR20200077404A (ko) 2020-06-30
TWI822931B (zh) 2023-11-21
JP2020102481A (ja) 2020-07-02
CN111347304A (zh) 2020-06-30
KR102799435B1 (ko) 2025-04-22

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