JP7270373B2 - 樹脂を含む複合基板の研削方法及び研削装置 - Google Patents
樹脂を含む複合基板の研削方法及び研削装置 Download PDFInfo
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- 239000000758 substrate Substances 0.000 title claims description 137
- 239000002131 composite material Substances 0.000 title claims description 99
- 229920005989 resin Polymers 0.000 title claims description 61
- 239000011347 resin Substances 0.000 title claims description 61
- 238000000034 method Methods 0.000 title claims description 31
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 160
- 239000004065 semiconductor Substances 0.000 claims description 39
- 230000007246 mechanism Effects 0.000 claims description 20
- 238000001179 sorption measurement Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 description 12
- 230000003746 surface roughness Effects 0.000 description 10
- 238000005516 engineering process Methods 0.000 description 7
- 238000005520 cutting process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 5
- 230000009467 reduction Effects 0.000 description 4
- 239000010949 copper Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052710 silicon Inorganic materials 0.000 description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 238000007517 polishing process Methods 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 238000004806 packaging method and process Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000003566 sealing material Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/02—Equipment for cooling the grinding surfaces, e.g. devices for feeding coolant
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
- B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
- B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
- B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B27/00—Other grinding machines or devices
- B24B27/0076—Other grinding machines or devices grinding machines comprising two or more grinding tools
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
- B24B37/07—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool
- B24B37/10—Lapping machines or devices; Accessories designed for working plane surfaces characterised by the movement of the work or lapping tool for single side lapping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B41/00—Component parts such as frames, beds, carriages, headstocks
- B24B41/06—Work supports, e.g. adjustable steadies
- B24B41/061—Work supports, e.g. adjustable steadies axially supporting turning workpieces, e.g. magnetically, pneumatically
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B47/00—Drives or gearings; Equipment therefor
- B24B47/10—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces
- B24B47/12—Drives or gearings; Equipment therefor for rotating or reciprocating working-spindles carrying grinding wheels or workpieces by mechanical gearing or electric power
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B55/00—Safety devices for grinding or polishing machines; Accessories fitted to grinding or polishing machines for keeping tools or parts of the machine in good working condition
- B24B55/06—Dust extraction equipment on grinding or polishing machines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
- B24B57/02—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of fluid, sprayed, pulverised, or liquefied grinding, polishing or lapping agents
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3105—After-treatment
- H01L21/31051—Planarisation of the insulating layers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- General Physics & Mathematics (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Ceramic Engineering (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Grinding Of Cylindrical And Plane Surfaces (AREA)
- Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
図2に示すように、第1の高圧水供給ノズル11aと第2の高圧水供給ノズル11bは、例えば、固定砥粒といし5の回転中心を基準として、回転円周方向の異なる位置に配置されても良い。
図3に示すように、高圧水供給ノズル11は、高圧水噴出口12から固定砥粒といし5の研削といし7の刃先までの距離L1、L2が5~30mmになるように配設されている。更に好ましくは、高圧水噴出口12から研削といし7の刃先までの距離L1、L2は、15~25mmである。この構成により、高圧水供給ノズル11から固定砥粒といし5に対して洗浄に好適な高圧水を噴出することができる。
図4に示すように、高圧水供給ノズル11は、1~20mm/secの速度且つ1~10mmの揺動幅L3で揺動する機構を有しても良い。これにより、高圧水を広く噴出することができ、大型の固定砥粒といし5の目詰まりを防止することができる。よって、大型のFOPLP基板等の複合基板20を高効率に研削することができる。
また、図示を省略するが、研削装置1は、樹脂基板21に電極23のみが埋め込まれた複合基板についても研削加工を行うことができる。
例えば、本発明の研削装置の固定砥粒といしとしては、前述のカップホイール型の固定砥粒といし5に替えて、他の一般的な形式の研削といしが用いられても良い。また例えば、固定砥粒といしは、垂直回転するよう設けられても良い。
その他、本発明の要旨を逸脱しない範囲で、種々の変更実施が可能である。
2 真空チャック
3 研削テーブル
5 固定砥粒といし
6 研削ヘッド
7 研削といし
8 研削水供給ノズル
10 高圧水供給機構
11 高圧水供給ノズル
11a 第1の高圧水供給ノズル
11b 第2の高圧水供給ノズル
12、12a、12b 高圧水噴出口
13 高圧水圧力コントローラ
20、120、220 複合基板
21 樹脂基板
22、122 半導体デバイスチップ
23 電極
24 電極
Claims (4)
- 半導体デバイスチップ及び電極の少なくとも一方を樹脂基板に複数埋め込んで形成された複合基板を、固定砥粒といしを用いて加工する研削工程において、前記複合基板と前記固定砥粒といしとの接触部分に純水を供給し、前記固定砥粒といしの前記複合基板から接触が離れた部分に対して複数の高圧水供給ノズルから高圧水を噴出しながら研削加工を行い、前記高圧水供給ノズルは、1~20mm/secの速度且つ1~10mm幅で揺動しながら前記高圧水を噴射することを特徴とする樹脂を含む複合基板の研削方法。
- 半導体デバイスチップ及び電極の少なくとも一方を樹脂基板に複数埋め込んで形成された複合基板を搭載して回転する真空チャック機構と、
前記真空チャックに搭載された前記複合基板を回転しながら研削する固定砥粒といし機構と、
前記複合基板と前記固定砥粒といしとの接触部分に純水を供給する研削水供給機構と、
前記固定砥粒といしの前記複合基板から接触が離れた部分に複数の高圧水供給ノズルから高圧水を供給する高圧水供給機構と、を有し、
前記高圧水供給ノズルは、1~20mm/secの速度且つ1~10mm幅で揺動する機構を有することを特徴とする樹脂を含む複合基板の研削装置。 - 前記高圧水供給ノズルから噴出する高圧水の圧力が3~20MPa且つ噴出角が5~20度であり、
前記固定砥粒といしと前記高圧水供給ノズルとの間隔が5~30mmであることを特徴とする請求項2に記載の樹脂を含む複合基板の研削装置。 - 前記真空チャックは、表面積が1000~7000cm2の前記複合基板を搭載可能な吸着面積を有し、且つ厚さが0.1~2mmの範囲内にある前記複合基板を研削加工可能となるよう平坦に吸着することを特徴とする請求項2または請求項3に記載の樹脂を含む複合基板の研削装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
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JP2018238095A JP7270373B2 (ja) | 2018-12-20 | 2018-12-20 | 樹脂を含む複合基板の研削方法及び研削装置 |
KR1020190151901A KR20200077404A (ko) | 2018-12-20 | 2019-11-25 | 수지를 포함하는 복합 기판의 연삭 방법 및 연삭 장치 |
US16/708,528 US11745299B2 (en) | 2018-12-20 | 2019-12-10 | Grinding method of composite substrate including resin and grinding apparatus thereof |
CN201911280524.XA CN111347304B (zh) | 2018-12-20 | 2019-12-13 | 包含树脂的复合基板的磨削方法和磨削装置 |
TW108146967A TWI822931B (zh) | 2018-12-20 | 2019-12-20 | 包含樹脂的複合基板的磨削方法和磨削裝置 |
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JP6671167B2 (ja) | 2015-12-16 | 2020-03-25 | 株式会社ディスコ | 積層基板の加工方法 |
KR102214510B1 (ko) | 2016-01-18 | 2021-02-09 | 삼성전자 주식회사 | 기판 씨닝 장치, 이를 이용한 기판의 씨닝 방법, 및 반도체 패키지의 제조 방법 |
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JP2007157930A (ja) | 2005-12-02 | 2007-06-21 | Tokyo Seimitsu Co Ltd | ウェーハ洗浄装置 |
JP2014028425A (ja) | 2012-06-27 | 2014-02-13 | Okamoto Machine Tool Works Ltd | 半導体デバイス基板の研削方法 |
JP2015090945A (ja) | 2013-11-07 | 2015-05-11 | 株式会社岡本工作機械製作所 | 再生半導体ウエハの製造方法 |
JP2016058655A (ja) | 2014-09-11 | 2016-04-21 | 株式会社ジェイデバイス | 半導体装置の製造方法 |
JP2018049973A (ja) | 2016-09-23 | 2018-03-29 | 株式会社岡本工作機械製作所 | 半導体装置の製造方法及び半導体製造装置 |
JP2018186217A5 (ja) | 2017-04-27 | 2020-05-28 |
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CN111347304B (zh) | 2023-12-22 |
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CN111347304A (zh) | 2020-06-30 |
US20200198083A1 (en) | 2020-06-25 |
US11745299B2 (en) | 2023-09-05 |
JP2020102481A (ja) | 2020-07-02 |
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